TWM328660U - Substrate processing device and control equipment thereof - Google Patents

Substrate processing device and control equipment thereof Download PDF

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Publication number
TWM328660U
TWM328660U TW096204671U TW96204671U TWM328660U TW M328660 U TWM328660 U TW M328660U TW 096204671 U TW096204671 U TW 096204671U TW 96204671 U TW96204671 U TW 96204671U TW M328660 U TWM328660 U TW M328660U
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Taiwan
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processing
treatment
liquid exchange
liquid
time
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TW096204671U
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Chinese (zh)
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Masahiro Yamamoto
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Dainippon Screen Mfg
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Publication of TWM328660U publication Critical patent/TWM328660U/en

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Cleaning Or Drying Semiconductors (AREA)
  • General Factory Administration (AREA)

Description

M328660 八、新型說明: 【新型所屬之技術領域】 本創作係關於一種對半導體晶圓或液晶顯示裝置用之玻 璃基板(以下僅稱作基板)實施特定處理之基板處理裝置及 其控制裝置,尤其係關於一種包含附帶於處理步驟之處理 液之交換處理、或附帶於處理步驟之乾燥處理部之洗淨處 理,在實際實行處理前預先製定排程之技術。 【先前技術】 先前,此種裝置根據處理液使用時間設定規定壽命之生 命時間,並在使用處理液之處理部之資源,每一生命時間 固定配置液交換處理。然後,以在如此配置之「定期液交 換處理」之間穿插之方式對各批配置各資源之使用時序 (例如,參照專利文獻1)。亦即,首先預先配置定期液交換 處理,並以在所配置之交互之定期液交換處理之間使用處 理部之方式進行排程。 & [專利文獻1]日本特開2003_86562號公報 【新型内容】 [創作所欲解決之問題] 然而,具有如此之構成之先前例之情形有如下之問題。 〃亦即,#當使用處理部之資源日寺,進行液交換後必須進 打批處理,《進行批處理後必須進行&交換之伴隨「附册 液交換處理」之處理步驟之問題。因此,若該處理步驟: 定期液交換處理鄰接配置時,則會如定期液交換、處理: 附帶液交換般在短時間内進行兩次液交換。因此,=附帶 M328660 液交換處理之情形 之裝置進行排程時 問題。 時,在固定配置定期液交換處理之先前 ,有導致處理液浪費,且生產量降低之 並且,上述之「 即:當處理批時, 若處理該批則處理 之批之不良影響等 附帶液交換處理」藉由以下理由進行, 想要以新液僅處理該批之情形,或因為 液會極端劣化或污染,想要回避對後續M328660 VIII. New type of description: [Technical field of the new type] The present invention relates to a substrate processing apparatus and a control device thereof for performing specific processing on a glass substrate (hereinafter simply referred to as a substrate) for a semiconductor wafer or a liquid crystal display device, in particular A technique for preparing a schedule by performing an exchange process including a treatment liquid attached to a treatment step or a washing treatment unit attached to a treatment step, and performing a process before actually performing the treatment. [Prior Art] Conventionally, such a device sets a life of a predetermined life based on the use time of the treatment liquid, and fixedly arranges the liquid exchange process for each life time in the resource of the treatment portion using the treatment liquid. Then, the use timing of each resource is arranged for each batch so as to be interposed between the "regular liquid exchange processes" thus arranged (for example, refer to Patent Document 1). That is, the periodic liquid exchange process is first pre-configured, and scheduling is performed by using the processing unit between the scheduled liquid exchange processes of the configured interactions. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-86562 [New Content] [Problems to be Solved by the Creation] However, the case of the prior example having such a configuration has the following problems. 〃 即 # , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Therefore, if the treatment step is as follows: the periodic liquid exchange treatment is arranged adjacently, the liquid exchange is performed twice in a short time as in the case of regular liquid exchange and treatment: with liquid exchange. Therefore, the problem is that the device with the M328660 liquid exchange process is scheduled. At the time of the fixed-discharge periodic liquid exchange treatment, there is a waste of the treatment liquid, and the production amount is reduced, and the above-mentioned "that is, when the batch is processed, if the batch is processed, the adverse effects such as the adverse effects of the batch are treated. "Processing" is carried out for the following reasons, if you want to treat the batch with only the new liquid, or because the liquid will be extremely deteriorated or contaminated, you want to avoid the follow-up

一又在進仃基板乾燥處理之乾燥處理部,有每隔預先決 疋:清潔時間定期地進行内部洗淨之情形。因&,在首先 固定配置定期洗淨處理後,以在其間穿插之方式配置使用 乾燥處理之資源之時序,但有附帶於處理步驟必須進行内 部洗淨處理之附帶洗淨處理時,仍有浪費洗淨用之處理液 之問題Further, in the drying treatment section in which the substrate is dried, there is a case where the internal cleaning is periodically performed every predetermined time: the cleaning time. In the case of &, after the periodic cleaning process is fixedly arranged, the timing of using the drying process is interposed between them, but there is still a cleaning process attached to the internal washing process in the processing step. Waste the problem of cleaning liquid

並且,「附帶洗淨處理」藉由以下理由進行,即:當處 理批時,料僅在祕臨處理前縣清洗乾淨乾燥處理^ 之内邛時,或因為若處理該批則乾燥處理部之内部會極端 /亏染’想要回避對後續批之相互污染等。 本創作係#於如此之情形所完成者’其目的在於提供— 種即使在批處理時有附帶液交換處理時,亦可防止處理液 浪費,且可提高生產量之基板處理裝置及其控制裝置。之 又,本創作之其他目的在於提供—種即使在批處理上有 附帶液交換處理時亦可防止洗淨液浪費之基板處理 其控制裝置。 置及 [解決問題之技術手段] M328660 ,本:作’為達成上述之目的採用如下之構成。 .、 月长項15己載之創作係一種基板處理裝置,其具 11理t’其係藉由處理液對基板進行處理者;及控制 日;當—邊使用前述處理部之資源—邊處理複數批 者H 際開始處理前決定各資源之使用時序並製定排程 理部於别述控制部製定排程時’基於按照前述處 &液之使用時間規定處理液之壽命之生命時間, ^ 料處理部之資料行處理液交換之定期液交換 與附,理步驟進行處理液之交換之附帶液交換 二過前一附帶液交換處理起 〗之時點、在别述處理部之資源配置定期液 處理’且當伴隨附帶液交換處理之特定處理步驟盘前 述定:液交換處理在時間上重複或鄰接或接近而配置時, 刪除别述定㈣交換處理而優先配置前述特定處理步驟。 控制部在自前一定期液交換 ,理或則-附帶液交換處理起僅經過生命時間之時點、在 ,理部之資源配置定期液交換處理,且當伴隨附帶液交換 處理之特定處理步驟與定期液交換處理在時間上重複或鄰 接或接近而配置時’刪除定期液交換處理而優先配置特定 處理步驟。因此’因為可以防止在短時間内進行附帶液交 換處理及定期液交換處理,故即使係在批之處理時有附帶 量 ,父換處理時亦可防止處理液之浪f,且可以提高生產 並且’此處所謂與定期液交換處理時間上「接近」係指 M328660 自前一附帶液交換處理至生命時間以内。 又,本創作巾,前料定處理步驟宜在即將開始處理步 驟之前伴隨附帶液交換處理(請求項2),前述特定處理步驟 宜在緊隨處理步驟之後伴隨附帶液交換處理(請求項3)^押 要用新液處理批時宜在即將開始處理步驟之前進行附帶: 父換處理,因批之處理而處理液被極端污染或劣化時,宜 在緊隨處理步驟之後進行附帶液交換處理。 、又’本創作中’優先配置之前述特定處理步驟,其附帶 液交換處理宜係在自前一附帶液交換處理或前一定期广六 換處理起至生命時間内(請求項4)。因為向處理部之處理^ 之供給幾乎定期進行’故可防止由於過度長時間空出供給 間隔而於處理液之供給系統產生故障之虞。 又’請求項5記載之創作係—種基板處理裝置之控制裝 置,該基板處理裝置具備藉由處理液對基板進行處理之處 理部’且在前述處理部進行基於按照處理液之使用時間規 定處理液*命之生命時間進行處理液交換之定期液交換處 理去及附帶於處理步驟進行處理液之交換之附帶液交換處 理者,该控制裝置之特徵在於具備:排程部,其係在自前 一定期液交換處理或前—附帶液交換處理起僅經過生命時 間之時點、在前述處理部配置錢液交換處理,且當 附帶液交換處理之特定_ 了田止时〆 ……+疋處理步驟係與前述定期液交換處理 換處理而優先配置前= = 刪除前述定期液交 理實行指示部,盆㈣據而製定排程者;及處 糸根據别述排程部所製定之排程發出處 M328660 理指令者。根據請求項5記載之創作,控制部在自前-定 期液交換處理或前-附帶液交換處理起僅經過生命時間之 時點在處理部之資源配置定期液交換處理,且當伴隨 液交換處理之特定處理步驟係與定期液交換處理時間 複或鄰接或接近而配置時,刪除定期液交換處理優先配置 特定處理步驟。因此,因為可以防止在短時間内進行附帶 液交換處理及定期液交換處理,故即使係在批之處理上有 ::液交換處理時亦可防止處理液之浪費,且可以提高生 借又=請求項6記載之創作係一種基板處理裳置’·其具 觜.乾煉處理部,其係對基板進行乾 部,其係當-邊使用前述乾燥處 資 及控制 批時,在實^門私老 邊處理複數 程者.結決定各資源之使用時序並製定排 之使用時^政在於前述控制部,基於按照前述乾燥處理部 寺曰1错由處理液進行内部洗淨之清潔時間,考慮使 月υ边乾無處理部之資源進行内部洗淨處理之 理、及附帶於處理步驟進行 …先淨處 理,在白a v料灯円先#處理之附帶洗淨處 清潔時間二Γ:料理或前一附帶洗淨處理起僅經過 處理,且*仲 燥處理部之資源配置定期洗淨 期洗淨處洗淨處理之特定處理步驟係與前述定 〜 寺間上重複或鄰接或接近而配置時,刪…乂、十.Further, the "washing treatment" is carried out by the following reasons, that is, when the batch is processed, it is only required to be cleaned and dried in the pre-treatment of the county, or because the batch is dried. The inside will be extreme/defective and want to avoid mutual contamination of subsequent batches. In the case of the author of the present invention, the object of the present invention is to provide a substrate processing apparatus and a control apparatus thereof capable of preventing waste of processing liquid even when there is a liquid exchange treatment in batch processing, and which can increase the throughput. . Further, another object of the present invention is to provide a substrate processing control device which can prevent waste of waste liquid even when there is a liquid exchange treatment in a batch process. [Technical means to solve the problem] M328660, this: The following structure is adopted for the purpose of achieving the above. The creation of the monthly long item 15 is a substrate processing apparatus having a processing method for processing the substrate by the treatment liquid; and a control day; while using the resources of the processing unit while processing The multiple batches of H determine the use timing of each resource before starting the processing, and formulate the schedule management unit when the schedule is specified by the control unit. 'Based on the life time of the treatment liquid according to the usage time of the above-mentioned & liquid, ^ material processing Department of data processing, liquid exchange, periodic liquid exchange and attachment, and the process of the exchange of the treatment liquid, the liquid exchange, the time of the previous liquid exchange treatment, and the resource allocation of the processing unit in the other processing section. Further, when the specific processing step with the accommodating liquid exchange processing is performed as described above: the liquid exchange processing is repeated in time or adjacent or close to each other, the other (4) exchange processing is deleted and the specific processing steps are preferentially arranged. The control unit arranges periodic liquid exchange processing from the previous periodic liquid exchange, the rational or incidental liquid exchange treatment, and only the life time, and the specific processing steps and periodicity accompanying the liquid exchange treatment. The liquid exchange process "deletes the periodic liquid exchange process" when the time is repeated or is arranged adjacent or close to each other, and the specific processing steps are preferentially configured. Therefore, since it is possible to prevent the liquid exchange process and the periodic liquid exchange process from being performed in a short time, even if there is an incidental amount in the batch processing, the treatment liquid can prevent the wave of the treatment liquid, and the production can be improved. 'The term "close" to the periodic liquid exchange treatment time means that M328660 has been processed from the previous liquid exchange to the life time. Further, in the present invention, the pre-processing step should be accompanied by an accompanying liquid exchange process (request item 2) immediately before the start of the processing step, and the specific processing step should be accompanied by the accompanying liquid exchange process (request item 3) immediately after the processing step. When the batch is treated with the new liquid, it is advisable to carry out the processing before the start of the processing step: When the treatment is carried out and the treatment liquid is extremely contaminated or deteriorated due to the treatment of the batch, the liquid exchange treatment should be carried out immediately after the treatment step. In the above-mentioned specific processing steps which are preferentially arranged in the present creation, the liquid exchange processing is preferably carried out from the previous liquid exchange processing or the previous periodic wide processing to the life time (request item 4). Since the supply of the processing to the processing unit is performed almost periodically, it is possible to prevent the supply system of the processing liquid from malfunctioning due to excessive supply of the supply interval for a long time. Further, in the creation system described in the claim 5, the substrate processing apparatus includes a processing unit that processes the substrate by the processing liquid, and the processing unit performs processing based on the usage time of the processing liquid. The liquid exchange process for the exchange of the treatment liquid during the life of the liquid and the liquid exchange process for the exchange of the treatment liquid with the treatment step, the control device is characterized in that it has a scheduling unit, which is based on the previous one. The periodic liquid exchange treatment or the pre-existing liquid exchange treatment is performed at the time when only the life time has elapsed, and the money exchange treatment is disposed in the processing unit, and when the liquid exchange treatment is performed, the specific _ field is stopped. Before the above-mentioned periodic liquid exchange processing is changed, the priority is set before == the above-mentioned periodic liquid delivery execution instruction unit is deleted, and the basin (4) is prepared according to the schedule; and the schedule is issued according to the scheduling section specified by the other scheduling unit M328660 Commander. According to the creation of the request item 5, the control unit arranges the periodic liquid exchange process in the resource of the processing unit at the time when only the life time has elapsed since the pre-rear liquid exchange process or the pre-charge liquid exchange process, and the specificity of the liquid exchange process is accompanied. The processing step is to delete the periodic liquid exchange processing priority configuration specific processing step when the processing step is repeated or adjacent or close to the periodic liquid exchange processing time. Therefore, since it is possible to prevent the liquid exchange process and the periodic liquid exchange process from being performed in a short time, even if it is in the treatment of the batch: the waste of the treatment liquid can be prevented during the liquid exchange treatment, and the borrowing can be improved. The creation described in claim 6 is a substrate processing device. The dry processing unit performs a dry portion on the substrate, and when the drying unit and the control batch are used, the actual door is used. The old-fashioned person handles the multi-party process. When the use of the resource is determined, and the use of the resource is determined, the control unit is based on the cleaning time of the internal cleaning by the treatment liquid according to the drying treatment unit. The internal cleaning process of the resources of the monthly no-processing department and the processing steps are carried out. First, the net treatment is carried out, and the cleaning time at the washing station of the white av light lamp first #process: second time: cooking or The previous processing with the cleaning process is only processed, and the resource processing of the *Bulk Processing Department is periodically repeated. The specific processing steps of the washing process are repeated or adjacent or close to each other. When set, delete ... qe, ten.

疋』洗淨處理而優先配置前述特定處理步驟。…L 理記載之創作’控制部在自前-定期洗淨處 、▼液洗淨理起僅經過清潔時間之時點、在乾燥 M328660 處理部之資源配置定誠淨處理,且#伴隨附帶洗淨處理 之特定處理步驟係與定期洗淨處理在時間上重複 接近而配置時,職定期洗淨處理優先配置教處理步 驟q因此’因為可以防止在短時間内進行附帶洗淨處理及 定期洗淨處理,故即使係在批之處理上有附帶洗淨處理時 亦可防止處理液之浪費,且可以提高生產量。The above-mentioned specific processing steps are preferentially configured in the cleaning process. ...L's documented creation's control unit has been cleaned from the front-period washing place, ▼ liquid cleaning only at the time of cleaning, and the resource configuration in the dry M328660 processing unit is set to be cleaned, and #included with washing treatment When the specific processing step is arranged in such a manner that the periodic cleaning process is repeated in time, the occupational periodic cleaning process preferentially configures the teaching processing step q, so that it is possible to prevent the cleaning process and the periodic cleaning process from being performed in a short time. Therefore, even if there is a washing treatment in the batch processing, the waste of the treatment liquid can be prevented, and the production amount can be increased.

並且,此處所謂與定期洗淨處理時間上「接近」係指自 前一附帶洗淨處理至生命時間以内。 曰 又,本創作中’前述較處理步驟宜在即將開始處理步 驟之前伴隨附帶洗淨處理(請求項7),前料Μ理步驟宜 在緊隨處理步驟之後伴隨附帶洗淨處理(請求項8)。為了批 之乾燥需要預先洗淨内部時,宜在即將開始處理步驟之前 進行附帶洗淨處理,因為乾燥而需要洗淨内部時,宜在= 隨處理步驟之後進行附帶洗淨處理。 又,本創作中,優先配置之前述特定處理步驟,其附帶 液洗淨處理宜係自前一附帶液洗淨處理或前一定期洗淨= 理起之清潔時間内(請求項9)。因為乾燥處理部之洗淨幾= 定期進行,故可防止因過度長時間空出之洗淨間隔而於乾 燥處理部產生故障之虞。 匕 又,請求項10記載之創作係一種基板處理裝置之控制裝 置,該基板處理裝置係具備對基板進行乾燥處理之乾燥處 理部,且在前述乾燥處理部,基於按照前述乾燥處理部之 使用時間藉由處理液進行内部洗淨之清潔時間而進行内部 洗淨處理之定期洗淨處理、及附帶於處理步驟進行内部洗 M328660 附帶冼淨處理者;前述控 備··排程部,直孫/ ώ二 制竑置之特徵在於具 ,、係在自爾一定期洗淨處理 处理起僅經過清潔時間之時點 :附f洗淨 期洗淨處理,且告 ” 則述乾燥處理部配置定 前述定期洗淨處理在時問卜…、特疋處理步驟係與 #j ftA. ^ ^ , 複或鄰接或接近而配置時, :: :Γ淨處理優先配置前述特定處理步称而製定 二::=r部,基__⑽定 产:::求項Μ記載之創作,控制裝置在自前-定期洗淨 二-附帶洗淨處理僅經過清料間之時點、在乾燥 处理:之資源配置定期洗淨處理’且當伴隨附帶洗淨處理 之特定處理步驟係與定期洗淨處理在時間上重複或鄰接或 接近而配置時’刪除定期洗淨處理而優先配置特定處理步 此’因為可以防止在短時間内進行附帶洗淨處理及 定期洗淨處理,故即使係在批之處理上有附帶洗淨處理時 亦可防止處理液之浪費,且可以提高生產量。 【實施方式】 以下’參照圖面對本創作之一實施例進行說明。 圖1係顯示與實施例相關之基板處理裝置之概略構成之 平面圖’圖2係顯示與實施例相關之基板處理裝置之概略 構成之方塊圖。 該基板處理裝置例如係用於對基板W實施藥液處理、洗 淨處理、及乾燥處理之裝置。基板W係以複數塊(例如25塊) 以直立姿勢被收納於盒1。收納有未處理之基板W之盒1被 M328660 載置於投入部3。於人如。θ 才又入邻3具備兩個載置盒1之载置台5。在 夾持基板處理II署夕士 & _ #置之中央部之投入部3之相反側,配備有 :出邛7。'亥輸出部7將已處理之基板W收納於盒1後連同 孤1輸出。此等機能之輸出部7與投入部3同樣,具備用於 載置盒1之兩個載置台9。 在沿投入部3與輸出部7之位置,配置有構成為可在此等 之間移動之第1搬送機構U。第1搬送機構11將複數塊基板 W連同載置於投入部3之盒丨一起向第2搬送機構丨)搬送。 第2搬送機構13從盒1取出所收納之所有基板冒後,向第 3搬送機構15搬送所有基板w。而且,從第3搬送機構15收 取已處理之基板W後,將基板w收納於盒1向第1搬送機構 11搬送。第3搬送機構15之構成為可沿基板處理裝置之長 度方向移動。 在前述第3搬送機構15之移動方向之最前側,配備有用 於將複數塊基板W收納於低壓腔室内並予以乾燥之乾燥處 理部17。 在第3搬送機構15之移動方向鄰接於上述乾燥處理部π 之位置,配備有第1處理部19。該第1處理部19具備用於對 複數塊基板W實施純水洗淨處理之純水洗淨處理部21,且 具備用於藉由處理液對複數塊基板W實施藥液處理之藥液 處理部23。又,具備有在此等之間搬送基板W之副搬送機 構25。該副搬送機構25除在第1處理部19内搬送基板之 外,並在與第3搬送機構15之間交接基板W。 在鄰接於第1處理部19之位置配備有第2處理部27。該第 -12- M328660 2處理部27與前述之第1處理部19係相同之構成。亦即,具 備純水洗淨處理部29、藥液處理部31、及副搬送機構33。 附ά又於第2搬送機構13之盒洗淨部3 5,具有在前述第2搬 送機構13取出所有基板W後洗淨經清空之盒1之機能。 如上構成之基板處理裝置如圖2之方塊圖所示,藉由控 制部37統括控制。 控制部37係由CPU等構成,具備排程部39、及處理實行 指示部41。連接於控制部37之記憶部43預先儲存有:由該 基板處理裝置之使用者等預先製定之包含規定如何處理基 板之複數處理步驟之流程;排程製定程式;及實行製定之 排程之處理程式者等。又,亦儲存有藉由排程製定程式所 製定之排程。 排权邛39將收納於盒丨後載置於投入部3之複數塊基板w 作為-批處理,根據裝置操作者所指示之預先記憶於記憶 443之流程製定排程,以便可在實際開始處理前,按時間 系列有效率地配置每批之處理步驟。 處理實仃指示部41基於藉由排程部39所製定之並記憶於 L P 43之排輊,以合適之時序進行與各處理部等之處理 相關之動作指示。 此處’對具體之流程進行說明。並且,為使說明易於理 、 处僅對包含藥液處理部23及其前後之處理步驟進 行說明’舉較實際之流程更簡化之例進行說明。 …例如,依次處理第1批11、第2批12、第3批13之情形, 第1批L1之、;六本〇 ^. 机私包含相當於藉由第2搬送機構13搬入之處理 •13- M328660 步驟pl、相當於藉由藥液處理部23之藥液處理之處理步驟 p2、及相當於藉由第2搬送機構13搬出之處理步驟p3。第2 批L2及第3批L3包含相當於藉由第2搬送機構13搬入之處理 步驟pl、相當於藉由藥液處理部23之藥液處理之處理步驟 P5 '及相當於藉由第2搬送機構13搬出之處理步驟p3。 並且,此處,定為僅第1批L1之處理步驟p2係在其前附 帶有藥液交換處理ex-b之「特定處理步驟」。該藥液交換 處理ex-b相當於本創作之附帶液交換處理。 ⑩ 其次,參照圖3〜圖5對藉由前述構成之基板處理裝置之 動作進行說明。並且,圖3〜5係顯示排程之製定過程之時 間圖表。 源一邊處理。其配置位置, 例如’控制部37之排程部3 9,首先在藥液處理部23,自 刚次進行之藥液交換處理起經過生命時間T1之時點配置藥 液父換處理。此處,定為從經過生命時間丁丨之^時點直至 Μ時點配置定期液交換處理ex。然後,參照記憶部43之流 _ 程進行第1批以之排程。第1批L1係基於流程藉由處理步驟 • Pl、P2、P3一邊使用第2搬送機構13及藥液處理部23之資 如圖3所示,附帶於處理步驟 p2刖之藥液交換處理ex_b配置於&tl時點至t3時點,相對 於定期液交換處理ex部分重複。 該情形下,排程部3 9, 理 如圖4所示,刪除定期液交換處Further, the term "proximity" with respect to the periodic washing treatment time means that the washing process is within the life time from the previous washing process. In addition, in the present creation, the aforementioned processing step should be accompanied by a washing process (request item 7) immediately before the start of the processing step, and the pre-treatment step should be accompanied by the washing process immediately after the processing step (request item 8) ). In order to dry the inside of the batch, it is advisable to carry out the washing treatment immediately before the start of the treatment step. When it is necessary to wash the inside, it is advisable to carry out the washing treatment after the treatment step. Further, in the present invention, the specific processing step which is preferentially arranged, the liquid washing treatment is preferably carried out in the cleaning time from the previous liquid washing treatment or the previous periodic washing = (request item 9). Since the cleaning of the drying treatment unit is performed periodically, it is possible to prevent the failure of the drying treatment unit due to the excessively long washing interval. Further, the creation of the item 10 is a control device for a substrate processing apparatus including a drying processing unit for drying a substrate, and the drying processing unit is based on the usage time of the drying processing unit. The cleaning process of the internal cleaning process by the cleaning time of the internal cleaning of the treatment liquid, and the internal cleaning of the M328660 with the cleaning process attached to the processing step; the control and scheduling section, Zhisun/ The second type of system is characterized by the fact that it is only after the cleaning time is processed by the cleaning process of the first cleaning process: the cleaning process of the f-washing period is provided, and the drying treatment unit is configured to set the aforementioned periodicity. When the cleaning process is in the middle of the time..., the special processing steps are configured with #j ftA. ^ ^ , complex or adjacent or close, :: : The net processing preferentially configures the aforementioned specific processing step and defines two: :=r Department, base __(10) fixed production::: the creation of the item ,, the control device is cleaned from the front - regular cleaning - the cleaning process is only after the clearing interval, in the drying process: the resource allocation "cleaning process" and when the specific processing steps accompanying the washing process are repeated in time or adjacent or close to each other, the 'removal of the regular washing process is preferentially configured to preferentially configure the specific process step' because it can be prevented Since the washing process and the periodic washing process are performed in a short period of time, even if there is a washing process in the batch process, waste of the processing liquid can be prevented, and the throughput can be increased. [Embodiment] BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a block diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment. The substrate processing apparatus is, for example, a device for performing a chemical liquid treatment, a cleaning treatment, and a drying treatment on the substrate W. The substrate W is housed in the cartridge 1 in a plurality of blocks (for example, 25 blocks) in an upright posture. The cassette 1 of the substrate W is placed on the input unit 3 by the M328660. In the case of θ, the θ is placed in the adjacent stage 3, and the mounting table 5 having the two mounting cassettes 1 is placed. On the opposite side of the input unit 3 of the central part of the center, there is an exit: 7. The output unit 7 stores the processed substrate W in the cassette 1 and outputs it together with the lone 1 . Similarly to the input unit 3, the output unit 7 includes two mounting stages 9 for mounting the cassette 1. At the position along the input unit 3 and the output unit 7, a first transport that is configured to be movable between them is disposed. The first transport mechanism 11 transports the plurality of substrates W together with the cartridge placed on the input unit 3 to the second transport mechanism 。). After the second transport mechanism 13 takes out all the substrates accommodated from the cartridge 1, All the substrates w are transported to the third transport mechanism 15 . After the processed substrates W are collected from the third transport mechanism 15 , the substrates w are stored in the cassette 1 and transported to the first transport mechanism 11 . The third transport mechanism 15 is configured to be movable in the longitudinal direction of the substrate processing apparatus. In the front side of the moving direction of the third conveying mechanism 15, a drying processing unit 17 for storing a plurality of substrates W in a low pressure chamber and drying them is provided. The first processing unit 19 is provided at a position in which the moving direction of the third conveying mechanism 15 is adjacent to the drying processing unit π. The first processing unit 19 includes a pure water washing treatment unit 21 for performing a pure water washing treatment on the plurality of substrates W, and a chemical liquid treatment for performing a chemical liquid treatment on the plurality of substrates W by the processing liquid. Part 23. Further, a sub-transport mechanism 25 that transports the substrate W between them is provided. The sub-transport mechanism 25 transfers the substrate W to and from the third transfer mechanism 15 in addition to the substrate transported in the first processing unit 19. The second processing unit 27 is provided at a position adjacent to the first processing unit 19. The processing unit 27 of the -12th to the M328660 2 has the same configuration as the first processing unit 19 described above. That is, the pure water washing treatment unit 29, the chemical liquid processing unit 31, and the sub transport mechanism 33 are provided. Further, the cartridge cleaning unit 35 of the second transport mechanism 13 has a function of washing out the empty cassette 1 after the second transport mechanism 13 takes out all the substrates W. The substrate processing apparatus constructed as above is integrally controlled by the control unit 37 as shown in the block diagram of Fig. 2 . The control unit 37 is constituted by a CPU or the like, and includes a scheduling unit 39 and a processing execution instruction unit 41. The memory unit 43 connected to the control unit 37 stores in advance a flow including a plurality of processing steps defined in advance by the user of the substrate processing apparatus, including how to process the substrate, a scheduling program, and a process of executing the scheduled schedule. The programmer waits. Also, schedules prepared by scheduling programs are stored. The dispatching unit 39 processes the plurality of substrates w placed in the cassette 3 and placed in the input unit 3 as a batch process, and schedules the memory in advance according to the procedure indicated by the device operator, so that the processing can be started actually. Before, the processing steps of each batch are efficiently configured according to the time series. The processing instruction unit 41 performs an operation instruction related to the processing of each processing unit or the like at an appropriate timing based on the memory set by the scheduling unit 39 and stored in the L P 43. Here is a description of the specific process. Further, in order to make the description easy to understand, only the processing steps including the chemical processing unit 23 and the processing steps before and after the processing are described, and the actual flow is simplified. For example, in the case of processing the first batch 11, the second batch 12, and the third batch 13 in sequence, the first batch of L1; the six stacks; the machine privately includes the processing by the second transport mechanism 13; 13- M328660 The step pl corresponds to the processing step p2 of the chemical liquid treatment by the chemical processing unit 23 and the processing step p3 corresponding to the second transport mechanism 13 being carried out. The second batch L2 and the third batch L3 include a processing step pl corresponding to the loading by the second transport mechanism 13, a processing step P5' corresponding to the chemical liquid processing by the chemical processing unit 23, and a second processing step 2 The processing step p3 in which the transport mechanism 13 is carried out. In addition, here, only the processing step p2 of the first batch L1 is preceded by a "specific processing step" in which the chemical liquid exchange processing ex-b is attached. This chemical exchange treatment ex-b corresponds to the accompanying liquid exchange treatment of the present creation. 10 Next, the operation of the substrate processing apparatus having the above configuration will be described with reference to Figs. 3 to 5 . Also, Figures 3 to 5 show time charts showing the process of setting up the schedule. Source side processing. In the arrangement position, for example, the scheduling unit 319 of the control unit 37 first arranges the liquid medicine parenting process at the time when the chemical liquid processing unit 23 has passed the life time T1 from the chemical liquid exchange process that has just been performed. Here, it is assumed that the periodic liquid exchange process ex is arranged from the time point of the passage of the life time to the time point of the time. Then, the first batch is scheduled in accordance with the flow of the memory unit 43. The first batch of L1 is based on the flow of the second transfer mechanism 13 and the chemical liquid processing unit 23 by the processing steps P1, P2, and P3, as shown in Fig. 3, and the chemical liquid exchange processing ex_b attached to the processing step p2. When it is set from & tl to t3, it is partially repeated with respect to the periodic liquid exchange process ex. In this case, the scheduling unit 3 9, as shown in FIG. 4, deletes the periodic liquid exchange.

置較好是藥液交換處理ex-b係納入 入生命時間 b起經 -14- M328660 T1内。因為向藥液處理部23之處理液之供給幾乎定期(每 隔生命時間T1)進行,故可防止因相對於藥液處理部以過 度長時間空出供給間隔而於處理液之供給系統產生故障之 虞。 其次,關於第2批L2及第3批L3,因為附帶於處理步驟 P5之液交換處理ex-b不存在,故如圖5所示,在第HfcL1、 、 藥液交換處理ex-b、及定期液交換處理以之間適當地配置 _ 處理步驟心1^,。並且,在自配置於t5時點之前一定 期液交換處理ex起經過生命時間T1後之(6時點配置下一定 期液交換處理ex。 如此,在排程部39製定使用各處理部之資源之排程後, 處理實行指示部41根據各資源之使用時序對各部進行指 示,實際地處理各批。 如上所述之控制部37,在自前一液交換處理起僅經過生 命時間T1之時點,在藥液處理部23之資源配置定期液交換 馨 處理eX,且當伴隨附帶液交換處理ex-b之特定處理步驟係 , 與定期液交換處理π在時間上重複配置時,刪除定期液交 換處理ex而優先配置特定處理步驟ρ2。因此,因為可以防 止在短時間内進行附帶液交換處理ex_b及定期液交換處理 ex,故即使係在處理上有附帶液交換處理以讣時亦可防止 處理液之浪費。 本創作並不限定於上述實施形態,可實施如下之變形。 (1)定期液交換處理ex與附帶液交換處理ex吨,不僅係在 如上所述之部分重複時,即使係在鄰接、或僅隔開一點時 -15- M328660 間之鄰接(接近)時,亦可刪除定期液交換處理ex而配置附 帶液交換處理ex-b。並且,此處所謂之時間上之鄰接(接近) 係指在生命時間T1以内。 例如如圖6所示,雖然在自前一液交換處理起經過生 命時間T1之時點配置有定期液交換處理以,但當自此刻僅 隔開一點時間配置處理步驟0時,只要刪除定期液交換處 理ex,配置伴隨附帶液交換處理ex_b之處理步驟a即可。Preferably, the excipient exchange treatment ex-b is included in the life time b from -14- M328660 T1. Since the supply of the treatment liquid to the chemical solution processing unit 23 is performed almost periodically (every life time T1), it is possible to prevent the supply of the treatment liquid from malfunctioning due to excessive supply of the supply interval with respect to the chemical treatment unit. After that. Next, in the second batch L2 and the third batch L3, since the liquid exchange processing ex-b attached to the processing step P5 does not exist, as shown in FIG. 5, the HfcL1, the chemical liquid exchange processing ex-b, and The periodic liquid exchange process is appropriately configured between the processing steps 1 . In addition, after the life cycle T1 has elapsed from the time when the liquid exchange process ex is performed at the time t5, the next periodic liquid exchange process ex is arranged at 6 o'clock. In this way, the scheduling unit 39 creates a row of resources for using each processing unit. After the process, the processing execution instructing unit 41 instructs each unit in accordance with the use timing of each resource, and actually processes each batch. The control unit 37 as described above is only at the time when the life time T1 has elapsed since the previous liquid exchange process. The resource of the liquid processing unit 23 is configured to periodically discharge the liquid exchange process eX, and when the specific process step associated with the liquid exchange process ex-b is repeated with the periodic liquid exchange process π, the periodic liquid exchange process ex is deleted. The specific processing step ρ2 is preferentially arranged. Therefore, since the liquid exchange processing ex_b and the periodic liquid exchange processing ex can be prevented from being performed in a short time, the waste of the treatment liquid can be prevented even if there is a liquid exchange treatment in the treatment. The present invention is not limited to the above embodiment, and the following modifications can be made. (1) Periodic liquid exchange treatment ex and incidental liquid exchange treatment ex tons, When only the above-mentioned partial repetition is repeated, even if it is adjacent (close to) between -15-M328660 when it is adjacent or separated only a little, the periodic liquid exchange process ex can be deleted and the liquid exchange process ex- b. In this case, the temporal adjacency (proximity) means that it is within the life time T1. For example, as shown in Fig. 6, although the liquid exchange process is arranged at the time point of the life time T1 from the previous liquid exchange process. However, when the processing step 0 is arranged only once at a time from this point, the processing step a accompanying the liquid exchange processing ex_b may be arranged as long as the periodic liquid exchange processing ex is deleted.

並且,在自附帶液交換處理以吨起經過生命時間丁丨後配置 定期液交換處理ex。 (2)不僅係在處理步驟以之前進行液交換(附帶液交換處 理ex-b),即使係在其後進行液交換,亦可與上述同樣地製 疋排程。例如,如圖7所示,如在處理步驟?2後之附帶液 交換處理仏績定㈣交換處理㈣複時,只要刪除定期 液交換處理ex’配置處理步驟p2及附帶液交換處理㈣, 並在自附帶液交換處理㈣起經過生命時㈣後配置定期 液交換處理ex即可。 ⑺上述之實施例中,對在藥液處理部23伴隨藥液之液 交換處理時之例進行了說明,但例如,即使係在乾燥處理 部17附帶於乾燥處理之内部之洗淨處理,藉由進行與上述 同樣之排程,亦可發揮與上述實施例㈣之制及效果。 亦P右將上述實施例之藥液處理部23與乾燥處理部口 置換’使定㈣交換處理成為基於根據乾職理部〗 、用:間藉:處理液進行内部洗淨之清潔時間、進行内部洗 淨处理之定期洗淨處理,且使附帶於特定處理步驟之處理 -16 - M328660 步驟P2之前或後之附帶液交換處理作為定期洗淨處理,藉 由進行與上述說明同樣之排程,可以一面實施藥液處理部 23之定期之槽洗淨、及伴隨處理步驟之附帶之槽洗淨一面 防止洗淨用之處理液之浪費。 (4)上述之實施例中,對同時處理3批之情形進行例示説 月但即使係同時處理1〜2批或4批以上之情形亦可適用 本創作。 [創作之效果] 根據與本創作相關之基板處理裝置及控制裝置,自前一 定期液交換處理或前一附帶液交換處理僅經過生命時間之 時點、在處理部之資源配置定期液交換處理,且當伴隨附 帶液交換處理之特定處理步驟與定期液交換處理在時間上 重複或鄰接或接近配置時,刪較期液交換處理而優先配 置:定處理步驟。因此’因為可防止在短時間内進行附帶 液父換處理及定期液交換處理,故即使係在批之處理上有 附帶液交換處理時亦可防止處理液之浪費,且可以提高生 產量。 ° 【圖式簡單說明】 圖1係顯示與實施例相關之基板處理裝置之概略構成之 平面圖。 圖2係顯示與實施例相關之基板處理裝置之概略構 方塊圖。 圖3係顯示排程之製定過程之時間圖表。 圖4係顯示排程之製定過程之時間圖表。 -17- M328660 圖5係顯示排程之製定過程之時間圖表。 圖6係顯示其他之配置例之時間圖表。 圖7係顯示緊隨特定處理步驟之後有附帶液交換處理之 情形之配置例之時間圖表。 【主要元件符號說明】In addition, the regular liquid exchange process ex is arranged after the life-time time is ton from the incidental liquid exchange treatment. (2) The liquid exchange (with the liquid exchange treatment ex-b) is carried out not only before the treatment step, but also in the same manner as described above, even if the liquid exchange is performed thereafter. For example, as shown in Figure 7, as in the processing steps? (2) After the replacement (4), the periodic liquid exchange process ex' placement process step p2 and the incidental liquid exchange process (4) are deleted, and after the life (4) is passed from the attached liquid exchange process (4) Configure the periodic liquid exchange process ex. (7) In the above-described embodiment, the example in which the chemical liquid processing unit 23 is subjected to the liquid exchange treatment of the chemical liquid has been described. However, for example, even if the drying processing unit 17 is attached to the cleaning process inside the drying process, By performing the same schedule as described above, the effects and effects of the above-described embodiment (4) can also be exerted. In addition, the chemical liquid processing unit 23 and the drying processing unit port of the above-described embodiment are replaced by the "fourth" exchange process, and the cleaning time is performed based on the dry work department and the internal cleaning process. The periodic washing treatment of the internal washing treatment, and the incidental liquid exchange treatment before or after the treatment - 1628, M328660, step P2, which is attached to the specific processing step, is performed as a periodic washing process, and the same schedule as described above is performed. It is possible to prevent the waste of the treatment liquid for washing while performing the regular tank washing of the chemical liquid processing unit 23 and the tank washing accompanying the processing step. (4) In the above embodiment, the case where three batches are simultaneously processed is exemplified, but the present invention can be applied even in the case of processing 1 to 2 batches or 4 batches or more at the same time. [Effects of Creation] According to the substrate processing apparatus and the control device related to the present creation, the periodic liquid exchange process is performed only at the time of the life cycle from the previous periodic liquid exchange process or the previous liquid exchange process, and When the specific processing steps accompanying the liquid exchange processing and the periodic liquid exchange processing are repeated in time or adjacent or close to each other, the liquid phase exchange processing is deleted and preferentially configured: a processing step. Therefore, since the incidental liquid replacement process and the periodic liquid exchange process can be prevented from being performed in a short period of time, waste of the treatment liquid can be prevented even if the liquid exchange treatment is performed in the batch process, and the production yield can be improved. [Brief Description of the Drawings] Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment. Fig. 2 is a block diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment. Figure 3 is a time chart showing the process of setting up the schedule. Figure 4 is a time chart showing the development process of the schedule. -17- M328660 Figure 5 is a time chart showing the process of setting up the schedule. Fig. 6 is a time chart showing other configuration examples. Fig. 7 is a timing chart showing a configuration example in the case where there is an accompanying liquid exchange process immediately after a specific processing step. [Main component symbol description]

W 基板 1 盒 3 投入部 5 載置台 7 輸出部 9 載置台 11 第1搬送機構 13 第2搬送機構 15 第3搬送機構 17 乾燥處理部 19 第1處理部 21 純水洗淨處理部 23 藥液處理部 25 副搬送機構 27 第2處理部 29 純水洗淨處理部 31 藥液處理部 33 副搬送機構 35 盒洗淨部 -18 - M328660 37 控制部 39 排程部 41 處理實行指示部 43 記憶部 ex-b 藥液交換處理 ex 定期液交換處理W substrate 1 cassette 3 input unit 5 mounting table 7 output unit 9 mounting table 11 first conveying mechanism 13 second conveying mechanism 15 third conveying mechanism 17 drying processing unit 19 first processing unit 21 pure water washing processing unit 23 chemical liquid Processing unit 25 Sub-transporting mechanism 27 Second processing unit 29 Pure water washing processing unit 31 Chemical liquid processing unit 33 Sub-transporting mechanism 35 Cartridge cleaning unit -18 - M328660 37 Control unit 39 Scheduling unit 41 Processing instruction unit 43 Memory Ex-b chemical exchange treatment ex regular liquid exchange treatment

-19--19-

Claims (1)

M328660 九、申請專利範圍: !.-種基板處理裝置,其係包含:處理部 、为斟I 、隹—各 1糸猎由處理 液對基板進仃處理者;及控制部,其 考掷划*次、s 田邊使用前述 处α貝"、ϋ處理複數批時,在實際開始處理 定各資源之使用時序並製定排程者; /、 其特徵在於: 前述控制部製定排程時’基於按照前述處理部之處理 液之使用時間以處理液壽命之生命時間,考慮使用前 述處理部之資源進行處理液交換之定㈣交換處理、及 附2於處理步料行處理㈣換之附帶液交換處理,在 自前-定期液交換處理或前—附帶液純處理起僅經過 生命時間之時點、在前述處理部之資源配置定期液交換 處理’且當伴隨附帶液錢處理之特定處理步驟係與前 述定期液交換處理在時間上重複或鄰接或接近而配置 時,刪除刖述定期液交換處理而優先配置前述特定處理 步驟。 2 ·如請求項1之基板處理裝置,其中 刖述特定處理步驟係在即將開始處理步驟之前伴隨附 帶液交換處理。 3·如請求項2之基板處理裝置,其中 刖述特定處理步驟係緊隨處理步驟之後伴隨附帶液交 換處理。 4.如明求項1至3中任一項之基板處理裝置,其中 優先配置之前述特定處理步驟,其附帶液交換處理係 -20- M328660 自前一附帶液交換處理或前一定期液交換處理起之生命 時間内。M328660 IX. Patent application scope: !.- Kind of substrate processing device, which comprises: a processing unit, which is a 斟I, a 隹-one 糸 hunter, the processing liquid is applied to the substrate; and the control unit *Time, s. When the field uses the above-mentioned α-bee and quot;, when processing a plurality of batches, the processing sequence of each resource is actually started and the scheduler is set; /, and the characteristics are as follows: According to the use time of the treatment liquid in the treatment unit, the life of the treatment liquid is used, and the treatment liquid exchange is performed using the resources of the treatment unit (4), and the treatment is carried out. The treatment is performed in the resource-distributed periodic liquid exchange process of the resource in the processing unit from the time when the life-time is passed from the pre-reported liquid exchange treatment or the pre-liquidation treatment, and the specific processing steps accompanying the liquid money treatment are When the periodic liquid exchange process is repeated in time or adjacent or close to each other, the above-described specific process steps are preferentially arranged by deleting the periodic liquid exchange process. 2. The substrate processing apparatus of claim 1, wherein the specific processing step is accompanied by an attached liquid exchange process immediately before the processing step is started. 3. The substrate processing apparatus of claim 2, wherein the specific processing step is followed by the accompanying liquid exchange processing immediately after the processing step. 4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the specific processing step of preferentially arranging the liquid exchange treatment system -20-M328660 from the previous liquid exchange treatment or the previous periodic liquid exchange treatment From the life time. 6. 一種基板處理裝置之控制裝置,該基板處理裝置係包含 藉由處理液對基板進行處理之處理部,且在前述處理部 進行基於按照處理液之使用時間規定處理液之壽命之生 命時間進行處理液交換之定期液交換處理、及附帶於處 理步驟進行處理液交換之附帶液交換處理者;前述控制 裝置之特徵在於包含: 排程部,其係在自前一定期液交換處理或前一附帶液 交換處理起僅經過生命時間之時點、在前述處理部配置 定期液交換處理,且當伴隨附帶液交換處理之特定處理 步驟係與前述定期液交換處理在時間上重複或鄰接或接 近而配置時,刪除前述定期液交換處理而優先配置前述 特定處理步驟並製定排程者;及 處理實行指示部,其係基於前述排程部所製定之排程 發出處理指令者。 一種基板處理裝置,其係包含··乾燥處理部,其係對基 板進行乾燥處理者;及控制部,其係t_邊使用前述ς =處理部之資源-邊處理複數批時,在實際開始處理前 决疋各貧源之使用時序並製定排程者; 其特徵在於 前述控制部,基於按照前述乾燥處理部之 由處理液進行内部洗淨之清潔時間,考身使 、a错 ^ Λτζ 专慮使用刖述乾條 處理部之貧源進行内部洗淨處理之定期洗淨處理、及: -21 - M328660A control device for a substrate processing apparatus, comprising: a processing unit that processes a substrate by a processing liquid, and wherein the processing unit performs a life time based on a life of the processing liquid according to a usage time of the processing liquid. The periodic liquid exchange process for the treatment liquid exchange, and the additional liquid exchange process for the treatment liquid exchange attached to the treatment step; the control device is characterized by comprising: a scheduling unit, which is attached to the previous periodic liquid exchange process or the previous When the liquid exchange process is performed only at the time of the life time, the periodic liquid exchange process is disposed in the processing unit, and when the specific process step associated with the liquid exchange process is repeated in time or adjacent or close to the periodic liquid exchange process And deleting the predetermined liquid exchange process to preferentially arrange the specific processing steps and formulating the scheduler; and the process execution instruction unit that issues the process command based on the schedule defined by the scheduler. A substrate processing apparatus comprising: a drying processing unit that performs drying processing on a substrate; and a control unit that starts t_ while processing the plurality of batches using the resource of the processing unit of the ς = processing unit Before the treatment, the use timing of each of the lean sources is determined and the scheduler is set up; the control unit is characterized in that the control unit is based on the cleaning time of the internal cleaning by the treatment liquid according to the drying treatment unit, and the test is made, and the error is made. The periodic washing treatment of the internal washing treatment using the poor source of the dry strip processing section is considered, and: -21 - M328660 帶於處理步驟進行内部洗淨處理之附帶洗淨處理,在自 則一定期洗淨處理或前一附帶洗淨處理起僅經過清潔時 間之時點、在前述乾燥處理部之資源配置定期洗淨處 理,且當伴隨附帶洗淨處理之特定處理步驟係與前述定 期洗淨處理在時間上重複或鄰接或接近而配置時,刪除 前述定期洗淨處理而優先配置前述特定處理步驟。 7_如睛求項6之基板處理裝置,其中 前述特定處理步驟在即將開始處理步驟之前伴隨附帶 洗淨處理。 8 ·如睛求項6之基板處理裝置,其中 月述特定處理步驟在緊隨處理步驟之後伴隨附帶洗淨 處理。 9.如請求項6至8中任一項之基板處理裝置,其中 >優先配置之前述特定處理步驟,其附帶洗淨處理係自珂一附帶洗淨處理或前一定期洗淨處理起之清潔時間 内0 ^ 10 •一種基板處理裝置之控制裝置,該基板處 理裝置包含對 基板進行乾燥處理之乾燁虛视加 α ^ ^ 乾森處理部,且在前述乾燥處理 部 進行基於按照前述乾燥處理部之使用時間藉由處理 行内部洗淨之清潔時間,進行内部洗淨處理之定 處理、及附帶於處理步驟進行 / 處理; 丁冏邛冼孕處理之附帶洗淨 前述控制裝置之特徵在於包含: 排程部’其係在自前一定期洗淨處理或前 一附帶洗淨 -22- M328660 處理起僅經過清、暫 定4㈣之時點、在前述乾燥處理部配置 *處理,且當伴隨附帶洗淨處理之特定處理牛. =前述定期洗淨處理在時間上重複或鄰接:接= 發部,其係基於前述排程部所製定之拆程 -23- M328660 七、指定代表圖: (一) 本案指定代表圖為:第(4 )圖。 (二) 本代表圖之元件符號簡單說明: (二)本代表圖之元件符號簡單說明·· 13 第2搬送機構 23 藥液處理部 ex-b 藥液交換處理 ex 定期液交換處理 LI 第1批 Pi 處理步驟 P2 處理步驟 P3 處理步驟 T1 生命時間The cleaning process is carried out in the internal washing process, and the cleaning process is performed only after the cleaning time is passed from the regular cleaning process or the previous cleaning process, and the resource is periodically washed in the drying process unit. And when the specific processing step accompanying the washing process is arranged in time or overlapping or close to the periodic washing process, the periodic washing process is deleted and the specific processing step is preferentially arranged. The substrate processing apparatus of claim 6, wherein the specific processing step is accompanied by an accompanying cleaning process immediately before the processing step is started. 8. The substrate processing apparatus of claim 6, wherein the specific processing step of the month is accompanied by the accompanying cleaning process immediately after the processing step. 9. The substrate processing apparatus according to any one of claims 6 to 8, wherein the specific processing step of the prior arrangement is preceded by the cleaning process from the cleaning process or the previous periodic cleaning process. 0 ^ 10 in the cleaning time. 1. A control device for a substrate processing apparatus, comprising: a drying process for drying a substrate, and a drying process according to the drying process The use time of the processing unit is determined by the cleaning time of the internal cleaning process, the internal cleaning process, and the processing step. The control device is characterized in that the control device is attached to the cleaning device. Including: the scheduling unit is disposed at the time of the previous drying treatment step or the provision of the previous cleaning treatment or the previous cleaning step -22-M328660, and is disposed in the drying processing unit*, and is accompanied by the washing Specific treatment of the net treatment. = The aforementioned periodic washing treatment is repeated in time or adjacent: the connection is based on the departure of the above-mentioned scheduling department. -23- M328660 VII. Designated representative map: (1) The representative representative of the case is: (4). (2) A brief description of the component symbols of the representative drawing: (2) A brief description of the component symbols of the representative drawing. · 13 Second conveying mechanism 23 Chemical liquid processing unit ex-b Chemical liquid exchange processing ex Periodic liquid exchange processing LI No. 1 Batch Pi processing step P2 processing step P3 processing step T1 life time
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