M323066 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱裝置，尤指一種用於電腦主機 板上的水冷式散熱裝置。 【先前技術】 用於電腦主機板之散熱裝置，從早期的鋁擠型散埶臀 的氣冷式散熱裝置，然而隨著電腦處理速肩 “及口琶子元件或裝置所產生的熱量不斷向上攀昇 :者：：冷散熱裝置應用在電腦主機板上，已逐漸受到使 用者所射及採用；因此，f者為迎合市場的強 吏 f續開發設計有多種的水冷散熱裝置，而該等散鮮置或 些待解決的技術課題， ί:Π:重點’並對水冷散熱裝置進行創新改良。 Α排白散熱裝置’主要包括水冷散熱模組、水 7排、水泵及稷數連通管，苴 電路板上，且1 —端面貼垃〕 ^熱模組係固定在 排、水粟則分別固====件之頂面’而水冷 處，並藉由連通管分別連通部的其他位置 此，以構成-水冷散熱裝置。7、…非及泵浦；如 然而，習知之水冷式散埶 各自分離型態，且分別安穿固：：於其各組成構件係 :位置上，其在裝設的過程‘各内部的其 與固定，相當的耗費组裝 牛進…的裝設 人力成本；另，當各構件 M323066 構件發生損壞時’往往需要對該電腦進行長時 :=維，甚至造成操作人員待工的成本耗損，相當 、、仃口經濟效益；著實亟待加以改善者。 【新型内容】 作之目的，在於提供一種模組化水冷散熱裝 错由整體結構的模組化設置，可與電腦主機板做 且衣連接，而大幅減少裝配時間及人力成本。 私相ί 了達成上述之目㈤，本創作係提供—種模組化水冷 “’、衣置，用於主機板之發熱元件的散熱，並與一散埶模 „包括—固定架、一水泵、一水冷排及複數連通、 /、中忒固疋条係架設在主機板上方，且對應於主機板 之裔熱元件配置，水栗係連接於固定架上，該水泵具有一 出水官及-入水管，而水冷排係固接於固定架之上方 水冷排具有一 進水官及-排水管，另料連通㈣分誠通於水栗、水 冷排之各水管及散熱模組。 本幻作之另-目的，在於提供—種模組化水冷散熱裝 置：其在損壞的維修過程中’可先以另一組水冷散熱裝置 換衣使用’再對原來的水冷散熱I置做詳細的檢測維護， 而大幅降低電腦的待機時間及人員待工所造成的成本浪 費。 【實施方式】 M323066 有關本創作之詳細說明及技術内容，配合圖式說明如 下，然而所附圖式僅提供參考與說明用，並非用來對本創 作加以限制者。 - 請參照第一及二圖所示，係分別為本創作之固定架、 水泵及水冷排立體分解圖及用以供本創作連通的散熱模組 •及記憶體模組，本創作提供一種模組化水冷散熱裝置，用 •於主機板8(第三圖）之發熱元件的散熱，此發熱元件係可 • 為記憶體模組81或顯示卡模組（圖未示）等，並與一水冷 式散熱模組9連通，該散熱裝置主要包括-固定架10、I 水泵20、一水冷排30及複數連通管4〇，其中： ㈣^㈣具有-平底倒「U」形框體u，於框體^ 之：端角落處分別延伸有貼接板12，於各貼接板12上開設 有穿孔13 ;另於框體n左側之中段處向内彎曲延伸有二相 對應的折板14 ’於各折板14上開設有螺孔15，· X，在框體 11頂面矩形通風孔16，於通風孔16之_侧邊延ς _ 有一定位;17。 該水栗20之左、右兩端分別延伸有凸耳21，並於各^ 耳21上開設有對應前述螺孔15的通孔22，以供螺絲等_ 凡件鎖固’謂水泵2Q固定連接在前述之框體丨丨側邊上. =水㈣之左側及頂面中間處分別凸伸有與其内 ; 出水管23及入水管24 〇 ' 該水冷排30固接於前述框㈣之上方，此水 包含有二圓形管31、四根連通於各圓形㈣的㈣ 及在扁形管體31之兩端面分別貼接有多數的散熱片二；另 M323066 的一進水管34 在左侧圓形管31之前端延伸有連通於其内 及一排水管35。 、 一第二圖所示，該水冷式散熱模组9包含—輪水管9]、 伙鈿水官91之-側延伸出的第-散熱板92、及一連接於 第一散熱板92侧邊的第二散熱㈣，該等散熱板92、= 内侧為平坦面用以貼接於記憶體模組δΐ之各記憶體上，另 各散熱板92、93外側凸伸有多數相 散熱表面積。 丁以增加 請續參照第三、四及五圖所示，係分 Γ:憶體模組立體分解圖、使用狀態圖及組合剖視圖:： :作之散熱裝置係可用於多數並列的記憶體模組δι的散 熱’組合時先將散熱模組9之各散熱板92、93分別央固於 =體模組81之前、後兩端面上，再以U形彎管94分別套 接連通於相鄰散熱模組9之輪水㈣一端，以組合 聯式循環迴路；此外，f ——Γ ^ 、， 、格，此外，其亦可為一並聯式循環迴路（圖未 不）；次將前述貼接板12之穿孔13對正於主機板8之貫通 孔置放，再以螺絲等螺固元件鎖固連接；最後，將一連通 兩端分別套接於水泵2〇之出水管烈及散熱模組9之 别水:91 —端’另一連通管40之兩端分別套接於水系20之 =水吕24及水冷排30之排水管35，又一連通管仙之兩端則 ^縣接於水冷排30之進水管34及另—散熱模組9之輪水 官則一端；如此，即可完成本創作之散熱裝置與主機板8 之圯杈組81組合裝設；使用時藉由水泵2〇的作動，以 令工作流體可在水泵2Q、水冷賴、各連通㈣及散熱模〜 M323066 組9之間循環流通，而對記憶體模組別之記憶體 散熱。 快逮 請參照第六圖所示，係為本創作之另一實施例組 視圖，本創作之散熱裝置除了可為上述實施例外，亦= 本實施例之型態，其更包括有一風扇5〇，該風扇训係固: 連接於水冷排30上，當該風扇5〇開始運轉後，可將= 流吹向水冷排30之扁形管32及散熱片33 ;繼之，流: 11之通風孔16，並對散熱模組9及其周邊的其他電;^元^ 或裝置作冷氣流的吹送與強制性散熱，而大幅提昇作 之散熱效能。 請=第七圖所示’係為本創作之又一實施例組合剖 圖’本貫知例之固定架10,係由一框體11，及二分別、車 ^於框體11’之左 '右兩侧的固定臂18及彈性夾掣臂⑺所 =哭與彈性夾挈臂19係分別央扣固定於記憶體 : 扳柄上，進而達成本創作與主機板8的快速組 產堂2所述，#知本創作之模域水冷散熱裝置已具有 穎性與進步性’又本創作之構造亦未曾見 :。開使用’完全符合新型專利申請要件，爰 依專利法提出申請。 【圖式簡單說明】 第 第一：：：創作之固定架、水泵及水冷排立體分解圖。 .田係用以供本創作連通的散熱模組及記憶體模組。 M323066 第三圖 第四圖 第五圖 第六圖 第七圖 系本創作應用於記憶體模組立體分解圖。 =f創作應用於記憶體模組使用狀態圖。 仫士，作應用於記憶體模組組合剖視圖。 係本創作:^ ^ 〆I作之另一實施例組合剖視圖。 糸創作之又一實施例組合剖視圖。 【主要元件符號說明】 【本創作】 固定架10、10， 貼接板12 折板14 通風孔16 固定臂18 框體11、11， 穿孔13 螺孔15 定位板17 彈性夾掣臂19 水泵20 凸耳21 出水管23 水冷排30 圓形管31 散熱片33 排水管35 通孔22 入水管24 扁形管32 進水管34 連通管40 風扇50 主機板8 記憶體模組81 M323066 散熱模組9 輸水管91 第二散熱板93 第一散熱板92 彎管94M323066 VIII. New Description: [New Technology Field] This creation is about a heat sink, especially a water-cooled heat sink for computer motherboards. [Prior Art] The heat sink for the computer motherboard, from the early aluminum extrusion type air-cooled heat sink, but with the computer processing speed shoulder "and the heat generated by the mouthpiece components or devices continue upwards Climbing: The following: The application of the cooling device on the computer motherboard has been gradually adopted and adopted by the user; therefore, in order to meet the market's strength, the design has a variety of water-cooling heat sinks. Fresh or some technical issues to be solved, ί: 重点: Focus 'and innovative and improved water-cooling heat sinks. Α 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排 排On the circuit board, and 1 - end face sticking ^ ^ The thermal module is fixed in the row, the water mill is fixed ==== the top surface of the piece' and the water is cold, and the other parts of the communication part are connected by the connecting pipe , to constitute a water-cooling heat sink. 7, ... and not pump; as a matter of course, the conventional water-cooled divergence is separated and solidified separately: in its component system: position, it is installed The process of setting up With the fixed, considerable cost of assembling the manpower into the cattle; in addition, when the components of the M323066 component are damaged, it is often necessary to carry out long-term operation of the computer: = dimension, even causing the operator to work at a cost, Equivalent, and economic benefits; the new ones need to be improved. [New content] The purpose is to provide a modular water-cooling heat-dissipation module with a modular structure of the overall structure, which can be connected with the computer motherboard. , and significantly reduce the assembly time and labor costs. Private phase ί to achieve the above objectives (5), this creation provides a kind of modular water-cooled '', clothing, for the heat dissipation of the heating elements of the motherboard, and a scattered埶 „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ In the above, the water pump has a water discharge official and an inlet water pipe, and the water-cooled drainage system is fixed on the upper side of the fixed frame, and the water-cooled drainage row has a water inlet official and a drainage pipe, and the other materials are connected (4). The water pipes and heat-dissipating modules of the cold row. The other purpose of this illusion is to provide a modular water-cooling heat sink: it can be changed to another set of water-cooling heat sinks during the repair process. The original water-cooling heat-dissipation I will be tested and maintained in detail, and the computer's standby time and the cost of personnel waiting for work will be greatly reduced. [Embodiment] M323066 Detailed description and technical content of this creation, with the description of the drawings The following drawings are provided for reference and explanation only, and are not intended to limit the creation. - Please refer to the first and second figures for the creation of the fixed frame, water pump and water-cooled row. And the heat dissipation module and the memory module for connecting the creation, the present invention provides a modular water-cooling heat dissipation device for heat dissipation of the heating element of the motherboard 8 (third diagram), the heating element The memory module 81 or the display card module (not shown) is connected to a water-cooled heat dissipation module 9, and the heat dissipation device mainly includes a fixing frame 10, an I water pump 20, and a The cold row 30 and the plurality of connecting tubes 4〇, wherein: (4)^(4) has a flat-bottomed "U"-shaped frame body u, and a fixing plate 12 is extended at the end corners of the frame body, respectively, at each of the bonding plates 12 The upper opening is provided with a perforation 13; and the middle portion of the left side of the frame n is bent inwardly and has two corresponding flaps 14'. The respective folds 14 are provided with screw holes 15, X, and the top surface of the frame 11 is rectangular. The venting opening 16 extends from the side of the venting opening _ _ has a positioning; The left and right ends of the water chestnut 20 respectively extend with a lug 21, and a through hole 22 corresponding to the screw hole 15 is opened in each of the ears 21 for screwing, etc. Connected to the side of the frame body .. = water (4) on the left side and the top surface of the top surface respectively protruded therein; the water outlet pipe 23 and the water inlet pipe 24 〇 ' The water cooling row 30 is fixed above the frame (4) The water includes two circular tubes 31, four (four) connected to each of the circular shapes (four), and a plurality of fins 2 attached to both end faces of the flat tube body 31; and an inlet pipe 34 of the M323066 on the left side The front end of the circular tube 31 extends to communicate with it and a drain pipe 35. As shown in FIG. 2, the water-cooling heat dissipation module 9 includes a water tube 9], a first heat dissipation plate 92 extending from the side of the water sump 91, and a side connected to the first heat dissipation plate 92. The second heat dissipation (4), the heat dissipation plates 92, = the inner side is a flat surface for attaching to the respective memory of the memory module δ, and the other heat dissipation plates 92, 93 have a plurality of heat dissipation surface areas protruding outside. In addition, please refer to the third, fourth and fifth figures. The system is divided into three parts: the three-dimensional exploded view of the memory module, the use state diagram and the combined sectional view:: The heat sink is used for most of the parallel memory models. When the heat dissipation of the group δι is combined, the heat dissipation plates 92 and 93 of the heat dissipation module 9 are respectively fixed on the front and rear end faces of the body module 81, and then the U-shaped elbows 94 are respectively sleeved and connected to each other. The end of the water (4) of the heat dissipation module 9 is combined with a circulating circuit; in addition, f —— Γ ^ , , , , , , , , , , , , , , , , , , , , , , , , , The through hole 13 of the connecting plate 12 is placed on the through hole of the main board 8 and then fixed by screwing elements such as screws; finally, a connecting end is respectively sleeved on the water outlet of the water pump 2 and the heat radiating mold Group 9 other water: 91 - end 'the other end of the connecting tube 40 is respectively sleeved in the water system 20 = water Lu 24 and the water cooling row 30 of the drain pipe 35, and the other end of the connecting pipe is the county The water inlet pipe 34 of the water-cooling row 30 and the other side of the water-cooling module of the heat-dissipating module 9; thus, the heat dissipation of the creation can be completed. It is installed in combination with the cymbal group 81 of the motherboard 8; in operation, the pump 2 〇 is operated to allow the working fluid to circulate between the water pump 2Q, the water cooling, the communication (4), and the heat dissipation module ~ M323066 group 9. And the other memory of the memory module is cooled. Please refer to the figure in the sixth figure, which is a view of another embodiment of the creation. The heat dissipation device of the present invention can be used in addition to the above embodiment, and is also in the form of the embodiment, and further includes a fan. The fan training system is connected to the water-cooling row 30. When the fan 5〇 starts to operate, the = stream can be blown to the flat tube 32 and the heat sink 33 of the water-cooling row 30; then, the flow: 11 venting holes 16, and the cooling module 9 and other peripheral power; ^ yuan ^ or device for the cold air blowing and forced cooling, and greatly improve the heat dissipation performance. Please refer to the figure 7 in the figure of the other embodiment of the present invention. The fixed frame 10 of the present invention is composed of a frame 11 and two, respectively, and the left side of the frame 11' 'The right side of the fixed arm 18 and the elastic clamping arm (7) = crying and elastic clamping arm 19 are respectively fixed to the memory: the handle, and thus achieve the creation and the rapid assembly of the motherboard 8 According to the description, the water cooling device of the model domain has been fascinating and progressive, and the structure of the creation has not been seen: The use of 'in full compliance with the new patent application requirements, 提出 apply under the patent law. [Simple description of the diagram] The first::: The stereoscopic exploded view of the fixed frame, water pump and water-cooled row. The field system is used for the heat dissipation module and memory module of this creation. M323066 The third figure The fourth picture The fifth picture The sixth picture The seventh picture The original creation is applied to the stereoscopic exploded view of the memory module. =f authoring is applied to the memory module usage state diagram. Gentleman, used in the memory module combination sectional view. This is a cross-sectional view of another embodiment of ^^ 〆I. A further cross-sectional view of another embodiment of the creation. [Main component symbol description] [This creation] Fixing frame 10, 10, Attaching plate 12 Folding plate 14 Ventilation hole 16 Fixing arm 18 Frame 11, 11, Perforation 13 Screw hole 15 Positioning plate 17 Elastic clamp arm 19 Water pump 20 Lug 21 Outlet pipe 23 Water-cooled row 30 Round tube 31 Heat sink 33 Drain pipe 35 Through hole 22 Inlet pipe 24 Flat pipe 32 Inlet pipe 34 Connecting pipe 40 Fan 50 Motherboard 8 Memory module 81 M323066 Thermal module 9 Loss Water pipe 91 second heat sink 93 first heat sink 92 elbow 94