TWM320289U - Improvement of surface mounting heat-dissipation structure - Google Patents

Description

M320289, VII, designated representative map: (1), the designated representative figure of this case is: the second picture. Heat dissipating component...B Heat sink cover...c - Filling hole.......c 1 w Light transmission hole.......C 2 • accommodating space.. ....C 3 ^ illuminating part.......D 1 -(·2), the symbol of the representative figure of this representative figure is simple description: VIII. New type description: 【New technical field】 Surface adhesion The heat dissipation structure is improved, and the heat dissipation element is disposed on the heat dissipation cover body: Side: Side shi 5 perfusion hole and light transmission hole 'and accommodate; g piece 'and its light-emitting element is covered by the heat-dissipating cover body by electricity "ΪSliiiS plastic site because of its large area on the circuit board The shop, by the heat effect, and through the guide, the piece reaches the better guide 4 M320289 - [previous technology] The group of heat-dissipating components as shown in the figure - shown by the metal heat sink A 1 On the other side, the terminal A 3 of the A piece is connected to the circuit board A 2, and the illuminating and hoarding of the circuit board is large, which has led to the required circuit board Α 2 face|changing the A 1 side A 3 needs to be The connection of the circuit board a 2 is very large, and the space of the terminal A 2 of the first piece A is also very numb when assembled. The straw, the & is easy to waste the problem of the circuit board. Sparse, the reality is based on the technology to be solved [new content] The details of the supply, diagram, and examples are as follows. The creation is based on the second, third and fourth diagrams. As shown, a system, a political heat body c] perfusion hole c light-transmitting hole C2m;;, t: y Ϊ is a heat-dissipating cover C, wherein one side of the heat-dissipating cover C is provided with a hole The hole c 2 is provided, and the accommodating space C is disposed at one of the heat-dissipating covers C. The accommodating space c 3 of the hot-cover body c is used for illuminating the slab The heat-dissipating adhesive F is filled in the accommodating space C3. The filling hole C1 of the heat-dissipating cover C of the jasper is supplied to the place where the heat-conductive adhesive F is used, and the light-transmitting hole c 2 of the second heat-covering body C is supplied to The light-emitting portion D1 of the light-emitting element D emits light when it emits light. M320289 • i embodiment] The implementation method of the light-emitting element D provides a surface adhesion heat dissipation structure improvement, which is the third-fourth, fifth, and 6, 7 and 8 show that when the user mounts the optical component D, the terminal 2 of the light-emitting component D is soldered to the circuit board by using soldering and the circuit is utilized. The copper foil on the board is used to conduct, and then the bean is placed on the light-emitting element of the road board, and a heat-dissipating element is mounted on the light-emitting element

After the two pieces of heat P are fitted, the heat conductive adhesive F is refilled in the accommodating space C of the heat dissipating component B - the heat conductive adhesive F is filled in the accommodating space C 3 of the heat dissipating component B, whereby the illuminating When the light is emitted from the portion 131, the heat source generated by the portion 131 is dissipated and the effect of insulation and waterproofing is achieved. When the light hole is fitted to the light-emitting element D, the light-emitting element D of the heat-dissipating element B is covered with the light-emitting element D of the light-emitting element D and the terminal D 2 of the light-emitting element D. Cover body cover and inject thermal adhesive? When the thermal conductive adhesive F is infused by the heat dissipation ί^ΐΙίί2, and until the heat dissipation of the heat-dissipating cover C is accommodated, the heat-dissipating component of the heat-dissipating component C is inserted.

Ϊ ( 五 五 五 五 五 五 五 五 五 五 五 五 五 五 ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ΐ ΐ ΐ ΐ ΐ When it is really full, the fault is caused by the heat-dissipating cover sheet, and then the heat-dissipating effect of the heat-conducting tube B can be installed. "Shenzhen", module I 1, wrong, to strengthen its heat-dissipating components for the household = Wengui feasible embodiment, not to limit the original 6 M320289 shows its progress and practicality, and compared with Xi Divided into the creation of this creation is more obvious as follows: 1 {Lack of use" B Yuan? Light change f Jin Lai hot film area is too large. Second, Cheng Yi 'easy to waste the space of the circuit board. Fourth, Cheng Yi, so that the light components The group is very troublesome. "The advantages of this creation" First, the heat-dissipating components and guides can make the effect of heat conduction, insulation and waterproof. Second, Lang's space for its circuit board.

Second, the cost is low, assembly is convenient. Fourth, it is progressive and practical. Fifth, enhance industrial competitiveness. In summary, under the breakthrough of the prior art structure, this creation has indeed achieved the desired effect, and it is not easy for people who are familiar with the art to think about it. Moreover, this creation has not been disclosed before the application, and it has Progressive and practical, it has already met the requirements for new patent applications, and proposed new applications in accordance with the law. M320289 / [Simple description of the diagram] The first picture is a stereo view of the application. - The second picture is a perspective view of the creation. The third picture is a three-dimensional exploded view of the creation. The fourth picture is a cross-sectional view of the creation. - The fifth picture is one of the embodiment diagrams of this creation. The sixth picture is the second embodiment of this creation. The seventh figure is the third embodiment of the creation of this creation. The eighth figure is the fourth embodiment of the present invention. The ninth figure is the fifth of the embodiment of the present creation. - The tenth figure is the sixth figure of the embodiment of this creation. • The eleventh figure is the seventh of the embodiment of this creation. The twelfth figure is the eighth of the embodiment of the present creation. The thirteenth figure is the ninth of the embodiment of the present creation. [Main component symbol description]

Light-emitting elements ..... A, D Metal heat sink · · · · A 1

Circuit board...A 2, E

Terminal.......A 3, D 2

Heat sink component.....B

Heat-dissipating cover.....C Filling hole...C 1 Light-transmitting hole...C 2 accommodating space.....C 3 Light-emitting part.....D 1

Thermal adhesive...F

Fin.......G Heat sink cover.....Η Heat sink housing.....Η 1 Heat pipe...I heat sink 8

Claims (1)

M320289 M320289 —-------------1·? 4 years? month double Zhengjiu, application patent scope _ 1, a surface adhesion heat dissipation structure improvement, basin system by Lei Jian ^ ^~77Γ ^ ^ hot kick The 散热 〒 艮〃 甶 甶 甶 甶 甶 甶 甶 甶 甶 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导 导ΐ ϊϊΐΐ ϊϊΐΐ : : : : : : : : : : : : : : : : : : : : : : : 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容The structure is improved, the heat-conducting cover body surface; the ij thermal structure is improved, the heat-dissipating body f component! The surface heat of the surface f is improved, and the heat-dissipating area is increased, thereby saving the component and further arranging the component according to the number of the light-emitting elements. Set iisliifHYD item: when it is sticky, structure improvement, its light! nhDr^e) '^^(LED^iihrEmIt? 1 〇de) and related light-emitting components such as light bulbs. The component-step-face iff f structure is improved, and the heat-dissipating module, by which, can further heat 3, and then extend its heat pipe to - heat dissipation 9