M314433 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種發光二極體之封裝結構，且特別 是有關於一種發光二極體封裝之散熱模組。 【先前技術】 由於高功率、高亮度發光二極體（LED)的發展，發光二 極體的應用面可以說是越來越廣了，舉凡LCD的背光、白 光光源、迷你型投影機及汽車燈源等等，皆為深具市場潛 力的標的。惟現今對於發光二極體光能轉換的效率，在技 術上尚未能有良好的突破，使得光的產生僅占輸入功率的 百分十五到二十，剩餘的百分之八十到八十五則以熱的形 式產生’不僅在亮度的提升上產生瓶頸，其產生的熱更是 衍生出許多的問題。研究顯示，若未能適時有效地排出發 光一極體所產生的熱源，則將會影響發光二極體的發光強 度、色純度及其壽命。因此，如何做好發光二極體的熱管 理’尤其是在發光二極體的封裝階段即做好散熱的設計， 便成為發光二極體應用的重要關鍵。 參照第1圖所示，其所繪示者係習知的一種LED封裝 的散熱模組圖，該習知之LED封裝的散熱模組10〇係提供 一金屬基板130作為導熱基材，並於該金屬基板13〇之上 下兩個表面130a、130b上分別貼附一層散熱膠材i2〇，然 後將LED電路板11〇固定於金屬基板13〇上表面13〇a之散 熱膠材120上，並於金屬基板13〇下表面}3〇b的散熱膠材 120上固定一散熱塊140，用以增加散熱面積。 M314433 上述習知之散熱模組，其缺點是材料成本過高、模組 的體積過大以及模組的重量過重。而且，在使用金屬基板 130作為導熱基材時，除了金屬基板13〇上下兩個表面 130a、130b所形成的介面會阻礙熱的傳導外，更由於金屬 基板130具有硬度及導電性，故必須在金屬基板13〇與led 電路板lio間提供一層散熱膠材120以作為固定LED電路 板110及絕緣之用，惟此散熱膠材12〇的熱傳導效率不佳， 進而影響了金屬基板130所能發揮的整體散熱效果。此時， 在作法上會在金屬基板130與LED電路板11 〇間再進行一 道定位打孔的繁瑣程序，使LED底部的散熱板（heatslug; 未繪不）能直接接觸金屬基板13〇，藉以幫助熱的傳導。 【新型内容】 因此’本新型的目的就是在提供一種LED封裝之散熱 杈組，用以增進模組整體的散熱效率、降低模組的體積和 重量、簡化模組的製作程序以及降低模組的製作成本。 根據本新型之上述目的，提出一種LED封裝之散熱模 組。該散熱模組係將LED電路板直接固定於貼附散熱膠材 的散熱塊上。 據上所述’由於直接以散熱塊作為導熱及散熱的基 板’無須以金屬基板作為導熱基材，因而減少了金屬基板 上下兩個表面介面及金屬基板與LED電路板間的一層散熱 膠材也減少了熱傳導的阻礙，故可以提高模組的散熱效 率再者’因為少了金屬基板作為導熱基材，所以不僅能 降低模組的重量和體積，也同時節省了材料成本。此外， M314433 也因為少了金屬基板作為基板’故無須定 而簡化了模組的製作程序。 彳序 【實施方式】 參照第2 β戶斤*，其係緣示依照本新型一較佳實施例 的一種散熱模組結構示意圖。在第2圖中，[ED封裝之散 熱模組之製造方法為首先在散熱塊240上塗佈一層散 熱膠材220，再將LED電路板21〇固定於散熱膠材，之 上。在本新型所提供之一較佳實施例中’上述之散熱塊謂 主要係由夕個政熱片所組合構成，而散熱片之材質可為 舒銅#呂；5墨及其組合。再另一個較佳實施例中，上 述之散熱膠材220可為高分子樹脂類之材質，例如環氧樹 脂（Epoxy) 〇 由上述本新型之較佳實施例可知，應用本新型具有增 進模組整體的散熱效率、降低模組整體的重量和體積、^ 化模組的製作程序以及降低模組的製作成本等優點。、9 雖然本新型已以較佳實施例揭露如上，然其並非用以 限定本新型，任何熟習此技藝者，在不脫離本新型之精神 和範圍内，當可作各種之更動與潤飾，因此本新型之保護 範圍當梘後附之申請專利範圍所界定者為準。 ^ 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下·· 第1圖係緣示習知的一種LED封裝之散熱模組圖。 M314433 第2圖係繪示依照本新型之一較佳實施例的一種散熱 模組結構示意圖。 【主要元件符號說明】 100 :習知之LED封裝的散110 : LED電路板 熱模組 130 :金屬基板 12 0 ·散熱膠材 200 :本新型一較佳實施例之 14 0 ·散熱塊 散熱模組 210 : LED電路板 240 ·散熱塊 220 :散熱膠材M314433 VIII. New Description: [New Technology Field] The present invention relates to a package structure of a light-emitting diode, and in particular to a heat-dissipating module of a light-emitting diode package. [Prior Art] Due to the development of high-power, high-brightness light-emitting diodes (LEDs), the application surface of light-emitting diodes can be said to be more and more wide, such as LCD backlights, white light sources, mini projectors and automobiles. Light sources, etc., are the subject of market potential. However, the current efficiency of light-emitting diode light energy conversion has not been able to make a good breakthrough in technology, so that the light generation only accounts for 15 to 20 percent of the input power, and the remaining 80 to 80 percent. The fifteenth generation in the form of heat 'not only creates a bottleneck in the improvement of brightness, but the heat generated by it is a lot of problems. Studies have shown that failure to properly and efficiently discharge the heat source generated by the light-emitting diode will affect the luminous intensity, color purity and lifetime of the light-emitting diode. Therefore, how to do the heat management of the light-emitting diodes, especially in the packaging stage of the light-emitting diodes, is a key to the application of the light-emitting diodes. Referring to FIG. 1 , the figure shows a heat dissipation module of a conventional LED package. The heat dissipation module 10 of the conventional LED package provides a metal substrate 130 as a heat conductive substrate, and A heat dissipating adhesive material i2〇 is attached to the upper two surfaces 130a and 130b of the metal substrate 13〇, and then the LED circuit board 11〇 is fixed on the heat dissipating adhesive material 120 of the upper surface 13〇a of the metal substrate 13 and A heat dissipating block 140 is fixed on the heat dissipating rubber 120 of the lower surface of the metal substrate 13 to increase the heat dissipating area. M314433 The above-mentioned conventional heat dissipation module has the disadvantages of high material cost, excessive module size and excessive weight of the module. Moreover, when the metal substrate 130 is used as the heat conductive substrate, in addition to the interface formed by the upper and lower surfaces 130a, 130b of the metal substrate 13 hindering the conduction of heat, and since the metal substrate 130 has hardness and conductivity, it must be A heat dissipation adhesive 120 is provided between the metal substrate 13A and the LED circuit board lio to serve as the fixed LED circuit board 110 and the insulation. However, the heat conduction efficiency of the heat dissipation adhesive material 12 is not good, thereby affecting the metal substrate 130. The overall cooling effect. At this time, in the practice, a complicated procedure of positioning and punching between the metal substrate 130 and the LED circuit board 11 is performed, so that the heat sink (heatslug; not drawn) at the bottom of the LED can directly contact the metal substrate 13〇, thereby Help with the conduction of heat. [New content] Therefore, the purpose of the present invention is to provide a heat dissipation package for an LED package to improve the overall heat dissipation efficiency of the module, reduce the size and weight of the module, simplify the module production process, and reduce the module. production cost. According to the above object of the present invention, a heat dissipation module of an LED package is proposed. The heat dissipation module directly fixes the LED circuit board on the heat dissipation block to which the heat dissipation adhesive is attached. According to the above description, since the substrate which directly uses the heat dissipation block as the heat conduction and heat dissipation does not need to use the metal substrate as the heat conduction substrate, the upper and lower surface interfaces of the metal substrate and the layer of heat dissipation adhesive between the metal substrate and the LED circuit board are also reduced. The heat conduction hindrance is reduced, so that the heat dissipation efficiency of the module can be improved. In addition, since the metal substrate is used as the heat conductive substrate, the weight and volume of the module can be reduced, and the material cost can be saved. In addition, M314433 also simplifies the module manufacturing process because it lacks a metal substrate as a substrate. [Embodiment] Referring to the second β-home*, the structure of the heat-dissipating module according to a preferred embodiment of the present invention is shown. In Fig. 2, the method of manufacturing the heat dissipation module of the ED package is to first apply a layer of the heat-dissipating adhesive 220 to the heat-dissipating block 240, and then fix the LED circuit board 21 to the heat-dissipating adhesive material. In a preferred embodiment provided by the present invention, the above-mentioned heat-dissipating block is mainly composed of a combination of a kimono hot film, and the material of the heat sink may be Shu copper #吕; 5 ink and a combination thereof. In another preferred embodiment, the heat dissipating adhesive 220 may be a polymer resin material, such as an epoxy resin (Epoxy). According to the preferred embodiment of the present invention, the application has the enhanced module. The overall heat dissipation efficiency, the overall weight and volume of the module, the manufacturing process of the module, and the cost of manufacturing the module are reduced. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and various modifications and refinements may be made without departing from the spirit and scope of the present invention. The scope of protection of this new type is defined as defined in the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0009] The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. The thermal module diagram of the package. M314433 FIG. 2 is a schematic structural view of a heat dissipation module according to a preferred embodiment of the present invention. [Main component symbol description] 100: The conventional LED package dispersion 110: LED circuit board thermal module 130: metal substrate 12 0 · heat dissipation adhesive material 200: a new preferred embodiment of the invention 14 0 · heat sink cooling module 210 : LED circuit board 240 · Heat sink 220 : heat sink