M313810 八、新型說明： 【新型所屬之技術領域】 本創作涉及一種散熱裝置，尤其涉及一種特別、裔田 為抽插式模組散熱的散熱裝置。 、於 【先前技術】 ' 現有的中央處理器散熱裝置中的散熱器為提高ιφ - 巧理器之間的貼合程度’降低兩者之間的介面熱阻：通 常是在散熱器的基座的底面上塗布一層導熱膏或'一導^ •襯墊來增加散熱器與中央處理器之間的貼合程度，以降^ 介面熱阻，從而實現良好的導熱及散熱。 一 “但是，上述的散熱裝置僅適用於比較固定不可抽插的 私子元件（如中央處理器），而當將類似的散熱裝置應用 在抽插式模組上時，由於抽插式模組可能會進行多次抽插 才呆作，其頂面的清潔程度也較差，多次抽插操作後導熱膏 將會因為受到污染使導熱性能大為降低，並且其呈糊狀易 損的物理特性也使其不適合應用在抽插式模組的散熱裝 •置上。 導熱襯墊（Thermal pad)是一種具有彈性的金屬絲 網狀物，具有較強的導熱能力，其導熱性能雖然受污染程 度的影響較小，並且其呈方塊海綿狀的物理特性也使其可 以應用在可抽插式模組上，但是導熱襯墊經抽插式模組長 期的反復抽插操作後，其表面也容易磨損導致導熱性能下 降。 由上可知，如果將現有的散熱裝置直接應用在抽插式 模組上，顯然存有缺陷而有待加以改善。 5 M313810 f新型内容】 本創作的主要目的力 發埶元件之間5在如i、一種用於改善散熱器與 用在度來降低介面熱阻，且特別適合應 、奋、、、且的夕二人抽插操作環境中的散熱裝置。 括目的’本創作提供—種散熱裝置，包 熱散熱11包括—基座及若干散熱鰭片，該散 拓、vr:固定裴設在該散熱器基座底面上的-導埶 的若板包±括；~本體及從該本體中部向下傾斜折伸出' —平片’上述的彈片是由並列排布的若干組彈片組 成，母一組彈片又由若干彈片組成。 、、 遠散熱裝置褒設在一抽插式模組的電連接哭 上’該電連接H殼體對應該散熱裝置設有―開口，料執 板的彈片從該電連接器殼體的開口凸伸到電連接哭嗖體 内部的容置空間中與抽插式模組的頂面緊密相貼接7 本創作具有以下有益效果，當抽插式模組插入裂設到 電2接器殼體内時’該導熱板的彈片將被向上壓緊，使其 緊密地貼接到抽插式模組的頂面，因而抽插式模組產生的 熱可以順暢地通過導熱板傳遞到散熱器再散發到空氣中 去。本創作散熱裝置的導熱板耐污染且不容易損壞，^而 較為適合應用在這種需要進行頻繁抽插操作環境中，即使 進行夕次抽插操作也能與抽插式模組頂面保持緊密的貼 合’降低介面熱阻以提高散熱性能。 Λ 為使能更進一步暸解本創作之特徵及技術内容，請來 閱以下有關本創作之詳細說明與附圖，然而所附圖式^提 供參考與說明用，並非用來對本創作加以限制者。 M313810 【實施方式] 月/閱第一圖至第四圖所示，本創作 s 、、且6 T以對應插設到一電連接器殼體4内。 該電連接器殼體4固定安襄在一電路板5上，由 :41、一底㊆42、兩側面43及一端面Μ合圍形成一供 抽插式無線收發模組6插設的容置空間，該容置空間的二 =有-插入口 45;該頂面41上開設有 的容置空間相通的開口⑴：該兩側面仏二 卜凸δ又有兩卡塊431。該電連接器殼體4在靠近端面以 白、位置δ又有一焊接在電路板5上的電連接器（圖未示 出），及電連接器可以與該抽插式無線收發模組6相對 接’使該抽插式無線收發模組6與電路板5電性連接在一 起從而進行信號傳輸。 錄熱裝置包括一散熱器2、一裝設在散熱器2底部 的導熱板3及一扣具1。 —如第五圖至第七圖所示，該散熱器2包括一基座 及若干從基座21的頂面向上延伸出的散熱鰭片22 ;這些 散熱鰭片22分成四組，每相鄰兩組之間留有一間隙23 ; 忒基座21的底面向下凸設有一凸塊24，該凸塊24的兩 端各設有一傾斜延伸部25。 該導熱板3由傳熱性能好且具有彈性的金屬材料（例 如銅）衝壓芎折而成的，包括一本體3丨、若干彈片Μ和 一折片33 ;該本體31成矩形平板狀；該本體31從中部 並排向下傾斜延伸出若干組彈片32,每一組由三個彈片 7 M313810 32組成。這些彈片32是直接從該本體31的中部進行切 '割再彎折而成的；該折片33是由該本體31的一端向上傾 斜彎折而成的。 該導熱板3的本體31及折片33的頂面上塗布有一層 可導熱的粘膠（圖中未示出），該粘膠可將該導熱板3粘 貼到忒散熱裔2基座21底面的凸塊24上，該折片33是 貼合在該散熱器2的傾斜延伸部25上。 該扣具1是由具有彈性的金屬材料衝壓成型的，包括 •兩個扣持部11和連接在該兩扣持部11之間的三個抵壓部 12 兩個扣持部U均大致呈矩形平板狀且並列相對設 立，每一扣持部11上設有兩個扣合孔m ;該兩扣持部 11的一侧通過該三個抵壓部12連接在一起，該三個抵壓 部12之間相互間隔設置，並形成匹配於該散熱器2中部 兩組散熱鰭片22的兩個容置空間121 ;每一抵壓部12整 體呈“M”字型。 如第一圖至第四圖所示，該散熱裝置裝設在該電連接 •器$體4的頂面41的開口 411上方；該扣具i的抵壓部 12穿過多組散熱鰭片22之間的間隙23，抵壓在該散熱器 I的基座21上，兩扣持部U的扣合孔lu對應扣接在該 電連接器殼體4的兩側面43的卡塊431上，將該散熱器 2和貼接在散熱器2底面上的導熱板3壓接在該電連接器 殼體4上。 此日守，該導熱板3的彈片32從該電連接器殼體4的 1 一 411中凸伸到该電連接器殼體4内的容置空間中，其 葛抽插式無線收發模組6尚未插入電連接器殼體4時， M313810 該彈片32的底面與電連接器殼體4底面42之間的距離要 小於抽插式無線收發模組6插入時其頂面與電連接器殼 底面42之間的距離。導熱板3的彈片犯具有良好的 彈性，可以使彈片32緊密貼接到抽插式無線收發模組6 的頂面，降低兩者之間的介面熱阻。 ^ °亥V熱板3的折片33和該散熱器2的傾斜延伸部25 •是沿f抽插式無線收發模組6插入的方向向下傾斜的，用 以引導該抽插式無線收發模組6順利地插入到該導熱板& 籲下方’同時可以加強導熱板3與散熱器、2之間的結合強 度，防„止該導熱板3在抽插式無線收發模組6插入時相對 散熱器2發生滑移。這些彈片％也是沿著抽插式盔 發模組6插入的方向向下傾斜的，當抽插式無線收發模組 6插入衣s又到電連接器殼體4時，該導熱板3的彈片犯 將被向上壓緊，使其緊密地貼接到抽插式無線收發模包6 的頂面，因而抽插式無線收發模組6產生的熱可以順暢地 通過導熱板3傳遞到散熱器2再散發到空氣中去。本 .散熱裝，的導熱板3财污染且不容易損壞，因而較為適合 應用在這種需要進行頻繁抽插操作的環境中，即使進行多 次抽插操作也能與抽插式無線收發模組6頂面保持緊密 的貼合，降低介面熱阻以提高散熱性能。 " F隹以上所述僅為本創作之較佳實施例，非意欲偈限本 作之專利保圍，故舉凡運用本創作說明書及圖式内 $所為之等效變化’均同理皆包含於本創作之權利保護範 圍内，合予陵明。 M313810 【圖式簡單說明】 f一圖是本創作的散熱裝置與電路板、電路板上的♦ 為威體及抽插式無線收發模組的立體分解圖· … f二圖是本創作的散熱裝置與電路板、電路板上 益殼體及抽插式無線收發模組的立體組裝圖；书 第二圖是本創作的散熱裝置與電路板及 ，器殼體的組裝狀態的俯視圖； 才反上的％連M313810 VIII. New description: [New technical field] The present invention relates to a heat dissipating device, and more particularly to a special heat sink for the heat dissipation of the plug-in module. [Prior Art] 'The heat sink in the existing CPU heat sink is to improve the fit between the ιφ - the controller' to reduce the interface thermal resistance between the two: usually on the base of the heat sink Apply a layer of thermal paste or 'a conductive pad' to the bottom surface to increase the adhesion between the heat sink and the central processor to reduce the thermal resistance of the interface to achieve good thermal and thermal dissipation. "However, the above-mentioned heat sink is only suitable for comparing fixed non-pinchable components (such as a central processing unit), and when a similar heat sink is applied to a plug-in module, due to the push-pull module It may be done by multiple extractions, and the top surface is also poorly cleaned. After multiple extraction operations, the thermal paste will be greatly deteriorated due to contamination, and it is mushy and vulnerable. It also makes it unsuitable for use in the heat sink installation of the plug-in module. The thermal pad is a flexible metal mesh with strong thermal conductivity and its thermal conductivity is contaminated. The effect is small, and its spongy-like physical properties make it applicable to the pluggable module. However, after the long-term repeated insertion and removal of the thermal pad by the plug-in module, the surface is also easy. Wear and tear lead to a decrease in thermal conductivity. It can be seen from the above that if the existing heat sink is directly applied to the plug-in module, there is obviously a defect that needs to be improved. 5 M313810 f new content] The main purpose of the work is to create a device between the components, such as i, a device for improving the heat sink and the use of the heat sink to reduce the thermal resistance of the interface, and is particularly suitable for the environment of the two people. The heat dissipating device. The purpose of the present invention is to provide a heat dissipating device, the heat dissipating heat 11 includes a base and a plurality of heat dissipating fins, and the dispersing, vr: fixing is disposed on the bottom surface of the heat sink base. The body plate and the body are inclined downwardly from the middle of the body. The above-mentioned elastic piece is composed of a plurality of sets of elastic pieces arranged side by side, and the female group of elastic pieces is composed of a plurality of elastic pieces. The remote heat sink is disposed on the electrical connection of the push-pull module. The electrical connection H housing is provided with an opening for the heat sink, and the elastic piece of the material plate protrudes from the opening of the electrical connector housing. Attached to the top surface of the push-pull module in the accommodating space inside the electric connection body. 7 The creation has the following beneficial effects: when the push-pull module is inserted into the electric 2 connector housing When the spring of the heat conducting plate will be pressed upwards, it will be closely attached The top surface of the push-pull module, so that the heat generated by the push-pull module can be smoothly transmitted to the heat sink through the heat-conducting plate and then radiated into the air. The heat-conducting plate of the heat sink is resistant to pollution and is not easily damaged. It is more suitable for applications in such a need to perform frequent pumping and inserting operation, even if it is inserted in the evening, it can be closely adhered to the top surface of the plug-in module to reduce the thermal resistance of the interface to improve the heat dissipation performance. For further understanding of the features and technical contents of this creation, please refer to the following detailed description and drawings regarding the creation. However, the drawings are provided for reference and explanation, and are not intended to limit the creation. M313810 [ Embodiments] As shown in the first to fourth figures, the creations s, and 6 T are correspondingly inserted into an electrical connector housing 4. The electrical connector housing 4 is fixed in an ampoule On the circuit board 5, a housing space for inserting and inserting the wireless transceiver module 6 is formed by a 41, a bottom 742, two side surfaces 43, and an end surface, and the second space of the housing space is provided with an insertion port. 45; the opening of the top surface 41 Spatially open openings (1): the two sides of the two sides of the convex δ have two blocks 431. The electrical connector housing 4 has an electrical connector (not shown) soldered to the circuit board 5 at a position δ near the end surface, and the electrical connector can be opposite to the push-in wireless transceiver module 6. The plug-in wireless transceiver module 6 is electrically connected to the circuit board 5 for signal transmission. The heat recording device comprises a heat sink 2, a heat conducting plate 3 mounted on the bottom of the heat sink 2, and a buckle 1. - As shown in the fifth to seventh embodiments, the heat sink 2 includes a base and a plurality of heat dissipation fins 22 extending upward from the top surface of the base 21; the heat dissipation fins 22 are divided into four groups, each adjacent A gap 23 is left between the two groups; a protrusion 24 is protruded downwardly from the bottom surface of the base 21, and an inclined extending portion 25 is disposed at each end of the protrusion 24. The heat conducting plate 3 is formed by stamping and folding a metal material (for example, copper) having good heat transfer performance and elasticity, and comprises a body 3丨, a plurality of elastic pieces 一 and a flap 33; the body 31 is formed into a rectangular flat plate shape; The body 31 extends obliquely downward from the middle portion of the plurality of sets of elastic pieces 32, each set consisting of three elastic pieces 7 M313810 32. The elastic pieces 32 are cut and cut directly from the central portion of the body 31; the folded piece 33 is formed by bending one end of the body 31 upward and obliquely. The top surface of the body 31 and the flap 33 of the heat conducting plate 3 is coated with a heat-conductive adhesive (not shown), and the adhesive can be attached to the bottom surface of the heat-dissipating base 2 On the bump 24, the flap 33 is attached to the inclined extension portion 25 of the heat sink 2. The buckle 1 is stamped and formed of a resilient metal material, and includes two latching portions 11 and three pressing portions 12 connected between the two latching portions 11 and the two latching portions U are substantially Each of the latching portions 11 is provided with two engaging holes m; one side of the two latching portions 11 is connected by the three pressing portions 12, and the three pressing portions are respectively provided. The portions 12 are spaced apart from each other and form two accommodating spaces 121 matching the two sets of heat dissipating fins 22 in the middle portion of the heat sink 2; each of the pressing portions 12 has an "M" shape as a whole. As shown in the first to fourth figures, the heat sink is disposed above the opening 411 of the top surface 41 of the electrical connector body 4; the pressing portion 12 of the clip i passes through the plurality of sets of heat dissipation fins 22 The gaps 23 are pressed against the base 21 of the heat sink 1. The fastening holes lu of the two latching portions U are correspondingly fastened to the blocks 431 of the two side faces 43 of the electrical connector housing 4. The heat sink 2 and the heat conducting plate 3 attached to the bottom surface of the heat sink 2 are crimped onto the electrical connector housing 4. In this case, the elastic piece 32 of the heat conducting plate 3 protrudes from the 1-411 of the electrical connector housing 4 into the accommodating space in the electrical connector housing 4, and the karaoke-type wireless transceiver module 6 When the electrical connector housing 4 has not been inserted, the distance between the bottom surface of the elastic piece 32 and the bottom surface 42 of the electrical connector housing 4 of the M313810 is smaller than that of the top surface and the electrical connector housing when the push-in type wireless transceiver module 6 is inserted. The distance between the bottom faces 42. The elastic piece of the heat conducting plate 3 has good elasticity, and the elastic piece 32 can be closely attached to the top surface of the push-pull type wireless transceiver module 6, thereby reducing the interface thermal resistance between the two. The flap 33 of the hot plate 3 and the inclined extension 25 of the heat sink 2 are inclined downward in the direction in which the f-plug wireless transceiver module 6 is inserted to guide the push-pull wireless transceiver. The module 6 is smoothly inserted into the heat conducting plate & below, and the bonding strength between the heat conducting plate 3 and the heat sink 2 can be enhanced, and the heat conducting plate 3 is inserted when the plug-in wireless transceiver module 6 is inserted. The sliding of the radiator 2 occurs. The elastic pieces are also inclined downward along the direction in which the plug-in helmet module 6 is inserted. When the push-in wireless transceiver module 6 is inserted into the clothing s and then to the electrical connector housing 4 At this time, the shrapnel of the heat conducting plate 3 will be pressed upward so as to be closely attached to the top surface of the push-pull wireless transceiver package 6, so that the heat generated by the push-pull wireless transceiver module 6 can be smoothly passed. The heat conducting plate 3 is transmitted to the heat sink 2 and then dissipated into the air. The heat radiating plate of the heat dissipating device is contaminated and not easily damaged, and thus is suitable for use in an environment where frequent pumping operations are required, even if Multiple plug-in operations can also be maintained on top of the push-in wireless transceiver module 6 Closely fit, reduce interface thermal resistance to improve heat dissipation performance. " F隹 The above is only a preferred embodiment of this creation, and it is not intended to limit the patent protection of this work, so use this creation manual and diagram The equivalent change of $ in the formula is included in the scope of protection of this creation, and is given to Lingming. M313810 [Simple description of the diagram] f is a heat sink and circuit board and circuit board of the creation The ♦ is a three-dimensional exploded view of the power-collecting and plug-in wireless transceiver module. ... f Figure 2 is the three-dimensional assembly of the heat sink and circuit board of the creation, the circuit board and the plug-in wireless transceiver module. The second picture of the book is a top view of the assembled heat dissipating device and the circuit board and the assembled state of the device housing;
^第四圖是第三圖的A-A線剖面圖； >第五圖是摘作的賴裝置的立體分解圖； 弟六圖是本創作的散熱裝 第七圖是本創作的岑岑壯 體、、且衣圖， 个钔作的放熱裝置的前 【主要元件符號說明】 1扣具 111扣合孔 121容置空間 22散熱鰭片 24凸塊 32彈片 11扣持部 12抵壓部 2散熱器 21基座 23間隙 2 5傾斜延伸部 3導熱板 本體 33折片 $電連接器殼體 10 M313810 ' 41頂面 42底面 431卡塊 45插入口 5電路板 6抽插式無線收發模組 411 開口 43侧面 44端面^The fourth figure is a cross-sectional view taken along line AA of the third figure; > the fifth figure is an exploded view of the extracted device; the sixth figure is the heat-dissipating figure of the present creation, which is the strong body of the creation. , and clothing drawings, the front of the main heat release device [main symbol description] 1 clip 111 fastening hole 121 housing space 22 heat sink fins 24 bumps 32 elastic sheet 11 buckle portion 12 pressure part 2 heat dissipation 21 pedestal 23 gap 2 5 oblique extension 3 heat conduction plate body 33 gusset $ electrical connector housing 10 M313810 '41 top surface 42 bottom surface 431 card 45 insertion port 5 circuit board 6 push-pull wireless transceiver module 411 End face 44 of the opening 43
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