M308600 八、新型說明： 【新型所屬之技術領域】 本創作係與電路板裝置有關，特別是指一種具同步測 能之高頻電路板裝置。 μ功 【先前技術】 一般高頻通訊電路的印刷電路板（PCB)上，傳遞訊號、 線路皆須有特定的佈局或零件裝置，贿止傳輪触中訊號= 減、失真或受雜訊干擾等致使降低通訊品質的因素，舉=哀 吕，鬲頻訊號處理電路和收發無線高頻訊號的天線裝置之卩，而 而維持有限定之訊號傳輸距離以避免訊號衰減，更以特定材: 之同軸傳輸線作為訊號傳輸媒介，以避免受雜訊干擾並維貝 旒之特性阻抗（characteristic impedance)。 汛 因此為確保電路佈設的訊號傳輸品質，高頻通訊產品 過耘的電路測試即為重要的工程，如第1圖所示習用之古，產 刷電路板1，具有一高頻電路區10、-同軸、線11及多數= 速電子元件14，高頻電路區1G内佈設有射頻電路，高 區10周邊環繞有接地電路，係與對應設置之 性¥通’可將外圍各高速電子元件14所產生的電㈣h (EMI)屏蔽於高頻電路區1G外並電性導通至電位零點，, 軸線11用以連接至收發無線高頻訊號的天線裝置，高頻電^ 電路中延伸至高頻電路區10外有一訊號線12，並更延伸2成 M308600 一傳導部121與一測試部122，傳導部121與同軸線n電性 $通，測试部122的近末端處則設有一連接器13，連接器13 的中心與訊號線12之測試部122電性導通，連接器13即為測 試機台連接用，因此可方便生產線上藉以測試高頻電子電路中 高頻訊號傳輸的電氣特性。 然而，印刷電路板上的電路佈設講究的是高密集度，對於 額外拉設測試接點的設計方式無疑需占去電路板上的有效利 用空間；且對於外露於金屬屏蔽區外的電路部分，連接至天線 的訊號傳輸線都有以特定阻抗設計的材質包覆，因此另外設置 的測試連接部及走線則徒增電磁波干擾之路徑，產生不必要的 天線效應；且測試連接部係由原本的高頻電路訊號線額外分流 增設，不但拉出的測試走線容易使原本連接至天線的傳輸訊號 衰減，同樣測試機台所測得的訊號特性亦為衰減過的傳輸訊 號，因此不易測得實際高頻電路訊號的傳輸品質。 【新型内容】 因此，本創作之主要目的乃在於提供一種具同步測試功能 之高頻電路板裝置，有效利用電路板上的電路設計空間，而能 於生產製造過程中同步測試高頻訊號傳輸的電氣特性並避免 電磁波雜訊干擾。 為達成前揭目的，本創作所提供之一種高頻電路板裝置， M308600 係豐设有至少二電路層，其中一高頻電路層係佈設有高頻電子 電路，包括接地線路及傳遞高頻類比訊號之至少一傳輸線，該 接地線路電性導通至接地電位（groundp〇tential)，鄰近該傳輸 線設有複數個接地銲點電性連接該接地線路，可維持該傳輸線 傳遞高頻類比訊號之特性阻抗（characteristic impedance)，該 傳輸線可電性連接於一般之同轴傳輸線，因此藉由該同軸傳輸 線電性連接至收發無線高頻訊號的天線裝置；另一測試電路層 係設有至少一同軸測點，該同軸測點具有一軸心及一同心環， 該軸心設有一正向穿設該電路板裝置之導電通孔，並對應至該 高頻電路層之傳輸線上，該導電通孔之孔壁有具導電性之導電 至屬，與該傳輸線電性連接，可傳遞高頻類比訊號至該測試電 路層，該同心環為以特定之距離環繞於該軸心，該同心環為具 v電性的金屬環狀物，正向穿設該測試電路層並電性導通至接 地電位，可維持該導電通孔傳遞高頻類比訊號之特性阻抗；因 此本創作所提供之高頻電路板裝置於導電線路製程後，還未進 亍如π軸傳輸線荨模組零件之模組化工程前，即可利用同軸測 點與電測機台電性連接而即時測試高頻電路特性。 本創作之另一目的乃在於提供一種具同步測試功能之高 頻電路板裝置，可測得實際高頻電路訊號的傳輸品質，有效避 免鬲頻訊號衰減所造成的影響。 為達成前揭目的，本創作所提供之一種高頻電路板裝置， M308600 為於上n路層之傳輸線上更設有 側鄰近於該連接_分％丨w — #fj 、]刀別扠有该接地銲點，該連接器係有具導 /一、一接頭及—接環，該接頭與該傳輪線電性連接，該接環 ”該接地鋅點雜連接，該連肋電性連接至_機台， 頻訊號的電氣特性；因此可將所測得的高頻訊號測試 ,^測減電路層之同轴測點測得的高頻訊號作比對，而進一 =斷以轴％傳輸⑥賴號是否產生訊號衰減的影響然後加 '父正測試數據，使本_所提供關_點結構之高頻電測 功能具有最佳的電測準確性。 【實施方式】 叮錄配°若干圖式列舉—較佳實施例，用以對本創作 之組成構件及功效作進—步朗，其巾所關式之簡要說明如 下： 第2圖係本創作所提供第-齡實施例之最上層電路層 示意圖； 弟3圖係上述第—較佳實關之最上層電路層於傳輸線 周圍的電路佈設示意圖； 第4圖係上述第―較佳實補之電路板裝置的局部剔視 圖’顯示該電路板裝置中高頻電路傳導高頻訊號至同轴傳輸線 及同軸測點的電路結構； 、弟5圖係上述第一較佳實施例之電路板裝置於第3圖所相 對之下視圖’為最下層電路層於同轴測點周圍的電路佈設示意 M308600 圖 電路層 第6圖係本創作所提供第二較佳實施例之最上芦 的局部示意圖。 曰 請參閱第2至第5 _示本創料提供 糸由上而下依序豐置有四電路層20、30、40、50,其中最 上層之電路層20為主要佈設高觀子電路的高頻電路層，電 路層30佈設有接地魏31，條導魅電位零點，電路層仙 佈設有電源電路41 ’電性導通至直流供應電源，且電性連接 於電路層2G的直流供應電位節點’最下層之電路層㈣為供 ict測試的測試電路層，各電路層2〇、如u係以高介 =數的絕緣材料為一基底細、細、彻、，可_目 層20、3〇、4G、5G之間產生不必要的寄生電性效應， 而衫響該電路«置2的電氣特性，以下針對電路層2〇、％ 作更進一步詳細的介紹： 、如第2圖所示，t路層2〇上具有一高頻電路區2〇1，用 以傳遞及處理局頻類比訊號，包括有複數條職線h及作電 =處理的各電子兀件22，並由_金屬框搬所環繞，金屬框 —2下韻對應設有接地線路，可作為高頻電路的電磁波屏 :’將外15高速f子元件所產生的電磁波干擾（emi)屏蔽於 呵頻電路區201外並電性導通至電路層3〇之接地電路;高 M308600 頻電路區201外具有一傳輸線23及一同軸傳輸線25，同軸傳 輸線25㈣連接缝發鱗高親制天線裝置，傳輸線Μ 電性連接於_傳輸線25 t央專㈣輸高舰狀—傳輸端 25卜該傳輸線23有-延伸部231及一訊號鲜點说，第3圖 參閱，延伸部231為穿透金屬框2〇2及接地線路而延伸進高頻 电路區201 Θ ’可將向頻訊號傳入高頻電路區2〇1冑理或將處 理過後的高頻訊號送出，訊號銲點232位於高頻電路區2〇1外 傳輸線23❺末端’可透過銲鍚26與同軸傳輸線％之傳輸端 251相焊接，第4圖參閱；由於高頻訊號傳輸路徑的周圍特定 距離需有接地電位以維持其訊號傳輸的特性阻抗，故除了以電 路層30之接地電路31佈設於電路層2〇下方外，訊號鲜點说 及同軸傳輸線25之傳輸端251的周邊皆須料導電元件導通 至接地電位目而於該訊號銲點232周圍設有複數個接地鲜點 24、於同軸傳輸線25内傳輸端251之周圍環繞有一接地環 252接地化252可透過銲％ 26焊接於接地鲜點24上，接地 =點24上則有-至多個接地通孔如貫穿該電路板裝置2， 第3圖蒼照’且接地通孔241周壁有導電金屬電性導通至電路 層30之接地電路31以及最下方的電路層5〇。 如第4及第5圖所示，該電路層5〇上設有一同轴測點a _轴測點51具有一軸心別以及環繞於該軸心510之-同 衣511 A軸、51〇没有正向穿設上述該電路板裝置之—導 電通孔51Ga及沿該導電通孔撕孔壁所佈設之—具導電性的 M308600 導電金屬51〇b，並與該訊號銲點232相連接，該同心環511 為具v電性的金屬環狀物，以特定之一間距512環繞於該軸心 510並縱向貫設至該電路層3〇而與接地電路31電性導通，該 間距512對應至電路層3〇、4〇中則為中空的部位，可使該訊 號銲點232傳遞高頻訊號至該同軸測點51的路徑中訊號衰減 的影響最小’·電路層5G上更有複數個接地測點52，為該些接 地通孔241胃牙至電路| 5〇之下表面上所形成之態樣，可更 有效屏蔽其他電性峨或雜輯高舰號的干擾。 因此本創作所提供之高頻電路板裝置係將高頻電路佈設 於上表層，將職接點佈設於下表層，使高頻電路板裝置之 上、下表面分财處理高頻訊號及進行〗c τ測試的電路功能， 故上述實施例之該電路钱置2於電路層2()上表面之平面空 間中设置-傳輸線23 ’彻傳輸線Μ及導電金屬$鳴傳導 高頻訊號’使該電路钱置2於導電祕製减，還未如 同軸傳輸線25等模組零件之模組化碎前，即可利用電❹ 50之同軸測點51與電測機台電性連接以即時測試高頻ς 性’並因同軸測點51之結構使高頻類比訊號傳輪時 因 定之特性阻抗：相較於習狀_電路板，不但小、 空間中額外拉設測試接點的設計，有效利用電路二、平面 降低天線效應的產生，亦可減少了連接㈣設置，有並 產成本；且由於該同軸測點51與高頻電路之間生 傳導方式’使高頻測試訊號傳輸路徑可小於如 °、电性 孓以平面設 11 M308600 額外傳輸路徑中產生訊號衰減 心510之間的間距512中空結 計之方式，因而減少高頻訊號於 的可能性’又有同心環511與轴 構’更能降低訊號衰減的影塑。 另本創作亦可應用習用之連接器裝置而 測的準雜，如第6圖所示為本創作所提供第二較佳實施例之 一電路層6〇 ’同於上述電路層20具有該高頻電路區2(Π、傳 輸㈣及_傳輸線25，其差異在於傳輸線U的訊號焊點 232上更增設一連接器61，連卿61係有-接頭6U、-接 可進-步躺以批51G傳輸高舰號是否產生訊號衰減的 影響然後加以校正測試數據，使本創作所提供以同軸測點Μ 之尚頻電測結構具有最佳的電測準確性。 環6U及-底座613，接頭611及接環612為具導電性的金屬 材料，且接頭611與訊號銲點232電性導通，接環612斑傳輸 線23兩侧之接地銲點24電性連接，総613為絕緣材料；因 此連接器61可直接接設至制機台，將所測得的高頻訊號測 試數據與電路層5G之同軸測點51測得的高頻訊號作比對，而 另值得一提的是，本創作所提供之高頻電路裝置主要為有 貫穿上表面傳輸線及下表面同軸測點之間的通孔結構，使方便 於下表面作ICT測試，因此電路板結構並不限定中間層的堆 疊，唯本創作以便於說明而將如上述實施例之接地電路31及 電源電路41分置於不同的基底300、400上，然亦可為實現於 12 M308600 同-電路層基底上之製程技術而皆有等同之功效。 唯’ Μ上所述者’僅為摘作之較封行實關 舉凡應用本創作說明書及申^ » 1 . 甲W專利乾圍所為之等效結構變 化，里應匕έ在本創作之專利範圍内。 【圖式簡單說明】M308600 VIII. New description: [New technical field] This creation is related to the circuit board device, especially a high-frequency circuit board device with synchronous measurement. μ work [previous technology] On the printed circuit board (PCB) of the general high-frequency communication circuit, the signal and circuit must be transmitted with specific layout or parts, and the brig stop signal is touched = reduced, distorted or interfered with by noise. The factors that reduce the quality of communication, such as 哀 鬲, 鬲 讯 处理 处理 处理 和 和 和 和 和 和 和 和 和 收发 收发 收发 收发 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀 哀The transmission line acts as a signal transmission medium to avoid noise interference and the characteristic impedance of the Weibei. Therefore, in order to ensure the signal transmission quality of the circuit layout, the circuit test of the high-frequency communication product is an important project, as shown in Fig. 1, the brush circuit board 1 has a high-frequency circuit area 10, - coaxial, line 11 and most = speed electronic component 14, high frequency circuit area 1G is provided with a radio frequency circuit, the periphery of the high area 10 is surrounded by a ground circuit, and the corresponding setting property can pass the peripheral high-speed electronic components 14 The generated electric (four)h (EMI) is shielded outside the high frequency circuit area 1G and electrically connected to the potential zero point, and the axis 11 is connected to the antenna device for transmitting and receiving the wireless high frequency signal, and the high frequency electric circuit extends to the high frequency There is a signal line 12 outside the circuit area 10, and further extends 20 to M308600, a conducting portion 121 and a testing portion 122. The conducting portion 121 is electrically connected to the coaxial line n, and a connector is disposed at the near end of the testing portion 122. 13. The center of the connector 13 is electrically connected to the test portion 122 of the signal line 12. The connector 13 is used for testing the test machine. Therefore, it is convenient for the production line to test the electrical characteristics of the high-frequency signal transmission in the high-frequency electronic circuit. However, the circuit layout on the printed circuit board is highly concentrated, and the design method for additionally drawing the test contact undoubtedly needs to occupy the effective use space on the circuit board; and for the circuit portion exposed outside the metal shielded area, The signal transmission line connected to the antenna is covered with a material with a specific impedance design. Therefore, the test connection and the trace provided separately increase the path of electromagnetic interference, resulting in unnecessary antenna effect; and the test connection is from the original The high-frequency circuit signal line is additionally shunted. Not only the test trace pulled out is easy to attenuate the transmission signal originally connected to the antenna, but also the signal characteristic measured by the test machine is also the attenuated transmission signal, so it is not easy to measure the actual high. The transmission quality of the frequency circuit signal. [New content] Therefore, the main purpose of this creation is to provide a high-frequency circuit board device with synchronous test function, which can effectively utilize the circuit design space on the circuit board, and can synchronously test the high-frequency signal transmission during the manufacturing process. Electrical characteristics and avoid electromagnetic noise interference. In order to achieve the pre-existing purpose, the high-frequency circuit board device provided by the creation, M308600 is equipped with at least two circuit layers, one of which is provided with high-frequency electronic circuits, including grounding lines and high-frequency analogy. At least one transmission line of the signal, the ground line is electrically connected to a ground potential, and a plurality of grounding pads are electrically connected to the ground line adjacent to the transmission line to maintain the characteristic impedance of the transmission line to transmit the high frequency analog signal (Characteristic impedance), the transmission line can be electrically connected to a common coaxial transmission line, so that the coaxial transmission line is electrically connected to the antenna device for transmitting and receiving the wireless high-frequency signal; and the other test circuit layer is provided with at least one coaxial measurement point. The coaxial measuring point has an axial center and a concentric ring, and the axial center is provided with a conductive through hole that is forwardly inserted through the circuit board device, and corresponds to the transmission line of the high frequency circuit layer, and the conductive through hole The wall has a conductive conductive to the genus, and is electrically connected to the transmission line, and can transmit a high frequency analog signal to the test circuit layer, and the concentric ring is A specific distance surrounds the axis, and the concentric ring is a v-shaped metal ring, and the test circuit layer is forwardly inserted and electrically connected to a ground potential to maintain the high-frequency analog signal of the conductive via. The characteristic impedance; therefore, the high-frequency circuit board device provided by the present invention can use the coaxial measuring point and the electric measuring machine before the conductive circuit process, before the modularization of the π-axis transmission line module component The station is electrically connected to test the characteristics of the high frequency circuit in real time. Another object of the present invention is to provide a high-frequency circuit board device with a synchronous test function, which can measure the transmission quality of the actual high-frequency circuit signal and effectively avoid the influence of the attenuation of the chirp signal. In order to achieve the pre-existing purpose, the high-frequency circuit board device provided by the present invention, the M308600 has a side adjacent to the connection on the transmission line of the upper n-channel layer. _分%丨w — #fj ,] The grounding soldering point, the connector is provided with a guiding/one, a joint and a ring, the joint is electrically connected to the transmission line, the connecting ring is connected to the grounding zinc point, and the connecting rib is electrically connected To the machine, the electrical characteristics of the frequency signal; therefore, the measured high-frequency signal test, the high-frequency signal measured by the coaxial measuring point of the circuit layer can be compared, and the current value is reduced by the axis % Whether the transmission 6 is affected by the signal attenuation and then the 'father positive test data, so that the high-frequency electrical measurement function of the off-point structure provided by this method has the best electrical measurement accuracy. [Embodiment] A number of diagrams - preferred embodiments for making the components and functions of the creation - step by step, the brief description of which is as follows: Figure 2 is the most of the first-age embodiment provided by the creation. The upper circuit layer is schematic; the third picture is the uppermost circuit layer of the above-mentioned preferred Schematic diagram of circuit layout around the transmission line; Figure 4 is a partial view of the above-mentioned "better-compensated circuit board device" showing the circuit structure of the high-frequency circuit conducting the high-frequency signal to the coaxial transmission line and the coaxial measuring point in the circuit board device The second embodiment of the circuit board device of the first preferred embodiment is shown in the lower view of FIG. 3, and the circuit layout of the lowermost circuit layer around the coaxial measuring point is indicated by the M308600 circuit layer. The present invention provides a partial schematic view of the uppermost reed of the second preferred embodiment. 曰Please refer to the second to fifth _ shows that the present invention provides 四 from the top to the bottom with four circuit layers 20, 30, 40, 50, wherein the uppermost circuit layer 20 is a high frequency circuit layer mainly disposed with a high-view circuit, the circuit layer 30 is provided with a grounding Wei 31, and the strip guiding potential zero point, and the circuit layer is provided with a power circuit 41 'electrically conductive to The DC power supply is electrically connected to the DC supply potential node of the circuit layer 2G. The circuit layer (4) of the lowermost layer is the test circuit layer for the ict test, and each circuit layer 2〇, such as u is a high dielectric material. One base Fine, fine, and thorough, can produce unnecessary parasitic electrical effects between the 20, 3〇, 4G, and 5G layers, and the shirt sounds the electrical characteristics of the circuit «2, the following for the circuit layer 2〇, % For further details: As shown in Figure 2, the t-layer 2 has a high-frequency circuit area 2〇1 for transmitting and processing the local frequency analog signal, including multiple lines h and Electric = processed electronic components 22, and surrounded by _ metal frame, metal frame - 2 rhyme corresponding to the grounding line, can be used as a high-frequency circuit electromagnetic wave screen: 'to the outer 15 high-speed f sub-component The electromagnetic interference (emi) is shielded outside the frequency circuit area 201 and electrically connected to the ground circuit of the circuit layer 3; the high M308600 frequency circuit area 201 has a transmission line 23 and a coaxial transmission line 25, and the coaxial transmission line 25 (four) connection seam The scaly high-parity antenna device, the transmission line Μ is electrically connected to the _ transmission line 25 t central special (four) high-ship-transmission terminal 25, the transmission line 23 has - extension 231 and a signal fresh point said, see Figure 3, The extension portion 231 extends into the high frequency circuit through the through metal frame 2〇2 and the ground line 201 Θ ' can send the frequency signal to the high frequency circuit area 2〇1 processing or send the processed high frequency signal, the signal soldering point 232 is located in the high frequency circuit area 2〇1 outside the transmission line 23❺ end through the soldering 26 is soldered to the transmission end 251 of the coaxial transmission line %, as shown in FIG. 4; since the specific distance around the high-frequency signal transmission path requires a ground potential to maintain the characteristic impedance of the signal transmission, the ground circuit 31 except the circuit layer 30 The wiring is disposed under the circuit layer 2, and the periphery of the transmission end 251 of the coaxial transmission line 25 is required to conduct the conductive element to the ground potential. The plurality of grounding points 24 are disposed around the signal soldering point 232. A grounding ring 252 is grounded around the transmitting end 251 in the coaxial transmission line 25, and the grounding 252 is soldered to the grounding fresh spot 24 through the soldering % 26, and the grounding point 24 has a plurality of grounding through holes, such as through the circuit board device. 2, FIG. 3 is a backlight and the peripheral wall of the ground via 241 is electrically conductively electrically connected to the ground circuit 31 of the circuit layer 30 and the lowermost circuit layer 5A. As shown in the fourth and fifth figures, the circuit layer 5 is provided with a coaxial measuring point a. The measuring point 51 has an axis and a surrounding of the axis 510 - a 511 A axis, 51 〇 The conductive via 51Ga of the above-mentioned circuit board device and the conductive M308600 conductive metal 51〇b disposed along the wall of the conductive via hole are not forwarded, and are connected to the signal solder joint 232. The concentric ring 511 is a v-shaped metal ring, and is connected to the axis 510 at a specific one of the pitches 512 and longitudinally connected to the circuit layer 3 to be electrically connected to the ground circuit 31. The pitch 512 corresponds to To the circuit layer 3〇, 4〇 is a hollow part, which can make the signal soldering point 232 transmit the high frequency signal to the coaxial measuring point 51. The influence of the signal attenuation is minimal. · There are more than one on the circuit layer 5G. The grounding measuring point 52 is formed on the surface of the grounding through hole 241 from the stomach tooth to the circuit 5 5 , and can effectively shield the interference of other electrical defects or high number of ships. Therefore, the high-frequency circuit board device provided by the present invention has a high-frequency circuit disposed on the upper surface layer, and the service contact point is disposed on the lower surface layer, so that the upper and lower surfaces of the high-frequency circuit board device are divided into high-frequency signals and processed. c τ test circuit function, so the circuit of the above embodiment is set to 2 in the plane space of the upper surface of the circuit layer 2 () - transmission line 23 'transmission line Μ and conductive metal $ 鸣 conducting high frequency signal' to make the circuit Qian set 2 in the conductive secret reduction, before the modularization of the module parts such as the coaxial transmission line 25, the coaxial measuring point 51 of the electric cymbal 50 can be electrically connected with the electric measuring machine to test the high frequency 即时 instantaneously. And because of the structure of the coaxial measuring point 51, the high-frequency analog signal transmission is determined by the characteristic impedance: compared to the _ board, not only small, space to pull the design of the test contact, effectively use the circuit two The plane reduces the antenna effect, and can also reduce the connection (4) setting, and has the cost of production; and because the coaxial measuring point 51 and the high-frequency circuit generate a conduction mode, the high-frequency test signal transmission path can be less than, such as °, Electrical The surface of the 11 M308600 extra transmission path produces a signal 1024 between the signal attenuation core 510 hollow junction, thus reducing the possibility of high-frequency signals. And the concentric ring 511 and the axial structure can reduce the attenuation of the signal. Plastic. In addition, the present invention can also be applied to the conventional connector device. As shown in FIG. 6, the circuit layer 6' of the second preferred embodiment of the present invention is the same as the above circuit layer 20. Frequency circuit area 2 (Π, transmission (4) and _ transmission line 25, the difference is that a connector 61 is added to the signal soldering point 232 of the transmission line U, and the Lianqing 61 series has a connector 6U, and the connection can be stepped in to the batch. Whether the 51G transmission high ship number has the effect of signal attenuation and then corrects the test data, so that the creation of the coaxial frequency measurement structure with coaxial measuring point has the best electrical measurement accuracy. Ring 6U and - base 613, connector 611 and the ring 612 are made of a conductive metal material, and the joint 611 is electrically connected to the signal soldering point 232, and the grounding pads 24 on both sides of the ring 612 transmission line 23 are electrically connected, and the crucible 613 is an insulating material; The device 61 can be directly connected to the machine table, and the measured high-frequency signal test data is compared with the high-frequency signal measured by the coaxial measuring point 51 of the circuit layer 5G, and it is worth mentioning that the creation The high frequency circuit device provided mainly has a transmission line extending through the upper surface and The through-hole structure between the surface coaxial measuring points makes it convenient for the lower surface to be ICT tested, so the circuit board structure does not limit the stacking of the intermediate layers, and the present invention is for the purpose of explanation, and the grounding circuit 31 and the power source as in the above embodiment are used for explanation. The circuit 41 is placed on different substrates 300, 400, but it can also be equivalent to the process technology implemented on the 12 M308600 same-circuit layer substrate. The application of this manual and the application of this patent specification are as follows: 1. The equivalent structure change of the patented W is the scope of the patent.
f 1圖係制高頻電路印刷電路板之示意圖； >第2圖係摘作所提供第-触實施狀最上層電路層 弟3圖係上述第— 周園的電路佈設示意圖； 較佳實施例之最上層電路層於傳輸 線 第二圖係上述第—触實施例之電路板裝置的局部剖視 圖』不錢路板褒置中高頻電路傳導高頻訊號至同轴傳輸線 及同軸測點的電路結構；F 1 is a schematic diagram of a high-frequency circuit printed circuit board; > Figure 2 is a schematic diagram of the circuit arrangement of the first-stage circuit of the first-layer circuit layer provided in the first-touch embodiment of the first-touch embodiment; The uppermost circuit layer of the example is a partial cross-sectional view of the circuit board device of the above-mentioned first-touch embodiment in the second line of the transmission line. The circuit structure of the high-frequency circuit conducting the high-frequency signal to the coaxial transmission line and the coaxial measuring point ;
第5圖係上述第—較佳實施例之電路板裝置於第3圖所相 對之下視圖’為最下層電路層於同軸測點周圍的電路佈設示意 圖； & 一圖係本創作所提供第二較佳實施例之最上層電路層 的局部示意圖。 【主要元件符號說明】 2電路板裝置 13 M308600 20 > 30 - 40 - 50 、60電路層 200、300、400、 500基底 201南頻電路區 202金屬框 21訊號線 22電子元件 23傳輸線 231延伸部 232訊號銲點 24接地銲點 241接地通孔 25同軸傳輸線 251傳輸端 252接地環 26銲錫 31接地電路 41電源電路 51同軸測點 510軸心 510a導電通孔 510b導電金屬 511同心環 512間距 52接地測點 61連接器 611接頭 612接環 613底座 14Figure 5 is a schematic view of the circuit board device of the above-described first preferred embodiment in a lower view of the third embodiment of the circuit of the lowermost circuit layer around the coaxial measuring point; & Figure 1 is provided by the present application A partial schematic view of the uppermost circuit layer of the second preferred embodiment. [Main component symbol description] 2 circuit board device 13 M308600 20 > 30 - 40 - 50, 60 circuit layer 200, 300, 400, 500 substrate 201 south frequency circuit area 202 metal frame 21 signal line 22 electronic component 23 transmission line 231 extension 232 signal solder joint 24 ground solder joint 241 ground through hole 25 coaxial transmission line 251 transmission end 252 grounding ring 26 solder 31 ground circuit 41 power supply circuit 51 coaxial measuring point 510 axis 510a conductive through hole 510b conductive metal 511 concentric ring 512 spacing 52 Grounding point 61 connector 611 joint 612 ring 613 base 14