M308446 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱模組測試治具，尤其是指一。卫 熱模組正面壓覆於中央處理單元晶片之測試治具疋a種可使β 【先前技術】 ^ 目前-韻生紅主贴在崎完輕必轉麵 =否為不良品’其係設計-固定治具來固定待測板後再來 進灯相關之測試，並裝設有相應待測板之散熱模組主體，以進行 無合之顧，細此狀況往_為各項產品機 組不同’導致每一種機型之散 政'，，、棋 利於測試健。 n观與大小也不_，並不 另外’若設計製造公司因為散熱模組㈣之 致。 機型上之中央處理單元晶片（Ce_ p_ingumt=「 不必隨著電腦域㈣時，賴人員财將 單元晶片上之散熱模組卸除，如此，將造成重工之問=== 狀間亦使得原先鎖固之螺牙有所損傷。再者，在進行測試作 =’、需將散熱模組與待測板上之中央處理單元晶片作一緊密貼 [口動作’如果貼合不確實，將造成中央處理單元晶片之受 力不均’進而造成損壞，測試亦無法繼續進行。 *故針對上制題，本創作發明人已提出相應的解決方案，如 中爭民國專利公告第聰別號案（第578案）所揭示之一種萬 用散熱模組測試治具。 ^ 木中，於測試治具上設計有一固定板架，固定板架 M3 08446 上設有-散熱模組，固定板架並且藉由二鉸鍵抱接於測試治具 上’當待測板設置於測試治具上時’固定板_向中央處理單元 晶片的位置旋轉並壓合於其上，輯制板上之中央處^單^ 片進行散熱，避免職過程裡中央處理單元晶片之過^。 定板架細可旋轉關係設置於測試治具上，亦即位於固定板架上 之散熱她細旋轉方式祕合巾央處理單元晶丨，而這樣的方 式往往易使得散熱模組於遷合過程中先單點撞擊到中央處^單元 晶片上的轉’之魏著固定板架之旋轉才逐漸地壓合ς上，由 於固定板架並非沿著巾央處理單元晶片之法線方向作壓合動作， 這將使得中央處理單元晶片受力不均而遭致損壞；再者，為使散 熱池壓合財央處理單元W之魏更加緊魏覆以提升導熱 效率於固定板架與散熱模組之間還設有複數個彈性元件，用以 進行自動導正之貼合動作，但在某些機型下，這轉性元件仍然 热法滿足緊密貼覆之要求，以致㈣效率不高，進崎低測試之 效果0 【新型内容】 根據白知技術，仍無法在散熱模組的壓合方式，以及緊密貼 财央處理單元晶4便於導熱上達成最佳化設計 ，有鑒於以上問 題/而本創作之目的在於提供一種散熱模組測試治具，以使散 熱，組能正面歸並緊龍合於巾央Α理⑼，不致破壞中央處 理單元晶片以順利進行熱交換。 i為了達成上述目的，本創作提供一種散熱模組測試治具，以 使政熱她與-發熱電子元件進行熱交換，此綱治具包含有一 M308446 主體座、一固定板架及一懸置機構，其中主體座設有一連接座及 弟瓜卡元件，而固定板架極設於連接座，而可相對於主體座 作一掀起或壓合之動作，並設有一匹配於該第一嵌卡元件之第二 甘八卡元件，用以在主體座作一壓合動作後，第二喪卡元件可與第 一甘欠卡兀件相互卡合。另外，懸置機構相應於發熱電子元件之位 置而设於固定板架一端，於固定板架平行於主體座時，懸置機構 1 糸與發熱電子元件間形成—間距，懸置機構更包含有-散熱模 、、且’舌動座及一固定座，而散熱模組包含有一散熱片體，其底 面之二相·各設有—連接架，各連接架分別S設有複數個調整 件及二平行轉調整件之導桿，活動座則包含有-承載板、一相 應於承载板之Μ合板，及複數侧定柱，各固定柱之 別設於承载板及墨合板，其中，承载板之一面凸設有 = 而f载板—穿孔，壓合板中央_-貫孔，^置 ，且私板相應於各導桿之位置處設有二結合孔，以 于牙人{§定座包含有—基板及—位於基板底面之 之二側相應於各穿孔位置處設有一直桿，並穿設於各穿 二=動=相對於固定座移動，各直桿於承載板底面之 制桿紅位置樞設有1 作部，當旋轉操作部時，祕Ρ 輪部一端所相對延伸之操 作直線運動，活動座並戶縮係以凝轉運動之方式鶴活動座 而使散埶麵正6^二:性件’活動座且能帶動散熱模組’ 月又…犋、、且正向屋覆於發熱電子元件上。 4乍之力效在於’散熱模組能以正面壓覆於中央處理單元 M3 08446 換之進行。 =:=二單點撞擊中央處理單元晶片而發生損壞之狀況， 以:早兀晶片時’能更加緊密地接觸，而利於熱交 =下在方式中詳細敘述本創作之詳細特徵以及優點，其 内谷足以使任何料相職藝者了解本創作之技_容並據以實 施，且根據本說明書所揭露之内容、申請專利範圍及圖式，任何 熟習相驗蟄者可輕絲轉本創作_之目的及優點。 【實施方式】 · 為使對本創作的目的、構造、特徵、及其功能有進—步的瞭 %，炫配合貫施例詳細說明如下。 根據本創作所揭不之散誠組測試治具，係使散熱模組能壓 合於各不同_之發熱電子元相進行健，其巾，發熱電子元 件係應祕電路板上，例如巾央處理單元晶片 Umt，CPU)、繪圖晶片（GraphicChip)、系統邏輯晶片組你她 Chipset)歧其他種類的積體電路晶片。在以下本創作的詳細說 明中，發熱電子元件將以中央處理單元晶片作為本創作之應用實 施例。 請參閱「第1A圖」、「第1B圖」，並結合參閱「第2圖」所 不，係為本創作實施例之散熱模組測試治具，其包含有主體座 110 ’固定板架120與懸置機構130。主體座110之外形係為長方 形，但不以此為限，主體座110上係開設有二鎖合孔111，二鎖合 孔111主要係與一治具底座2⑻相固定。又，主體座11〇上係設 M308446 有外形為長方形之連接座112,且連接座112上之二相對側分別插 财-鉸鏈ι13，二鉸鏈ι13再與_板架12G之二側她接，使 固定絲12〇可以二鉸鏈II3為轉動軸心作—掀起或壓合之動 作。主體座110更設有第一嵌卡元件114及鄰近於第一嵌卡元件 114之擋止件115。第一嵌卡元件114具有卡勾座116,卡勾座⑽ 上枢设有可活動之卡勾117,而擋止件115係鄰設於第一嵌卡元件 114周圍，而呈一桿狀。 另外，固定板架120上設有鏤空部122，以供第一嵌卡元件 H4之卡勾117伸入，以及與第一嵌卡元件114相匹配之第二嵌卡 件124。在固定板架120以二鉸鏈113為轉動軸心作一壓合之 動作後，可令第二針元件124與第一嵌卡元件114彼此進行卡 合。 固疋板木120之一端設有懸置機構13〇。懸置機構UQ係藉 由支架125而連結於固定板架120，用以裝設散熱模組3〇〇。其中， 放熱模組300包含有散熱風扇3〇1與散熱片體302，散熱風扇3〇1 係位於散熱片體302之頂面，而散熱片體3〇2底面之二相對側各 &有連接架303 ’二連接架303再分別豎設有複數個調整件3〇5 (如彈簧），及二平行於各調整件305之導桿3〇6。 懸置機構130更包含有活動座14〇與固定座15〇,活動座14〇 係設於固定座150之底面，並用以結合散熱模組3⑻。其中，活 動座140包含有承載板14卜相應於承載板141之壓合板142，及 複數個設置於承載板141與壓合板142間之固定柱143，而各固 定柱143之二端係分別設於承載板141與壓合板142，如此，活 10 M308446 動座140内便形成有一容置空間。而承載板141之一面凸設有連 結塊144，在承载板141之二侧並分設有穿孔145。壓合板142具 有一貫孔146，並且壓合板142之相應於二導桿306位置處設有 二結合孔147。在活動座140與散熱模組300相結合時，貫孔146 可供散熱模組300置入，並且使散熱模組3〇〇位於容置空間内。 當散熱模組300位於容置空間内時，二導桿3〇6係穿設於二結合 孔147，複數個調整件305另端連結於壓合板142之貫孔146外 側，且使得壓合板142與連接架303之間形成一間距，如此，在 政熱片體302壓合於待測板4〇〇上之中央處理單元晶片4〇1時， 散熱片體302可利用各調整件305進行自動導正之貼合動作，緩 衝活動座140之下壓力。 又，固定座150則包含有基板151及設於基板151底面之鎖 附板152，其中’基板151之二相對侧各設有一直桿153，各直桿 153係用以相應穿設承載板141之二穿孔145，再者，各直桿I% 與活動座之承紐⑷底面間更套設有雜件⑽與不連續 環161 ’不連續環161係用以固定彈性件160於直桿153上，彈 性件160之彈性力可防止活動在垂直移動時下動過大而 _散熱片體302。基於上述的結構，活動座14〇適於相對於固 定座150移動，且能調整散熱片體3〇2與中央處理單元晶片他 間之貼覆關係。 而鎖附板152設有開D 155，且相應於活動座⑽中連 ⑷之位置則樞設有屢制桿154，開口 155可供墨制桿 空間。塵制桿W包含有凸輪部156，及自凸輪部156 —端相^ 11 M3 08446 L伸之t作I57。又’凸輪部1S0係可接觸於連結塊⑷，並栖 接於鎖附板！52，當旋制桿154以下塵連結塊144時，活動 座140受連結塊144影響而一並作直線運動，因而屢制桿154之 旋轉運動係可職成活動座⑽之直線運動，並帶動散熱模組· 朝中央處理單晶片401之方向移動以使散熱片體搬貼覆於中 央處理單元晶片4〇1。 請參閱「第3圖」、「第4圖」與「第5圖」所示，將主體座 1—10透過其上之二鎖合孔m鎖固於治具底座上，且接上散熱 板組300 +散熱風扇3〇1的電源、，並使待測板·透過治具底座 20^上所佈設之複數根支撐柱迎而置於其上方，且貼設有散熱 錫泊紙310於散熱片體3〇2之底面，如此，固定板架⑽可以二 ，鏈113為轉軸作—往下壓合之動作，同時，機構130亦會 隨固定板架12G旋轉，當蚊板架12Q平行於待測板彻上之^ 央處理單元晶片401，亦即固定板架12〇被擔止件115所抵頂而 停止旋轉錄於水平位置時，麵罐⑽亦隨之停止旋轉並與 中央處理單元晶片401形成間距，而第一針元件114的卡勾ιΐ7 伸入鏤空部m ’第二喪卡元件）24即卡合於第—嵌卡元件Μ4， 此％ ’懸置麵130即保持一正面壓合之方向，使得散熱片體皿 可由上而下壓覆於中央處理單元晶片401。 接著，開始旋轉壓制桿之操作部m，凸輪部说合在 方辑時下壓連結塊144，連結塊144進而會帶動活動座14〇二沿 著各直桿153❿垂直向下移動，活動座⑽中承載板⑷進而施 壓予各直桿153上之彈性件，使各彈性件⑽逐步蓄積回復 12 M3 08446 =，職件副㈣也會控制活動座⑽下麼散熱片體搬的力 罝’而活動座⑽會再連動散熱模組_併向τ移動。當_ 桿⑸旋轉九十度，各彈性件160無法再觀縮，使得活動座_ 不再移動，同時散熱片體302恰可正向麼覆在待測板上 央處理單元晶片401。 在散熱片體3〇2接觸中央處理單元晶片4〇1之時，各調整件 305會自動緩衝活動座14〇中屢合板]42所施予散熱片體迎之 下屋力，使得散熱片體302與中央處理單元晶片4〇1之接觸面上， ^處的受力能夠分佈均勻，並達職密貼覆之絲，而測試人員 亦可展開製程測試。、 m 本創作透過此測試治具之設計，進而可達到實現適用測試各 年士不同產品機型之中央處理單元晶片所需散熱需求之目的，同 ^猎域止件的設置，可使拥定絲相對於主體座旋轉並靠 才，固定板架係被關下麟度而處在水平位置，如此一來， 面壓覆於中央處理單元以，她於習知技術中旋 二^ 正面壓覆並不會產生單點撞擊而遭 小二赦^均之^事’此外，控繼置機構之位移行程，能逐步縮 曰^士、果、、績:央處理早凡晶片之間距，並在貼覆中央處理單元 :、蚪’自動導正其貼合接觸關係，而利於熱交換之進行，且可 冒進治具於測試過程中的效率。 本創=糊作已叫賊如上，綠鱗用以限定 侧者，在獅本創作之精__， " 更動與潤飾’因此本創作之專利保護範圍須視後附 13 M308446 之申請專利範圍所界定者為準。 【圖式簡單說明】 第1A圖，本創作散熱模組測試治具之結構示意圖。 第1B圖，本創作散熱模組測試治具之懸置機構立體分解圖。 第2圖，本創作散熱模組測試治具與底座之組立圖。 第3圖及第4圖，本創作散熱模組測試治具之懸置機構動作 示意圖。 第5圖，本創作散熱模組測試治具之立體外觀圖。 【主要元件符號說明】 110 ..................................................主體座 111 ..................................................鎖合孔 112 ..................................................連接座 113 ..................................................鉸鏈 114 ..................................................第一嵌卡元件 115 ..................................................擋止件 116 ..................................................卡勾座 117 ..................................................卡勾 120..................................................固定板架 122..................................................鏤空部 124 ................................................................第二嵌卡元件 125 ..................................................•支架 130..................................................懸置機構 活動座 14 140 M308446 141 ..................................................承載板 142 ..................................................壓合板 143 ............... 固定柱 144 ..................................................連結塊 145 ..................................................穿孔 146 ..................................................貫孔 147 ................................................••結合孔M308446 Eight, new description: [New technology field] This creation is about a thermal module test fixture, especially one. The test module on the front side of the thermal module is pressed against the central processing unit chip. A kind of β can be used. [Previous technology] ^ Currently - rhyme red main sticker on the end of the light must turn surface = no bad product' - Fix the fixture to fix the test board and then enter the test related to the lamp, and install the main body of the heat sink module corresponding to the board to be tested, so as to make the situation unmatched. 'Leading the decentralization of each type of machine', and chess is good for testing. n view and size are not _, not the other 'if the design and manufacturing company because of the thermal module (four). The central processing unit chip on the model (Ce_p_ingumt=“It is not necessary to follow the computer domain (4), the personnel module will remove the heat dissipation module on the unit chip, so that the heavy work will be caused. === The locking screw has been damaged. In addition, the test is done as ', and the heat-dissipating module must be closely attached to the central processing unit chip on the board to be tested. [Bottom action 'If the fit is not correct, it will cause The unevenness of the central processing unit chip caused damage and the test could not be continued. * Therefore, in response to the above-mentioned problem, the inventor of the present invention has proposed a corresponding solution, such as the case of the China Patent Proclamation No. A universal heat-dissipation module test fixture disclosed in the 578th case. ^ In the wood, a fixed plate frame is designed on the test fixture, and the fixed plate frame M3 08446 is provided with a heat dissipation module, a fixed plate frame and a borrowing Attached to the test fixture by two hinges 'When the board to be tested is placed on the test fixture', the fixed plate _ rotates to the position of the central processing unit wafer and is pressed onto it, at the center of the board. Single ^ piece for heat dissipation The central processing unit wafer passes through the process. The finely rotatable relationship of the fixed plate frame is set on the test fixture, that is, the heat dissipation on the fixed plate frame, and the fine rotation mode of the towel processing unit is processed in such a manner. It is often easy for the heat-dissipating module to first hit the center of the heat-dissipating module during the relocation process. The rotation of the fixed-plate frame on the unit wafer is gradually pressed against the raft, because the fixed plate frame is not along the towel center. The normal direction of the processing unit wafer is pressed, which will cause the central processing unit wafer to be damaged due to uneven force; in addition, in order to make the cooling pool pressurize the financial processing unit W, the Wei is more tightly coated to enhance the thermal conduction. The efficiency is also provided with a plurality of elastic elements between the fixed plate and the heat dissipation module for the automatic guiding action, but in some models, the rotating element still meets the requirements of the close fitting. Therefore, (4) the efficiency is not high, the effect of the test is low. [New content] According to Baizhi technology, it is still impossible to achieve the best heat transfer in the heat-dissipating module. Design, in view of the above problems / and the purpose of this creation is to provide a thermal module test fixture, so that the heat dissipation, the group can be merged into the front of the towel (9), without destroying the central processing unit wafer for smooth operation Heat Exchange. In order to achieve the above objectives, the present invention provides a heat-dissipation module test fixture for heat exchange between the heat and the electronic components. The fixture includes a M308446 body seat, a fixed plate holder and a suspension. a mechanism, wherein the main body seat is provided with a connecting seat and a diaper card component, and the fixed plate frame is disposed at the connecting seat, and can be lifted or pressed with respect to the main body seat, and is provided with a matching to the first embedded The second card component of the card component is configured to engage the first card component with the first card component after the pressing operation of the body block. In addition, the suspension mechanism corresponds to the heat generating electronic component The position is set at one end of the fixed plate frame. When the fixed plate frame is parallel to the main body frame, the suspension mechanism 1 形成 forms a gap with the heat-generating electronic component, and the suspension mechanism further includes a heat dissipation mold and a tongue. a heat sink and a fixed seat, and the heat dissipation module comprises a heat sink body, wherein two sides of the bottom surface are respectively provided with a connecting frame, and each connecting frame is respectively provided with a plurality of adjusting members and guiding rods of two parallel rotating adjusting members The movable seat comprises a carrier plate, a plywood corresponding to the carrier plate, and a plurality of side columns, wherein the fixing columns are disposed on the carrier plate and the ink plate, wherein one of the carrier plates is convexly disposed and f The carrier plate-perforation, the center of the pressing plate is _-through hole, and the private plate is provided with two bonding holes corresponding to the positions of the guiding rods, so that the teeth can be placed on the bottom surface of the substrate. The two sides are respectively provided with a straight rod at each of the perforation positions, and are disposed to be respectively moved by two movements relative to the fixed seat, and each of the straight rods is pivoted at a red position of the bottom of the carrier plate. When the operation part is rotated, the operation of the extension of one end of the wheel is linearly moved, and the movable seat is condensed and moved to form a movable seat, so that the surface of the movable surface is 6^2: It can drive the heat-dissipating module 'monthly... 、, and the roof is overlaid on the heating electronic components. The effect of the 4 在于 is that the 'heat dissipation module can be pressed on the front side of the central processing unit M3 08446 for replacement. =:= Two single points hit the central processing unit wafer and the damage occurs, so that: when the wafer is pressed early, the contact can be more closely contacted, and the heat transfer = the detailed features and advantages of the creation are described in detail. The inner valley is enough for any performer to understand the skill of the creation and to implement it. According to the content, patent application scope and schema disclosed in this manual, anyone who is familiar with the test can change the creation. The purpose and advantages of _. [Embodiment] · In order to make the purpose, structure, features, and functions of this creation advance, the details of the Hyun Coordination are described below. According to the creation test fixtures that are not disclosed in this creation, the heat dissipation module can be pressed against the different heating electron elements to carry out the health, and the towel and the heating electronic components are on the circuit board, for example, the towel center. Processing unit wafers Umt, CPU), graphics chips (GraphicChip), system logic chipsets, and other Chipsets are different types of integrated circuit chips. In the following detailed description of the present work, the heat-generating electronic component will use the central processing unit wafer as an application embodiment of the present creation. Please refer to "1A" and "1B", and in conjunction with "2", it is a thermal module test fixture of the present embodiment, which includes a main body 110' fixed plate 120 And the suspension mechanism 130. The main body 110 has a rectangular shape, but not limited thereto. The main body 110 is provided with two locking holes 111. The two locking holes 111 are mainly fixed to a jig base 2 (8). Moreover, the main body seat 11 is provided with a connector block 112 having a rectangular shape, and the opposite sides of the connecting seat 112 are respectively inserted into the wealth-hinge ι13, and the two hinges 135 are connected to the two sides of the y-panel 12G. The fixing wire 12 〇 can be made by the two hinges II3 as the rotating axis. The body block 110 is further provided with a first card-infoil element 114 and a stop member 115 adjacent to the first card-in-clamping element 114. The first card-incorporating element 114 has a hooking seat 116. The hooking seat (10) is pivotally provided with a movable hook 117, and the stopping member 115 is disposed adjacent to the first engaging component 114 and has a rod shape. In addition, the fixed plate frame 120 is provided with a hollow portion 122 for the hook 117 of the first card-incorporating element H4 to protrude, and a second card member 124 matching the first card-incorporating element 114. After the fixed plate frame 120 is pressed by the two hinges 113 as the rotating shaft center, the second needle member 124 and the first card engaging member 114 can be engaged with each other. One end of the solid wood 120 is provided with a suspension mechanism 13A. The suspension mechanism UQ is coupled to the fixed plate frame 120 by a bracket 125 for mounting the heat dissipation module 3〇〇. The heat dissipation module 300 includes a heat dissipation fan 3〇1 and a heat sink body 302. The heat dissipation fan 3〇1 is located on the top surface of the heat sink body 302, and the opposite sides of the bottom surface of the heat sink body 3〇2 have The connecting frame 303 'the two connecting frames 303 are respectively vertically provided with a plurality of adjusting members 3〇5 (such as springs) and two guiding rods 3〇6 parallel to the adjusting members 305. The suspension mechanism 130 further includes a movable seat 14 〇 and a fixed seat 15 〇. The movable seat 14 〇 is disposed on the bottom surface of the fixed seat 150 and is used for combining the heat dissipation module 3 ( 8 ). The movable base 140 includes a supporting plate 14 corresponding to the supporting plate 141, and a plurality of fixing posts 143 disposed between the supporting plate 141 and the pressing plate 142, and the two ends of the fixing posts 143 are respectively provided. The carrier plate 141 and the pressing plate 142 are formed such that an accommodating space is formed in the movable 10 M308446 movable seat 140. On one side of the carrier plate 141, a connecting block 144 is protruded, and two sides of the carrying plate 141 are provided with through holes 145. The pressure plate 142 has a constant hole 146, and the pressure plate 142 is provided with two coupling holes 147 at positions corresponding to the two guide bars 306. When the movable seat 140 is combined with the heat dissipation module 300, the through hole 146 can be placed in the heat dissipation module 300, and the heat dissipation module 3 can be placed in the accommodating space. When the heat dissipation module 300 is located in the accommodating space, the two guiding rods 3 〇 6 are disposed through the two coupling holes 147 , and the plurality of adjusting members 305 are connected to the outside of the through holes 146 of the pressing plate 142 at the other end, and the pressing plate 142 is caused. A spacing is formed between the mounting frame 303 and the connecting frame 303. Thus, when the central heating unit 302 is pressed against the central processing unit wafer 4〇1 on the board 4 to be tested, the heat sink body 302 can be automatically used by the adjusting members 305. The guiding action of the guide is to cushion the pressure under the movable seat 140. Moreover, the fixing base 150 includes a substrate 151 and a locking plate 152 disposed on the bottom surface of the substrate 151. The two sides of the substrate 151 are respectively provided with a straight rod 153, and each of the straight rods 153 is configured to respectively pass the carrier plate 141. The second hole 145, and further, the straight rod I% and the bottom of the movable seat (4) are provided with a miscellaneous member (10) and a discontinuous ring 161. The discontinuous ring 161 is used for fixing the elastic member 160 to the straight rod 153. Upper, the elastic force of the elastic member 160 prevents the movement from being excessively moved while moving vertically. Based on the above structure, the movable seat 14 is adapted to move relative to the fixed seat 150, and the attachment relationship between the heat sink body 3〇2 and the central processing unit wafer can be adjusted. The lock plate 152 is provided with an opening D 155, and corresponding to the position of the connection (4) in the movable seat (10), a plurality of levers 154 are provided, and the opening 155 is provided for the ink rod space. The dust rod W includes a cam portion 156, and a protrusion t from the end portion of the cam portion 156 M11 08446 L is I57. Further, the cam portion 1S0 is in contact with the joint block (4) and is inhabited by the lock plate! 52, when the screw 154 is below the dust connecting block 144, the movable seat 140 is linearly moved by the connecting block 144, so that the rotating motion of the repeatedly rod 154 can act as a linear motion of the movable seat (10) and drive The heat dissipation module is moved toward the center processing unit wafer 401 so that the heat sink body is attached to the central processing unit wafer 4〇1. Please refer to "3", "4" and "5" to lock the main body 1-10 through the two locking holes m on the fixture base and connect the heat sink. The power supply of the group 300 + cooling fan 3〇1, and the plurality of support columns arranged on the fixture base 20^ are placed on the upper side of the board, and the heat-dissipating tinplate 310 is attached to the heat dissipation. The bottom surface of the body 3〇2, so that the fixed plate frame (10) can be two, the chain 113 is the rotating shaft for the downward pressing action, and the mechanism 130 also rotates with the fixed plate frame 12G, when the mosquito tray frame 12Q is parallel to When the processing unit wafer 401 of the board to be tested is completely covered by the supporting member 115 and stopped to rotate in the horizontal position, the surface tank (10) also stops rotating and the central processing unit The wafer 401 forms a pitch, and the hook ΐ7 of the first needle element 114 extends into the hollow portion m 'the second card component 24) to be engaged with the first card component Μ4, and the % 'suspension surface 130 maintains a front surface The direction of the press is such that the fin body can be pressed over the central processing unit wafer 401 from top to bottom. Then, the operating portion m of the pressing rod is started to be rotated, and the cam portion is pressed to press the connecting block 144. The connecting block 144 further drives the movable seat 14 to move vertically downward along each straight rod 153, and the movable seat (10) The middle carrier plate (4) is further pressed to the elastic members on the straight rods 153, so that the elastic members (10) gradually accumulate and recover 12 M3 08446 =, and the workpiece pair (4) also controls the force of the heat sink body under the movable seat (10). The movable seat (10) will then move the cooling module _ and move to τ. When the _ rod (5) is rotated by ninety degrees, the elastic members 160 can no longer be retracted, so that the movable seat _ no longer moves, and the heat sink body 302 can be positively overlaid on the board processing unit wafer 401 to be tested. When the heat sink body 3〇2 contacts the central processing unit chip 4〇1, each adjusting member 305 automatically buffers the movable plate 14 in the movable plate 14 to apply the heat sink body to the house, so that the heat sink body 302 and the central processing unit wafer 4〇1 contact surface, the force at ^ can be evenly distributed, and reach the close-fitting wire, and testers can also carry out the process test. , m This creation through the design of this test fixture, in order to achieve the purpose of testing the heat dissipation requirements of the central processing unit chip of different product models for different years of the test, with the setting of the ^ hunting domain stop, can make the setting The wire is rotated relative to the main body seat, and the fixed plate frame is closed in a horizontal position, so that the surface is pressed against the central processing unit, and she is pressed in the prior art by a conventional technique. It does not produce a single point of impact and is affected by the small two 赦 ^ 均 ^ ' In addition, the displacement of the relay mechanism can be gradually reduced, ^, fruit, and performance: the central processing of the wafer spacing, and in The central processing unit is attached: 蚪'automatically guides its contact relationship, which facilitates the heat exchange and can impede the efficiency of the fixture during the test. This creation = paste has been called thief as above, the green scale is used to limit the side, in the lion's creation of the essence __, " change and retouching' Therefore, the scope of patent protection of this creation must be attached to the scope of patent application of 13 M308446 The definition is final. [Simple description of the diagram] Figure 1A shows the structure of the test fixture for the thermal module. Figure 1B shows an exploded view of the suspension mechanism of the heat-dissipation module test fixture. Figure 2, the assembly diagram of the heat-dissipation module test fixture and the base. Figure 3 and Figure 4 show the action of the suspension mechanism of the heat-dissipation module test fixture. Figure 5 is a three-dimensional appearance of the test fixture of the heat dissipation module. [Main component symbol description] 110 ........................................... .......body seat 111 ........................................ ..........Lock hole 112 .................................... ..............Connector 113 ................................. .................Hinges 114 ............................... ...................The first embedded component 115 ......................... .........................stops 116 ..................... .............................Card seat 117 ................ .................................Catch 120.............. .................................... fixed plate frame 122.......... ........................................ hollowing out 124....... .................................................. .......the second embedded component 125 ..................................... .............• Bracket 130.................................. ................suspension mechanism movable seat 14 140 M308446 141 ......................... .........................Loading board 142 ............... ...................................Plywood 143 ............ ... fixed column 144 ............................................ ...link block 145 ......................................... .........Perforation 146 ....................................... ...........through hole 147 .................................... ............•• Combination hole
150 ..................................................固定座 151 ..................................................基板 152 ..................................................鎖附板 153 .............................................·····直桿 154 ..................................................壓制桿 155 ..................................................開口 156 ..................................................凸輪部 157 ..................................................操作部 160 ..................................................彈性件 161 ..................................................不連續環 200 ..................................................治具底座 201 ............................................................支撐柱 300 ..................................................散熱模組 301 ..................................................散熱風扇 302 ..................................................散熱片體 303····..............................................連接架 M308446 305 ..................................................調整件 306 ...................................................導桿 310..................................................散熱錫箔紙 400 ..................................................待測板 401 ..................................................中央處理單元晶片 16150 ................................................. Fixing seat 151 .............................................. ....substrate 152 ............................................ ...locking plate 153 ........................................ .....····· Straight rod 154 ..................................... .............pressing rod 155 .................................. ................opening 156 ................................ ..................Cam section 157 ............................. .....................Operation Department 160 .......................... ........................elastic parts 161 ....................... ...........................discontinuous ring 200 ................... ............................... Fixture base 201 ............... .......................................Support column 300 .. ................................................thermal mode Group 301................................................ .. cooling fan 302 ............................................. ..... Heat sink body 303····........ ......................................Connecting frame M308446 305 ........ ..........................................Adjustment 306 ..... ........................................ Guide rod 310. .................................................heat dissipation Tin foil paper 400................................................ ...test board 401 ........................................... ....... central processing unit wafer 16