1344590 0960529 26118twf.doc/p 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱裝置，且特別是有關於一種 適於與發熱源緊密接合的散熱裝置。 【先前技術】 隨著電子產業的迅速發展，主機板（M〇ther B〇ard) 鲁 上之電子元件的運鼻速度亦大幅提高，這些電子元件所產 生之熱量也隨之遽增，主機板上之電子元件例如是中央處 理器（CentralProcessingUnit，cpu)或是其他發熱晶片。 =此’料通常會中央處理器上配設—散絲置，以降低 =處理②内部之工作溫度。其中，中央處理器是插置於 連接板上之—插槽（Μα) ’以藉由蹄來與域板電性 由迴使St#槽之間會配置多個焊球，並藉 _ Μ Γ &焊球電性連接於主機板與插槽之間。 “ ，電性連接於主機板與插槽之 -來法平整地組裝在主機板上。如此 器之表= 置之二=4=中央處理 理器損壞。 勿有散熱不均勻之現象，導致中央處 5 1344590 0960529 26118twf.d〇c/p 【發明内容】 本發明提供一種散熱裝置，其能施以一平均壓力以使 散熱裝置與發熱源緊密貼合。 本發明提出一種散熱裝置，其適於對一電路板上之一 發熱源進行散熱。此散熱裝置包括一散熱器以及一固定模 組。散熱器是配置於發熱源上，且散熱器頂面之中央區域 設有一凹槽。固定模組設有一抵壓部，且固定模組跨設於 散熱器並卡合於電路板。其中’抵壓部抵靠於凹槽，以使 散熱器與發熱源緊密接合。 在本發明之一實施例中’散熱器包括一鰭片组以及一 板件，鰭片組設置於發熱源上’板件設置於鰭片組之頂部， 且凹槽設於板件朝向抵壓部之一面。 在本發明之一實施例中’固定模組包括一抵壓件以及 至少二第一固定件，抵壓部設於抵壓件朝向散熱器之一 面，些第一固定件設於抵麼件之側邊並卡合於電路板。 在本發明之一實施例中，第一固定件為一固定螺柱。 在本發明之一實施例中，電路板設有至少二對應這些 第一固定件之第二固定件，而第一固定件是卡合於這些第 一固定件。 在本發明之一實施例中，凹槽為一弧形凹槽。 在本發明之一實施例中，抵壓部與凹槽接觸之部份為 一球狀結構。 在本發明之一實施例中’抵壓部為一錐狀結構。 本發明是藉由一固定模組來使散熱器與發熱源緊密 6 0960529 26118twf.d〇c/p 接合。其中’固定模組設有一抵壓部，而散熱器頂面之中 央區域設有一對應抵壓部之凹槽。值得一提的是，當固定 模組跨設散熱器並卡合於電路板時，抵壓部能緊密地抵靠 於散熱器頂面之凹槽，並將抵壓力量均勻地施予散熱器， 進而使得散熱器與發熱源緊密接合。即使，發熱源因故呈 傾斜狀態時’本發明之散熱裝置仍能藉由此固定模組緊密 地貼合於發熱源上，以有效地對發熱源進行散熱。 為讓本發明之上述特徵和優點能更明顯易僅，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1繪示本發明一實施例之散熱裝置的示意圖。請參 考圖1 ’本實施例之散熱装置1〇〇適於對一電路板2〇〇上 之一發熱源210進行散熱。詳細地說，電路板上會設 置一插槽（Socket)220，而例如是中央處理器（Centrai Processing Unit，CTU)之發熱源210是插置於插槽220， 以與例如是主機板之電路板2〇〇電性連接。其中，插槽22〇 會藉由多個焊球（Solder Ball) 230以電性連接於電路板 200上，而本實施例之散熱裝置100即是組裝在插置於插 槽220的發熱源210上，以對發熱源21〇進行散熱。接著， 下文針對本實施例之散熱裝置1〇〇做說明。 承上所述’散熱裝置1〇〇主要包括一配置於發熱源21〇 上之散熱器110以及一跨設於散熱器11〇並固定於電路板 200上之固定模組120。跨設於散熱器11〇之固定模組12〇 1344590 0960529 26118twf.doc/p 會施予散熱器110 —抵塵力量，以使散熱器110緊密且平 均地與發熱源210貼合，散熱器11〇即可有效地對發熱源 210進行散熱。特別的是，本實施例是在散熱器頂面 之中央區域設置一凹槽ll〇a ’並於固定模組120設置一對 應凹槽110a之抵壓部120a，而當固定模組120跨設於散 熱器110並卡合於電路板200時，抵壓部i2〇a是抵靠於凹 槽110a，並施予散熱器11〇抵壓力量，以使散熱器11〇與 發熱源210緊密貼合。 ^ 具體地說，固定模組120是由一抵壓件122以及至少 二第一固定件124所組成。抵壓部i2〇a是設於抵壓件122 朝向散熱器110之一面，這些第一固定件124可設置於抵 壓件122之側邊’且電路板200設有至少二對應這些第一 固定件124之第二固定件240。其中，本實施例是以二第 一固疋件124以及一第二固定件240為例，二第二固定件 240例如是分別配置於發熱源21〇之兩對角，而二第二固 定件240則是對應這些第二固定件24〇之配設位置而設置 鲁 於抵壓件122上。當然，其他實施例之散熱器亦可藉由三 個或是四個第一固定件之輔助以更穩固地固定於發熱源 上，本文在此並不做任何限制。此外，上述第一固定件124 可以為一固定螺柱，第二固定件24〇可以為卡合孔，而這 些第一固定件124即是對應地卡合於這些第二固定件24〇 中。 雖然’本實施例之固定模組12〇是以一抵壓件122以 及至少二第一固定件124之組合為例，但是在其他較佳實 8 1344590 0960529 26118twf.doc/p =列，^定模組12G亦可以為一彈性扣具，第-固定件 可以為-適於卡合電路板之卡合孔的卡勾，本發 明在此並不做任何限制。 、j 一方面’本實施例之散熱器110可以由一鰭片組112 以及板件114所組成，鰭片組112是配設於發熱源 t崎板件HA疋6又置於鳍片組1丨2之頂部，而凹槽110a f設置於板件114朝向抵壓部施之-面，且凹槽u〇a 又於，件114表面之中央區域。在本實施例巾，凹槽 例如是-弧形凹槽’而抵壓部脑與凹槽丨收接觸之部 伤例如為一球狀結構。如此一來，固定模組12〇與散熱器 110之間即有較佳之接合關係’以更有效地將散熱器^ 緊配合於發熱源210上。 、另一方面，如配置於插槽220與電路板200之間的部 份焊球230在插槽220組裝於電路板2〇〇的迴焊製程中因 過度熔解而塌陷’使得插槽220朝向塌陷處傾斜，並導致 發熱源210無法平整地組裝在電路板2〇〇上時（如圖2所 示，其繪示本發明一實施例之散熱裝置組裝於呈傾斜狀態 之發熱源上的示意圖），由於本實施例在散熱器11〇頂面之 中央區域設置凹槽ll〇a’並在固定模組12〇上設置適於抵 壓凹槽110a之抵壓部i2〇a，因此即使插置於插槽22〇上 之發熱源210呈傾斜狀態，固定模組120之抵壓部12〇a 仍能將抵壓力量均勻地施予散熱器11〇，使得散熱器11〇 仍能緊密地貼合於發熱源210上。如此，散熱器11〇與發 熱源210即有較大之接觸面積，以有效地對發熱源21〇進 9 0960529 26118twf.doc/p 行散熱。當然，如插槽220因其他製程因素而無法平整地 組裝於電路板200時，本實施例亦能藉由上述抵墨部120 與凹槽110a之接合關係來使散熱裝置100緊密地貼合於發 熱源210表面。 此外’在其他實施例中，抵壓部120a亦可為一錐狀 結構或是其他適當之結構。進一步地說，凡能將抵壓力量 均勻地施予散熱器110，以使散熱器110能緊密地貼合於 發熱源210上之抵壓部120a均屬本發明之精神與範疇，本 文在此對抵壓部120a之結構設計並不作任何的限制。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知^者，在不 脫離本發明之精神和範圍内，當可作些許之更動與潤飾， 因此本發明之賴翻當視_之_請專概圍所界定者 為準。 【圖式簡單說明】 圖1緣示本發明一實施例之散熱巢置的示音圖。 μ 發Γ實施㈣熱袭置組裳於呈傾斜狀 悲之發熱源上的不意圖。 【主要元件符號說明】 100 :散熱裝置 1·散熱器 110a :凹槽 1344590 0960529 26118twf.doc/p1344590 0960529 26118twf.doc/p IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink suitable for tight engagement with a heat source. [Prior Art] With the rapid development of the electronics industry, the nose speed of the electronic components on the motherboard (M〇ther B〇ard) is also greatly increased, and the heat generated by these electronic components is also increased. The upper electronic component is, for example, a central processing unit (cpu) or other heat generating chip. = This material is usually placed on the central processor - the filament is placed to reduce the operating temperature inside the process 2. Wherein, the central processing unit is inserted into the slot on the connection board (Μα)' to electrically connect the domain board with the hoof and the plurality of solder balls are arranged between the St# slots, and borrow _ Μ Γ The solder ball is electrically connected between the motherboard and the slot. ", electrically connected to the motherboard and the slot - the method is assembled on the motherboard. The table of the device = 2 = 4 = the central processing device is damaged. Do not have uneven heat dissipation, resulting in the central 5 1344590 0960529 26118twf.d〇c/p SUMMARY OF THE INVENTION The present invention provides a heat dissipating device capable of applying an average pressure to closely fit a heat dissipating device to a heat source. The present invention provides a heat dissipating device suitable for Dissipating heat from a heat source on a circuit board. The heat sink includes a heat sink and a fixed module. The heat sink is disposed on the heat source, and a central portion of the top surface of the heat sink is provided with a recess. A pressing portion is disposed, and the fixing module is disposed across the heat sink and is engaged with the circuit board. The 'agaping portion abuts against the groove to make the heat sink closely engage with the heat source. In an embodiment of the present invention The 'heat sink includes a fin set and a plate member, and the fin set is disposed on the heat source. The plate member is disposed on the top of the fin set, and the groove is disposed on one side of the plate member facing the pressing portion. In one embodiment' The fixed module includes a pressing member and at least two first fixing members. The pressing portion is disposed on one side of the pressing member facing the heat sink, and the first fixing members are disposed on the side of the resisting member and are engaged with the circuit board. In an embodiment of the invention, the first fixing member is a fixing stud. In an embodiment of the invention, the circuit board is provided with at least two second fixing members corresponding to the first fixing members, and the first fixing portion In one embodiment of the invention, the groove is an arcuate groove. In one embodiment of the invention, the portion of the pressing portion that contacts the groove is a The ball-shaped structure. In one embodiment of the present invention, the pressing portion is a tapered structure. The present invention is a fixed module for engaging the heat sink with the heat source 6 60960529 26118 twf.d〇c/p. Wherein the 'fixed module is provided with a pressing portion, and the central portion of the top surface of the heat sink is provided with a corresponding recess of the pressing portion. It is worth mentioning that when the fixed module spans the heat sink and is engaged with the circuit board The pressing portion can closely abut against the groove on the top surface of the heat sink, and the amount of the pressing force is equal The heat sink is uniformly applied, and the heat sink is closely coupled with the heat source. Even if the heat source is tilted for any reason, the heat sink of the present invention can be closely attached to the heat source by the fixing module. In order to effectively dissipate heat from the heat source, the above features and advantages of the present invention will be more apparent, and the preferred embodiments are described below in detail with reference to the accompanying drawings. A schematic diagram of a heat dissipating device according to an embodiment of the present invention is shown in Fig. 1. The heat dissipating device 1 of the present embodiment is adapted to dissipate heat from a heat source 210 on a circuit board 2. Specifically, the circuit A socket 220 is disposed on the board, and a heat source 210 such as a central processing unit (CTU) is inserted in the slot 220 to be electrically connected to a circuit board 2 such as a motherboard. Sexual connection. The heat sink 100 of the present embodiment is assembled in the heat source 210 inserted in the slot 220. The heat sink 100 of the embodiment is electrically connected to the circuit board 200 by a plurality of solder balls 230. In the above, heat is dissipated to the heat source 21〇. Next, the heat sink 1 of the present embodiment will be described below. The heat sink 1 includes a heat sink 110 disposed on the heat source 21A and a fixed module 120 spanned from the heat sink 11 and fixed to the circuit board 200. The fixed module 12 〇 1344590 0960529 26118 twf.doc/p straddles the heat sink 11 会 will apply the heat sink 110 to the dusting force so that the heat sink 110 fits closely and evenly with the heat source 210, the heat sink 11 The heat source 210 can be effectively dissipated. In particular, in this embodiment, a recess 11' is disposed in a central portion of the top surface of the heat sink, and a pressing portion 120a corresponding to the recess 110a is disposed in the fixing module 120, and when the fixing module 120 is straddle When the heat sink 110 is engaged with the circuit board 200, the pressing portion i2〇a is abutted against the recess 110a, and the heat sink 11 is applied to the pressure amount so that the heat sink 11 is closely attached to the heat source 210. Hehe. Specifically, the fixing module 120 is composed of a pressing member 122 and at least two first fixing members 124. The pressing portion i2〇a is disposed on one side of the pressing member 122 facing the heat sink 110. The first fixing members 124 may be disposed on the side of the pressing member 122 and the circuit board 200 is provided with at least two corresponding to the first fixing. The second fixing member 240 of the member 124. In this embodiment, the two first fixing members 124 and the second fixing member 240 are exemplified, and the second fixing members 240 are respectively disposed at two opposite corners of the heat source 21, and the second fixing members are respectively disposed. 240 is disposed on the pressing member 122 corresponding to the arrangement position of the second fixing members 24 . Of course, the heat sink of other embodiments may be more stably fixed to the heat source by the aid of three or four first fixing members, and is not limited herein. In addition, the first fixing member 124 can be a fixing stud, and the second fixing member 24 can be a locking hole, and the first fixing members 124 are correspondingly engaged with the second fixing members 24A. Although the fixing module 12 of the present embodiment is exemplified by a combination of a pressing member 122 and at least two first fixing members 124, in other preferred embodiments 8 1344590 0960529 26118twf.doc/p = column, The module 12G can also be an elastic buckle, and the first fixing member can be a hook suitable for engaging the engaging hole of the circuit board, and the invention is not limited herein. On the one hand, the heat sink 110 of the present embodiment may be composed of a fin group 112 and a plate member 114. The fin group 112 is disposed on the heat source t-slab member HA疋6 and is placed in the fin group 1 The top of the crucible 2, and the recess 110a f is disposed on the surface of the plate member 114 facing the pressing portion, and the recess u〇a is again in the central region of the surface of the member 114. In the towel of the present embodiment, the groove is, for example, an arcuate groove, and the portion where the pressing portion of the pressing portion is in contact with the groove is, for example, a spherical structure. As a result, there is a better bonding relationship between the fixed module 12A and the heat sink 110 to more effectively fit the heat sink to the heat source 210. On the other hand, if a portion of the solder ball 230 disposed between the slot 220 and the circuit board 200 is collapsed due to excessive melting in the reflow process of the socket 220 assembled in the circuit board 2, the slot 220 is oriented. When the collapsed portion is inclined, and the heat source 210 is not assembled smoothly on the circuit board 2 (as shown in FIG. 2, it shows a schematic diagram of the heat sink according to an embodiment of the present invention assembled on a heat source in an inclined state. In this embodiment, the recess 11' is disposed in the central portion of the top surface of the heat sink 11, and the pressing portion i2〇a adapted to press the recess 110a is disposed on the fixed module 12A, so even if the recess is formed The heat source 210 placed on the slot 22 is inclined, and the pressing portion 12〇a of the fixing module 120 can evenly apply the pressing force to the heat sink 11〇, so that the heat sink 11〇 can still be tightly It is attached to the heat source 210. Thus, the heat sink 11 and the heat source 210 have a large contact area to effectively dissipate the heat source 21 into the heat sink. Of course, if the slot 220 cannot be assembled smoothly on the circuit board 200 due to other process factors, the embodiment can also closely fit the heat sink 100 by the bonding relationship between the ink receiving portion 120 and the recess 110a. The surface of the heat source 210. Further, in other embodiments, the abutting portion 120a may be a tapered structure or other suitable structure. Further, any of the pressing portions 120a capable of uniformly applying the pressing force to the heat sink 110 so that the heat sink 110 can be closely attached to the heat generating source 210 is within the spirit and scope of the present invention. The structural design of the pressing portion 120a is not limited in any way. While the invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and it is to be understood by those skilled in the art without departing from the spirit and scope of the invention. Retouching, therefore, the invention depends on the _ _ _ please refer to the definition of the general. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing a heat sink nest according to an embodiment of the present invention. μ Γ Γ ( 四 四 四 四 ( ( 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热[Main component symbol description] 100: Heat sink 1· Heat sink 110a: Groove 1344590 0960529 26118twf.doc/p
112 :鰭片組 114 :板件 120 :固定模組 120a :抵壓部 122 :抵壓件 124 :第一固定件 200 :電路板 210 :發熱源 220 :插槽 230 :烊球 240 :第二固定件112: fin group 114: plate member 120: fixing module 120a: pressing portion 122: pressing member 124: first fixing member 200: circuit board 210: heat source 220: slot 230: ball 240: second Fastener