M307265 八、新型說明： ^【新型所屬之技術領域】 - 本創作涉及一種電路板組合，尤其係一種可防止電路 板受到衝擊後影響電路板上晶片功能之電路板組合。 [先前技術】 在主機板之生産過程中，積體電路晶片之一種常見封 裝方式爲：將晶片之焊點藉由獨立之錫球焊接到印刷電路 板之焊盤上，從而實現晶片與印刷電路板之間之信號傳 • 輸。習知技術中焊接晶片所使用之錫球爲含鉛材料，在印 刷電路板承受衝擊時，由於錯元素良好之抗衝擊性能，錫 球並不容易斷裂。然而，隨著電子産業之發展，電子産品 之安全使用問題已成爲重要議程。爲了防止含鉛錫球對環 境之污染及對使用者人身健康之危害，無鉛錫球之使用逐 漸被引入晶片之封裝過程中，並扮演著越來越重要之角 色。惟，由於無錯錫球之脆性比較強，當印刷電路板跌落 Φ 或受到衝擊時，容易發生斷裂，影響晶片之信號傳輸功能。 因此，一種可防止印刷電路板受到衝擊後影響晶片功能之 電路板組合便成爲業界所急需。 【新型内容】 鑒於以上内容，有必要提供一種可減小印刷電路板受 到衝擊後影響晶片功能之電路板組合。 一種電路板組合，包括一板體及一晶片，所述晶片包 括複數呈方形陣列分佈之焊點，所述晶片之每一焊點藉由 一錫球焊接於所述板體上，所述晶片位於方形陣列至少一 M307265 角處之至少一個焊點與對應之錫球間不形成信號傳輸通 • 道。 - 一種電路板組合，包括一板體及至少一晶片，所述晶 片在一方形區域中包括複數焊點，所述晶片之每一焊點藉 由一錫球焊接於所述板體上，每一個焊點與對應之錫球分 別形成一信號傳輸通道，所述方形區域的至少一角處不設 置所述焊點。 相對於習知技術，本創作電路板組合對晶片受到衝擊 ® 時所受正向應力較大之位置處不設置信號傳輸通道，當受 到外界衝擊時，因其他位置之焊點及錫球位置處受正向應 力較小，故可防止晶片在受到相同衝擊時影響晶片功能。 【實施方式】 請參閱圖1及圖2，本創作電路板組合包括一印刷電 路板10及一焊接於所述印刷電路板10上之晶片20,所述 晶片20底面設有複數呈方形（長方形或正方形）陣列分 φ 佈之焊點21，所述焊點21分別負責傳輸不同之資料信號。 每一焊點21藉由一獨立之錫球30焊接於所述印刷電路板 上。所述每一負責信號傳輸之焊點21與每一錫球30分別 形成一資料像輸通道，實現所述晶片20與所述印刷電路 板10之間之信號傳輸。 藉由一衝擊仿真分析軟體LS-DYNA對印刷電路板10 受到衝擊時晶片20之焊點所受應力之情形進行模擬。模 擬條件設定爲：在一印刷電路板10之中心位置處焊接一 晶片20，印刷電路板跌落或受到撞擊時之初速度爲 M307265 4.86m/s。藉由一加速度曲線來模擬印刷電路板10受到衝 ’ 擊時四個角點之受力情形（如圖3所示），當印刷電路板 • 10受到通常業界認定之非破壞性臨界撞擊力時，其各角點 之最大加速度設定爲45 G。根據上述之模擬條件，得出之 結果爲：錫球30所受到正向應力之分佈規律爲自方形晶 片20之四個角點向中心位置處逐漸減小’即位於晶片20 方形陣列之四個角點位置處之錫球30所受之正向應力值 最大。請參照圖4，方形陣列之其中一個角點位置處之各 _ 錫球30所受正向應力之具體結果如下表所示： 錫球編號 正向應力（MPa) A 84.30 B 51.54 C 49.05 D 37.39 E 35.04 F 33.66 G 30.75 Η 30.50 I 30.35 J 26.66M307265 VIII. New Description: ^[New Technology Field] - This creation involves a circuit board combination, especially a circuit board combination that prevents the board from being impacted and affects the function of the chip on the circuit board. [Prior Art] In the production process of the motherboard, a common packaging method of the integrated circuit chip is to solder the solder joint of the wafer to the pad of the printed circuit board by a separate solder ball, thereby realizing the wafer and the printed circuit. Signal transmission between boards. In the prior art, the solder balls used for soldering wafers are lead-containing materials. When the printed circuit board is subjected to impact, the solder balls are not easily broken due to the good impact resistance of the wrong elements. However, with the development of the electronics industry, the issue of the safe use of electronic products has become an important agenda. In order to prevent environmental pollution caused by lead-containing solder balls and harm to users' personal health, the use of lead-free solder balls has gradually been introduced into the packaging process of wafers and plays an increasingly important role. However, since the error-free solder ball is relatively brittle, when the printed circuit board is dropped or impacted, it is prone to breakage, which affects the signal transmission function of the chip. Therefore, a circuit board combination that prevents the printed circuit board from being affected by the impact of the wafer is an urgent need in the industry. [New content] In view of the above, it is necessary to provide a circuit board combination that can reduce the effect of the printed circuit board on the wafer after being impacted. A circuit board assembly comprising a board body and a wafer, the wafer comprising a plurality of solder joints distributed in a square array, each solder joint of the wafer being soldered to the board body by a solder ball, the wafer No signal transmission path is formed between at least one solder joint located at a corner of at least one M307265 of the square array and the corresponding solder ball. A circuit board assembly comprising a board body and at least one wafer, the wafer comprising a plurality of solder joints in a square area, each solder joint of the wafer being soldered to the board body by a solder ball, each A solder joint and a corresponding solder ball respectively form a signal transmission channel, and the solder joint is not disposed at at least one corner of the square region. Compared with the prior art, the circuit board assembly does not provide a signal transmission channel at a position where the forward stress is large when the wafer is subjected to impact®, and when it is subjected to an external impact, the solder joint and the position of the solder ball are at other positions. The positive stress is small, so that the wafer can be prevented from affecting the function of the wafer when subjected to the same impact. [Embodiment] Referring to FIG. 1 and FIG. 2, the circuit board assembly includes a printed circuit board 10 and a wafer 20 soldered on the printed circuit board 10. The bottom surface of the wafer 20 is provided with a plurality of squares (rectangular Or square) The array is divided into solder joints 21 of φ, which are responsible for transmitting different data signals. Each solder joint 21 is soldered to the printed circuit board by a separate solder ball 30. Each of the solder joints 21 responsible for signal transmission and each of the solder balls 30 respectively form a data image transmission channel for signal transmission between the wafer 20 and the printed circuit board 10. The impact of the solder joint of the wafer 20 when the printed circuit board 10 is impacted is simulated by an impact simulation software LS-DYNA. The simulation condition is set such that a wafer 20 is soldered at a central position of the printed circuit board 10, and the initial speed of the printed circuit board when dropped or impacted is M307265 4.86 m/s. The acceleration curve is used to simulate the force of the four corners of the printed circuit board 10 when it is impacted (as shown in Figure 3), when the printed circuit board 10 is subjected to the generally recognized non-destructive critical impact force. The maximum acceleration of each corner point is set to 45 G. According to the above simulation conditions, the result is that the distribution of the forward stress of the solder ball 30 is gradually reduced from the four corner points of the square wafer 20 toward the center position, that is, four of the square arrays of the wafer 20 The solder ball 30 at the corner position is subjected to the largest positive stress value. Referring to Figure 4, the specific results of the forward stress of each of the _ solder balls 30 at one of the corners of the square array are shown in the following table: Tin Ball No. Forward Stress (MPa) A 84.30 B 51.54 C 49.05 D 37.39 E 35.04 F 33.66 G 30.75 Η 30.50 I 30.35 J 26.66
由上表可以看出，位於所述晶片20之方形陣列角點 8 M307265 位置處之錫球A所受正向應力最大，以該錫球A爲頂點所 圍成之直角三角形底邊所在之各錫球所受正向應力隨著 ，邊之增長而逐漸減小。其中，第—個直角三角形底邊所 之錫球B、C所受正向應力比頂點所在之錫球A減小了 38%第—個直角二角形底邊所在之錫球d、e、F比頂點 所在之錫球A所受正向應力減小了 5 〇 %。再將晶片設於印 刷電路板之其他不同位置’得出之結論亦大致如此。也就 是說，當印刷電路板10受到衝擊過大時，位於晶片2〇之 長方开j車歹J角點位置處之錫球A最容易斷裂或損壞。因 此’在B曰片20之設計過程中，可在不影響其功能之前提 下曰將排配在曰曰片2〇受正向應力最大之方形陣列角點處 ^焊點21或者與該角點共同圍成直角三角形範圍内之複 谭點21不設定㈣傳輸功能，即在此範_晶片20與 印刷電路板10之間不形成信號傳輸通道。但所述直角三 角形範圍内仍設有焊點21及錫球30,用以增大晶片2〇之 受力範圍。將如此之晶片2G藉由錫球30焊接於所述印刷 電^板10上，當印刷電路板1〇受到外力衝擊時，即使位 ;曰曰片20之方形陣列角點處及其附近受正向應力較大處 ,顆或多顆锡球30斷裂，由於所述斷裂之錫球％内之 焊點21並不負貝信號傳輸，因此不會影響晶片20之功能。 請參閱圖5及圖6，按照上述原理，本創作還可藉由 另-種實施方式來達成，即將晶片2〇上之一方形區域中 ，於Μ向應力最大之角點之焊點21或與該角點共同圍 、直角二角形範圍内之複數烊點21及與所述桿點對應之 M307265 錫球30直接移除，即，在此範圍内所述晶片2〇與印刷電 路板10之間不形成信號傳輸通道。結果表明，移除角點 之焊點21及錫球30後’與之相鄰之兩錫球b，、c，上所受 到之正向應力減小爲66.60MPa ’與未移除錫球％ 前曰 片20角點處之錫球所受正向應力相比，減小了 2〇% ·移 除與角點圍成直角三角形範圍内之三個焊點21及錫球3〇 後，與所述直角三角形底邊相鄰之三顆錫球d、&、f上受 到之正向應力減小爲53.69MPa，與未移除錫球如之前2 片20角點處之錫球所受正向應力相比，減小了 ％%。該 實加方式亦可達到改善錫球所受正向應力之效果。 離盘實施例中，當所述焊點20心橫向間隔距 =、縱向間隔距離相等時，所述三角形爲一等腰直角三角 乂。另外，上述實施方式之原理亦可用於 點21按戶召苴他四硌轳+夕i 日日月20上之知 【圖式簡單說明】形或多邊形規律分佈時之情況。 圖1=本創作電路板組合較佳實施方式之立體結構示意 圖2係圖1沿Π-Π向之剖視圖。 圖3係本創作電路板組合 圖4係本創作電路板組合第4=逮度曲線圖。 錫球分佈圖。 貫&方式中之晶片焊點及 圖5係本創作電路板 錫球分佈圖。、、 實施方式中之晶片浮點及 圖6係本創作電路板组合第 實方式中之晶片焊點及 M307265 錫球分佈圖。 【主要元件符號;說明】 印刷電路板 10 晶片 20 焊點 21 錫球 30As can be seen from the above table, the solder ball A located at the position of the square array corner 8 M307265 of the wafer 20 is subjected to the greatest forward stress, and the bottom edge of the right-angled triangle surrounded by the solder ball A as the apex is located. The positive stress on the solder ball gradually decreases as the edge grows. Among them, the tin balls B and C at the bottom of the first right triangle are subject to a 38% reduction in the forward stress than the tin ball A at the apex. The tin balls d, e, F where the bottom edge of the right angled rectangle is located The positive stress of the solder ball A, which is located at the vertex, is reduced by 5%. The conclusion is also drawn from the fact that the wafer is placed at a different location on the printed circuit board. That is to say, when the printed circuit board 10 is subjected to an excessive impact, the solder ball A located at the position of the corner of the wafer 2 is most likely to be broken or damaged. Therefore, in the design process of the B-chip 20, it can be removed before the function is not affected, and will be arranged at the corner of the square array with the greatest positive stress. The point Tan 21 in the range of the right triangle is not set to the (four) transmission function, that is, no signal transmission path is formed between the wafer 20 and the printed circuit board 10. However, solder joints 21 and solder balls 30 are still provided in the right-angled triangle to increase the force range of the wafer. The wafer 2G is soldered to the printed circuit board 10 by the solder ball 30, and when the printed circuit board 1 is impacted by an external force, even if the position is at the corner of the square array of the cymbal 20 When the stress is large, the one or more solder balls 30 are broken, and since the solder joints 21 in the broken solder balls are not negatively transmitted, the function of the wafer 20 is not affected. Referring to FIG. 5 and FIG. 6, according to the above principle, the present invention can also be achieved by another embodiment, that is, in a square region on the wafer 2, at the solder joint 21 of the corner where the stress is greatest. The plurality of defects 21 in the range of the right-angled square and the M307265 solder ball 30 corresponding to the rod point are directly removed from the corner point, that is, the wafer 2 and the printed circuit board 10 are directly removed in this range. No signal transmission channel is formed between them. The results show that after removing the solder joints 21 of the corners and the solder balls 30, the positive stresses on the two solder balls b, c, which are adjacent to them are reduced to 66.60 MPa' and the solder balls are not removed. Compared with the forward stress of the solder ball at the corner of the front cymbal 20, the solder ball is reduced by 2〇%. After removing the three solder joints 21 and the solder balls in the range of a right triangle, the corners are removed. The positive stress on the three solder balls d, &, f adjacent to the bottom of the right triangle is reduced to 53.69 MPa, and the solder ball is not removed from the solder ball as in the previous two 20 corners. Compared to the forward stress, the %% is reduced. This addition method can also achieve the effect of improving the positive stress on the solder ball. In the disc embodiment, when the solder joints 20 are laterally spaced apart from each other and the longitudinal spacing distance is equal, the triangle is an isosceles right triangle. In addition, the principle of the above embodiment can also be used for the point 21 to call the four 硌轳 硌轳 夕 夕 夕 夕 夕 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a preferred embodiment of the present circuit board assembly. Fig. 2 is a cross-sectional view of Fig. 1 taken along the Π-Π direction. Figure 3 is the combination of the circuit board of this creation. Figure 4 is the 4th=catch curve of the creation board combination. Tin ball distribution map. The wafer solder joints in the & method and Figure 5 are the solder ball distribution diagrams of the circuit board. The wafer floating point in the embodiment and FIG. 6 are the wafer solder joints and the M307265 solder ball distribution map in the first embodiment of the present circuit board assembly. [Main component symbol; description] Printed circuit board 10 Wafer 20 Solder joint 21 Tin ball 30
1111