M306353 八、新型說明： 【新型所屬之技術領域】 本創作係提供一種快閃記憶卡組裝構造，特別是針對 快閃記憶卡結構中，用來傳輸訊號的端子組裝構造加以改 良’可達到節省成本及組裝方便之功效。 【先前技術】 第一圖所示係為一種習知的快閃記憶卡立體分解 圖’該快閃記憶卡的規格為SD卡（SD CARD )，其主要係 •包括： 一多層電路板10,前端具有容置部n，容置部内預設 有記憶卡晶片及電子電路12。 一殼體20，相對於容置部^設有複數個缺槽21。 一電路板30，係為一多層電路板構造，相對於多層電 路板10的面向（圖示中的上方）設有若干錫球32,相對 於殼體20的面向（圖示中的下方）則設有若干金箔31， •且錫球32與金箔31之間藉由電路板30,上鑽設複數以上 的小孔以達錫球32與金箔31導通，進而構成電路的連接。 將上述電路板30設置在多層電路板1〇的容置部u， 利用錫球32與容置部u内的記憶卡晶片及電子電路12 焊接後，可使金箔31間接與記憶卡晶片及電子電路12構 成電性連接。 然後，再將殼體20與多層電路板10組合，可使電路 板30的金箔31曝露在殼體2〇的複數個缺槽21上，如此， 即可藉由金箔31與其他外接裝置（圖未顯示）來傳送或接 M306353 收記憶卡内的資料。 上述的習知快閃記憶卡構造中，除了多層電路板10 及殼體20的製程之外，需另外以標準的多層電路板製程製 造出一片設置有若干錫球32及金箔31之間鑽設複數以上 的小孔來導通，製造上較為繁瑣。 【新型内容】 羑是’本創作之快閃記憶卡，係包括：一前端具有容 _ 置部之多層電路板、一相對於容置部設有複數個缺槽之殼 體、一設於容置部内之基座、以及複數個插置在基座上的 端子。其中，每一片端子係彎折成蓋呈“匸，，形，其相對 於容置部的面向為焊接面，可與多層電路板及殼體之間的 記憶卡晶片及電子電路連接，相對於缺槽的面向則為接觸 面；將端子插置在基座上，並置入多層電路板與殼體之間 後，可使端子的接觸面曝露在殼體之缺槽，如此即可供快 •閃記憶卡内的記憶卡晶片及電子電路傳輸訊號。 上述本創作之快閃記憶卡中的複數端子與基座之 間，其結合是採取插置方式，因此可以解決傳統使用多層 電路板鑛上金箱及錫球，並需在金箱與錫球之間鑽設複數 j孔乂達‘通之目的，且此方式的加卫，不但不經濟且形 成電路的阻值比較高之缺點。可大幅降低製造的程序及 ^本且^電路阻值過高的問題（因接觸端子為一體成 办），此為本創作之主要目的。 乂下藉由圖不、几件符號及配合圖示之詳細說明，進 M306353 一步就本創作之較佳實施例詳加說明如下： 有關本創作之詳細說明及技術内容，配合圖式說明如 下，然而所附圖式僅提供參考與說明用，並非用來對本創 作加以限制者。 【實施方式】 清參閱第二、三圖所示，係為本創作較佳實施例之立 體分解圖，其組成元件係包括： 肇 一多層電路板10，前端具有容置冑u，並設有記憶 卡晶片及電子電路12。 " 一殼體20，其形狀與多層電路板1〇相對應，並且可 與多層電路板10相互蓋合而形成記憶卡的外型；另外，該 殼體20在相對於多層電路板1〇的容置部n位置設有複數 個缺槽21。 基座40，设置在多層電路板之容置部11内，其 #與殼體20的複數個缺槽21之相對應位置，分別設置有二 隔離槽41，每一隔離槽41由基座4〇的其中一面延伸至另 面，形成上下相對應的狀態，並且在相對於容置部11 的面向上分別設置有—^溝42。 複數片端子50,每一片端子5〇係彎折成蓋呈“匸” 形，恰可嵌在基座40上的隔離槽41而固定，其相對於容 置部11的面向為焊接面51，可與多層電路板1〇上的記憶 卡晶片及電子電路12電性連接，該焊接面51上另設置有 扣鉤52，俾能扣合在隔離槽41上的卡溝42 ;該端子5〇 M306353 在相對於殼體20之缺槽21的面向則為接觸面53。 請同時參考第二到四圖，t複數片端子5()分別嵌置 在基座4G上的每-個隔離槽41時，藉由端子5()焊接面 51上的扣鉤52扣合於卡溝42,可使複數片端子5〇分別固 定在基座40上的隔離槽41。 此時，將結合後的基座4〇與複數片端子5〇焊接於多 層電路板10上的容置部u内，即可使每一片端子5〇的焊 接面51分別與多層電路板1〇上的記憶卡晶片及電子電路 12接觸而電性連接；然後再將殼體2〇與多層電路板相 互蓋合，即可使每一片端子5〇的接觸面53與殼體2〇的缺 槽21對位，並且讓接觸面53曝露在缺槽21上，以構成完 當圮憶卡插置在例如數位相機、手機等可攜式電子裝 置（圖未顯示）使用時，端子50接觸面53可與該等可攜 式電子裝置電性連接，此時，由於端子5〇的焊接面Η又 •分別與多層電路板10上的記憶卡晶片及電子電路12接觸 而電性連接，因此可使可攜式電子裝置與記憶卡上的記憶 卡晶片及電子電路12電性連接，進而雙向傳輸信號。 本創作除了上述的結合方法之外，亦可在多層電路板 10内相對於每一片端子50的位置預設焊接點13 (如第二 圖所不），如此可將基座4〇及端子利用焊接方式固定在多 層電路板10上，以提高接合的穩定度；另外，前述的記憶 卡晶片及電子電路12亦可以設置在一片電路板上而容置 在多層電路板10與殼體20之間，惟，以上所述僅為本創 M306353 作之較佳實施例而已，非因此即偈限本發明之專利範圍， 故舉凡運用本創作說明書及圖式内容所為之簡易修飾及等 效結構變化，均應同理包含於本創作之專利範圍内，合予 陳明。 口 綜上所述，本創作之「快閃記憶卡」，的確能藉由上 述所揭露之構造，達到所述之功效。且本創作申請^未見 於刊物亦未公開使用，誠已符合新型專利之新穎、進步等 要件。 ，’上述所揭之圖式及說明，僅為本創作之實施例而 非為限定本創作之實施例；大凡熟悉該項技m之人士， 之特徵範，，所作之其它等效變化或修飾， 白應涵盍在以下本案之申請專利範圍内。 M306353 【圖式簡單說明】 弟 圖 $知記憶卡結構示意圖。 第二圖本創作之立體分解圖。 ，三圖本創作之基座與端子之體分解圖。 第四圖本創作之基座與端子之組裝示意圖。 【主要元件符號說明】 多層電路板............. 參 容置部.............11 記憶卡晶片及電子電路......12 焊接點· · ...........13 殼體· · · ........· · · 20 缺槽· · · ............. 基座· · · ...........40 隔離槽· · ...........41 卡溝· · · ........... · 42 鲁 端子· · · ..........50 焊接面· · ...........51 扣鉤· · · ............. 接觸面· · .............M306353 VIII. New description: [New technical field] The creation system provides a flash memory card assembly structure, especially for the flash memory card structure, the terminal assembly structure for transmitting signals is improved, which can save cost. And the convenience of assembly. [Prior Art] The first figure shows a stereoscopic exploded view of a conventional flash memory card. The flash memory card has the specification of an SD card (SD CARD), and its main system includes: a multilayer circuit board 10 The front end has a receiving portion n, and the memory card chip and the electronic circuit 12 are pre-arranged in the receiving portion. A housing 20 is provided with a plurality of notches 21 with respect to the receiving portion. A circuit board 30 is a multi-layer circuit board structure, and a plurality of solder balls 32 are provided with respect to the face of the multi-layer circuit board 10 (upper in the drawing), with respect to the face of the casing 20 (lower in the drawing) A plurality of gold foils 31 are provided, and between the solder balls 32 and the gold foils 31, a plurality of small holes are drilled through the circuit board 30 to electrically connect the solder balls 32 and the gold foils 31, thereby forming a circuit connection. The circuit board 30 is disposed in the accommodating portion u of the multilayer circuit board 1 , and the solder ball chip and the electronic circuit 12 in the accommodating portion u are soldered by the solder ball 32 to indirectly bond the gold foil 31 to the memory card chip and the electronic device. Circuit 12 constitutes an electrical connection. Then, the casing 20 is combined with the multilayer circuit board 10, so that the gold foil 31 of the circuit board 30 can be exposed on the plurality of notches 21 of the casing 2, so that the gold foil 31 and other external devices can be used. Not shown) to transfer or connect the data in the M306353 to the memory card. In the above conventional flash memory card configuration, in addition to the process of the multilayer circuit board 10 and the housing 20, a plurality of solder balls 32 and gold foils 31 are separately fabricated by a standard multilayer circuit board process. More than a plurality of small holes are turned on, which is cumbersome to manufacture. [New content] 羑 is the flash memory card of this creation, which includes: a multi-layer circuit board having a front end portion and a housing having a plurality of vacancies with respect to the accommodating portion; a base in the housing and a plurality of terminals interposed in the base. Wherein, each of the terminals is bent into a cover having a shape of "匸", which is a soldering surface with respect to the surface of the accommodating portion, and can be connected to the memory card chip and the electronic circuit between the multilayer circuit board and the housing, with respect to The face of the slot is the contact surface; the terminal is inserted on the base and placed between the multilayer circuit board and the housing, so that the contact surface of the terminal is exposed in the slot of the housing, so that it can be quickly used. • Memory card chip and electronic circuit transmission signals in the flash memory card. The combination of the multiple terminals and the pedestal in the above-mentioned flash memory card is inserted, so that the conventional use of the multilayer circuit board mine can be solved. On the gold box and the tin ball, it is necessary to drill a plurality of j-holes between the gold box and the tin ball. The purpose of this method is not only uneconomical, but also has the disadvantage of high resistance of the circuit. It can greatly reduce the manufacturing process and the problem that the resistance of the circuit is too high (because the contact terminals are integrated), this is the main purpose of the creation. The following figures are not shown, several symbols and matching icons Detailed description, enter M306353 one step The preferred embodiments of the present invention are described in detail below: The detailed description and technical contents of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to the second and third figures, it is an exploded perspective view of a preferred embodiment of the present invention. The constituent elements of the present invention include: a multi-layer circuit board 10 having a receiving end ,u and provided with Memory card chip and electronic circuit 12. " A housing 20 having a shape corresponding to the multilayer circuit board 1 , and being closable with the multilayer circuit board 10 to form an outer shape of the memory card; A plurality of notches 21 are formed at positions of the accommodating portion n of the multilayer circuit board 1 . The susceptor 40 is disposed in the accommodating portion 11 of the multilayer circuit board, and the plurality of vacancies 21 of the housing 20 and the housing 20 Corresponding positions are respectively provided with two isolation grooves 41, each of which is extended from one side of the base 4 to the other side, forming a state corresponding to the upper and lower sides, and respectively facing the facing surface of the receiving portion 11 Set with -^ groove 42. The sheet terminal 50, each of the terminals 5 is bent into a "匸" shape, and can be fixed in the isolation groove 41 of the base 40, and the surface of the receiving portion 11 is the welding surface 51. And electrically connected to the memory card chip and the electronic circuit 12 on the multi-layer circuit board, the soldering surface 51 is further provided with a hook 52, which can be fastened to the card groove 42 on the isolation slot 41; the terminal 5〇M306353 The contact surface 53 with respect to the notch 21 of the housing 20 is the contact surface 53. Referring also to the second to fourth figures, when the plurality of terminals 5 () are respectively embedded in each of the isolation grooves 41 on the base 4G, The hooks 52 on the soldering surface 51 of the terminal 5 are fastened to the card groove 42, so that the plurality of terminals 5 are fixed to the isolation slots 41 on the base 40. At this time, the combined bases are 4〇 and a plurality of terminals 5〇 are soldered in the accommodating portion u of the multilayer circuit board 10, so that the soldering surface 51 of each of the terminals 5〇 and the memory card chip and the electronic circuit 12 on the multilayer circuit board 1 respectively Contact and electrical connection; then the housing 2〇 and the multi-layer circuit board are covered with each other, so that the contact surface 53 of each of the terminals 5〇 and the housing 2 are lacking. The slot 21 is aligned, and the contact surface 53 is exposed on the slot 21 to form a terminal 50 contact surface when the memory card is inserted into a portable electronic device (not shown) such as a digital camera or a mobile phone. The electrical connection between the terminal and the portable electronic device is electrically connected to the memory card chip and the electronic circuit 12 on the multilayer circuit board 10, thereby being electrically connected. The portable electronic device is electrically connected to the memory card chip and the electronic circuit 12 on the memory card to transmit signals in both directions. In addition to the above-described bonding method, the present invention can also preset the soldering point 13 (as in the second figure) in the position of each of the terminals 50 in the multilayer circuit board 10, so that the base 4 and the terminal can be utilized. The soldering method is fixed on the multi-layer circuit board 10 to improve the stability of the bonding. In addition, the foregoing memory card chip and the electronic circuit 12 can also be disposed on a single circuit board and accommodated between the multi-layer circuit board 10 and the housing 20. However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, so that the simple modification and equivalent structural changes of the present specification and the drawings are used. All should be included in the scope of the patent of this creation, and be combined with Chen Ming. In summary, the "flash memory card" of the present invention can achieve the above-mentioned effects by the above-described structure. And this creation application ^ has not been seen in the publication and has not been used publicly. Cheng has already met the novelty, progress and other requirements of the new patent. The drawings and descriptions set forth above are merely examples of the present invention and are not intended to limit the embodiments of the present invention; those skilled in the art, and other equivalent variations or modifications thereof , Bai Yinghan is within the scope of the patent application in the following case. M306353 [Simple diagram of the diagram] Brother diagram $ Know the structure of the memory card. The second picture is a three-dimensional exploded view of the creation. The exploded view of the base and terminal of the three-picture creation. The fourth figure is a schematic diagram of the assembly of the base and the terminal of the present creation. [Main component symbol description] Multi-layer circuit board............. 容容置部..................11 Memory card chip and electronic circuit.... ..12 Welding points · · ...........13 Housing · · · ........· · · 20 missing slots · · · ......... .... pedestal · · · ...........40 isolation groove · · ...........41 card groove · · · ........ ... · 42 Lu terminal · · · ..........50 welding surface · ·..............51 hook · · · ........ ..... Contact surfaces· · .............