CN2938229Y

CN2938229Y - Flash momery card

Info

Publication number: CN2938229Y
Application number: CN 200620117086
Authority: CN
Inventors: 刘锡如
Original assignee: KEYWAY TECHNOLOGY Co Ltd
Current assignee: KEYWAY TECHNOLOGY Co Ltd
Priority date: 2006-06-22
Filing date: 2006-06-22
Publication date: 2007-08-22
Anticipated expiration: 2016-06-22

Abstract

The utility model relates to a flash memory card, comprising a multi-layer circuit board provided with a containing part on the front end, a shell body arranged with a plurality of concave grooves correspondingly to the containing part, a base arranged inside the containing part, and a plurality of terminals arranged on the base. The terminals will be inserted in the base, between the multi-layer circuit board and the shell body, then the interfaces of the terminals will be exposed to the concave grooves of the shell body for flash memory card to transmit the communication signals. The intercalation-mode combination between the terminals and the base surpasses the traditional processing mode, thereby achieving the purposes of saving cost and easy installation.

Description

Flash memory

[technical field]

The utility model relates to a kind of flash memory assembled configuration.

[prior art]

Fig. 1 is a kind of known flash memory three-dimensional exploded view, and the specification of this flash memory is SD card (SD CARD), and it mainly comprises:

One multilayer circuit board 10, front end has holding part 11, is preset with memory card wafer and electronic circuit 12 in the holding part.

One housing 20 is provided with a plurality of short slots 21 with respect to holding part 11.

One circuit board 30, be to be multilayer circuit board structure, be provided with some tin balls 32 with respect to multilayer circuit board 10 towards (top in the icon), then be provided with some goldleaf 31 with respect to housing 20 towards (below in the icon), and between tin ball 32 and the goldleaf 31 by circuit board 30, on be drilled with the above aperture of plural number reaching tin ball 32 and goldleaf 31 conductings, and then the connection of forming circuit.

Foregoing circuit plate 30 is arranged on the holding part 11 of multilayer circuit board 10, utilize the memory card wafer and electronic circuit 12 welding in tin ball 32 and the holding part 11 after, can make goldleaf 31 constitute electric connections with memory card wafer and electronic circuit 12 indirectly.

Then, with housing 20 and multilayer circuit board 10 combinations, the goldleaf 31 of circuit board 30 is exposed to the open air on a plurality of short slots 21 of housing 20 again, so, can transmit or receive the data in the memory card by goldleaf 31 and other external device (figure does not show).

In the above-mentioned known fast-flash memory card structure, except the processing procedure of multilayer circuit board 10 and housing 20, need in addition multilayer circuit board processing procedure with standard to produce a slice and be provided with and be drilled with the above aperture of plural number between some tin balls 32 and the goldleaf 31 and come conducting, comparatively loaded down with trivial details in the manufacturing.

[summary of the invention]

The purpose of this utility model is to provide a kind of flash memory, and it comprises: a multilayer circuit board, and front end has holding part; One housing, its shape is corresponding with multilayer circuit board and cover the memory card external form that has memory card wafer and electronic circuit with formation mutually, and this housing is provided with a plurality of short slots in the holding part position with respect to multilayer circuit board; One pedestal is arranged in the holding part of multilayer circuit board, and the opposite position of itself and short slot is provided with a plurality of isolation channels, and each isolation channel extends to another side by the wherein one side of pedestal; And plural pieces terminal, each sheet terminal is bending and is embedded in the isolation channel on the pedestal and fixes, its with respect to holding part towards being that face of weld and memory card wafer and electronic circuit electrically connect, terminal with respect to short slot towards being surface of contact then, and expose to the open air on short slot.

Terminal is plugged on the pedestal, and after inserting between multilayer circuit board and the housing, can makes the surface of contact of terminal expose short slot to the open air at housing, so can be for memory card wafer and the electronic circuit transmission signal in the flash memory.

Between the plural terminals and pedestal in the flash memory of above-mentioned the utility model, its combination is to take the plant mode, therefore can solve tradition uses multilayer circuit board to plate goldleaf and tin ball, and need between goldleaf and tin ball, to be drilled with plural aperture with the shortcoming that reaches conducting (and the processing of this mode, not only uneconomical and the resistance value ratio formation circuit is higher).

The utility model can significantly reduce program, saving cost and the effect easy to assembly of manufacturing, and does not have the too high problem of circuit resistance (because of contact terminal is one of the forming).

[description of drawings]

Fig. 1 is known memory card structure synoptic diagram.

Fig. 2 is the three-dimensional exploded view of the utility model.

Fig. 3 is the pedestal of the utility model and the three-dimensional exploded view of terminal.

Fig. 4 is the pedestal of the utility model and the assembling synoptic diagram of terminal.

The main element symbol description:

Multilayer circuit board ... 10 holding parts ... 11

Memory card wafer and electronic circuit ... 12 pads ... 13

Housing ... 20 short slots ... 21 pedestals ... 40

Isolation channel ... 41 Ka Gou ... 42 terminals ... 50

Face of weld ... 51 clasps ... 52 surface of contact ... 53

[embodiment]

Seeing also shown in Fig. 2,3, is the three-dimensional exploded view for the utility model preferred embodiment, and it forms assembly is to comprise:

One multilayer circuit board 10, front end has holding part 11, and is provided with memory card wafer and electronic circuit 12.

One housing 20, its shape is corresponding with multilayer circuit board 10, and can cover mutually with multilayer circuit board 10 and form the external form of memory card; In addition, this housing 20 is provided with a plurality of short slots 21 in holding part 11 positions with respect to multilayer circuit board 10.

One pedestal 40, be arranged in the holding part 11 of multilayer circuit board 10, the opposite position of a plurality of short slots 21 of itself and housing 20, be respectively arranged with an isolation channel 41, each isolation channel 41 extends to another side by the wherein one side of pedestal 40, form corresponding state up and down, and with respect to holding part 11 towards on be respectively arranged with a card ditch 42.

Plural pieces terminal 50, each sheet terminal 50 is to be bent into lid to be " ㄈ " shape, just can be embedded in the isolation channel 41 on the pedestal 40 and fix, its with respect to holding part 11 towards being face of weld 51, can electrically connect with memory card chip and the electronic circuit 12 on the multilayer circuit board 10, be provided with clasp 52 in addition on this face of weld 51, in order to do the card ditch 42 that can be fastened on the isolation channel 41; This terminal 50 with respect to the short slot 21 of housing 20 towards then being surface of contact 53.

Please also refer to Fig. 2 to Fig. 4, when plural pieces terminal 50 is embedded in each isolation channel 41 on the pedestal 40 respectively, be fastened on card ditch 42, can make plural pieces terminal 50 be separately fixed at isolation channel 41 on the pedestal 40 by the clasp 52 on terminal 50 face of weld 51.

At this moment, will in conjunction with after pedestal 40 and plural pieces terminal 50 be welded in the holding part 11 on the multilayer circuit board 10, the face of weld 51 that can make each sheet terminal 50 respectively with multilayer circuit board 10 on memory card wafer and electronic circuit 12 contact and electrically connect; And then housing 20 and multilayer circuit board 10 covered mutually, can make short slot 21 contrapositions of surface of contact 53 with the housing 20 of each sheet terminal 50, and allow surface of contact 53 expose to the open air on short slot 21, to constitute complete memory card.

When memory card is plugged on for example portable electronic devices such as digital camera, mobile phone (figure shows) use, terminal 50 surface of contact 53 can electrically connect with these portable electronic devices, at this moment, owing to the face of weld 51 of terminal 50 again respectively with multilayer circuit board 10 on memory card wafer and electronic circuit 12 contact and electrically connect, memory card wafer and electronic circuit 12 on portable electronic devices and the memory card are electrically connected, and then the transmitted in both directions signal.

The utility model is except above-mentioned associated methods, also can be with respect to the default pad 13 (as shown in Figure 2) in the position of each sheet terminal 50 in multilayer circuit board 10, so can utilize welding manner to be fixed on the multilayer circuit board 10 pedestal 40 and terminal, to improve the degree of stability that engages; In addition, aforesaid memory card wafer and electronic circuit 12 can also be arranged on a slice circuit board and be contained between multilayer circuit board 10 and the housing 20, only, the above only is the preferred embodiment of the utility model, and is non-so promptly limit to the claim of the utility model.

Claims

1. flash memory is characterized in that it comprises:

One multilayer circuit board, front end has holding part;

One housing, its shape is corresponding with multilayer circuit board and cover the memory card external form that has memory card wafer and electronic circuit with formation mutually, and this housing is provided with a plurality of short slots in the holding part position with respect to multilayer circuit board;

One pedestal is arranged in the holding part of multilayer circuit board, and the opposite position of itself and short slot is provided with a plurality of isolation channels, and each isolation channel extends to another side by the wherein one side of pedestal; And

The plural pieces terminal, each sheet terminal is bending and is embedded in the isolation channel on the pedestal and fixes, its with respect to holding part towards being that face of weld and memory card wafer and electronic circuit electrically connect, terminal with respect to short slot towards being surface of contact then, and expose to the open air on short slot.

2. according to 1 described a kind of flash memory of claim the, the isolation channel that it is characterized by pedestal with respect to holding part towards on be respectively arranged with Yi Kagou, the face of weld of terminal is provided with clasp and is fastened on Ka Gou.

3. according to 1 described a kind of flash memory of claim the, it is characterized by memory card wafer and electronic circuit and be preset on the multilayer circuit board.

4. according to 3 described a kind of flash memories of claim the, it is characterized by in the multilayer circuit board with respect to the default tin ball in the position of each sheet terminal, to utilize welding manner to be fixed on the multilayer circuit board pedestal and terminal.