M3 04401 八、新型說明： 【新型所屬之技術領域】 的結構，且特別是有關 本新型是有關於一種加工工具 於一種磨削工具的結構。 【先前技術】 磨削工具主要是應用於軟質多孔材料的修整、硬脆材 料的磨削以及材料表面粗糙化等領域。目前f知所使用的 磨削工具是以所使用的研磨顆粒來進行分類，依照不同的 研磨顆^的材料性質，可以使用電鑛或硬焊的方式來製造 目月〕t知所使用的金剛石磨削工具的的金剛石磨料多 、不規貝丨的排列方式排列於基材上，且多被包埋鑲嵌在焊 接層中。除此之外，金剛石磨料突出於基材表面的高度也 呈現不一致的情形。此種情形同樣出現於其他材質的研磨 顆粒上，並不限於金剛石磨料。 及的研磨顆粒突出基材表面的高度不一致的情 〆在負荷車乂重的磨削工業中，容易造成研磨顆粒受力的 不均勻。研磨顆粒高度的不一致以及受力的不均，不僅會 =加f元件造成損傷，也使得較突出的研磨顆粒較易脫 从從而〜響了磨削速度與品質。此外，由於習知所使用 的釺=層與基材以及研磨顆粒之間的結合面上不存在牢固 的化學結合，也會使得研磨顆粒容易脫落，造成其穩定性 不佳。 在習知中為了防止研磨顆粒的脫落，開始增加奸焊層 的厚度，其結果是造成了僅有小力5G%的研磨顆粒的高度 5 M3 04401 大出基材表面以及容屑空間的減少。此種情形進一步使得 砂輪容易堵塞，影變工呈沾你^ 〜瞽工具的使用哥命。因此，一種具有高 度#大小均-的研磨顆粒’且釺谭層與基材以及研磨顆粒 之間的結合面具有較牢固的結合的磨削工具為目前工業界 所需。 【新型内容】 髻M3 04401 VIII. New description: The structure of the [new technical field], and especially related to this new type is related to a processing tool in the structure of a grinding tool. [Prior Art] Grinding tools are mainly used in the fields of dressing of soft porous materials, grinding of hard and brittle materials, and roughening of materials. At present, the grinding tools used are classified according to the abrasive particles used. According to the material properties of different abrasive particles, it is possible to manufacture the diamonds by means of electro-mine or brazing. The grinding tool has a plurality of diamond abrasives arranged in an irregular arrangement on the substrate and is embedded in the solder layer. In addition to this, the height of the diamond abrasive protruding from the surface of the substrate also appears to be inconsistent. This situation also occurs on abrasive particles of other materials and is not limited to diamond abrasives. The abrasive particles protrude from the surface of the substrate inconsistently. In the grinding industry where the load is heavy, it is easy to cause unevenness of the abrasive particles. The inconsistency in the height of the abrasive particles and the unevenness of the force will not only cause damage to the f-component, but also make the more prominent abrasive particles easier to disengage and thus the grinding speed and quality. In addition, since there is no strong chemical bond between the ruthenium layer used in the prior art and the bonding surface between the substrate and the abrasive particles, the abrasive particles are liable to fall off, resulting in poor stability. In the prior art, in order to prevent the detachment of the abrasive particles, the thickness of the solder layer is increased, and as a result, the height of the abrasive particles having a small force of 5 G% is 5 M3 04401 which is larger than the surface of the substrate and the space of the chip. This situation further makes the grinding wheel easy to block, and the shadow changer is stained with the use of your ^~瞽 tool. Therefore, a grinding tool having a high degree of size-average abrasive particles and a relatively strong bond between the tantalum layer and the substrate and the abrasive particles is currently required in the industry. [New content] 髻
口此本新型提供了一種具有較佳使用壽命的磨削工 具。 根據本新型-實施例所述，提出了 一種磨削工具，此 磨削工具包含多個排列於基材上且具有相同裸露高度的研 磨顆粒。研磨顆粒與基材間具有—釺焊層，此釺焊層為具 有至少3 %重量鈦金屬的銅合金。 由本新型實施例中可知，本新型實施例所述的磨削工 具在使用上具有㈣知磨削工具較佳的磨削率以 使用壽命。 的This new type provides a grinding tool with a better service life. According to the novel-embodiment, a grinding tool is proposed which comprises a plurality of grinding granules arranged on a substrate and having the same bare height. Between the abrasive particles and the substrate, there is a ruthenium weld layer which is a copper alloy having at least 3% by weight of titanium metal. As can be seen from the novel embodiments, the grinding tool of the present embodiment has (4) a better grinding rate for the service life of the grinding tool. of
【實施方式】 第1圖所示為依照本新型-實施例所述之一種 具的剖面結構圖。第i圖中，多個研磨顆粒32分佈於 30之上，且研磨顆粒32肖基材3Q之間具有—料芦^ ^本新型-實施例中，研磨顆粒32以相等的高度裸9露 材3〇夕卜。在此實施例巾，研磨雖32可經由任何習矣二 ㈣’例如先以篩網先篩選出相同粒徑之研磨顆粒，。的 者於基板的方式來達成此構造。在本新型—實施例中再= M304401 材30的材料為金屬或陶瓷，但並不限於此兩種材料。在另 一實施例中，研磨顆粒32可以為金剛石磨料或氮化硼磨 料’但並不限於此兩種磨料。在本新型另一實施例中，釺 焊層42b為具有至少3 %重量鈦金屬的銅合金。 第2圖係為第1圖中區塊a的放大圖。在本新型一實 施例中，研磨顆粒32裸露在外的高度約為80 %，且呈現 正二角形的排列方式。在此實施例中，研磨顆粒32為金剛 石磨料，研磨顆粒32與釺焊層42b之間形成一層碳化鈦層 44,有助於增加研磨顆粒32與釺焊層4沘的接著。在本新 型另一實施例中，研磨顆粒32具有百分之二十到百分之八 十之高度裸露於基材30表面。 第3圖係為第1圖的俯視圖，其中研磨顆粒32以矩陣 排列的方式排列在基材30上。 第4圖係為依照本新型另一實施例所述之一種磨削工 具的剖面結構圖。在此實施例中，在研磨顆粒32與奸焊層 42b上具有一層防腐蝕層46。防腐蝕層46可以為電鍍鎳 2、陶瓷釉料層、氮化鈦層或類金剛石塗層，但並不限於 二^項目在本新型一實施例中，防腐蝕層46的材料為陶 二&料且其厚度為2微米。在本新型另一實施例中，防 腐餘層46的厚度為1微米到5微米。 t、，第5圖係為依照本新型一實施例所完成之磨削工具的 磨^率分析圖。本新型實施例中的磨削工具在使用上具有 車乂白知磨削工具較佳的磨削率以及多一倍的使用壽命。 雖然本新型已以實施例揭露如上，然其並非用以限定 本新型，任何熟習此技藝者，在不脫離本新型之精神和範 7 M3 04401 圍内，當可作各種之更動與潤飾，因此本新型之保護範圍 當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 月&更明顯易懂，所附圖式之詳細說明如下： 第1圖所示為依照本新型一實施例所述之一種磨削工 具的剖面結構圖。 第2圖係為第1圖中區塊A的放大圖。 第3圖係為第1圖的俯視圖。 圖係為依]3、?、本新型另一實施例所述之一種磨削工 具的剖面結構圖 第5圖係為依照本新型一實施例所完成之磨削工具的 磨削率分析圖。 32 :研磨顆粒 44 :碳化鈦層 【主要元件符號說明】 30 :基材 42b :奸焊層 46 :防腐蝕層[Embodiment] Fig. 1 is a cross-sectional structural view showing an article according to the present invention. In the figure i, a plurality of abrasive particles 32 are distributed over 30, and the abrasive particles 32 have a material between the 3Q and 3Q. In the present invention, in the embodiment, the abrasive particles 32 are bare at the same height.夕卜. In this embodiment, the abrasive 32 can be screened out of the same particle size of the abrasive particles by any of the prior art. This is done in a substrate manner. In the present invention - the material of the M304401 material 30 is metal or ceramic, but is not limited to the two materials. In another embodiment, the abrasive particles 32 can be diamond abrasive or boron nitride abrasives' but are not limited to the two abrasives. In another embodiment of the present invention, the solder layer 42b is a copper alloy having at least 3% by weight titanium metal. Fig. 2 is an enlarged view of block a in Fig. 1. In one embodiment of the present invention, the abrasive particles 32 are exposed to a height of about 80% and exhibit a regular dihedral arrangement. In this embodiment, the abrasive particles 32 are diamond abrasives, and a layer of titanium carbide 44 is formed between the abrasive particles 32 and the solder layer 42b to help increase the adhesion of the abrasive particles 32 to the solder layer 4. In another embodiment of the present invention, the abrasive particles 32 have a height of twenty to eighty percent exposed to the surface of the substrate 30. Fig. 3 is a plan view of Fig. 1 in which abrasive particles 32 are arranged in a matrix arrangement on a substrate 30. Fig. 4 is a sectional structural view showing a grinding tool according to another embodiment of the present invention. In this embodiment, an anti-corrosion layer 46 is provided on the abrasive particles 32 and the solder layer 42b. The anti-corrosion layer 46 may be an electroplated nickel 2, a ceramic glaze layer, a titanium nitride layer or a diamond-like coating, but is not limited to the second embodiment. In an embodiment of the present invention, the material of the anti-corrosion layer 46 is Tao Er & And the thickness is 2 microns. In another embodiment of the present invention, the anti-corrosion residual layer 46 has a thickness of from 1 micron to 5 microns. t, and Fig. 5 is a graph showing the grinding rate analysis of the grinding tool according to an embodiment of the present invention. The grinding tool of the new embodiment has a better grinding rate and a service life of twice as much as the boring tool. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and retouchings without departing from the spirit of the present invention and the scope of the present invention. The scope of the new protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and easy to understand, the detailed description of the drawings is as follows: Figure 1 shows an implementation according to the present invention. A cross-sectional structural view of a grinding tool as described in the example. Fig. 2 is an enlarged view of block A in Fig. 1. Fig. 3 is a plan view of Fig. 1. Fig. 5 is a cross-sectional structural view of a grinding tool according to another embodiment of the present invention. Fig. 5 is a graph showing a grinding rate analysis of a grinding tool according to an embodiment of the present invention. 32: Abrasive particles 44: Titanium carbide layer [Explanation of main component symbols] 30: Substrate 42b: Beaded layer 46: Anti-corrosion layer