M295796 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種LED封裝結構，且特別是有關於 一種用做背光源的LED封裝結構。 【先前技術】 相對於傳統上作為背光源的冷陰極管（c〇ld Cath〇de Fliiorescem Lamp; CCFL)具有高耗電量、演色性差且含汞的 環保顧慮，發光二極體（Light-Emitting Diode; LED)低耗電 量、演色性較高及不含汞的優點，使得LED將逐漸取代 CCFL成為新一代的LCD液晶顯示器的背光源。 應用於液晶顯示器的LED白光背光源是利用r、g、b 二原色光混色而成，而非使用螢光粉激發產生白光，因此， R、G、B的混色效果即為其關鍵所在。一般常見的lED白 光背光源是將多顆發出R、G、B三色之LED燈以直線方 式佈設排列，形成LED背光模組發光裝置；然而，以直線 方式排列的LED背光模組由於間隔較大，會使各個LED燈 所發出的光線之間形成較大的間隙，導致混色效果受到限 制’並產生不均勻的光色。傳統上，要解決間隙的問題， 必須增加背光模組的厚度，然而此種方式已無法符合現今 對電子產品薄型化的要求。 一般來說’將LED緊密地組合在一起可達到更佳的混 色效果’然而，在設計可達到良好混色效果的LEd配置時， 政熱性的問題也必須加以考慮。一般來說，排列愈緊 M295796 密時，熱源亦會愈集中，因之需要具備較複雜的散熱結構·， 而若加大LED燈之間的間距，雖可使熱能容易散出，但另 一方面卻會造成混色不均勻。因此如何在色彩均勻度和散 熱之間取得平衡，是應用LED白光作為背光源時必須要k 服的問題。 【新型内容】 因此本新型一方面就是在提供一種LED封袭結構，用 以改善傳統LED封裝產品應用於背光源之色彩均勻度不佳 的問題。 本新型另一方面是在提供一種LED封裝結構，用以改 善傳統LED封裝產品於多顆使用時散熱效率不佳的缺點。 本新型再一方面是在提供一種LED封裝結構，用以解 決傳統LED封裝產品應用於背光源時，為增加亮度及色彩 飽和度造成體積及厚度增加的問題。 根據本新型之上述目的，提出一種LED封裝結構，於 基板上分別固定具有R、G、B三種色光之發光半導體元件， 並配置成等邊三角形之排列方式；再於每一發光半導體元 件上各覆蓋一凹透鏡結構，透過此凹透鏡結構可將每一發 光半導體元件朝側向的發光強度變大，使不同色光之發光 半導體元件所發出的光線能於短距離内混合均勻，且提高 色衫之飽和度。依照本新型一較佳實施例，基板可為一高 導熱材料’固定於基板上之紅光、綠光及藍光發光半導體 元件具有相同之亮度等級；凹透鏡之材料可為高透光性塑 M295796 根據上述可知，應用本新型具有下列優點： 1·本新型之LED封裝結構利用於同一基板上固定具 有R G B _原色之發光半導體元件，並分別於每一發光 半導體元件上覆蓋一凹透鏡結構，此凹透鏡結構可將每一 發光半導體元件朝側向的發光強度變大，減少間隙的產 生，因而可使光線均勻混合，達到提高混色均勻度的效果。 2·本新型之LED封裝結構利用於每一發光半導體元 件上覆蓋一凹透鏡結構，可使其朝側向的發光強度變大， 因此發光半導體元件之間的排列不需過於緊密仍能使光線 均勻混合，特別適用於使用多顆LED封裝產品時提高元件 間的散熱效率。 3·本新型之LED封裝結構於基板上分別固定r、g、 B三種色光之發光半導體元件，並配置成等邊三角形之排 列方式，所佔體積較小並可發出光色均勻之白光，達到使 LED封裝產品小型化的目的，增加產品之使用範圍。 為了使本發明之構成特徵、操作方法、目的及優點更 加容易了解’故於下文中配合圖示及文字敘述，說明本發 明之實施例。 【實施方式】 請參照第1圖，其繪示依照本新型之較佳實施例的一 種LED封裝結構俯視圖。LED封裝結構1〇〇包含基板11〇、 紅光發光半導體元件12 0、綠光發光半導體元件13 〇、藍光 7 M295796 發光半導體元件140及凹透鏡結構15〇。 紅光發光半導體元件120、綠光發光半導體元件13〇 及藍光發光半導體元件14〇分別以固晶方式固定於基板 110上，用以放出R、G、B三種色光；此三種發光半導體 元件並以等邊三角形之排列方式配置，即紅光發光半導體 元件120、綠光發光半導體元件13〇及藍光發光半導體元件 140分別位於等邊三角形的三個鄰角上，依照此種配置方 式，每一發光半導體元件之間有一定的距離，可促進散熱。 每一發光半導體元件上各覆蓋有一凹透鏡結構15〇，當提供 適當電壓時，每一發光半導體元件會發出光，並透過此凹 透鏡結構150將朝側向的發光強度變大，達到均勻混色的 效果。 依照本新型之較佳實施例，基板110可為一高導熱材 料所構成，例如印刷電路板、陶瓷基板或金屬基板。位於 同一基板上之三個發光半導體元件之亮度應為相同等級。 構成凹透鏡結構之材料可為具透光性的熱固型或熱塑型塑 膠。 請參照第2圖，其繪示依照本新型之較佳實施例的一 種LED封裝結構側視圖。如第2圖所示，凹透鏡結構15〇 為一圓柱狀結構，其周圍高突而中央凹陷，每個凹透鏡結 構150分別與另外兩個凹透鏡結構15〇緊靠排列，並分別 覆蓋於發光半導體元件上。 请參照第3圖及第4圖，其繪示依照本新型之較佳實 施例的一種LED封裝結構截面圖及發光強度分佈圖。由第 M295796 3圖可看出凹透鏡結構15〇之周圍高突而中央凹陷，且由於 其外型為圓柱體，因此位於同一基板上的每一凹透鏡結構 150皆與另外兩個凹透鏡結構150互相交錯排列。如第4 圖所示’由發光半導體元件的發光強度分佈410可看出， 凹透鏡結構150可使每一發光半導體元件朝側向的發光強 度變大，並涵蓋排列在基板上的另外兩個發光半導體元件 所發出的光線範圍，因此不會有間隙產生，促使不同發光 φ 半導體元件所發出的三種色光能於短距離内混合均勻，可 提高色彩之飽和度。 請參照第5圖，其繪示依照本新型一較佳實施例的一 種利用LED封裝結構100作為背光源之示意圖。背光模組 500包含多個LED封裝結構1〇〇排列於螢幕51〇後方，其 中每個LED封裝結構100皆利用三個發光半導體元件分別 發出R、G、B三原色之色光，藉由凹透鏡結構將其發光之 角度擴大，如此混合出均勻的白光，由於LED封裝結構ι〇〇 • 纟有良好的散熱性及混光效果，且可減少背光模組的體積 及厚度，因此適用於多顆使用，作為背光源之應用。 由上述本新型較佳實施例可知，應用本新型具有下列 優點。 、 首先，本新型之LED封裝結構將可發出R、G、Β三 原色的三個發光半導體元件，以排列在等邊三角形之三^ 部角的方式固定於同-基板上，並透過凹透鏡結構將其朝 側向的發光強度變大，可使R、G、Β三原色充分混合均勾， 以發出高飽和度及高演色性的白光，達到提高咖封裝產 M295796 品的色彩飽和度及均勻度之目的。 再者，本新型之led封裝結構利用排列在等邊三角形 之三個鄰角的方式，將三個發光半導體元件固定於同一基 板上，不但可減少整體之體積，更具有良好的散熱性，適 用於夕顆使用，可兼顧散熱性及色彩均勻度，提供具備多 用途特性的封裝體，可增加LED的使用範圍。 雖然本新型已以一較佳實施例揭露如上，然其並非用 以限疋本新型，任何熟習此技藝者，在不脫離本新型之精 神和範圍内，當可作各種之更動與潤飾，因此本新型之保 遵Ι&圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 %更明顯易懂，所附圖式之詳細說明如下： 第1圖是本新型之較佳實施例的一種LED封裝結構俯 视圖。 第2圖係繪示依照本新型之較佳實施例的一種lEE)封 波結構側視圖。 第3圖繪示依照本新型之較佳實施例的一種led封裝 結構截面圖。 第4圖繪示依照本新型之較佳實施例的一種led封裝 、结構的發光強度分佈示意圖。 第5圖係繪示一種利用本新型之led封裝結構作為背 M295796 光源之不意圖。 【主要元件符號說明】 100 : LED封裝結構 120 ··紅光發光半導體元件 140 :藍光發光半導體元件 410 :發光強度分佈 510 :螢幕 110 :基板 130 :綠光發光半導體元件 150 :凹透鏡結構 500 :背光模組M295796 VIII. New Description: [New Technology Field] The present invention relates to an LED package structure, and in particular to an LED package structure used as a backlight. [Prior Art] Compared with the conventional cold cathode tube (c〇ld Cath〇de Fliiorescem Lamp; CCFL), which has a high power consumption, poor color rendering, and mercury-containing environmental concerns, the light-emitting diode (Light-Emitting) Diode; LED) Low power consumption, high color rendering and no mercury, LED will gradually replace CCFL as the backlight of a new generation of LCD liquid crystal display. The LED white backlight used in the liquid crystal display is made by mixing the two primary colors of r, g, and b instead of using the fluorescent powder to generate white light. Therefore, the color mixing effect of R, G, and B is the key point. The common lED white light backlight is to arrange a plurality of LED lights emitting R, G, and B in a straight line to form an LED backlight module light-emitting device; however, the LED backlight modules arranged in a straight line are separated by a gap. Large, will cause a large gap between the light emitted by each LED light, resulting in a limited color mixing effect and produce uneven light color. Traditionally, to solve the problem of gaps, it is necessary to increase the thickness of the backlight module. However, this method cannot meet the requirements for thinning electronic products today. In general, 'LEDs are tightly combined to achieve better color mixing'. However, in designing LEd configurations that achieve good color mixing, the issue of political heat must also be considered. In general, when the M295796 is densely arranged, the heat source will become more concentrated, so it is necessary to have a more complicated heat dissipation structure. However, if the distance between the LED lamps is increased, the heat energy can be easily dissipated, but the other is However, it will cause uneven color mixing. Therefore, how to balance the color uniformity and heat dissipation is a problem that must be applied when using LED white light as a backlight. [New content] Therefore, in one aspect of the present invention, an LED encapsulation structure is provided to improve the problem of poor color uniformity of a conventional LED package product applied to a backlight. Another aspect of the present invention is to provide an LED package structure for improving the disadvantages of poor heat dissipation efficiency of conventional LED package products in multiple applications. A further aspect of the present invention is to provide an LED package structure for solving the problem of increasing volume and thickness for increasing brightness and color saturation when a conventional LED package product is applied to a backlight. According to the above object of the present invention, an LED package structure is proposed, in which light-emitting semiconductor elements having three colors of R, G, and B are respectively fixed on a substrate, and arranged in an equilateral triangle arrangement; and then on each of the light-emitting semiconductor elements Covering a concave lens structure, the light-emitting intensity of each of the light-emitting semiconductor elements is increased by the concave lens structure, so that the light emitted by the light-emitting semiconductor elements of different color lights can be uniformly mixed in a short distance, and the saturation of the color shirt is improved. degree. According to a preferred embodiment of the present invention, the substrate can be a high thermal conductive material 'the red, green and blue light emitting semiconductor components fixed on the substrate have the same brightness level; the material of the concave lens can be high light transmittance plastic M295796 according to As can be seen from the above, the present invention has the following advantages: 1. The LED package structure of the present invention utilizes a light-emitting semiconductor component having RGB primary colors on the same substrate, and each of the light-emitting semiconductor components is covered with a concave lens structure, the concave lens structure The light-emitting intensity of each of the light-emitting semiconductor elements can be increased in the lateral direction, and the generation of the gap can be reduced, so that the light can be uniformly mixed to achieve an effect of improving the color mixture uniformity. 2. The LED package structure of the present invention utilizes a concave lens structure on each of the light-emitting semiconductor elements, so that the lateral light-emitting intensity is increased, so that the arrangement between the light-emitting semiconductor elements does not need to be too tight and the light can be evenly distributed. Hybrid, especially suitable for improving the heat dissipation efficiency between components when using multiple LED package products. 3. The LED package structure of the present invention respectively fixes the light-emitting semiconductor components of r, g, and B color light on the substrate, and is arranged in an arrangement of equilateral triangles, which occupies a small volume and can emit white light with uniform light color. The purpose of miniaturizing LED package products is to increase the range of products used. In order to make the features, operation, objects, and advantages of the present invention easier to understand, the embodiments of the present invention are described below in conjunction with the drawings. [Embodiment] Referring to Figure 1, a top view of an LED package structure in accordance with a preferred embodiment of the present invention is shown. The LED package structure 1A includes a substrate 11A, a red light emitting semiconductor device 120, a green light emitting semiconductor device 13A, a blue light 7 M295796 light emitting semiconductor device 140, and a concave lens structure 15A. The red light emitting semiconductor device 120, the green light emitting semiconductor device 13A, and the blue light emitting semiconductor device 14 are respectively fixed on the substrate 110 by a die bonding method for emitting R, G, and B colors; the three light emitting semiconductor devices are The arrangement of the equilateral triangles, that is, the red light emitting semiconductor device 120, the green light emitting semiconductor device 13A, and the blue light emitting semiconductor device 140 are respectively located at three adjacent corners of an equilateral triangle, and according to this configuration, each of the lights There is a certain distance between the semiconductor components to promote heat dissipation. Each of the light-emitting semiconductor elements is covered with a concave lens structure 15 〇. When a suitable voltage is supplied, each of the light-emitting semiconductor elements emits light, and the lateral light-emitting intensity is increased through the concave lens structure 150 to achieve uniform color mixing. . In accordance with a preferred embodiment of the present invention, substrate 110 can be constructed of a highly thermally conductive material such as a printed circuit board, ceramic substrate or metal substrate. The brightness of the three light-emitting semiconductor elements on the same substrate should be of the same grade. The material constituting the concave lens structure may be a light-transmitting thermosetting or thermoplastic type plastic. Please refer to FIG. 2, which illustrates a side view of an LED package structure in accordance with a preferred embodiment of the present invention. As shown in FIG. 2, the concave lens structure 15 is a cylindrical structure, and the periphery thereof is highly convex and centrally recessed. Each of the concave lens structures 150 is closely arranged with the other two concave lens structures 15 and respectively covered with the light emitting semiconductor elements. on. Please refer to FIG. 3 and FIG. 4, which are cross-sectional views showing an LED package structure and a luminous intensity distribution diagram according to a preferred embodiment of the present invention. It can be seen from the figure of M295796 3 that the concave lens structure 15 is surrounded by a high protrusion and is centrally recessed, and since its appearance is a cylinder, each concave lens structure 150 on the same substrate is interlaced with the other two concave lens structures 150. arrangement. As can be seen from the luminous intensity distribution 410 of the light-emitting semiconductor element, as shown in FIG. 4, the concave lens structure 150 can increase the lateral luminous intensity of each of the light-emitting semiconductor elements and cover the other two light rays arranged on the substrate. The range of light emitted by the semiconductor element is such that no gap is generated, so that the three color lights emitted by the different light-emitting φ semiconductor elements can be uniformly mixed in a short distance, and the saturation of the color can be improved. Referring to FIG. 5, a schematic diagram of utilizing an LED package structure 100 as a backlight is illustrated in accordance with a preferred embodiment of the present invention. The backlight module 500 includes a plurality of LED package structures 1 〇〇 arranged behind the screen 51 , wherein each of the LED package structures 100 respectively emits R, G, and B primary colors by using three light emitting semiconductor elements, and the concave lens structure The angle of illumination is enlarged, so that uniform white light is mixed, and the LED package structure 〇〇 〇〇 has good heat dissipation and light mixing effect, and can reduce the volume and thickness of the backlight module, so it is suitable for multiple uses. As a backlight application. It will be apparent from the above-described preferred embodiments of the present invention that the application of the present invention has the following advantages. First, the LED package structure of the present invention is capable of emitting three light-emitting semiconductor elements of R, G, and 原 three primary colors, and is fixed on the same substrate by being arranged at three corners of an equilateral triangle, and is transmitted through the concave lens structure. The lateral illuminating intensity is increased, and the R, G, and 原 primary colors are sufficiently mixed to emit white light with high saturation and high color rendering, thereby improving the color saturation and uniformity of the M295796 product. purpose. Furthermore, the LED package structure of the present invention uses three adjacent semiconductor elements arranged on the same substrate to reduce the overall volume and has good heat dissipation. It is used in the case of the eve, and it can provide heat dissipation and color uniformity, and provides a package with multi-purpose characteristics, which can increase the range of use of the LED. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and various modifications and refinements may be made without departing from the spirit and scope of the invention. This new type of warranty is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: FIG. 1 is a preferred embodiment of the present invention. Top view of the LED package structure. Figure 2 is a side elevational view of a lEE) sealing structure in accordance with a preferred embodiment of the present invention. 3 is a cross-sectional view of a LED package structure in accordance with a preferred embodiment of the present invention. FIG. 4 is a schematic diagram showing the distribution of luminous intensity of a LED package and structure according to a preferred embodiment of the present invention. Figure 5 is a schematic diagram showing the use of the LED package structure of the present invention as the back M295796 light source. [Main component symbol description] 100 : LED package structure 120 · Red light emitting semiconductor device 140 : Blue light emitting semiconductor device 410 : Luminous intensity distribution 510 : Screen 110 : Substrate 130 : Green light emitting semiconductor device 150 : Concave lens structure 500 : Backlight Module