CN2906927Y - LED encapsulation structure - Google Patents
LED encapsulation structure Download PDFInfo
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- CN2906927Y CN2906927Y CN 200620004187 CN200620004187U CN2906927Y CN 2906927 Y CN2906927 Y CN 2906927Y CN 200620004187 CN200620004187 CN 200620004187 CN 200620004187 U CN200620004187 U CN 200620004187U CN 2906927 Y CN2906927 Y CN 2906927Y
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- led encapsulating
- encapsulating structure
- concavees lens
- led
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Abstract
The utility model relates to an LED packing structure. Even numbers of color types of lighting semiconductor components are fixed on a base plate; and a concave mirror structure is covered on each lighting semiconductor component for strengthening the luminous intensity of each lighting semiconductor component. The utility model can be used for evenly mixing the rays radiated from lighting semiconductor components which is provided with different colors so as to increase the color saturation.
Description
Technical field
The utility model relates to a kind of LED encapsulating structure, particularly relates to a kind of LED encapsulating structure that is used as backlight.
Background technology
With respect to traditionally as cold-cathode tube (the Cold Cathode FluorescentLamp of backlight; CCFL) have high power consumption, color rendering difference and mercurous environmental protection misgivings, light-emitting diode (Light-Emitting Diode; LED) the higher and not mercurous advantage of low power consumption, color rendering makes LED will replace the LCD Backlight For Liquid Crystal Display Panels that CCFL becomes a new generation gradually.
The LED white light backlight that is applied to LCD is to utilize R, G, B primaries colour mixture to form, but not uses phosphor powder to excite the generation white light, and therefore, the colour mixture effect of R, G, B is its key point.General common LED white light backlight is that many LED lamps that send R, G, B three looks are laid arrangement with linear fashion, forms LED-backlit module light-emitting device; Yet the LED-backlit module of arranging with linear fashion forms bigger gap between the light that each LED lamp is sent because bigger at interval, causes the colour mixture effect to be restricted, and produces uneven photochromic.Traditionally, solve the problem in gap, must increase the thickness of module backlight, yet this kind mode can't meet now the requirement to the electronic product slimming.
In general, LED is closely combined the colour mixture effect that can reach better, yet when design can reach the LED configuration of good colour mixture effect, the problem of thermal diffusivity must take in also.In general, LED arranges heals when tight, and thermal source also can be more concentrated, thereby need possess complicated radiator structure; And if the spacing between the increasing LED lamp though heat energy is shed easily, can cause colour mixture inhomogeneous but then.Therefore how averaging out between the color uniformity and heat radiation, is the problem that must overcome when using the LED white light as backlight.
This shows that above-mentioned existing LED encapsulating structure obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that existing LED encapsulating structure exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of LED encapsulating structure of new structure, just becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing LED encapsulating structure exists, the design people is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of LED encapsulating structure of new structure, can improve general existing LED encapsulating structure, make it have more practicality.Through constantly research, design, and, create the utility model that has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present utility model is, overcome the defective that existing LED encapsulating structure exists, and provide a kind of LED encapsulating structure of new structure, technical problem to be solved is to make it improve the not good problem of the color uniformity that traditional LED encapsulating products is applied to backlight, thereby is suitable for practicality more.
Another purpose of the present utility model is, a kind of LED encapsulating structure of new structure is provided, and technical problem to be solved is to make it improve traditional LED encapsulating products not good shortcoming of radiating efficiency when using for many, thereby is suitable for practicality more.
A purpose more of the present utility model is, a kind of LED encapsulating structure of new structure is provided, technical problem to be solved is when making it solve traditional LED encapsulating products and be applied to backlight, for increasing the problem that brightness and color saturation cause volume and thickness to increase, thereby is suitable for practicality more.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.According to a kind of LED encapsulating structure that the utility model proposes, this encapsulating structure comprises: a substrate; One ruddiness, a green glow and a blue light emitting semiconductor element are fixed on this substrate in the mode at three adjacent angles being arranged in an equilateral triangle; And a plurality of concavees lens structures, be covered on each those luminescent diode component, see through this concavees lens structure the luminous intensity of each those luminescent diode component towards side direction become greatly.
The purpose of this utility model and solve its technical problem and also can adopt following technical measures further to realize.
Aforesaid LED encapsulating structure, wherein said substrate are a highly heat-conductive material.
Aforesaid LED encapsulating structure, wherein said highly heat-conductive material are printed circuit board (PCB).
Aforesaid LED encapsulating structure, wherein said highly heat-conductive material are pottery.
Aforesaid LED encapsulating structure, wherein said highly heat-conductive material are metal.
Aforesaid LED encapsulating structure, wherein said luminescent diode component has identical brightness degree.
Aforesaid LED encapsulating structure, the material of wherein said concavees lens structure are thermoset plastic.
Aforesaid LED encapsulating structure, the material of wherein said concavees lens structure are thermoplastics type's plastic cement.
The utility model compared with prior art has tangible advantage and beneficial effect.Via as can be known above, in order to achieve the above object, the utility model provides a kind of LED encapsulating structure, fixedly has the luminescent diode component of R, G, three kinds of coloured light of B on substrate respectively, and is configured to the arrangement mode of equilateral triangle; On each luminescent diode component, respectively cover a concavees lens structure again, seeing through this concavees lens structure can become the luminous intensity of each luminescent diode component towards side direction greatly, the light that luminescent diode component sent of different color light can be mixed in short distance, and improve the saturation of color.According to this novel preferred embodiment, substrate can be a highly heat-conductive material, and the ruddiness, green glow and the blue light emitting semiconductor element that are fixed on the substrate have identical brightness degree; The material of concavees lens can be the high light transmittance plastic cement.
Via as can be known above-mentioned, a kind of LED encapsulating structure of the utility model, fixing respectively plural number is planted the luminescent diode component of different color light on substrate.All be coated with a concavees lens structure on each luminescent diode component, seeing through this concavees lens structure can become big towards lateral direction light emission intensity with each luminescent diode component.By aforesaid way the light that luminescent diode component sent of different color light is mixed, to improve the saturation of color.
By technique scheme, the utility model LED encapsulating structure has following advantage at least:
1. LED encapsulating structure of the present utility model be used in fixedly have R, G on the same substrate, the trichromatic luminescent diode component of B, and respectively at covering a concavees lens structure on each luminescent diode component, this concavees lens structure can become the luminous intensity of each luminescent diode component towards side direction greatly, reduce the generation in gap, thereby light is evenly mixed, reach the effect that improves the colour mixture uniformity.
2. LED encapsulating structure of the present utility model is used in and covers a concavees lens structure on each luminescent diode component, can make its luminous intensity become big towards side direction, therefore the arrangement between the luminescent diode component does not need light is evenly mixed, and improves interelement radiating efficiency when being specially adapted to use the plurality of LEDs encapsulating products.
3. LED encapsulating structure of the present utility model fixing luminescent diode component of R, G, three kinds of coloured light of B respectively on substrate, and be configured to the arrangement mode of equilateral triangle, shared volume is less and can send photochromic uniform white light, reach the purpose that makes the miniaturization of LED encapsulating products, increase the scope of application of product.
In sum, the utlity model has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, have technically than much progress, and produced handy and practical effect, and more existing LED encapsulating structure has the multinomial effect of enhancement, thus be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is a kind of LED encapsulating structure vertical view of preferred embodiment of the present utility model.
Fig. 2 is a kind of LED encapsulating structure end view that illustrates according to preferred embodiment of the present utility model.
Fig. 3 illustrates a kind of LED encapsulating structure sectional view according to preferred embodiment of the present utility model.
Fig. 4 illustrates the luminous intensity distribution schematic diagram according to a kind of LED encapsulating structure of preferred embodiment of the present utility model.
Fig. 5 illustrates a kind of schematic diagram that utilizes LED encapsulating structure of the present utility model as backlight.
100:LED encapsulating structure 120: red light-emitting semiconductor element
140: blue light emitting semiconductor element 410: luminous intensity distributes
510: screen 110: substrate
130: green luminescence semiconductor element 150: the concavees lens structure
500: module backlight
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of LED encapsulating structure, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
See also shown in Figure 1ly, it illustrates a kind of LED encapsulating structure vertical view according to preferred embodiment of the present utility model.LED encapsulating structure 100 comprises substrate 110, red light-emitting semiconductor element 120, green luminescence semiconductor element 130, blue light emitting semiconductor element 140 and concavees lens structure 150.
Red light-emitting semiconductor element 120, green luminescence semiconductor element 130 and blue light emitting semiconductor element 140 are fixed on the substrate 110 with solid crystal type respectively, in order to emit R, G, three kinds of coloured light of B; This three kinds of luminescent diode components and with the configuration of the arrangement mode of equilateral triangle, be that red light-emitting semiconductor element 120, green luminescence semiconductor element 130 and blue light emitting semiconductor element 140 lay respectively on three adjacent angles of equilateral triangle, according to this kind configuration mode, certain distance is arranged between each luminescent diode component, can promote heat radiation.Respectively be coated with a concavees lens structure 150 on each luminescent diode component, when appropriate voltage was provided, each luminescent diode component can send light, and will become big towards the luminous intensity of side direction through this concavees lens structure 150, reached the effect of uniform color mixture.
According to this novel preferred embodiment, substrate 110 can be a highly heat-conductive material and constitutes, for example printed circuit board (PCB), ceramic substrate or metal substrate.The brightness that is positioned at three luminescent diode components on the same substrate should be same levels.The material that constitutes the concavees lens structure can be heat curing-type or the thermoplastics type's plastic cement with light transmission.
See also shown in Figure 2ly, it illustrates a kind of LED encapsulating structure end view according to this novel preferred embodiment.As shown in Figure 2, concavees lens structure 150 is a cylindrical-shaped structure, high prominent and concavity around it, each concavees lens structure 150 respectively with two other concavees lens structure 150 near arrangement, and be covered on the luminescent diode component respectively.
See also Fig. 3 and shown in Figure 4, it illustrates a kind of LED encapsulating structure sectional view and luminous intensity distribution plot according to this novel preferred embodiment.As seen from Figure 3, high prominent and concavity around the concavees lens structure 150, and because its external form is a cylinder, therefore be positioned on the same substrate each concavees lens structure 150 all with the arrangement that intermeshes of two other concavees lens structure 150.As shown in Figure 4, luminous intensity distribution 410 by luminescent diode component can be found out, concavees lens structure 150 can make each luminescent diode component become big towards the luminous intensity of side direction, and contain the light scope that two other luminescent diode component sent that is arranged on the substrate, therefore can gappedly not produce, three kinds of coloured light that impel different luminescent diode component to send can mix in short distance, can improve the saturation of color.
See also shown in Figure 5ly, it illustrates according to a kind of LED of utilization encapsulating structure 100 of this novel preferred embodiment schematic diagram as backlight.Module 500 backlight comprises that a plurality of LED encapsulating structures 100 are arranged in screen 510 rears, wherein each LED encapsulating structure 100 all utilizes three luminescent diode components to send R, G, the trichromatic coloured light of B respectively, angle it is luminous by the concavees lens structure enlarges, so blend uniform white light, because LED encapsulating structure 100 has good thermal diffusivity and mixed light effect, and can reduce the volume and the thickness of module backlight, therefore be applicable to many uses, as the application of backlight.
By above-mentioned novel preferred embodiment as can be known, use the originally novel following advantage that has.
At first, LED encapsulating structure of the present utility model can send R, G, trichromatic three luminescent diode components of B, mode with three adjacent angles being arranged in equilateral triangle is fixed on the same substrate, and it is big with its luminous intensity change towards side direction to see through the concavees lens structure, R, G, B three primary colors are fully mixed, to send the white light of high saturation and high color rendering, reach the color saturation of raising LED encapsulating products and the purpose of the uniformity.
Moreover, the utilization of this new LED encapsulating structure is arranged in the mode at three adjacent angles of equilateral triangle, three luminescent diode components are fixed on the same substrate, not only can reduce whole volume, have more good thermal diffusivity, be applicable to many uses, can take into account the thermal diffusivity and the color uniformity, the packaging body that possesses the multipurpose characteristic is provided, can increases the scope of application of LED.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art are not in breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (8)
1, a kind of LED encapsulating structure is characterized in that it comprises:
One substrate;
One ruddiness, a green glow and a blue light emitting semiconductor element are fixed on this substrate in the mode at three adjacent angles being arranged in an equilateral triangle; And
A plurality of concavees lens structures are covered on each those luminescent diode component, see through this concavees lens structure the luminous intensity of each those luminescent diode component towards side direction become greatly.
2, LED encapsulating structure according to claim 1 is characterized in that wherein said substrate is a highly heat-conductive material.
3, LED encapsulating structure according to claim 2 is characterized in that wherein said highly heat-conductive material is a printed circuit board (PCB).
4, LED encapsulating structure according to claim 2 is characterized in that wherein said highly heat-conductive material is pottery.
5, LED encapsulating structure according to claim 2 is characterized in that wherein said highly heat-conductive material is a metal.
6, LED encapsulating structure according to claim 1 is characterized in that wherein said luminescent diode component has identical brightness degree.
7, LED encapsulating structure according to claim 1, the material that it is characterized in that wherein said concavees lens structure is a thermoset plastic.
8, LED encapsulating structure according to claim 1, the material that it is characterized in that wherein said concavees lens structure is thermoplastics type's plastic cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620004187 CN2906927Y (en) | 2006-03-09 | 2006-03-09 | LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620004187 CN2906927Y (en) | 2006-03-09 | 2006-03-09 | LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2906927Y true CN2906927Y (en) | 2007-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620004187 Expired - Fee Related CN2906927Y (en) | 2006-03-09 | 2006-03-09 | LED encapsulation structure |
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| CN (1) | CN2906927Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113391394A (en) * | 2021-07-01 | 2021-09-14 | 广东小天才科技有限公司 | Backlight generating device and display device |
-
2006
- 2006-03-09 CN CN 200620004187 patent/CN2906927Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113391394A (en) * | 2021-07-01 | 2021-09-14 | 广东小天才科技有限公司 | Backlight generating device and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070530 Termination date: 20110309 |