M294089 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種封裝結構，且特別是有關於一種 表面黏著型（SMD-Type)和支架型（DIP-Type)共用的封裝妹 構。 、口 【先前技術】 — 紅外線遙控的應用普及於各種家電用品，如電視、錄 _ 放影機或冷氣機的控制等等。使用者藉由一遙控器發射— 紅外線訊號給受控制端（例如上述的電視、錄放影機或冷氣 機）的紅外線遙控接收模組，藉以將控制命令傳達給受控制 端’而達成使用者的控制的結果。 目前紅外線遙控的應用已漸漸普及於體積更小型的電 子商品上，例如隨身聽、數位像機或個人數位助理（PDA)。 因為這些商品的尺寸也一再被小型化，裝設於其内的紅外 線遙控接收模組也面臨相同的驅勢。 • 表面黏著型紅外線遙控接收模組就是因應上述驅勢所 產生的元件。此種接收模組之封裝結構為了排除電磁波對 封裝結構内之元件的干擾，通常會加上一金屬殼體。然而， 上述的結構使的表面黏著型紅外線遙控接收模組比支架型 的紅外線遙控接收模組生產成本昂貴。如何使設計出一設 計更簡單及成本更低廉的紅外線遙控接收模組封裝結構， 是各廠家急欲解決的問題。 【新型内容】 M294089 因此本新型的目的就是在提供一種表面黏著型 (SMD_Type)和支架型（DIP-Type)共用的封裝結構。 根據本新型之上述及其他目的，提出一種紅外線遙控 接收模組封裝結構。此封裝結構包含一本體，其内包含一 光半導體晶片和一訊號處理元件。三根支架型接腳自封裝 結構之本體延伸而出。每一支架型接腳具有至少一彎折部 及一連接部，且連接部與該本體之底面同平面。連接部可 插入一基板之通孔後焊接或以本體之底面藉表面粘著技術 固定於基板上。封裝結構之本體更内含一金屬屏蔽殼與三 根支架型接腳連接。金屬屏蔽殼包覆光半導體晶片和訊號 處理元件，藉以排除外界電磁波的干擾。 ' 由上述可知，應用本新型之封裝結構，使紅外線遙控 接收模組可以藉由支架型接腳彎折後，即可利用表面粘著 技術固定於基板上。此封裝結構免除習知SMD結構需加裝 金屬屏蔽殼於本體外的缺點，可降低SMD結構的元件成本。 【實施方式】 如上所述，本新型提供一種表面黏著型和 支架型（DIP-Type)共用的封裝結構，使得紅外線遙控接收模 組得以藉由此結構，以兩種不同方式固定於基板上。此封 裝結構藉由支架型的接腳，經治具彎折後，使部分接腳與 封裝結構本體之底面共平面。所以，此封裝結構可以用I 述兩種不1¾方式固定於基板上。以下將配合較佳實施例來 詳細說明本新型之紅外線遙控接收模組的封裝結構。 請參照第1圖，其繪示依照本新型一較佳實施例的一 M294089 種表面黏著型和支架型共用的紅外線遙控接收模組封裝結 構之立體圖。一紅外線遙控接收模組100具有一本體1〇2 及三根支架型接腳104。每根支架型接腳1〇4均具有一彎折 部104a及一連接部104b。連接部1〇仆可以插入一基板（未 繪出）之通孔後焊接或以連接部1〇4b之底面藉表面粘著技 術固定於基板。 請參照第2圖，其繪示依照本新型一較佳實施例的一 種表面黏著型和支架型共用的紅外線遙控接收模組封裝結 構之侧視圖。紅外線遙控接收模組1〇〇以連接部1〇仆之底 面藉表面粘著技術（SMT)固定於基板2〇〇上。為了可以使支 架型接腳104可以符合上述的目的，將原支架型接腳1〇4 經兩次彎折後，使其連接部1〇4b需與本體1〇2之底面i〇2a 同平面，使其方便於基板2〇〇平面上吃錫。上述的彎折支 架型接腳次數並不受到限制，但最後其連接部1〇仆均需與 本體102之底面i〇2a同平面。換言之，支架型接腳1〇4至 少具有一彎折部l〇4a，使連接部1〇4b與本體1〇2之底面 102a同平面。 明參照第3圖，其繪示依照本新型一較佳實施例的一 種表面黏著型和支架型共用的紅外線遙控純模組封裝結 構之内部結構示意圖。紅外線遙控接收模組之本體1〇2内 各光半導體曰曰片11 〇及訊號處理元件112。上述兩元件經固 晶及打線於一金屬屏蔽殼108内。金屬屏蔽殼1〇8包覆光 半導體晶片110及訊號處理元件112，且與三根支架型接腳 104連接，藉以排除外界電磁波的干擾。在製造時三根支架 型接腳104與金屬屏蔽殼108可一次成型，藉以解省生產 M294089 的成本。金屬屏蔽殼108具有一開口窗1〇8a，使由受光部 1〇6入射的紅外線可以穿越其中而被光半導體晶片ιι〇所 接收。因為，此設計已藉由本體1〇2内之金屬屏蔽殼工⑽ 排除外界電磁波的干擾，便不需要如習知於本體外加裝金 屬屏蔽殼的方式。 ' 由上述本新型較佳實施例可知，應用本新型之封裝結 構，使紅外線遙控接收模組可以藉由支架型接腳彎折後， 即可利用表面粘著技術固定於基板上。此封裝結構免除習 知SMD結構需加裝金屬屏蔽殼於本體外的缺點，可降低 SMD結構的元件成本。 雖然本新型已以一較佳實施例揭露如上，然其並非用 以限疋本新型，任何熟習此技藝者，在不脫離本新型之精 神和範圍内，當可作各種之更動與潤飾，因此本新型之保 4範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖係繪示依照本新型一較佳實施例的一種表面黏 著型和支架型共用的紅外線遙控接收模組封裝結構之立體 園， —第2圖係繪示依照本新型一較佳實施例的一種表面黏 著型和支架型共用的紅外線遙控接收模組封裝結構之側視 圖；以及 第3圖係繪不依照本新型一較佳實施例的一種表面黏 M294089 著型和支架型共用的紅外線遙控接收模組封裝結構之内部 結構示意圖。 紅外線遙控接收模組 106:受光部 【主要元件符號說明】 100 ： 102 :本體 102a :底面 104 :支架型接腳 104a :彎折部 104b :連接部 108 :金屬屏蔽殼 110 :光半導體晶片 112 :訊號處理元件 108a :開口窗 200 :基板M294089 VIII. New description: [New technical field] The present invention relates to a package structure, and in particular to a package structure shared by a surface mount type (SMD-Type) and a bracket type (DIP-Type). Port [Previous Technology] — The application of infrared remote control is widely used in various household appliances, such as TV, recording, or air conditioner control. The user transmits an infrared signal to an infrared remote control receiving module of the controlled terminal (such as the above-mentioned television, video recorder or air conditioner) by a remote controller, thereby transmitting the control command to the controlled terminal to achieve the user's The result of the control. At present, the application of infrared remote control has gradually spread to smaller electronic products such as a walkman, a digital camera or a personal digital assistant (PDA). Since the size of these products has been repeatedly miniaturized, the infrared remote control receiving modules installed therein are also facing the same momentum. • The surface-adhesive infrared remote control receiver module is the component generated by the above-mentioned driving force. The package structure of such a receiving module is usually provided with a metal casing in order to eliminate the interference of electromagnetic waves on components in the package structure. However, the above structure makes the surface-adhesive infrared remote control receiving module more expensive to produce than the bracket type infrared remote receiving module. How to design a package structure of infrared remote control receiving module with simpler design and lower cost is an urgent problem for various manufacturers. [New content] M294089 Therefore, the purpose of the present invention is to provide a package structure common to surface mount type (SMD_Type) and bracket type (DIP-Type). According to the above and other objects of the present invention, an infrared remote control receiving module package structure is proposed. The package structure includes a body including an optical semiconductor wafer and a signal processing component. The three bracket type pins extend from the body of the package structure. Each of the bracket-type pins has at least one bent portion and a connecting portion, and the connecting portion is flush with the bottom surface of the body. The connecting portion can be inserted into the through hole of a substrate and soldered or fixed on the substrate by the surface adhesion technique on the bottom surface of the substrate. The body of the package structure further includes a metal shield shell connected to the three bracket type pins. The metal shield case encloses the optical semiconductor chip and the signal processing component to eliminate interference from external electromagnetic waves. As can be seen from the above, by applying the package structure of the present invention, the infrared remote control receiving module can be fixed on the substrate by surface adhesion technology after being bent by the bracket type pin. The package structure eliminates the disadvantages of the conventional SMD structure that requires the addition of the metal shield shell in the body, and can reduce the component cost of the SMD structure. [Embodiment] As described above, the present invention provides a package structure common to the surface mount type and the DIP type, so that the infrared remote control receiving module can be fixed to the substrate in two different ways by this structure. The package structure is bent by the fixture after the fixture is bent, so that part of the pins are coplanar with the bottom surface of the package structure body. Therefore, the package structure can be fixed to the substrate by the two types described in the above. The package structure of the infrared remote control receiving module of the present invention will be described in detail below in conjunction with the preferred embodiment. Please refer to FIG. 1 , which is a perspective view showing a package structure of a M294089 surface-adhesive and bracket type shared infrared remote control receiving module according to a preferred embodiment of the present invention. An infrared remote control receiving module 100 has a body 1〇2 and three bracket type pins 104. Each of the bracket type pins 1 〇 4 has a bent portion 104a and a connecting portion 104b. The connecting portion 1 can be inserted into a through hole of a substrate (not shown) and soldered or fixed to the substrate by surface adhesion using the bottom surface of the connecting portion 1 4b. Please refer to FIG. 2, which is a side view of a package structure of a surface-adhesive and bracket type shared infrared remote control receiving module according to a preferred embodiment of the present invention. The infrared remote control receiving module 1 is fixed to the substrate 2 by surface adhesion technology (SMT) by the bottom surface of the connecting portion 1 . In order to make the bracket type pin 104 conform to the above purpose, the original bracket type pin 1〇4 is bent twice, so that the connecting portion 1〇4b needs to be flush with the bottom surface i〇2a of the body 1〇2. It makes it convenient to eat tin on the plane of the substrate 2 . The number of the bent bracket type pins described above is not limited, but in the end, the connecting portion 1 is required to be flush with the bottom surface i 〇 2a of the body 102. In other words, the bracket type pin 1〇4 has at least one bent portion 10a, so that the connecting portion 1〇4b is flush with the bottom surface 102a of the body 1〇2. Referring to FIG. 3, an internal structure diagram of a surface-adhesive and bracket type shared infrared remote control pure module package structure according to a preferred embodiment of the present invention is shown. The optical semiconductor chip 11 and the signal processing component 112 are disposed in the main body 1 of the infrared remote control receiving module. The two components are solidified and wired in a metal shield shell 108. The metal shield case 1 包覆 8 encloses the semiconductor wafer 110 and the signal processing element 112, and is connected to the three bracket type pins 104 to eliminate interference from external electromagnetic waves. The three bracket type pins 104 and the metal shield case 108 can be formed at one time during manufacture to save the cost of producing the M294089. The metal shield case 108 has an opening window 1 〇 8a through which infrared rays incident from the light receiving portion 1 〇 6 can be received by the optical semiconductor wafer. Because this design has eliminated the interference of external electromagnetic waves by the metal shield shell (10) in the body 1〇2, there is no need to add a metal shield shell as in the prior art. As can be seen from the above preferred embodiment of the present invention, by applying the package structure of the present invention, the infrared remote control receiving module can be fixed on the substrate by surface adhesion technology after being bent by the bracket type pin. This package structure eliminates the disadvantages of the conventional SMD structure that requires the addition of a metal shield shell to the present invention, and can reduce the component cost of the SMD structure. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and various modifications and refinements may be made without departing from the spirit and scope of the invention. The scope of this new type of insurance 4 is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. The invention relates to a three-dimensional garden of a surface-adhesive type and a bracket type shared infrared remote control receiving module package structure, and FIG. 2 is a view showing a surface-adhesive type and a bracket type shared infrared remote control receiving according to a preferred embodiment of the present invention. A side view of the module package structure; and FIG. 3 is a schematic diagram showing the internal structure of a surface mount M294089 type and a bracket type shared infrared remote control receiving module package structure according to a preferred embodiment of the present invention. Infrared remote control receiving module 106: light receiving unit [main component symbol description] 100 : 102 : body 102a : bottom surface 104 : bracket type pin 104a : bent portion 104b : connecting portion 108 : metal shield shell 110 : optical semiconductor wafer 112 : Signal processing component 108a: opening window 200: substrate