TWM294088U - Infrared receiver module - Google Patents

Infrared receiver module Download PDF

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Publication number
TWM294088U
TWM294088U TW095201590U TW95201590U TWM294088U TW M294088 U TWM294088 U TW M294088U TW 095201590 U TW095201590 U TW 095201590U TW 95201590 U TW95201590 U TW 95201590U TW M294088 U TWM294088 U TW M294088U
Authority
TW
Taiwan
Prior art keywords
bracket
remote control
type pins
infrared remote
plane
Prior art date
Application number
TW095201590U
Other languages
Chinese (zh)
Inventor
Chin-Chia Hsu
Hui-Chin Lin
Original Assignee
Everlight Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everlight Electronics Co Ltd filed Critical Everlight Electronics Co Ltd
Priority to TW095201590U priority Critical patent/TWM294088U/en
Publication of TWM294088U publication Critical patent/TWM294088U/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Light Receiving Elements (AREA)
  • Optical Communication System (AREA)
  • Selective Calling Equipment (AREA)

Description

M294088 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種封裝結構，且特別是有關於一種 支架型（DIP-Type)的封裝結構。 【先前技術】 紅外線遙控的應用普及於各種家電用品，如電視、錄 放影機或冷氣機的控制等等。使用者藉由一遙控器發射一 紅外線吼號給受控制端（例如上述的電視、錄放影機或冷氣 機）的紅外線遙控接收模組，藉以將控制命令傳達給受控制 端’而達成使用者的控制的結果。 目前紅外線遙控的應用已漸漸普及於體積更小型的電 子商品上，例如隨身聽、數位像機或個人數位助理（PDA)。 因為這些商品的尺寸也一再被小型化，裝設於其内的紅外 線遙控接收模組也面臨相同的驅勢。 睛參照第1圖，其繪示習知一種小型化之支架型紅外 線遙控接收模組封裝結構之側視圖。紅外線遙控接收模組 104被包覆於一金屬屏蔽殼102内，排除電磁波對封裝結構 内之元件的干擾。紅外線遙控接收模組的支架型接腳1 〇6 加上金屬屏蔽殼的支腳l〇2a，使得此封裝結構能矗立於一 電路板平面上吃錫。然而，外加金屬屏蔽殼於一支架型紅 外線遙控接收模組使得生產成本提高許多。如何設計出一 更簡單及成本更低廉的紅外線遙控接收模組封裝結構，是 各廠家急欲解決的問題。 【新型内容】 5 M294088 因此本新型的目的就是在提供一種支架型封裝結構， 使得一紅外線遙控接收模組能矗立於電路板平面上吃錫。 根據本新型之上述及其他目的，提出一種紅外線遙控 接收模組封裝結構。此封裝結構包含一本體，其内包含一 光半導體晶片和一訊號處理元件。此封裝結構的三根支架 型接腳自本體延伸而出。每一支架型接腳具有一波浪部及 一連接部’且三根支架型接腳之連接部的尾端定義一平 面，使三根支架型接腳可矗立於一電路板平面上吃錫。此 封裝結構的本體更内含一金屬屏蔽殼與三根支架型接腳連 接’金屬屏蔽殼包覆光半導體晶片和訊號處理元件，藉以 排除外界電磁波的干擾。 由上述可知，應用本新型具有下列優點：（1)在接腳設 計上，接腳的尾端能定義一平面，而使得紅外線遙控接收 模組能矗立於一電路板平面上吃錫；（2)紅外線遙控接收模 組的本體外可免除外加的金屬屏蔽殼，能大幅節省物料成 本；以及（3)在紅外線遙控接收模組的製程上，可節省組裝 金屬屏蔽殼的工費及工時。 【實施方式】 如上所述，本新型提供一種支架型封裝結構，藉由將 三根支架型接腳折彎，使其接腳的尾端能定義一平面，藉 以矗立於一電路板平面上吃錫。以下將配合較佳實施例來 詳細說明本新型之紅外線遙控接收模組的封裝結構。 請參照第2A圖，其繪示依照本新型一較佳實施例的一 種紅外線遙控接收模組封裝結構之立體圖。紅外線遙控接 M294088 收模組200包含一本體202及三根支架型接腳 204/206/208。每根支架型接腳均包含波浪部204a/206a/208a 及連接部204d/206d/208d。在焊接紅外線遙控接收模組於 電路板上時，連接部204d/206d/208d用來插入電路板上的 通孔，波浪部204a/206a/208a則頂住電路板的平面。支架 型接腳206更包含一向下的折彎部206b，使得連接部 204d/206d/208d的尾端能定義一平面，而使得紅外線遙控 接收模組200能矗立於一電路板平面上吃錫。 請參照第2B圖，其繪示依照本新型另一較佳實施例的 一種紅外線遙控接收模組封裝結構之立體圖。紅外線遙控 接收模200包含一本體202及三根支架型接腳 204/206/208。每根支架型接腳均包含波浪部204a/206a/208a 及連接部204d/206d/208d。在焊接紅外線遙控接收模於電 路板上時，連接部204d/206d/208d用來插入電路板上的通 孔，波浪部204a/206a/208a則頂住電路板的平面。支架型 接腳206更包含一向上的折彎部206c，使得連接部 204d/206d/208d的尾端能定義一平面，而使得紅外線遙控 接收模組200能矗立於一電路板平面上吃錫。 雖然，上述兩較佳實施例只說明兩種支架型接腳 204/206/208的設計方式，其他的支架型接腳的結構只要能 使支架型接腳具有波浪部及連接部，且連接部的尾端能定 義一平面，而使得紅外線遙控接收模能矗立於一電路板平 面上吃錫，皆不超出本新型的創作精神。 請參照第3圖，其繪示依照本新型一較佳實施例的一 種紅外線遙控接收模組封裝結構之側視圖。紅外線遙控接 7 M294088 收模組之本體202内含光半導體晶片214及訊號處理元件 216。上述兩元件經固晶及打線於一金屬屏蔽殼212内。金 屬屏蔽设212包覆光半導體晶片214及訊號處理元件216, 且與三根支架型接腳204/206/208連接，藉以排除外界電磁 波的干擾。在製造時，三根支架型接腳204/206/208與金屬 屏蔽殼212可一次成型，藉以節省生產的成本。金屬屏蔽 殼212具有一開口窗212a，使由受光部210入射的紅外線 可以穿越其中而被光半導體晶片214所接收。因為，此設 计已藉由本體202内之金屬屏蔽殼212排除外界電磁波的 干擾’便不需要如習知於本體外加裝金屬屏蔽殼的方式。 由上述本新型較佳實施例可知，應用本新型具有下列 優點：（1)在接腳設計上，接腳的尾端能定義一平面，而使 得紅外線遙控接收模組能矗立於一電路板平面上吃錫；（2) 紅外線遙控接收模組的本體外可免除外加的金屬屏蔽殼， 能大幅節省物料成本；以及（3)在紅外線遙控接收模組的製 程上，可郎省組裝金屬屏蔽殼的工費及工時。 雖然本新型已以一較佳實施例揭露如上，然其並非用 以限定本新型，任何熟習此技藝者，在不脫離本新型之精 神和範_，當可作各種之更動與潤飾，因此本新型之保 護範圍當視後社巾請專利範㈣界定者為準。 圖式簡單說明 2本新型之上述和其他 能更明顯易懂，所附圖式之詳細說明如下： 貫川M294088 VIII. New description: [New technical field] The present invention relates to a package structure, and in particular to a package type (DIP-Type) package structure. [Prior Art] The application of the infrared remote control is popularized in various home appliances such as televisions, video recorders, and air conditioner controls. The user transmits an infrared nickname to an infrared remote control receiving module of the controlled terminal (such as the above-mentioned television, video recorder or air conditioner) by a remote controller, thereby transmitting the control command to the controlled terminal to achieve the user. The result of the control. At present, the application of infrared remote control has gradually spread to smaller electronic products such as a walkman, a digital camera or a personal digital assistant (PDA). Since the size of these products has been repeatedly miniaturized, the infrared remote control receiving modules installed therein are also facing the same momentum. Referring to Fig. 1, there is shown a side view of a conventional packaged infrared type remote control receiving module package structure. The infrared remote control receiving module 104 is wrapped in a metal shield case 102 to eliminate electromagnetic waves from interfering with components in the package structure. The bracket type pin 1 〇6 of the infrared remote control receiving module and the leg l〇2a of the metal shield case enable the package structure to stand on a board surface to eat tin. However, the addition of a metal shield to a bracket type infrared remote control receiving module increases the production cost. How to design a simpler and lower cost infrared remote control receiver module package structure is an urgent problem for manufacturers. [New content] 5 M294088 Therefore, the purpose of the novel is to provide a bracket type package structure, so that an infrared remote control receiving module can stand on the plane of the circuit board to eat tin. According to the above and other objects of the present invention, an infrared remote control receiving module package structure is proposed. The package structure includes a body including an optical semiconductor wafer and a signal processing component. The three bracket-type pins of the package structure extend from the body. Each bracket type pin has a wave portion and a connecting portion', and the tail end of the connection portion of the three bracket type pins defines a flat surface, so that the three bracket type pins can stand on a board plane to eat tin. The body of the package structure further comprises a metal shield shell connected to the three bracket type pins. The metal shield shell covers the optical semiconductor chip and the signal processing component, thereby eliminating interference from external electromagnetic waves. It can be seen from the above that the application of the present invention has the following advantages: (1) In the pin design, the tail end of the pin can define a plane, so that the infrared remote control receiving module can stand on a circuit board plane to eat tin; (2 The infrared remote control receiving module can be exempted from the addition of a metal shielding shell, which can greatly save material cost; and (3) in the process of the infrared remote control receiving module, the labor and working hours of assembling the metal shielding shell can be saved. [Embodiment] As described above, the present invention provides a bracket-type package structure, by bending three bracket-type pins so that the tail end of the pin can define a plane, thereby standing on a board plane to eat tin . The package structure of the infrared remote control receiving module of the present invention will be described in detail below in conjunction with the preferred embodiment. Please refer to FIG. 2A, which is a perspective view of a package structure of an infrared remote control receiving module according to a preferred embodiment of the present invention. Infrared remote control M294088 Receiver module 200 includes a body 202 and three bracket type pins 204/206/208. Each of the bracket type pins includes a wave portion 204a/206a/208a and a connecting portion 204d/206d/208d. When the infrared remote control receiving module is soldered to the circuit board, the connecting portions 204d/206d/208d are used to insert through holes in the circuit board, and the wave portions 204a/206a/208a are placed against the plane of the circuit board. The bracket type pin 206 further includes a downwardly bent portion 206b so that the tail end of the connecting portion 204d/206d/208d can define a plane, so that the infrared remote control receiving module 200 can stand on a board plane to eat tin. Please refer to FIG. 2B, which is a perspective view of a package structure of an infrared remote control receiving module according to another preferred embodiment of the present invention. The infrared remote receiving die 200 includes a body 202 and three bracket type pins 204/206/208. Each of the bracket type pins includes a wave portion 204a/206a/208a and a connecting portion 204d/206d/208d. When the infrared remote control receiving mold is applied to the circuit board, the connecting portions 204d/206d/208d are used to insert the through holes on the circuit board, and the wave portions 204a/206a/208a are placed against the plane of the circuit board. The bracket type pin 206 further includes an upwardly bent portion 206c so that the tail end of the connecting portion 204d/206d/208d can define a plane, so that the infrared remote control receiving module 200 can stand on a board plane to eat tin. Although the above two preferred embodiments only illustrate the design of the two bracket type pins 204/206/208, the other bracket type pins can be configured such that the bracket type pins have a wave portion and a connecting portion, and the connecting portion The tail end can define a plane, so that the infrared remote control receiving mold can stand on a board plane to eat tin, which does not exceed the creative spirit of the novel. Please refer to FIG. 3, which is a side view of a package structure of an infrared remote control receiving module according to a preferred embodiment of the present invention. Infrared remote control 7 M294088 The body 202 of the receiving module contains an optical semiconductor chip 214 and a signal processing component 216. The two components are solid crystallized and wired in a metal shield shell 212. The metal shield 212 encloses the optical semiconductor wafer 214 and the signal processing component 216 and is connected to the three bracket type pins 204/206/208 to eliminate interference from external electromagnetic waves. At the time of manufacture, the three bracket type pins 204/206/208 and the metal shield case 212 can be molded at one time, thereby saving production costs. The metal shield case 212 has an opening window 212a through which infrared rays incident from the light receiving portion 210 can be received by the optical semiconductor wafer 214. Because the design has eliminated the interference of external electromagnetic waves by the metal shield case 212 in the body 202, it is not necessary to add a metal shield case as in the prior art. It can be seen from the above preferred embodiment of the present invention that the application of the present invention has the following advantages: (1) In the pin design, the tail end of the pin can define a plane, so that the infrared remote control receiving module can stand on a circuit board plane. (2) Infrared remote control receiver module can be exempted from the addition of a metal shield shell, which can greatly save material costs; and (3) in the process of infrared remote control receiver module, Kolang province assembled metal shield shell Labor and working hours. Although the present invention has been disclosed in a preferred embodiment as above, it is not intended to limit the present invention, and any person skilled in the art can make various changes and retouching without departing from the spirit and scope of the present invention. The scope of protection shall be subject to the definition of the patent towel (4). BRIEF DESCRIPTION OF THE DRAWINGS 2 The above and other aspects of the present invention can be more clearly understood, and the detailed description of the drawings is as follows:

第1圖係繪示習知支牟兜〗4 L 〃、1外線遙控接收模組封裝結 M294088 構之側視圖； 第2A圖係繪示依照本新型一較佳實施例的一種紅外 線遙控接收模組封裝結構之立體圖； 第2B圖係繪示依照本新型另一較佳實施例的一種紅 外線遙控接收模組封裝結構之立體圖；以及 第3圖係繪示依照本新型一較佳實施例的一種紅外線 遙控接收模組封裝結構之側視圖。FIG. 1 is a side view showing a conventional remote control receiving module package junction M294088; FIG. 2A is a view showing an infrared remote receiving die according to a preferred embodiment of the present invention; FIG. 2B is a perspective view of a package structure of an infrared remote control receiving module according to another preferred embodiment of the present invention; and FIG. 3 is a perspective view of a preferred embodiment of the present invention. Side view of the infrared remote control receiving module package structure.

【主要元件符號說明】 100 :紅外線遙控接收模組 104 :本體 102 :金屬屏蔽殼 102a :支腳 200 :紅外線遙控接收模組 202 :本體 204/206/208 :支架型接腳 204a/206a/208a ··波浪部 206b/206c :彎折部 204d/206d/208d :連接部 212 :金屬屏蔽殼 212a :開口窗 210 :受光部 214 :光半導體晶片 216 :訊號處理元件[Main component symbol description] 100: Infrared remote control receiving module 104: Main body 102: Metal shield case 102a: Leg 200: Infrared remote control receiving module 202: Main body 204/206/208: Bracket type pin 204a/206a/208a Wave portion 206b/206c: bent portion 204d/206d/208d: connection portion 212: metal shield case 212a: opening window 210: light receiving portion 214: optical semiconductor wafer 216: signal processing element

Claims (1)

M294088 九、申請專利範圍： ^一種紅外線遙控接收模組封裝結構，至少包含： 一本體，内含一光半導體晶片和一訊號處理元件；以 及 二根支架型接腳，自該本體延伸而出，每一該支架型 接腳具有一波浪部及一連接部，且該三根支架型接腳之該 連接部的尾端定義一平面，使該三根支架型接腳可矗立於 電路板平面上吃錫。 2·如申請專利範圍第丨項所述之紅外線遙控接收模組 、妒、°構其中該本體更内含一金屬屏蔽殼與三根支架型 接腳連接，該金屬屏蔽殼包覆該光半導體晶片和該訊號處 理元件，藉以排除外界電磁波的干擾。 種積體電路封裝結構，至少包含： 本體，内含至少一積體電路；以及 二根支架型接腳，自該本體延伸而出，每一該支架型 =腳具有-波浪部及—連接部，且該三根支架型接腳之該 轉部的尾端^義―平面，使該三根支㈣接聊可嘉立於 電路板平面上吃錫。 4·如中請專利範圍帛3項所述之積體電路封裝結構， “本體更内含一金屬屏蔽殼與三根支架型接腳連接， M294088 該金屬屏蔽殼包覆該至少一積體電路，藉以排除電外界磁 波的干擾。M294088 IX. Patent application scope: ^ An infrared remote control receiving module package structure, comprising at least: a body containing an optical semiconductor chip and a signal processing component; and two bracket type pins extending from the body Each of the bracket-type pins has a wave portion and a connecting portion, and a tail end of the connecting portion of the three bracket-type pins defines a plane, so that the three bracket-type pins can stand on the plane of the circuit board to eat tin . 2. The infrared remote control receiving module according to the invention of claim 2, wherein the body further comprises a metal shielding shell connected to the three bracket type pins, the metal shielding shell covering the optical semiconductor wafer And the signal processing component to eliminate interference from external electromagnetic waves. The integrated circuit package structure comprises at least: a body including at least one integrated circuit; and two bracket type pins extending from the body, each of the bracket type=foot having a wave portion and a connection portion And the tail end of the three bracket type pins is the same as the plane, so that the three branches (four) can be placed on the plane of the board to eat tin. 4. The integrated circuit package structure as described in the scope of patent 帛3, "the body further includes a metal shield shell connected to the three bracket type pins, and the metal shield shell covers the at least one integrated circuit. In order to eliminate the interference of external magnetic waves.
TW095201590U 2006-01-24 2006-01-24 Infrared receiver module TWM294088U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108481196A (en) * 2018-04-28 2018-09-04 骏艺精密模具（苏州）有限公司 A kind of adjustable oblique top polishing clamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108481196A (en) * 2018-04-28 2018-09-04 骏艺精密模具（苏州）有限公司 A kind of adjustable oblique top polishing clamp

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