CN209929305U - Mixed signal microcontroller and apparatus - Google Patents
Mixed signal microcontroller and apparatus Download PDFInfo
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- CN209929305U CN209929305U CN201920798503.6U CN201920798503U CN209929305U CN 209929305 U CN209929305 U CN 209929305U CN 201920798503 U CN201920798503 U CN 201920798503U CN 209929305 U CN209929305 U CN 209929305U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The present application relates to a mixed signal microcontroller and apparatus. The mixed signal microcontroller comprises a packaging body provided with a mounting surface for surface mounting and a wafer bare chip arranged in the packaging body; the wafer die is connected to package pins on the package body by bonding wires. The wafer bare chip comprises a microcontroller bare chip and an analog-to-digital converter bare chip, and the two bare chips and the mounting surface of the packaging body are arranged in a stacked mode, so that the occupied area of the device is effectively reduced. The bare chips and the package pins are electrically connected through bonding wires. Based on the structure, the bare chips in the packaging body can carry out data transmission, and the bare chips carry out data transmission with the outside through the packaging pins; compared with a packaged chip finished product, the bare chip has small size, is beneficial to reducing the occupied area of a packaging body during mounting, is convenient to be applied to a data acquisition end with strict requirements on circuit volume, and the obtained device packaging product has high cost performance and is more competitive.
Description
Technical Field
The present application relates to the field of semiconductor technology, and more particularly, to a mixed signal microcontroller and apparatus.
Background
Aiming at low-speed high-precision signal data acquisition and application, a high-precision ADC (Analog-to-Digital Converter) chip and a microcontroller chip are generally combined in the industry and are electrically connected based on a PCB (printed circuit Board) stage. That is, a high-precision ADC chip, a microcontroller chip, and some other peripheral components are mounted on the PCB.
In the era of the internet of things, the volume requirement of a data acquisition end is more and more strict, and the smaller the occupied area of components is, the more advantageous the components are. In the implementation process, the inventor finds that at least the following problems exist in the conventional technology: in a traditional data acquisition system, a chip, corresponding pins of the chip and a peripheral circuit occupy large area.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a mixed signal microcontroller and a device thereof, aiming at the problem that the traditional technology occupies a large area in low-speed and high-precision signal data acquisition and application.
To achieve the above object, in one aspect, an embodiment of the present application provides a mixed signal microcontroller, including:
the packaging body is provided with a surface mounting surface for surface mounting, and the edge of the surface mounting surface is provided with a packaging pin.
The first wafer bare chip is arranged in the packaging body, stacked on the mounting surface and electrically connected with the packaging pins through the bonding wire.
And the second wafer bare chip is arranged in the packaging body, stacked on the first wafer bare chip and electrically connected with the packaging pins and the first wafer bare chip through bonding wires respectively.
The first wafer bare chip is a microcontroller bare chip, and the second wafer bare chip is an analog-to-digital converter bare chip; alternatively, the first wafer die is an analog-to-digital converter die and the second wafer die is a microcontroller die.
In one embodiment, the mounting surface is provided with heat dissipation pads; a first wafer die is stacked on the thermal pad.
In one embodiment, the package further comprises a substrate; the substrate is arranged in the packaging body and is stacked between the heat dissipation bonding pad and the first wafer bare chip.
In one embodiment, the package pin includes:
and the digital power supply pin group is electrically connected with the micro-controller bare chip through the bonding wire.
And the analog power supply pin group is electrically connected with the analog-to-digital converter bare chip through a bonding wire.
In one embodiment, the package pin includes:
the analog signal input pin set is electrically connected with the analog-to-digital converter bare chip through a bonding wire.
In one embodiment, the package pin includes:
the special pin group is electrically connected with the micro-controller bare chip through a bonding wire; the dedicated set of pins includes a clock signal pin and/or a reset pin.
In one embodiment, the package pin includes:
and the general IO pin group is electrically connected with the micro-controller bare chip through a bonding wire.
In one embodiment, the package pin includes:
the peripheral interface pin group is electrically connected with the micro-controller bare chip through a bonding wire; the peripheral interface pin group comprises any one or any combination of the following pins: an I2C pin, a UART pin, a PWM pin, and a control pin.
In one embodiment, the package is a QFN package.
On the other hand, the embodiment of the present application further provides an apparatus, including a system application board, and the mixed signal microcontroller as described above; the mixed signal microcontroller is mounted on the system application board.
One of the above technical solutions has the following advantages and beneficial effects:
a microcontroller bare chip and an analog-to-digital converter bare chip are arranged in the device packaging body, and the two bare chips and the mounting surface of the packaging body are arranged in a stacked mode, so that the occupied area of the device is effectively reduced. The bare chips and the package pins are electrically connected through bonding wires. Based on the structure, the bare chips in the packaging body can carry out data transmission, and the bare chips carry out data transmission with the outside through the packaging pins; compared with a packaged chip finished product, the size of the bare chip is small, and the occupied area of a packaging body during mounting is favorably reduced.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular description of preferred embodiments of the application, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the subject matter of the present application.
FIG. 1 is a diagram of an exemplary mixed signal microcontroller application environment;
FIG. 2 is a first schematic block diagram of a mixed signal microcontroller in one embodiment;
FIG. 3 is a second schematic block diagram of a mixed signal microcontroller in one embodiment;
FIG. 4 is a third schematic block diagram of a mixed signal microcontroller in one embodiment;
FIG. 5 is a fourth schematic block diagram of a mixed signal microcontroller in one embodiment;
FIG. 6 is a schematic diagram of the electrical connections of the mixed signal microcontroller in one embodiment;
FIG. 7 is a schematic diagram of the dimensions of a mixed signal microcontroller in one embodiment; fig. 7(a) is a schematic view of a first viewing angle, fig. 7(b) is a schematic view of a partial detail, and fig. 7(c) is a schematic view of a second viewing angle.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
At present, two schemes are generally adopted in the industry for acquisition and application of low-speed high-precision signal data. The first method is to select a high-precision ADC chip to be combined with a microcontroller chip and carry out electrical connection based on a PCB level; that is, a high-precision ADC chip, a microcontroller chip, and some other peripheral components are mounted on the PCB. For the design and manufacture, the use condition of the core chip is clear at a glance without any technical protection measures, the occupied area of the chip is large, the discrete devices are all attached to the surface of the PCB, the moisture-proof and moisture-proof functions are weak, and the abnormal work is easy to occur. In the era of the internet of things, the volume requirement on a data acquisition end is more and more strict, the smaller the occupied area of components is, the better the requirements are, in addition, the ADC chip and the microprocessor chip come from different manufacturers, in the using process, a user needs to develop a driving program suitable for the self requirement and design a set of ADC chip calibration method, and the operation is complex. The other is to design a mixed signal integrated circuit, design an analog IP core and a digital IP core in a chip, and finally manufacture a mixed signal controller through a tape-out. However, such designs are expensive, and the final finished chip is expensive and cannot accept custom software and hardware.
Therefore, the embodiment of the application adopts a semiconductor packaging technology, and the wafer bare chip of the high-precision analog-digital converter and the wafer bare chip of the microcontroller are integrated in a packaging body to form a mixed signal microcontroller so as to realize a high-precision data acquisition system. In particular, the embodiment of the application can be applied to the application environment as shown in fig. 1. The mixed signal microcontroller is an independent device, has the advantages of shock resistance, moisture resistance, falling resistance, high temperature resistance, secret technology and the like, has convenient and efficient mounting property, and is small in occupied area and low in cost.
In one embodiment, there is provided a mixed signal microcontroller, as shown in fig. 2, comprising:
the packaging body is provided with a surface mounting surface for surface mounting, and the edge of the surface mounting surface is provided with a packaging pin.
The first wafer bare chip is arranged in the packaging body, is stacked on the mounting surface and is electrically connected with the packaging pins through the bonding wire.
And the second wafer bare chip is arranged in the packaging body, is stacked on the first wafer bare chip and is electrically connected with the packaging pins and the first wafer bare chip through bonding wires respectively.
The first wafer bare chip is a microcontroller bare chip, and the second wafer bare chip is an analog-to-digital converter bare chip; alternatively, the first wafer die is an analog-to-digital converter die and the second wafer die is a microcontroller die.
Specifically, the mixed signal microcontroller comprises a packaging body, and a first wafer bare chip and a second wafer bare chip which are arranged in the packaging body. The package body is provided with a mounting surface for surface mounting of the device, for example, the mixed signal microcontroller is mounted on the PCB board by using a surface mounting technology based on the mounting surface. The mounting surface, the first wafer bare chip and the second wafer bare chip are stacked in sequence to form a laminated structure, so that the occupied area can be effectively reduced. The first wafer die and the second wafer die are electrically connected through a bonding wire, namely, signal transmission can be carried out between the two wafer dies. Meanwhile, the first wafer bare chip is electrically connected with the packaging pins through the bonding wire, and based on the structure, the first wafer bare chip can perform signal transmission with the outside through the packaging pins; the second wafer bare chip is electrically connected with the packaging pins through the bonding wires, and based on the structure, the second wafer bare chip can perform signal transmission with the outside through the packaging pins.
The package is used to package a wafer die, a bonding wire, and the like. The package body is usually a flat cuboid or a rectangular frustum structure, and the mounting surface is usually a rectangular surface with the largest area, which is not limited herein. Alternatively, the package may be a ceramic package, a plastic package, a glass package, or the like, which is not particularly limited herein. The mounting surface is usually a plane, which is convenient for the package to be mounted on the application board surface. It should be noted that the size of the package, the package specification, and other structural parameters may be customized according to the application of the device, the function and the model of the die actually selected, and the like, and are not limited herein.
The packaging pins are used for realizing the electrical connection and signal transmission between the wafer bare chip inside the packaging body and an external device; specifically, the package pins are arranged at the edge of the package body, so that the package pins are conveniently connected with external bonding pads; it should be noted that the package pins may be either an electrode contact structure embedded in the package (e.g., stepped electrode contacts formed at the edge of the package) or a lead structure extending outside the package (e.g., gull-wing leads), both of which may be used to make electrical connections to external pads.
The wafer bare chip can be thinned and cut, and specifically, the thickness and the shape of the wafer bare chip can be set correspondingly according to the type of the selected chip and the packaging specification. The size of the first wafer die may be larger than the size of the second wafer die, i.e., the area of the first wafer die is larger than the area of the second wafer die. The larger size first wafer die may serve as a circuit interconnect carrier with the second wafer die stacked on the first wafer die. That is, when the size of the microcontroller bare chip is larger than that of the analog-to-digital converter bare chip, the first wafer bare chip is the microcontroller bare chip, and the second wafer bare chip is the analog-to-digital converter bare chip; when the size of the analog-to-digital converter bare chip is larger than that of the microcontroller bare chip, the first wafer bare chip is the analog-to-digital converter bare chip, and the second wafer bare chip is the microcontroller bare chip. The micro-controller bare chip, the analog-to-digital converter bare chip and the packaging pins are matched, so that the acquisition and processing of external low-speed high-precision signals can be realized. It should be noted that the bare chip inside the package body can be selected according to the requirement, and the corresponding manufacturer and model can be selected to support the hardware customization function; in addition, after the bare chip is packaged, parameters such as the model and the specification of the chip cannot be exposed easily, and the security of the device to hardware is improved.
In the implementation of the application, a wafer bare chip of a microcontroller and a wafer bare chip of an analog-to-digital converter are selected in a packaging body of a device, the wafer bare chips are electrically connected through a bonding wire, and required pins are electrically connected with packaging pins on the packaging body to form an independent device packaging product. Compared with a data acquisition system formed by combining a microcontroller chip and a high-precision analog-to-digital converter chip, the wafer bare chip is adopted to replace the packaged chip in the embodiment of the application, the occupied area and the volume are greatly reduced, the laminated structure is adopted, the occupied area of the device is further reduced, the application to a data acquisition end with strict requirements on the circuit volume is facilitated, the performance-price ratio of the obtained device package is high, and the competitiveness is high. In addition, the embodiment of the application can be directly attached to a system mounting plate through Surface Mount Technology (SMT), and the use is convenient.
In addition, the embodiment of the application can support hardware customization and software customization, can select different packaging specifications according to the functions and application occasions of bare chips, and is suitable for various application occasions; and the integration degree of the device is high, and compared with a system with discrete components, the stability is higher and the anti-interference capability is strong. Meanwhile, the device package can protect the design scheme and material brand type of internal use, greatly protect the autonomous technical scheme and enhance the competitive advantage.
Further, based on the above structure, the microcontroller die may be configured with a compiling library, and the compiling library includes driving data of transmission standards, calling standards, and the like of various analog-to-digital converters. The micro-controller bare chip can call corresponding standards to transmit and control signals of the analog-to-digital converter according to the manufacturer or the model of the analog-to-digital converter, thereby realizing the universality of the device, meeting the requirement of hardware customization, being convenient for users to use, and compared with the traditional technology, the users do not need to develop a driving program or a calibration method and the like by themselves. It should be noted that the driving data in the compiled library may be existing device driving data, and is not limited herein. The embodiment of the application can be realized based on the SIP (System In a Package) technology, an integrated circuit is not required to be designed, the cost of designing the integrated circuit and the cost of designing the tape-out can be saved, and the cost can be effectively reduced.
In one embodiment, as shown in fig. 3, the mounting surface is provided with heat-dissipating pads; a first wafer die is stacked on the thermal pad.
Specifically, the mounting surface of the package body is further provided with a heat dissipation pad, that is, the heat dissipation pad is arranged on the outer surface of the package body and can be stacked under the first wafer die to form a stacked structure with the first wafer die and the second wafer die. The heat dissipation welding disk can be used for being welded on an application board of a system, and can also be used for conducting heat generated by devices inside a packaging body, such as a wafer bare chip, to the application board, so that the junction temperature of the bare chip inside is reduced, and the reliability of a circuit is improved. It should be noted that the heat sink pad may be circuit ground and electrically isolated from the package pins; in addition, the radiating welding disk is welded on the system application board, so that the impedance of the ground can be reduced, and the noise interference of the data acquisition system based on the packaging body can be reduced.
In one embodiment, as shown in fig. 4, the package further includes a substrate; the substrate is arranged in the packaging body and is stacked between the mounting surface and the first wafer bare chip.
Specifically, the package may further include a substrate for carrying the wafer die, which may be used to increase the stability of the internal components of the package. Specifically, a first wafer die is stacked on one side of a substrate and a heat sink pad is stacked on the other side of the substrate.
In one embodiment, as shown in fig. 5, a package pin includes:
and the digital power supply pin group is electrically connected with the micro-controller bare chip through the bonding wire.
And the analog power supply pin group is electrically connected with the analog-to-digital converter bare chip through a bonding wire.
Specifically, in a package pin of the mixed signal microcontroller, a digital power supply pin group and an analog power supply pin group may be included. The digital power supply pin group is electrically connected with corresponding pins (such as power supply pins) on the microcontroller bare chip through the bonding wire, and an external digital power supply can be led into the microcontroller bare chip to supply power to the bare chip; the analog power pin group is electrically connected with a corresponding pin (such as a power pin) on the analog-to-digital converter bare chip through a bonding wire, and external analog power can be led into the analog-to-digital converter bare chip to supply power to the bare chip. Based on the structure, the analog power supply and the digital power supply of the embodiment of the application are independent in the packaging body, so that the problem of signal interference can be solved, and the high-precision analog-to-digital converter can exert the best performance.
It should be noted that the pin group mentioned in the embodiment of the present application may include at least one pin, and the specific number of the pins may be set according to actual functions and requirements, which is not specifically limited herein; similarly, the number of pins included in the package pins may also be set according to the actual application scenario of the device, which is not limited herein.
In one embodiment, as shown in fig. 6, the package pin includes: the analog signal input pin set is electrically connected with the analog-to-digital converter bare chip through a bonding wire.
Specifically, in a package pin of the mixed signal microcontroller, an analog signal input pin group may be further included. The pin group is electrically connected with corresponding pins (such as data acquisition pins) on the analog-to-digital converter bare chip through bonding wires, provides an analog signal transmission channel for the bare chip, and transmits analog signals between the analog-to-digital converter bare chip and the outside. Based on the structure, the device can conveniently acquire low-speed and high-precision signals.
In one embodiment, as shown in fig. 6, the package pin includes: the special pin group is electrically connected with the micro-controller bare chip through a bonding wire; the dedicated set of pins includes a clock signal pin and/or a reset pin. Each of the pins may be electrically connected to the microcontroller die by a bonding wire.
Specifically, in a package pin of the mixed signal microcontroller, a special pin group can be further included; the dedicated pins are pins different from the ordinary input/output IO ports and having unique functions, such as external crystal clock source input pins, reset pins, and the like. The pin group is electrically connected with corresponding pins (such as a clock pin, a reset pin and the like) on the microcontroller bare chip through a bonding wire, a special signal transmission channel is provided for the bare chip, and special signal transmission between the microcontroller bare chip and the outside is carried out. Based on this structure, the device can be easily subjected to external calibration, control, and the like.
In one embodiment, as shown in fig. 6, the package pin includes: and the general IO pin group is electrically connected with the micro-controller bare chip through a bonding wire.
Specifically, in a package pin of the mixed signal microcontroller, a general IO pin group may also be included. The pin group is electrically connected with corresponding pins (such as general IO pins) on the microcontroller bare chip through bonding wires, an IO signal transmission channel is provided for the bare chip, and IO signal transmission between the microcontroller bare chip and the outside is carried out. Based on the structure, the device can conveniently expand the interface and the function, and the application of the device is enriched.
In one embodiment, as shown in fig. 6, the package pin includes: the peripheral interface pin group is electrically connected with the micro-controller bare chip through a bonding wire; the peripheral interface pin group comprises any one or any combination of the following pins: an I2C (Inter-Integrated Circuit) pin, a UART (Universal Asynchronous Receiver/Transmitter) pin, a PWM (Pulse Width Modulation) pin, and a control pin. Each of the pins may be electrically connected to the microcontroller die by a bonding wire.
Specifically, in a package pin of the mixed signal microcontroller, a peripheral interface pin group may be further included. The pin group is electrically connected with corresponding pins (such as a signal acquisition pin, a signal output pin and the like) on the microcontroller bare chip through a bonding wire, provides a peripheral interface signal transmission channel for the bare chip and transmits signals between the microcontroller bare chip and a peripheral interface. Wherein the peripheral interface type may include at least one of an I2C interface, a UART interface, a PWM interface, and a control interface.
In one embodiment, the package is a QFN package (Quad Flat No-lead Package).
Specifically, the mixed signal microcontroller can be a QFN package, the package pins are in an electrode contact structure, and the package type has the advantages of small occupied area, low height and excellent electrical performance and heat dissipation performance. Alternatively, the package may be a QFN20 package, a QFN32 package, a QFN40 package, or the like, and is not limited herein.
The Package body may also be another Package type such as a QFP (Flat Package, square Flat Package technology) Package, and the corresponding Package type may be selected according to application requirements.
In one embodiment, as shown in FIG. 7, the mixed signal microcontroller is a standard QFN32 package. The pin number of the packaging pin is 32, the bottom of the packaging body is provided with a heat dissipation pad, and the other parts of the QFN32 packaging device are encapsulated by the plastic package except the pin and the heat dissipation pad are exposed. The dimension numbers and corresponding values in fig. 7 can be shown in table 1.
Specifically, a micro-controller bare chip and a high-precision analog-to-digital converter bare chip are selected, the bare chips with larger sizes are used as circuit interconnection carriers, electrical connection of communication ports between the bare chips is carried out through bonding (bare chip routing and bonding), then required pins are connected with package pins, and finally the bare chips are packaged by black colloid to obtain a finished product of mixed signal micro-controller chip. The independent device package is an integrated circuit chip, is represented as QFN32 package, can be directly attached to a system mounting plate through SMT, and is convenient to use. The device packaging product has the advantages of low cost, small size and area, small occupied area, high device confidentiality, high integration degree, high stability, strong anti-interference performance and the like, supports hardware customization, software customization and specification customization, and is suitable for various application occasions.
TABLE 1
In one embodiment, there is provided an apparatus comprising a system application board, and a mixed signal microcontroller as described above; the mixed signal microcontroller is mounted on the system application board.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.
Claims (10)
1. A mixed signal microcontroller, comprising:
the packaging structure comprises a packaging body and a packaging body, wherein the packaging body is provided with a mounting surface for surface mounting, and a packaging pin is arranged at the edge of the mounting surface;
the first wafer bare chip is arranged in the packaging body, stacked on the mounting surface and electrically connected with the packaging pins through bonding wires;
the second wafer bare chip is arranged in the packaging body, stacked on the first wafer bare chip and electrically connected with the packaging pins and the first wafer bare chip through bonding wires respectively;
wherein the first wafer die is a microcontroller die and the second wafer die is an analog-to-digital converter die; or, the first wafer die is an analog-to-digital converter die, and the second wafer die is a microcontroller die.
2. The mixed signal microcontroller of claim 1 wherein the mounting face is provided with heat sink pads; the first wafer die is stacked on the thermal spreading pad.
3. The mixed signal microcontroller of claim 2 wherein the package further comprises a substrate;
the substrate is laminated between the thermal spreading pad and the first wafer die.
4. The mixed signal microcontroller of claim 1 wherein the package pins comprise:
a set of digital power supply pins electrically connected to the microcontroller die by a bonding wire;
and the analog power supply pin group is electrically connected with the analog-to-digital converter bare chip through a bonding wire.
5. The mixed signal microcontroller of claim 1 wherein the package pins comprise:
an analog signal input pin set is electrically connected to the analog-to-digital converter die by a bonding wire.
6. The mixed signal microcontroller of claim 1 wherein the package pins comprise:
a dedicated set of pins electrically connected with the microcontroller die by bonding wires; the dedicated set of pins includes a clock signal pin and/or a reset pin.
7. The mixed signal microcontroller of claim 1 wherein the package pins comprise:
a general IO pin set electrically connected with the microcontroller die by a bonding wire.
8. The mixed signal microcontroller of claim 1 wherein the package pins comprise:
a set of peripheral interface pins electrically connected to the microcontroller die by a bonding wire; the peripheral interface pin group comprises any one or any combination of the following pins: an I2C pin, a UART pin, a PWM pin, and a control pin.
9. The mixed signal microcontroller according to any one of claims 1 through 8, wherein the package is a QFN package.
10. An apparatus comprising a system application board, and a mixed signal microcontroller as claimed in any one of claims 1 to 9;
the mixed signal microcontroller is attached to the system application board.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190051A (en) * | 2019-05-29 | 2019-08-30 | 广州致远电子有限公司 | Mixed signal microcontroller, equipment and preparation method |
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2019
- 2019-05-29 CN CN201920798503.6U patent/CN209929305U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190051A (en) * | 2019-05-29 | 2019-08-30 | 广州致远电子有限公司 | Mixed signal microcontroller, equipment and preparation method |
| CN110190051B (en) * | 2019-05-29 | 2021-03-19 | 广州致远电子有限公司 | Mixed signal microcontroller, equipment and preparation method |
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Address after: 510000 room 306, 3rd floor, 43 Sicheng Road, software park, Tianhe District, Guangzhou City, Guangdong Province Patentee after: GUANGZHOU ZHIYUAN ELECTRONICS Co.,Ltd. Address before: 510665 room 517, 1023 Gaopu Road, Tianhe Software Park, Tianhe District, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU ZHIYUAN ELECTRONICS Co.,Ltd. |