CN213280233U

CN213280233U - Chipless conductive assembly

Info

Publication number: CN213280233U
Application number: CN202022132702.9U
Authority: CN
Inventors: 连世雄
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2021-05-25
Anticipated expiration: 2030-09-25

Abstract

The utility model discloses a no chip's conductive component, it includes: a substrate, wherein a conductive circuit layer is distributed in the substrate; the sealing adhesive layer completely or partially covers the substrate; wherein, there is not a chip in the substrate and the sealing glue layer. Therefore, the utility model discloses can combine to carry out the effect that the circuit switched on a circuit board, even do not have the chip and still enable the electric signal and can transmit, and then reach reduce cost's efficiency.

Description

Chipless conductive assembly

Technical Field

The utility model relates to a conductive component, especially a conductive component who does not have chip.

Background

With the development of technology, the variety of electronic devices and products is increasing, however, in order to make these electronic devices and products have more functions and performances, it is indispensable to upgrade the chip as the core of data processing and operation.

However, if the chip is not needed, only the electrical signal is transmitted, but the electronic component with the chip is still used, which not only causes waste, but also increases the cost.

Therefore, in summary, the inventors of the present invention have been diligent in research and thinking for many years and have designed a chipless conductive element to improve the technical deficiencies in the art and further enhance the industrial application.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a conductive assembly without a chip, which is capable of conducting a circuit on a circuit board without a chip, thereby reducing the cost.

Therefore, to achieve the above object, the present invention provides a chipless conductive assembly, comprising: a substrate, wherein a conductive circuit layer is distributed in the substrate; the sealing adhesive layer completely or partially covers the substrate; wherein, there is not a chip in the substrate and the sealing glue layer.

The chipless conductive assembly as described above, wherein the substrate is further connected to at least one connection element.

The chipless conductive element as described above, wherein the Package of the chipless conductive element includes a Ball Grid Array (BGA) series, a Small Outline Package (SOP) series, a Small Outline J-lead Package (SOJ) series, a Plastic Leaded Chip Carrier (PLCC) series, a Plastic peripheral Flat Package (PQFP) series, or a Quad Flat Non-lead Package (QFN) series.

The chipless conductive assembly as described above, wherein the encapsulant layer is a resin.

In summary, the utility model is not only innovative in space form, but also can increase the above-mentioned multiple functions compared with common articles.

Drawings

Fig. 1 is a first cross-sectional view of a chipless conductive assembly of the present invention.

Fig. 2 is a second schematic cross-sectional view of a chipless conductive assembly of the present invention.

Description of the reference numerals

10 chipless conductive assembly

11 substrate

111 conductive line layer

12 sealant layer

13 connecting piece

Detailed Description

The following describes an embodiment of the present invention with reference to fig. 1 and 2. The description is not intended to limit the embodiments of the present invention, but is one of the embodiments of the present invention, and in the drawings and the examples, the same or similar reference numbers refer to the same, substantially the same, or functionally the same parts and assemblies throughout the drawings. The drawings are in a simplified form and, in all embodiments, are not drawn to precise scale.

Referring first to fig. 1, the present invention is a chipless conductive assembly 10, comprising: a substrate 11, wherein a conductive circuit layer 111 is disposed in the substrate 11; and a sealant layer 12, wherein the sealant layer 12 completely or partially covers the substrate 11; wherein there is no chip between the substrate 11 and the sealing compound layer 12. In addition, the sealing compound layer 12 is a resin. Therefore, when the functions and performances of the electronic device and the product do not need to be improved, the conductive component 10 can be combined with a circuit board (not shown) to conduct the circuit, so that the electric signal can be transmitted even if the chip is not available, and the effect of reducing the cost is achieved.

However, the substrate 11 is also connected to at least one connector 13, such that the conductive element 10 can be bonded to the circuit board, for example, as shown in FIG. 1, the connector 13 is a Ball Grid Array (BGA) connector; in addition, the Package of the conductive element 10 includes not only Ball Grid Array (BGA) series as shown in fig. 1, but also Small Outline Package (SOP) series as shown in fig. 2, or other Small Outline J-lead Package (SOJ) series not shown in the drawings, Plastic Leaded Chip Carrier (PLCC) series, Plastic Quad Flat Package (PQFP) series, or Quad Flat Non-lead Package (QFN) series.

The event the utility model provides a no chip's conductive component combines to carry out the effect that the circuit switched on a circuit board through this conductive component, even do not have the chip still to enable the electric signal and can transmit, and then reach reduce cost's efficiency.

The above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made in the claims and the description of the present invention are still included in the scope of the present invention.

Claims

1. A chipless conductive assembly, comprising:

a substrate, wherein a conductive circuit layer is distributed in the substrate; and

a sealing adhesive layer, which completely or partially covers the substrate;

wherein, there is not a chip in the substrate and the sealing glue layer.

2. The chipless conductive assembly of claim 1 wherein the substrate is further connected to at least one connection element.

3. The chipless conductive element of claim 2, wherein the package of the chipless conductive element comprises one of a ball grid array package family, a low profile J-lead package family, a plastic leaded chip carrier package family, a plastic quad flat no-lead package family or a quad flat no-lead package family.

4. The chipless conductive assembly of any one of claims 1 to 3, wherein the encapsulant layer is a resin.