M291082 18262twf.doc/y 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種晶圓承載裝置，且特別是有關於 可以有效地固定晶圓的一種晶圓承載裝置與前開式晶圓 盒。 【先前技術】M291082 18262twf.doc/y VIII. New Description: [New Technology Field] This creation is related to a wafer carrier, and in particular to a wafer carrier and front opening crystal that can effectively fix the wafer. Round box. [Prior Art]
隨著積體電路之半導體元件的積集度日益增加，相對 的製程的準確度就顯得格外重要。因此，一旦晶圓在製程 中受到損害而產生微粒(particle)，不但晶圓本身無法繼續 使用而報廢，另外，晶圓所產生的微粒也可能對機台造成 污染，影響後續所生產的晶圓，造成後續製程的失敗，因 向耗賈大夏生產成本。此外，假如用來放置晶圓的承載裝 置無法有效地將位於其中的晶圓固定住，則晶圓在承載裝 置中便可能因為碰撞而生微粒或受到損害。 圖上為依照本創作實施例所繪示的一種晶圓承載裝置 的承載箱之剖面示意圖。請參照圖i，—般的晶圓 置包括承载箱100、蓋板106與固定器108。承載箱100 内部設置有相互平行之凹槽⑽，凹槽1()2可以容置 104。盍板106可以伴罐灸# ^ 日日、 哭]08斯要认—，？载相 内部之晶圓104。固定 时108配置於盍板1〇6上。一 槽102中，ifm 瓜來况，將曰曰固104至入凹 哭⑽ρ 、Ί板蓋上後，利用蓋板1〇6上的固定 為108即可將置於 ^口疋 的誤差，造成中，往往會陶^ 一 102的沬度過深，如圖丨中位於區 5 M291082 18262twf.doc/y 域109的凹槽102,使得晶圓承載裝置的蓋板1〇6蓋上後， 位於固定器108無法有效地將位於區域1〇9的晶圓固 定住，以致於晶圓104在傳送的過程中容易受到損害而產 生微粒，並對機台及後續製程產生影響。 【新型内容】 3 效地=目的就是在提供-種晶圓承載裝置，可以有 載箱内部設置有一f反、一固定器與一墊片。承 置多數個晶圓，平订之夕數個凹槽，這些凹槽適於容 出。蓋柄I ’且承載箱具有一個開口可供晶圓置入或移 晶圓。固定if卸地連接承载箱，適於保護承载箱内部之 器之間，使；八己置於蓋板之一面。墊片配置於蓋板與固定 —。 。刀固定器㈣，以固定上述晶圓至少其甲之 依照本a 部分固定器^^施例所述之晶圓承载裝置，上述之突起 依照本對於具有深度較深之凹槽。 的中間部分述之晶㈣载裝置，上述之墊片 本剑作另沪 刀 括一盒體、〜^出―種前開式晶圓盒，此前開式晶圓盒包 相^行之多數二槽固盒體内部設置有 且盒體之侧面I 一 9 14二於容置多數個晶圓， 於盒體之侧面：、:：開口可供晶圓置入或移出。門板配置 口疋魏置於門板之内侧。固定器包括框 6 M291082 18262twf.doc/y 架以及配置純架之相對二#]且與凹槽相職的多數個固 定桿。墊片配置於門板與框架之間，使部分閘狀固定器突 起，以固定上述晶圓至少其中之一。 口° 依照本創作實施例所述之前開式晶圓盒，上述之突起 的部分閘狀固定器例如是相對於具有深度較深之凹槽。 依照本創作實施例所述之前開式晶圓盒，上述之墊片 的長度例如介於7.8公分〜9.8公分之間。 依照本創作實施例所述之前開式晶圓盒，上述之墊片 的寬度例如介於2.1公分〜4.1公分之間。 依照本創作實施例所述之前開式晶圓盒，上述之墊片 的中間部分例如高於其他部分。 依，本創作實施例所述之前開式晶圓盒，上述之中間 部分的高度例如大於〇·5公分。 ，照本創作實施例所述之前開式晶圓盒，上述之墊片 的材質例如為聚碳酸酯與碳或硬塑膠。 依照本創作實施例所述之前開式晶圓盒，上述之墊片 的阻值例如介於1〇5歐姆〜1〇9歐姆之間。 依照本創作實施例所述之前開式晶圓盒，上述之墊片 可承受的溫度例如介M8(rc〜12(rc之間。 依照本創作實施例所述之前開式晶圓盒，上述之墊片 例如不具有彈性且不會產生微粒。 依照本創作實施例所述之前開式晶圓盒，上述之墊片 的配置方式例如為卡置或黏合。 依照本創作實施例所述之前開式晶圓盒，上述之固定 7 M291082 18262twf.doc/y 器的材質例如為聚碳酸醋邀 硬塑膠。 ~厌或可耐熱且不會產生微粒的 基於上述，本創作在利用曰 盒裝置晶圓時，於固定器鱼芸曰曰圓承载裝置或前開式晶圓 部分固定器突起，以固；位二ί:’板之間配置墊片，使 深之凹槽中的晶圓。因此， 果/、块差而製作出深度較 、， 在晶圓的運译讲名口 Τ+7 1 善晶圓位於深度較深的凹槽中而益固二/以改 受到損害。 〜有效固&而因碰撞產生微粒或 為讓補狀均㈣他目自 易憧，下文特舉較佳實施例，# 不1炎占此更明頰 明如下。 、_聽合所附圖式，作詳細說 【實施方式】 圖2Α為依照本創作實施例所綠示的一種 置的承載箱之剖面示意圖。圖2Β Α 曰曰口 ？載衣 绔示的一德壯，S B為依恥本創作實施例所 :一立=胃7(載衣置之具有深度較深之凹槽區域之剖 時參照圖2A與圖2B，晶圓承載裝置包」 it =、固定器208與墊片2ω。承載箱· 内^置有相互平行之凹槽202a與鳥。凹槽孤盘 曰。b適於容置晶圓2〇4，且承載箱2〇〇具有開口 2⑽可將 曰^圓204置入或移出。在本實施例中，位於區域2〇9的凹 槽202b的深度例如大於凹槽2〇2a的深度，因而使得位於 ^域209的晶圓204的高度低於位於凹槽2〇2a中的晶圓 M291082 18262twf.d〇c/y /風板2⑽可拆卸地連接承載箱200。蓋板206適於保 瘦承载箱200内部之晶圓2〇4◦固定器2〇8配置於蓋板2〇6 之面，以於蓋板206蓋上時將晶圓2〇4固定住。墊片21〇 配，於蓋板206與固定器2〇8之間，配置方式例如是卡置 或‘ s ’且墊片21〇的中間部分例如是高於其他部分，以 f 口卩刀固定為208突起，其中突起的部分固定器208例如 是相對於具有深度較深之凹槽202b，也就是相對於區域 • 2〇9。因此，位於區域209的晶圓204便可以被有效地固定 住。 值得一提的是，上述之墊片亦可應用於一般熟知的前 開式晶圓盒(front opening unified pod，FOUP)。 圖3A為依照本創作實施例所繪示的一種前開式晶圓 孟的孟體之剖面示意圖。圖3B為依照本創作實施例所繪 示的一種承載前開式晶圓盒的門板之前視示意圖。請同時 參照圖3A與圖3B，前開式晶圓盒包括盒體3〇〇、門板306、 _ 固定器308、與墊片310。盒體300内部設置有相互平行之 凹槽302a與302b，凹槽302a與302b適於容置晶圓304。 且盒體300之一側面具有開口 307可供晶圓304置入或移 出。在本實施例中，位於區域309的凹槽302b的深度例如 大於凹槽302a的深度。 門板306配置於盒體300之侧面，適於保護盒體3〇〇 内部之晶圓304。當門板306開啟時，使得晶圓304能夠 從盒體300的開口 307置入凹槽302a與302b中。固定器 3〇8配置於該門板306之内側。固定器308的材質例如為 M291082 18262twf.doc/y 聚碳酸酯與碳或可耐熱且不會產生微粒的硬塑膠，其可承 X的w於80 C〜120 C。固定器308包括框架308a與 固定桿308b。固定桿308b配置於框架308a之相對二侧且 與凹槽302a與302b相對應。當晶圓304放置於凹槽302a 與302b中後，將門板306關上，此時分別相對應於凹槽 302a的每一根固定桿3〇8a便可以將位於凹槽3〇2a的晶圓 304固定住。此外，墊片31〇配置於門板3〇6與框架3〇8a 之間，使部分閘狀固定器308突起，其中突起的部分閘狀 固定器308例如是相對於具有深度較深之凹槽3〇2b，即區 域309。圖3C為依照本創作實施例所纟會示的一種前開式晶 圓盒之具有深度較深之凹槽區域之剖面示意圖。請參照圖 3C ’當將門板306關上後，由於墊片310配置於門板306 與框架308a之間而使得相對於區域309的框架308a突 起，以及使得位於此部分框架308a二侧的固定桿308b較 其他的固定桿308b突起例如〇·8毫米〜ι·2毫米，進而使 得位於凹槽302b的晶圓304可以被突起的固定桿308b有 效地固定住。 在本實施例中，墊片310配置於門板306與框架308a 之間的方式例如是卡置或黏合，而墊片310長度例如是介 於7·8公分〜9.8公分之間，寬度例如是介於2.1公分〜4.j 公分之間。此外，墊片31〇的中間部分例如是高於其他部 刀，中間部分的尚度例如是大於5公分。另外，墊片31 〇 的材質例如是聚碳酸酯與碳或硬塑膠，阻值例如是介於 105歐姆〜1〇9歐姆之間，可承受的溫度例如是介於8〇Qc 10 M291082 18262twf.doc/y 〜not之間，且㈣31Q本身不具有彈性，以碟保墊片 3H)可以將固定器3〇8撐起。此外，墊片3ι〇本身也不奋 產生微粒，以避免污染晶圓304。 曰 述，在本齡之本創作於晶圓承載裝置或前開 式曰日圓益的固定器與蓋板或門板之間配置墊片，以使部八 固定器突起，可以使固定器有效地將位於因模呈等差= :出深度較深之凹槽中的晶圓。因此，在晶圓的運送過ς =，位於深度較深之凹槽中的晶圓由於被突起的固定器固 疋住:避免了晶圓因碰撞而產生微粒或受到損害的問題。 π定創作已以較佳實施例揭露如上，然其並非用以 =丄任何熟爾藝者’在不脫離本創作之精神 ^耗圍内，當可作些許之更動麵飾，因此本創作中 耗圍當視後附之申請專利範圍所界定者為 ’、叹 【圖式簡單說明】 參 之剖聊乍實施例崎示的-種晶圓承載裝置 圖2Α為依照本創作實施例 置的承载箱之剖面示意圖。 種日日®承载裝 置之f右2Β^依照本創作實施例所繪示的-種晶圓承載裝 一、有淥度較深之凹槽區域之剖面示意圖。 盒之矛圖意3Α圖為依照本創作實施例崎示的—種前開式晶圓 圖3Β為依照本創作實施例 7 晶圓盒的門板之前視示意圖。曰不的一種承载前開式 M291082 18262twf.doc/y 圖3C為依照本創作實施例所繪示的一種前開式晶圓 盒之具有深度較深之凹槽區域之剖面示意圖。 【主要元件符號說明】 100、200 :承載箱 102、202a、202b、302a、302b :凹槽 104、204、304 :晶圓 106、206 :蓋板 108、 208、308 ··固定器 109、 209、309 :區域 207、307 :開口 210、310 :墊片 300 :盒體 306 :門板 308a :框架 308b :固定桿As the integration of semiconductor components of integrated circuits increases, the relative accuracy of the process is particularly important. Therefore, once the wafer is damaged in the process and particles are generated, not only the wafer itself cannot be used for use, but also the particles generated by the wafer may contaminate the machine and affect the subsequent wafers. , causing the failure of the subsequent process, due to the cost of production. In addition, if the carrier for placing the wafer cannot effectively hold the wafer located therein, the wafer may be damaged or damaged by the collision in the carrier. The figure shows a schematic cross-sectional view of a carrying case of a wafer carrying device according to the present embodiment. Referring to FIG. 1, the general wafer assembly includes a carrying case 100, a cover 106, and a holder 108. The inside of the carrying case 100 is provided with grooves (10) parallel to each other, and the groove 1 () 2 can accommodate 104. Seesaw 106 can be accompanied by cans of moxibustion # ^ 日日, 哭] 08 ́s to recognize -,? Wafer 104 inside the carrier. The fixed time 108 is disposed on the seesaw 1〇6. In a slot 102, the ifm melon condition will be tamped 104 to the concave crying (10) ρ, the slab cover, and the fixing on the cover 1 〇 6 is 108, which can be placed in the 疋 疋 error, resulting in In the middle, it is often too deep, such as the groove 102 in the area 5 M291082 18262twf.doc/y field 109, so that the cover plate 1〇6 of the wafer carrier is covered, The holder 108 is incapable of effectively holding the wafers located in the area 1〇9 so that the wafer 104 is easily damaged during the transfer to generate particles and affect the machine and subsequent processes. [New content] 3 Effectiveness = The purpose is to provide a wafer carrier device, which can be provided with a f-inverter, a holder and a gasket inside the carrier. A plurality of wafers are placed, and a plurality of grooves are formed on the evening, which are suitable for receiving. The handle I ’ and the carrying case have an opening for the wafer to be placed or moved. The fixed if unloading connection to the carrying case is adapted to protect the inside of the carrying case so that the eight is placed on one side of the cover. The gasket is placed on the cover and fixed. . The knife holder (4) is for fixing the wafer to at least one of the wafer carriers according to the embodiment of the present invention, and the protrusion is according to the groove having a deeper depth. In the middle part of the description of the crystal (four) carrier device, the above-mentioned gasket, the sword is made of another box, a box, a ^ front out type of open wafer box, the previous open wafer box package The inside of the slotted box body is disposed and the side of the box body is arranged to accommodate a plurality of wafers on the side of the box body::: The opening is for inserting or removing the wafer. Door panel configuration The port is placed on the inside of the door panel. The holder consists of a frame 6 M291082 18262twf.doc/y frame and a plurality of fixed rods that are configured to be opposite to the groove. The gasket is disposed between the door panel and the frame to cause a portion of the gate retainer to protrude to fix at least one of the wafers. According to the previously opened wafer cassette of the present embodiment, the above-mentioned protruding partial gate holder is, for example, opposed to a groove having a deep depth. According to the previously opened wafer cassette of the present embodiment, the length of the spacer is, for example, between 7.8 cm and 9.8 cm. According to the prior open wafer cassette of the present embodiment, the width of the spacer is, for example, between 2.1 cm and 4.1 cm. According to the previously opened wafer cassette of the present embodiment, the intermediate portion of the above-mentioned spacer is, for example, higher than the other portions. According to the previously opened wafer cassette of the present embodiment, the height of the intermediate portion is, for example, greater than 〇·5 cm. According to the prior open wafer cassette of the present embodiment, the material of the gasket is, for example, polycarbonate and carbon or hard plastic. According to the prior open wafer cassette of the present embodiment, the resistance of the spacer is, for example, between 1 〇 5 ohms and 1 〇 9 ohms. According to the prior open wafer cassette of the present embodiment, the temperature that the gasket can withstand is, for example, M8 (rc~12). Before the open wafer cassette according to the present creative embodiment, the above The spacer is, for example, not elastic and does not generate particles. According to the prior open wafer cassette of the present embodiment, the spacer is disposed, for example, by snapping or bonding. The wafer cassette, the above-mentioned fixed 7 M291082 18262twf.doc/y material is, for example, a polycarbonate plastic hard plastic. ~ Annoying or heat-resistant and does not generate particles based on the above, this creation is using a wafer device wafer , in the holder of the fish ball round bearing device or the front opening wafer part of the holder protrusion, to fix the position; the spacer is placed between the plates to make the wafer in the deep groove. Therefore, The block is made to have a deeper depth, and the wafer is translated into a well-known port Τ+7 1 The good wafer is located in a deeper depth groove and is benefited from damage. ～ Effective solid & Produce particles due to collision or to make the complement (4) DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The preferred embodiment of the present invention is as follows: Schematic diagram of the carrying case. Figure 2Β 曰曰 曰曰 ? 载 载 载 载 载 载 载 载 载 载 , , , , , , , SB SB SB SB SB SB SB SB SB SB SB SB SB SB SB SB SB 依 依 胃 胃 胃 胃 胃 胃 胃Referring to FIG. 2A and FIG. 2B, the wafer carrying device package "it", the holder 208 and the spacer 2ω. The carrying case is provided with mutually parallel grooves 202a and birds. It is suitable for accommodating the wafer 2〇4, and the carrying case 2〇〇 has an opening 2(10) for inserting or removing the 204^ circle 204. In the present embodiment, the depth of the groove 202b at the area 2〇9 is, for example, larger than the concave The depth of the groove 2〇2a, thus making the height of the wafer 204 located in the field 209 lower than the wafer M291082 18262twf.d〇c/y/winding plate 2 (10) located in the groove 2〇2a is detachably connected to the carrying case 200 The cover plate 206 is adapted to be used for the wafer 2 inside the load-bearing box 200. The holder 2〇8 is disposed on the surface of the cover 2〇6 to cover the wafer 2 when the cover 206 is covered. 〇4 is fixed. The gasket 21 is disposed between the cover plate 206 and the holder 2〇8, and the arrangement is, for example, a snap or 's' and the middle portion of the spacer 21〇 is higher than the other portions, for example, The f-cushion is fixed to 208 protrusions, wherein the raised partial holder 208 is, for example, opposite to the groove 202b having a deeper depth, that is, relative to the area. 2〇9. Therefore, the wafer 204 located in the area 209 can be It is effectively fixed. It is worth mentioning that the above-mentioned gasket can also be applied to a well-known front opening unified pod (FOUP). FIG. 3A is a cross-sectional view of a front open wafer of a Meng Meng body according to an embodiment of the present invention. FIG. 3B is a front elevational view of a door panel carrying a front open wafer cassette according to an embodiment of the present invention. FIG. Referring to FIG. 3A and FIG. 3B simultaneously, the front opening wafer cassette includes a casing 3, a door panel 306, a holder 308, and a gasket 310. The inside of the casing 300 is provided with mutually parallel grooves 302a and 302b, and the grooves 302a and 302b are adapted to accommodate the wafer 304. And one side of the case 300 has an opening 307 for the wafer 304 to be placed or removed. In the present embodiment, the depth of the groove 302b located in the region 309 is, for example, greater than the depth of the groove 302a. The door panel 306 is disposed on the side of the casing 300 and is adapted to protect the wafer 304 inside the casing 3. When the door panel 306 is opened, the wafer 304 can be placed into the recesses 302a and 302b from the opening 307 of the cartridge 300. The holder 3〇8 is disposed inside the door panel 306. The material of the holder 308 is, for example, M291082 18262 twf.doc/y polycarbonate and carbon or a hard plastic which is heat-resistant and does not generate particles, and can carry X at 80 C to 120 C. The holder 308 includes a frame 308a and a fixed rod 308b. The fixing bars 308b are disposed on opposite sides of the frame 308a and correspond to the grooves 302a and 302b. After the wafer 304 is placed in the recesses 302a and 302b, the door panel 306 is closed, and the wafer 304 located in the recess 3〇2a corresponding to each of the fixing rods 3〇8a of the recess 302a, respectively. fix. Further, the spacer 31 is disposed between the door panel 3〇6 and the frame 3〇8a to cause the partial gate holder 308 to protrude, wherein the protruding partial gate holder 308 is, for example, opposite to the groove 3 having a deep depth. 〇 2b, area 309. Fig. 3C is a schematic cross-sectional view showing a groove region having a deeper depth of a front opening type circular box according to the present embodiment. Referring to FIG. 3C, when the door panel 306 is closed, since the spacer 310 is disposed between the door panel 306 and the frame 308a, the frame 308a is protruded with respect to the region 309, and the fixing rod 308b located on both sides of the portion of the frame 308a is compared. The other fixing rods 308b are protruded, for example, from 8 mm to 1 mm, so that the wafer 304 located in the recess 302b can be effectively held by the protruding fixing rod 308b. In this embodiment, the manner in which the spacer 310 is disposed between the door panel 306 and the frame 308a is, for example, latching or bonding, and the length of the spacer 310 is, for example, between 7·8 cm and 9.8 cm, and the width is, for example, Between 2.1 cm and 4.j cm. Further, the intermediate portion of the spacer 31 is, for example, higher than the other cutters, and the intermediate portion is, for example, larger than 5 cm. In addition, the material of the gasket 31 例如 is, for example, polycarbonate and carbon or hard plastic, and the resistance value is, for example, between 105 ohms and 1 〇 9 ohms, and the temperature that can withstand is, for example, 8 〇 Qc 10 M291082 18262 twf. Between doc/y and not, and (4) 31Q itself does not have elasticity, and the holder 3〇8 can be supported by the disc washer 3H). In addition, the spacer 3 〇 itself does not create particles to avoid contaminating the wafer 304. To put it in mind, a spacer is placed between the holder of the wafer carrier device or the front opening type of the Japanese utility and the cover plate or the door panel so that the portion of the holder is raised so that the holder can be effectively positioned. Because the mode is equal to the difference =: the wafer in the groove with deeper depth. Therefore, the wafer is transported over ς =, and the wafer in the deeper recess is fixed by the raised fixture: the problem of the wafer being damaged or damaged by the collision is avoided. The π-definite creation has been disclosed above in the preferred embodiment, but it is not used to = 丄 any cooked artist's, without departing from the spirit of this creation, when it is possible to make some changes to the face, so this creation The scope defined by the patent application scope is ', sigh [simplified description of the drawing], and the implementation of the example of the wafer carrier device is shown in Fig. 2, which is the load according to the present creative embodiment. Schematic diagram of the box. The right side of the day-to-day bearing device is a cross-sectional view of a grooved area having a deeper degree of curvature according to the present invention. The present invention is a front view of a door panel of a wafer cassette according to the present invention. A type of pre-opening type M291082 18262 twf.doc/y FIG. 3C is a schematic cross-sectional view of a recessed region having a deeper depth of a front opening wafer cassette according to an embodiment of the present invention. [Main component symbol description] 100, 200: carrying case 102, 202a, 202b, 302a, 302b: groove 104, 204, 304: wafer 106, 206: cover plate 108, 208, 308 · · holder 109, 209 309: area 207, 307: opening 210, 310: spacer 300: case 306: door panel 308a: frame 308b: fixed rod
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