TWI358742B - Wafer container door with particulate collecting s - Google Patents
Wafer container door with particulate collecting s Download PDFInfo
- Publication number
- TWI358742B TWI358742B TW94112231A TW94112231A TWI358742B TW I358742 B TWI358742 B TW I358742B TW 94112231 A TW94112231 A TW 94112231A TW 94112231 A TW94112231 A TW 94112231A TW I358742 B TWI358742 B TW I358742B
- Authority
- TW
- Taiwan
- Prior art keywords
- door
- bottom plate
- particle
- particle capture
- textured structure
- Prior art date
Links
Description
1358742 九、發明說明: 【發明所屬之技術領域】 本發明係有關於一基板容器。更精確言之,本發明係有 關於基板容器門,該門具有網紋結構區域,用以捕集及預 防在容器内產生粒子或微粒的循環流動。 【先前技術】1358742 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a substrate container. More specifically, the present invention relates to a substrate container door having a textured structure for trapping and preventing the circulation of particles or particles generated within the container. [Prior Art]
基板容器係使用在半導體加工處理工業中,用以貯存及 傳送半導體晶圓、平坦平板基板、及薄膜框架。使用在半 導體加工處理工業中的容器範例為 F 0 U P s (前部開口統一 莢)、FOSBs(前部開口運輸盒)、及SMIF(標準化機械介面) 莢。該種容器一般具有由一門所密封地關閉之開敞底部或 側面之外殼。該門經常具有一可經由一清晰或透明塑膠門 平板而見到之具有閂鎖機構之内部艙,該平板通常由聚碳 酸酯所形成。 半導體晶圓之加工處理成為成品電子組件典型地需要許 多處理步驟,於處理期間,晶圓必須被操作與加工。晶圓 係非常有價值、非常精細、且易於被物理與電氣衝擊所損 壞。此外,成功的高產能加工處理需要最大程度之清潔度 且不受粒子或微粒及其他之污染。因為此一需求,已發展 專.用之容器或載具,以供在加工、操作、及運輸晶圓期間 的使用。這些容器保護晶圓不受物理及電氣的危害,且係 可密封地以保護晶圓不受污染。該種晶圓載具或容器通常 包括一具有多數之晶圓固持隔架於其内側的外殼。容器之 一側係開敞的,以供出入之用但可由一門關閉。該門通常 312XP/發明說明書(補件)/94-07/94112231 5 ⑤Substrate containers are used in the semiconductor processing industry to store and transport semiconductor wafers, flat flat substrates, and film frames. Examples of containers used in the semiconductor processing industry are F 0 U P s (front open unified pods), FOSBs (front open transport boxes), and SMIF (standardized mechanical interface) pods. Such containers typically have an open bottom or side outer casing that is hermetically closed by a door. The door often has an interior compartment with a latching mechanism that can be seen through a clear or transparent plastic door panel, which is typically formed from polycarbonate. The processing of semiconductor wafers into finished electronic components typically requires many processing steps during which wafers must be manipulated and processed. Wafers are very valuable, very fine, and easily damaged by physical and electrical shocks. In addition, successful high-volume processing requires maximum cleanliness and is free of particles or particulates and other contaminants. Because of this need, specialized containers or vehicles have been developed for use during processing, handling, and transport of wafers. These containers protect the wafer from physical and electrical hazards and are sealable to protect the wafer from contamination. Such wafer carriers or containers typically include a housing having a plurality of wafer holding spacers on the inside thereof. One side of the container is open for access and can be closed by a door. The door is usually 312XP / invention manual (supplement) /94-07/94112231 5 5
1358742 具有一閂鎖機構,以固著地保持且密封該門於定位。通1 閂鎖機構係圍繞住,以保護不受損壞及意外引動。 雖然晶圓外殼係使用在乾淨環境中,一段時間後,不 望之污染物會聚積在外殼上與外殼中。粒子污染物係經 外殼的部件之間的摩擦接觸及從外殼裝載與卸載晶圓之 業中所產生。依此,晶圓容器的一重要特徵係為能完全 可清潔,以確保加工處理保持清潔度。清潔通常以一液 溶液完成,且以壓縮空氣或其他氣體於後乾燥部件。 半導體晶圓製造程序通常對任何污染係非常敏感的。 染能以許多方式產生,例如,經由諸如閂鎖機構組件的 件在基板容器門内的滑動接觸。在基板容器被超時使 時,其可產生且聚積粒子。超時之後,粒子形成會造成 明塑膠門平板的可見到之髒污、斑點、及/或暗晦的結果 雖然如此出現不希望之美學結果,但該種污染與微粒或 子亦有進入外殼内且污染晶圈的風險。 因為前述之一般問題不能由習知晶圓容器來解決,目 有需要可克服習知設計所固有之問題及缺陷的晶圓容器 【發明内容】 本發明的具體例之晶圓容器,經由提供收集與捕捉粒 或微粒的粒子捕捉特性實質上可克服習知設計的前述 題,且實質上減輕該種粒子與污染之負面視覺效果。 一晶圓容器,該容器具有一外殼,該外殼具有一用以 入與移除晶圓至外殼的内部中之出入開口 ,及一組態成 選擇性地關閉該開口之門底板。在S Μ I F莢組態中,門包 希 由 作 地 體 污 組 用 透 〇 粒 前 〇 子 問 插 以 含 312ΧΡ/發明說明書(補件)/94-07/94丨12231 6 ⑧ 1358742 一具有自其向下延伸之周邊壁的頂部壁,界定一門底板内 部。晶圓容器包含一閂鎖機構,該機構可操作地與底板耦 接,閂鎖機構係組態成以操作地固著底板至開口。晶圓容 器亦包含一具有粒子捕捉區域的平板,該區域被界定在平 板的内部表面上,平板組態成以可卸地耦接底板,使得當 平.板耦接至底板時,内部表面與底板界定成一底板内部, 其中由閂鎖機構所產生之粒子或微粒均由粒子捕捉區域所 捕捉。1358742 has a latching mechanism to hold and seal the door in place. The through 1 latch mechanism is wrapped around to protect it from damage and accidental actuation. Although the wafer housing is used in a clean environment, undesirable contaminants can accumulate on the housing and the housing after a period of time. Particle contaminants are produced by frictional contact between components of the outer casing and from the loading and unloading of wafers from the outer casing. Accordingly, an important feature of the wafer container is that it is completely cleanable to ensure that the processing remains clean. Cleaning is usually done in a one-solution solution and the parts are dried afterwards with compressed air or other gases. Semiconductor wafer fabrication processes are often very sensitive to any contamination system. Dyeing energy can be produced in a number of ways, for example, by sliding contact within a substrate container door via a member such as a latch mechanism assembly. When the substrate container is timed out, it can generate and accumulate particles. After timeout, particle formation can result in visible dirt, spots, and/or darkness of the visible plastic door panel. Although undesired aesthetic results occur, the contamination and particles or sub-entries also enter the outer casing. And the risk of polluting the crystal ring. Because the general problems described above cannot be solved by conventional wafer containers, there is a need for a wafer container that overcomes the problems and drawbacks inherent in conventional designs. SUMMARY OF THE INVENTION A wafer container of a specific example of the present invention provides collection and capture by providing The particle capture properties of the particles or microparticles substantially overcome the aforementioned problems of conventional design and substantially mitigate the negative visual effects of such particles and contamination. A wafer container having an outer casing having an access opening for inserting and removing the wafer into the interior of the outer casing, and a door bottom plate configured to selectively close the opening. In the S Μ IF pod configuration, the door pack is made up of a smear-preserving scorpion with a 312 ΧΡ / invention specification (supplement) / 94-07/94 丨 12231 6 8 1358742 The top wall of the perimeter wall from which it extends downward defines the interior of a door panel. The wafer container includes a latch mechanism operatively coupled to the bottom plate, the latch mechanism being configured to operatively secure the bottom plate to the opening. The wafer container also includes a flat plate having a particle trapping region defined on an inner surface of the flat plate, the flat plate being configured to detachably couple the bottom plate such that when the flat plate is coupled to the bottom plate, the inner surface is The bottom plate is defined as a bottom plate interior in which particles or particles produced by the latching mechanism are captured by the particle capture area.
本發明的具體例之特性與優點係粒子或微粒均由隔離之 網紋組織區域所捕集,且被阻止在門内循環流動及可能性 地與晶圓接·觸。 本發明的具體例之特性與優點係可排除或減少在透明表 面上之髒污或暗晦所例示的粒子之聚積。 【實施方式】. 用以承載基板之基板容器2 0係顯示於圖1 - 3。參照圖2, 晶圓容器20大致包含一具有界定供進入容器20之内部28 用的出入開口 26之門框24的外殼22,具有用以接受與固 持晶圓(未示於圖)之多數槽孔3 2的卡匣3 0,及用以密封 地封閉出入開口 2 6的門4 0。門4 0大致包含門底板部4 0 A 與平板部40B。門40可包含多數之運動耦接槽41,用以定 位與固著容器2 0在一件處理設備(未顯示)上。門4 0亦可 包含用以接受與保持卡匣3 0之定位結構4 1 A。參照圖3, 門40可包含頂部壁42及自頂部壁42延伸離開之周邊壁 44。周邊壁44與頂部·壁42界定門40之内部空間46。門 312XP/發明說明書(補件)/94-07/94112231 7 ⑧ 1358742 40可包含一沿著門周邊47A所用以密封地嚙合外殼部 22 之墊密片47。門導承47B可提供於每一隅角47C處以準確 地定位門40在門框24中。 門4 0亦可包含至少一裝設在門4 0之内部空間4 6中的閂 鎖機構5 0,用以將門4 0固著在外殼2 2的門框2 4中。閂 鎖機構50可包含一對回轉地耦接至頂部壁42的下部表面 (未顯示)之閂鎖臂5 2 ( A )、5 2 ( B )。每一閂鎖臂5 2 ( A )、5 2 ( B ) 係可收縮地延伸通過門4 0之周邊壁4 4中的開口 4 4 A,且 每一組態成以閂鎖至外殼2 2之門框2 4,用以固著門4 0在 門框2 4中。凸輪5 3係旋轉地耦接至頂部壁4 2的下部表面 且耦接每一閂鎖臂5 2 ( A )、5 2 ( B ),因此,凸輪5 3之旋轉 同時地移動每一閂鎖臂 5 2 ( A )、5 2 ( B )橫向地通過開口 具有包含於其中之閂 43A,以嚙合閂框24或自其脫離 鎖機構的門之晶圓容器之範例係揭示在本專利申請人所擁 有之美國專利號碼6 , 7 4 9 , 0 6 7中,其將於此聯合參考。 雖然閂鎖機構 5 0之引動部係於此陳述且說明為一旋轉 凸輪,能使用可施加一線性滑動動作至閂鎖臂5 2 ( A )、5 2 ( B ) 的任何其他合適構件或機構,包含諸如陳述於PCT申請案 號碼W 0 0 1 / 0 4 0 2 2 A 1中的一軌條與小齒輪機構,其亦將於 此聯合參考。適合與本發明之多種具體例一起使用的凸輪 操作閂鎖機構之進一步描述,係揭示於美國專利號碼 6,7 1 2,2 1 3及共同申請中專利申請案系歹|J號碼10/317, 023 及 10/3 18,374中,每一前述專利與申請案均於此聯合參 考。 312XP/發明說明書(補件)/94-07/94112231 ⑧ 1358742The characteristics and advantages of the specific examples of the present invention are that the particles or particles are trapped by the isolated textured region and are prevented from circulating in the door and possibly in contact with the wafer. The characteristics and advantages of the specific examples of the present invention are such that the accumulation of particles exemplified by dirt or darkness on the transparent surface can be eliminated or reduced. [Embodiment] The substrate container 20 for carrying a substrate is shown in Fig. 1-3. Referring to Figure 2, the wafer container 20 generally includes a housing 22 having a door frame 24 defining an access opening 26 for accessing the interior 28 of the container 20, having a plurality of slots for receiving and holding wafers (not shown). The latch 3 0 of 3 2 and the door 40 for sealingly closing the access opening 26 . The door 40 generally includes a door bottom plate portion 40A and a flat plate portion 40B. Door 40 can include a plurality of kinematic coupling slots 41 for positioning and securing container 20 on a piece of processing equipment (not shown). The door 40 may also include a positioning structure 4 1 A for receiving and holding the cassette 30. Referring to Figure 3, the door 40 can include a top wall 42 and a peripheral wall 44 extending away from the top wall 42. The perimeter wall 44 and the top wall 42 define an interior space 46 of the door 40. Door 312XP/Invention Manual (Refill)/94-07/94112231 7 8 1358742 40 may include a gasket 46 for sealingly engaging the outer casing portion 22 along the door periphery 47A. A door guide 47B can be provided at each corner 47C to accurately position the door 40 in the door frame 24. The door 40 can also include at least one latch mechanism 50 mounted in the interior space 46 of the door 40 for securing the door 40 in the door frame 24 of the housing 22. The latch mechanism 50 can include a pair of latch arms 5 2 (A ), 5 2 (B) that are rotationally coupled to a lower surface (not shown) of the top wall 42. Each of the latch arms 5 2 ( A ), 5 2 ( B ) retractably extends through an opening 4 4 A in the peripheral wall 44 of the door 40 and is each configured to latch to the housing 2 2 The door frame 2 4 is used to fix the door 40 in the door frame 24. The cam 53 is rotatably coupled to the lower surface of the top wall 42 and coupled to each of the latch arms 5 2 ( A ), 5 2 ( B ) so that the rotation of the cam 5 simultaneously moves each latch An example of a wafer container in which the arms 5 2 ( A ), 5 2 ( B ) have a latch 43A laterally through the opening to engage the latch frame 24 or the door from which it is disengaged from the lock mechanism is disclosed in the applicant. U.S. Patent No. 6, 7 4 9 , 0,7, which is incorporated herein by reference. Although the actuating portion of the latch mechanism 50 is described herein and illustrated as a rotating cam, any other suitable member or mechanism that can apply a linear sliding action to the latch arms 5 2 (A), 5 2 (B) can be used. , including a rail and pinion mechanism such as that set forth in PCT Application No. W 0 0 1 / 0 4 0 2 2 A 1 , which will also be incorporated herein by reference. Further description of a cam-operated latching mechanism suitable for use with the various embodiments of the present invention is disclosed in U.S. Patent No. 6,7 1 2, 2 1 3 and the commonly-owned patent application 歹|J No. 10/317 Each of the aforementioned patents and applications are hereby incorporated by reference. 312XP/Invention Manual (supplement)/94-07/94112231 8 1358742
參照圖3至5,透明平板7 0之形式的平板4 Ο B係可移除 地耦接至門40的周邊壁44以封閉内部48。扣夾70A嚙合 在底板40A上的接受結構70B中。雖然在一具體例中的平 板7 0係透明的,但平板7 0亦可為非透明的且不會離開本 發明之範疇。平板7 0具有如示於圖3與4中的上部或内側 表面72及如示於圖1與2中之下部或外側表面74。當耦 接至門40的周邊壁44時,平板70之上部表面72面向門 40的内部46。在本發明的一具體例中,平板70具有延伸 由其通過之一對開口 7 6,以提供出入至凸輪5 3。如特別地 示於圖5,該對開口 76可具有大致上對扁圓(oval)組態, 但亦可為其他組態。 在一具體例中,透明平板7 0之内側表面7 2可包含離散 網紋區域8 0之形式的粒子捕捉區域7 5,用以捕集且預防 微粒或粒子之施放,該微粒或粒子係終由互相面對地移動 裝設在内部4 6中之組件或門4 0的任何其他部位或透明平 板70時所產生。雖然在一具體例中網紋區域80被隔離, 多數之網紋區域80可分佈在内部表面72上且不會離開本 發明之範疇。透明平板7 0之‘離散網紋部8 0可配置在透明 平板70之内部表面72上的任何地方。如特別地示於圖4 至7,網紋部80大致上配置鄰近於凸輪53且近接開口 74» 在不同之具體例中,網紋區域8 0可配置大致上近接於任何 移動組件,使得所產生之粒子或微粒落入網紋區域8 0内且 使捕集於其中。在本發明的另一具體例中,内側表面 72 之變化度係成網紋。具有適合供該種承載表面用的網紋組 9 3 ] 2XP/發明說明書(補件)/94-07/94112231 1358742 態之網紋區域80亦可作用為承載表面。 可使用任何機械、化學或光學處理以施加一網紋在透明 平板7 0的内側表面7 2 内。例如,網紋區域8 0典型地由模 製製成,但在某些應用中;亦可合適地選擇使用諸如蝕刻 或雷射切削。亦例如,一具有合適之網紋與表面性質的預 形件或薄膜可被嵌入模製成為外蓋。該預形網紋部亦可作 用為一承載表面。亦可使用其他加工方法且不會離開本發 明之範疇。Referring to Figures 3 through 5, a plate 4 Ο B in the form of a transparent plate 70 is removably coupled to the peripheral wall 44 of the door 40 to enclose the interior 48. The clip 70A engages in the receiving structure 70B on the bottom plate 40A. Although the flat plate 70 is transparent in a specific example, the flat plate 70 may be non-transparent and does not depart from the scope of the present invention. The plate 70 has an upper or inner side surface 72 as shown in Figures 3 and 4 and a lower or outer side surface 74 as shown in Figures 1 and 2. When coupled to the peripheral wall 44 of the door 40, the upper surface 72 of the plate 70 faces the interior 46 of the door 40. In one embodiment of the invention, the plate 70 has an extension through which it passes through a pair of openings VII to provide access to the cam 53. As shown particularly in Figure 5, the pair of openings 76 can have a substantially oboval configuration, but can be other configurations as well. In one embodiment, the inner surface 72 of the transparent plate 70 may include a particle capture region 75 in the form of a discrete textured region 80 for capturing and preventing the application of particles or particles. It is produced by moving the components mounted in the interior 46 or any other part of the door 40 or the transparent plate 70 facing each other. Although the textured regions 80 are isolated in a particular embodiment, a majority of the textured regions 80 can be distributed over the interior surface 72 without departing from the scope of the present invention. The 'discrete textured portion 80 of the transparent plate 70 can be disposed anywhere on the interior surface 72 of the transparent plate 70. As particularly shown in Figures 4 through 7, the textured portion 80 is generally disposed adjacent to the cam 53 and the proximal opening 74». In a different embodiment, the textured region 80 can be configured to be substantially adjacent to any moving component such that The resulting particles or particles fall within the textured region 80 and are trapped therein. In another embodiment of the invention, the degree of change in the inner side surface 72 is textured. The textured region 80 having a textured group suitable for such a load-bearing surface can also function as a load bearing surface for the textured region of the state of the invention. Any mechanical, chemical or optical treatment can be used to apply a texture within the inside surface 7 2 of the transparent plate 70. For example, the textured region 80 is typically molded, but in some applications; such as etching or laser cutting may also be suitably employed. Also for example, a preform or film having suitable texture and surface properties can be insert molded into an outer cover. The pre-shaped web portion can also function as a load bearing surface. Other processing methods can also be used without departing from the scope of the invention.
參照圖6a至9b,可使用各種網紋以產生網紋區域80。 例如,如示於圖6 a、6 b,透明平板7 0之内側表面7 2可由 數個同心肋7 3構成。如示於圖6 b,同心肋7 3可具有大致 上的波動起伏橫别面幾何形狀。在圖7a、7b、8的不同具 體例中,網紋區域8 0可包含線性肋8 1。線性肋可具有變 化之橫剖面幾何形狀。例如,如示於圊7 b,V型凹口橫刹 面幾何形狀可被形成在内側表面7 2内,以形成粒子捕捉區 域7 5的網紋表面8 0。如示於圖8,亦可形成方型凹口橫剖 面幾何形狀。在另一具體例中,如示於圖9a,交叉線條肋 83可被形成在透明平板70的内側表面72上,以形成粒子 捕捉區域7 5的網紋表面8 0。如特別地示於圖9 b與9 c,不 規則及/或複合橫剖面幾何形狀亦可形成在内側表面 72 上,以形成粒子捕捉區域75的網紋表面 80。其他橫剖面 幾何形狀係可在本發明之範疇内想像,且那些討論不應被 視為限。 在其他具體例中,經由黏合一具有網紋上部表面之薄 312XP/發明說明書(補件)/94-07/941 ] 2231 10 ⑧ 1358742 膜,網紋區域8 0可施加至透明平板7 0的内側表面7 2上。 網紋薄膜允許一使用者去定位網紋區域 80在任何會產生 粒子或微粒之處。在又另一具體例中,黏劑可配置於透明 平板7 0的内侧表面7 2上,以捕捉任何所產生之粒子。 在作業中,網紋區域80係在製造之時以施加至或進入透 明平板7 0的内側表面7 2中。在晶圓容器2 0被使用時,裝 設在門 4 0之内部 4 6中的多種移動構件將產生粒子或微 粒。因為透明平板7 0裝設低於門4 0,粒子會掉落至透明 Φ 平板7 0的内側表面7 2上。在粒子掉落至内側表面7 2上 時,其將捕捉在網紋區域8 0中,藉此預防粒子循環通過門 4 0之内部4 6且可能地接觸所包覆之晶圓。當使用者需要 自門4 0之内部4 6與網紋區域8 0移除粒子時,使用者僅需 自門4 0脫離平板7 0,移除粒子,及更換門4 0上的平板7 0。 雖然本發明已參照特定具體例說明,習於本技藝者可以 了解在不離本發明之精神與範疇下,在成型與細部中可製 成改變。因而,所示之具體例應被視為顯示用之範例而非Referring to Figures 6a through 9b, various textures can be used to create the textured regions 80. For example, as shown in Figures 6a, 6b, the inner side surface 72 of the transparent plate 70 can be constructed of a plurality of concentric ribs 73. As shown in Figure 6b, the concentric ribs 7 3 can have a substantially undulating cross-sectional geometry. In the different embodiments of Figures 7a, 7b, 8, the textured region 80 may comprise linear ribs 81. The linear ribs can have varying cross-sectional geometries. For example, as shown in Figure 7b, a V-notch lateral brake face geometry can be formed in the inside surface 72 to form the textured surface 80 of the particle capture zone 75. As shown in Figure 8, a square notch cross-sectional geometry can also be formed. In another embodiment, as shown in Figure 9a, cross-hat ribs 83 can be formed on the inner side surface 72 of the transparent plate 70 to form the textured surface 80 of the particle-trapping region 75. Irregular and/or composite cross-sectional geometries may also be formed on the inner side surface 72 to form the textured surface 80 of the particle capture region 75, as particularly shown in Figures 9b and 9c. Other cross-sectional geometries can be imagined within the scope of the present invention, and those discussions should not be considered as limiting. In other embodiments, the textured region 80 can be applied to the transparent plate 70 by bonding a thin 312XP/inventive specification (supplement)/94-07/941 2231 10 8 1358742 film having a textured upper surface. The inner side surface is 7 2 . The textured film allows a user to locate the textured area 80 wherever particles or particles are produced. In yet another embodiment, the adhesive can be disposed on the inside surface 72 of the transparent plate 70 to capture any particles produced. In operation, the textured region 80 is applied to or into the inside surface 72 of the transparent plate 70 at the time of manufacture. When the wafer container 20 is used, a plurality of moving members disposed in the interior 46 of the door 40 will produce particles or particles. Since the transparent plate 70 is mounted lower than the door 40, the particles will fall onto the inner side surface 72 of the transparent Φ plate 70. As the particles fall onto the inner side surface 72, they will be trapped in the textured region 80, thereby preventing the particles from circulating through the interior 46 of the door 40 and possibly contacting the coated wafer. When the user needs to remove the particles from the inner 4 6 of the door 40 and the textured area 80, the user only needs to detach the plate 70 from the door 40, remove the particles, and replace the plate 70 on the door 40. . Although the invention has been described with reference to the specific embodiments, it will be understood by those skilled in the art that modifications can be made in form and detail without departing from the spirit and scope of the invention. Thus, the specific examples shown should be considered as examples for display rather than
用以侷限本發明。 【圖式簡單說明】 圖1係依據本發明的一具體例之具有一門的晶圓容器之 底部立體圖; 圖2係依據本發明的一具體例之具有一門及一晶圓托盤 的晶圓容器之分解圖; 圖3係依據本發明的一具體例之一晶圓卡匣的門之底部 分解圖; 312ΧΡ/發明說明書(補件)/94-07/94112231 Η⑧It is intended to limit the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a bottom perspective view of a wafer container having a gate according to an embodiment of the present invention; FIG. 2 is a wafer container having a gate and a wafer tray according to an embodiment of the present invention. 3 is an exploded view of a bottom of a wafer cassette according to a specific example of the present invention; 312 ΧΡ / invention specification (supplement) /94-07/94112231 Η8
1358742 圖4係依據本發明的一具體例之門的平板之立體圓 圖5係依據本發明的一具體例之平板的近視圖,顯 平板之内側表面上的起伏幾何形狀; 圖6係依據本發明的一具體例之平板的内側表面之 平面圖,該平板具有同心肋之粒子捕捉區域; 圖6b係圖6a之粒子捕捉區域的橫剖面圖; 圖 7 a係依據本發明的一具體例之平板的内側表面 部平面圖,該平板具有線性肋之粒子捕捉區域; 圖7b係圖7a之粒子捕捉區域的具體例之橫剖面圖 圖8係圖7a之粒子捕捉區域的不同具體例之橫剖i 圖 9 a係依據本發明的一具體例之平板的内側表面 部平面圖,該平板具有交叉線條肋之粒子捕捉區域; 圖9b係顯示圖9a之交叉線條肋產生的幾何形狀之 面圖;及 圖 9c係顯示依據本發明的一具體例之具有由交叉 肋所產生的任意幾何形狀之粒子捕捉區域的橫剖面圖 【主要元件符號說明】 20 晶圓容益 2 2 外殼部 不在 頂部 之頂 i 1圖; 之頂 橫剖 線條 24 門框 26 出 入開 28 内 部 30 卡 匣 32 槽 孔 312XP/發明說明書(補件)/94-07/94112231 12 13587421358742 is a perspective view of a flat plate of a door according to a specific example of the present invention. FIG. 5 is a close-up view of a flat plate according to a specific example of the present invention, the undulating geometry on the inner side surface of the display plate; A plan view of an inner side surface of a flat plate having a concentric rib particle capturing region; FIG. 6b is a cross-sectional view of the particle capturing region of FIG. 6a; FIG. 7a is a flat plate according to a specific example of the present invention. FIG. 7b is a cross-sectional view of a specific example of the particle capturing region of FIG. 7a. FIG. 8 is a cross-sectional view of a different specific example of the particle capturing region of FIG. 7a. 9a is a plan view of the inside surface portion of the flat plate according to a specific example of the present invention, the flat plate having a particle capturing region of the intersecting line rib; FIG. 9b is a plan view showing the geometry of the intersecting line rib of FIG. 9a; and FIG. 9c A cross-sectional view showing a particle capturing region having an arbitrary geometry generated by a cross rib according to a specific example of the present invention. [Main element symbol description] 20 crystal圆容益 2 2 The outer casing is not at the top of the top i 1 picture; the top cross section line 24 door frame 26 out into the opening 28 the inner part 30 card 匣 32 slot hole 312XP / invention manual (supplement) /94-07/94112231 12 1358742
40 門 40A 門 底 板 部 40B 平 板 部 4 1 運 動 耦 接槽 4 1 A 定 位 結 構 42 頂 部 壁 43A 開 D 44 周 邊 壁 44A 開 D 46 内 部 空 間 47 墊 密 片 47A 門 周 邊 47B 門 導 承 47C 隅 角 48 内 部 50 閂 鎖 機 構 52 A 閂 鎖 臂 52B 閂 鎖 臂 53 凸 輪 70 透 明 平 板 70A 扣 夾 70B 接 受 結 構 72 上 部 表 面 73 同 心 肋 312XP/發明說明書(補件)/94-07/94112231 13 ⑤ 1358742 74 下 部 表 面 75 粒 子 捕 捉 區域 76 開 α 80 網 紋 區 域 8 1 線 性 肋 83 交 叉 線 條 肋40 Door 40A Door Base Plate 40B Flat Plate 4 1 Motion Coupling Slot 4 1 A Positioning Structure 42 Top Wall 43A Open D 44 Peripheral Wall 44A Open D 46 Interior Space 47 Pad 46A Door Surrounding 47B Door Guide 47C Corner 48 Internal 50 Latch mechanism 52 A Latch arm 52B Latch arm 53 Cam 70 Transparent plate 70A Clamp 70B Accepting structure 72 Upper surface 73 Concentric rib 312XP / Invention manual (supplement) /94-07/94112231 13 5 1358742 74 Lower Surface 75 particle capture area 76 open α 80 textured area 8 1 linear rib 83 cross line rib
312XP/發明說明書(補件)/94-07/9411223 ] 14 ⑤312XP/Invention Manual (supplement)/94-07/9411223] 14 5
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56352604P | 2004-04-18 | 2004-04-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200605156A TW200605156A (en) | 2006-02-01 |
TWI358742B true TWI358742B (en) | 2012-02-21 |
Family
ID=38701491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94112231A TWI358742B (en) | 2004-04-18 | 2005-04-18 | Wafer container door with particulate collecting s |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN101014509A (en) |
MY (1) | MY140537A (en) |
TW (1) | TWI358742B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102053082B1 (en) * | 2014-02-17 | 2020-01-08 | (주)테크윙 | Handler for semiconductor device test and operating method thereof |
TWI829388B (en) * | 2022-10-12 | 2024-01-11 | 迅得機械股份有限公司 | Cassette for carrying plates |
-
2005
- 2005-04-18 TW TW94112231A patent/TWI358742B/en not_active IP Right Cessation
- 2005-04-18 CN CN 200580019814 patent/CN101014509A/en active Pending
- 2005-04-18 MY MYPI20051702 patent/MY140537A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN101014509A (en) | 2007-08-08 |
TW200605156A (en) | 2006-02-01 |
MY140537A (en) | 2009-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101264938B1 (en) | Wafer container door with particulate collecting structure | |
JP4441111B2 (en) | Wafer container with door | |
JP5268142B2 (en) | Mask blank storage case, mask blank storage method, and mask blank storage body | |
TW200822268A (en) | Wafer cassette | |
JPH1187483A (en) | Transporting container | |
JP2017527997A (en) | Substrate container | |
TWI358742B (en) | Wafer container door with particulate collecting s | |
TWI634062B (en) | Substrate storage container | |
JP4765607B2 (en) | Impact resistant clean container, sample transfer system | |
JP4372313B2 (en) | Substrate storage container | |
TWI343353B (en) | A wafer container having the snap-fitting constraint module | |
TWI270954B (en) | Wafer carrier door with form fitting mechanism cover | |
TWI293195B (en) | Wafer carrier door and latching mechanism with c-shaped cam follower | |
TW440909B (en) | Lid latch mechanism for clean box | |
JP3093068B2 (en) | Wafer case | |
WO2006055119A2 (en) | Unlatching apparatus for media disk caddy | |
JPH092563A (en) | Disk case | |
JP6061269B2 (en) | Opening and closing device for transfer container | |
TWI310229B (en) | Substrate carrier having door latching and substrate clamping mechanisms | |
JP4007735B2 (en) | Thin plate container opener | |
JP2001002180A (en) | Base transporting container | |
JP3759766B2 (en) | Container for containing and holding semiconductor wafers | |
TW201249728A (en) | Automated warehouse | |
KR100583482B1 (en) | Non esd wafer cassette | |
JP2002370777A (en) | Storage container, and opening structure for lid body thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |