M288949 八、新型說明： 【新型所屬之技術領域】 本創作係提供-觀子裝置之機殼散熱結構，尤指可辅心 奸置内輕氣與外部流通並快賴散敗氣之機殼散熱結構书 俾將主機錢料魅生之雜·速婦，以翻 置的使用壽命之目的。 衣 【先前技術】 按，現今科技資訊快速發展，而個人電月、電子筆記本及筆 記型電腦由於運算功能強、速度快，耻被普遍於各個行業 ’而網路時代的來臨更造成電腦的f及化，其巾電腦主機之機殼 内部之電氣彡賴线板上的各種電子賴、等，於運作= 容易產生熱能，以致熱空氣充斥在電腦機殼内部，尤其是主機板 上之晶片於運作時，其運作速度愈快所產生的熱能愈高，為避免 因高熱燒毀晶片而縮短晶片的使用壽命，因此在各個晶片上均設 有散熱片’使晶片上產生之熱能傳導至散熱片上，或者電氣系統 如硬碟、光碟機等，於運作時亦可能產生熱能，然而，不論是主 機板或電氣系統所產生之熱能，全部熱空氣形成聚集在機殼内部 ，僅利用機殼後側裝設小型散熱風扇做散熱，實無法將機殼内部 之熱空氣快速排除，仍會影響機殼内部主機板或電氣系統之使用 哥命。 本案申請人因鑑於電腦主機於運作時，在機殼内部所產生之 熱空氣難以快速排除之困擾，曾於民國九Η * —年十月九日以「具 M288949 使機殼内部與外部空氣流通之作用，且具有快速排散熱空氣之功 能’能避免電子裝置運作過熱，並可延長其制壽命。 、本創作之_人要目的則在於$側盍板上所設之散熱S備，係可 為散熱風扇、散熱、具複數散熱狀散鮮板或其他具有散 熱功能之設備；且散熱風扇可為直流風扇。 【實施方式】M288949 VIII. New Description: 【New Technology Fields】 This creation provides the heat dissipation structure of the case-view device, especially the heat dissipation of the chassis that can be used for the light and external circulation. The structure of the book will be the main purpose of the money, the charm of the woman, the purpose of the life of the flip. Clothing [previous technology] Press, today's technology information is developing rapidly, and personal power month, electronic notebook and notebook computer are popular in various industries due to their powerful computing power and fast speed. The advent of the Internet era has caused computer f And the various internal electronic circuits on the inside of the casing of the towel computer mainframe, etc., in operation = easy to generate heat, so that hot air is filled inside the computer case, especially the chip on the motherboard In operation, the faster the operation speed, the higher the heat energy generated. In order to avoid shortening the life of the wafer due to high heat burning of the wafer, heat sinks are provided on each wafer to conduct heat energy generated on the wafer to the heat sink. Or electrical systems such as hard drives, CD players, etc., may also generate heat during operation. However, regardless of the thermal energy generated by the motherboard or electrical system, all hot air is collected inside the casing, and only the rear side of the casing is used. If a small cooling fan is used for heat dissipation, it is impossible to quickly remove the hot air inside the casing, which will still affect the internal motherboard or electrical system of the casing. Use brother lives. The applicant of this case was troubled by the fact that the hot air generated inside the casing was difficult to be quickly eliminated when the computer was in operation. It was used in the Republic of China on September 9th. The function of the function of quickly dissipating air can prevent the electronic device from overheating and prolong the life of the device. The purpose of this creation is to provide heat dissipation for the side panel. The utility model relates to a cooling fan, a heat dissipating device, a plurality of heat dissipating plates or other devices having a heat dissipating function, and the cooling fan can be a DC fan.
為達成上述目的及構造，本瓣所制之技術手段及其功效 ’兹繪圖就本_之難實關詳加酬聽造與魏如;，j 利完全瞭解。 ㈣閱弟-、二、二A、三圖所示，係為本創作之立體 圖、立體分解圖、散熱設備之立體分解圖、側視剖面圖，由圖中 可以清楚料，本_軒裝置係包括機殼丨、板㈣ 設備3等所組成，其中： …、 該機殼1可為電駐機或電難品機箱等各式電子裝置，龙 内部為具有容置空間i i，並可於容置空間i U固設電編 =Π:電氣系統12如硬碟機、光碟機、，機 、、友路衣置4 ’主機板i 3則固設有各種電 忐 7 1丁日日乃、中水 义理斋、連接器等電腦主機所需之配備。 、 該侧蓋板2係設有鏤空部2工。 該散熱設備3為具辅助散熱功能之設備，可為散熱風 今散_ 3 2、具複數散熱孔川之散熱罩板3 3等 政熱功能之設備。 ，、有 7 M288949 /述各構件於組裝時，該機殼1的容置空間11外部相對於 電孔系統1 2與主機板1 3之側面，係供側蓋板2餘固定，俾 使側皿板2(位於機殼1側邊，並於側蓋板2之鏤空部21處裝 有月’、、、又備3，俾利用散熱設備3辅助散熱之功能，當機殼1 容置空間11内之電氣系統12、主機板i 3因運作^產生熱能 二使熱空氣散佈於容置空間1 1⑽，即可藉由散熱設備3對 ^•氣系Ά12、主機板丨3進行辅助散熱，則可使容置空間11 内之熱空氣與外部空氣產生對流，而可辅助容置空間11内快速 排散熱空氣’崎餘1 1内福度，藉贿電氣系統！ 2主機板13在較低溫度中運作，並可延長其使用壽命，且可 降低電氣系統12、主機板13之故障率，有效提昇電腦主機之 使用效率。 再叫翏閱第二、二A、三、四、五圖所示，係為本創作之立 體分觸、散熱設備之立體分解圖、側視剖賴、較佳實施例立 體ί解圖，—實施例之立體分解圖，由各圖式中可以清楚看出 ’則述側錢2之鏤空部2 !所嵌設之散熱設備3若為散熱風扇 3 1，即可·散熱風扇3 1直騎魏系統1 2、主機板i 3 吹达冷風，並使容置空間11内之熱空氣由機殼！後側之複數散 熱孔14排出，達到辅助電氣系統i 2、主機w 3快速散熱之 功效’而散熱風扇3!係可為直徑i 6 e _ i 6 c _上之直 流風扇’听產生較大的風力吹送至魏系⑽2、主機板丄3 ’達到快速散熱及使空氣流通之目的；若於鏤空部2丨裝設散熱 8 M288949 續片3 2之散熱設備3 ’則利用散熱鰭片3 2抵貼於電氣系統工 2、主機板13上，再以散熱鰭片3 2將容置空間i丄内之熱空 氣吸收，並往外快速排散，亦可達_助電氣祕丨2、主機板 1 3快速散熱之功能。該散熱設備3亦可為散鮮板3 3，並於 散熱罩板3 3上設有複數散熱孔3 3丄，再藉由複數散熱孔3 3 1加速容置空間1i内部空氣與外部空氣對流之速度，具有輔助 ^ 電氣系統12、主機板13快速散熱之功效。 請參閱第五、六圖所示，係為本創作再一實施例之立體分解 圖、又-實施例之側視剖面圖，該散熱裝置3之散熱罩板3 3内 為可裝設有餘1 6 en^l 6 cnmji之散熱風扇3 i (直流 風扇）’並將散熱風扇31、散熱罩板33-同固設於侧蓋板2 之鏤空部21處’俾_散熱風扇3 i對機殼i容置空間丄丄内 之電观系統1 2、主機板1 3吹送冷風，謂利用散熱罩板3 3 φ 上複數政熱孔3 31供容置空間11内之熱空氣與外部空氣對流 ，可更快速對容置空間11之電氣系統12、主機板！3進行散 熱。 疋以，以上所述僅為本創作之較佳實施例而已，非因此侷限 本創作之專利範圍，本創作之機殼散熱裝置係利用機殼1之侧蓋 板2设有鏤空部2工，而可於鏤空部21處設有散熱設備3，如 政心風扇3 1、散熱鰭片3 2或散熱罩板3 3等可供獅散熱 又備俾使機殼1内部容置空間11的熱空氣與外部空氣快逮 9 M288949 對流’可對容置空間11内之電氣系統i 2、主機板i 3輔助散 有效使機殼1容置空間11快速散熱之功能 ，故舉凡可達成 前述效果之卿_摘_紐，此_祕飾及等效結構 變化，均朗理包含於本創作之專利範_，合予陳明。 述本創作a子衣置之機殼散熱結構於實際使㈣，為可具 有下列各項優點，如： ()機成之側盖板以散熱設備相對於電氣系統、主機板，而由 散熱設備對電録統、主機板進行辅助散熱 ，以將運作時 產生之熱空氣排散，降低電氣系統、主機板之工作溫度， 並可延其使用壽命。 (二）2如部容置钟可彻賴設備之辅錄熱，而使容置 工間内之熱空氣與外部空氣產生對流，即驗速排散容置 空間内部之熱空氣。 故本創作主要為針對電子裝置内部之電氣系統與主機板做 輔助放熱’而极運作巾之電m主機板可快速排散熱能， 、降低’、工作喊生的溫度並可延長使用壽命為主要保護重點， 為使電子裝置可達快速散熱之功能，惟，以上所述僅為本創作之 較佳實施_已，_此即舰本創作之專利細，故舉凡運用 本創作說财簡如容所為之簡祕飾及等效結觀化，均應 同理包含於摘作之專概H内，合予陳明。 絲上所述，本創作上述之電子裝置之機殼散熱結構於使用時 10 M288949In order to achieve the above purpose and structure, the technical means and function of the valve are made by the author of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ (4) Read the brother-, second, second, and third pictures, which are the three-dimensional map, the three-dimensional exploded view, the three-dimensional exploded view of the heat-dissipating device, and the side-viewing cross-sectional view, which can be clearly seen from the figure. The utility model comprises a casing 丨, a plate (4) device 3, etc., wherein: ..., the casing 1 can be various electronic devices such as an electric parking machine or an electric hard-working chassis, and the interior of the dragon has a accommodating space ii, and can be accommodated Set space i U fixed electric code = Π: electrical system 12 such as hard disk drive, CD player, machine, and friend road clothing set 4 'main board i 3 is fixed with a variety of electric 忐 7 1 Ding Ri Nai, The equipment required for computer mainframes such as Zhongshui Yilizhai, connectors, etc. The side cover 2 is provided with a hollow portion. The heat dissipating device 3 is a device with an auxiliary heat dissipating function, and can be a heat dissipating wind _ 3 2, with a plurality of cooling holes, the heat dissipation cover plate 3 3 and other political heat function equipment. When there are 7 M288949 / when the components are assembled, the external space of the housing 11 of the casing 1 is opposite to the side of the electric hole system 12 and the main board 13 , and the side cover 2 is fixed, and the side is fixed. The dish board 2 (located on the side of the casing 1 and installed in the hollow portion 21 of the side cover 2 is equipped with a month', and is also provided with a heat dissipation device 3 to assist the heat dissipation function, when the casing 1 accommodates the space The electric system 12 and the main board i 3 in the 11 are generated by the heat generating device 2, so that the hot air is dispersed in the accommodating space 1 1 (10), and the heat dissipating device 3 can assist the heat dissipation of the gas system 12 and the main board 丨3. The convection of the hot air in the accommodating space 11 and the outside air can be assisted, and the air in the accommodating space 11 can be quickly arranged to dissipate the air. It operates in temperature and can prolong its service life, and can reduce the failure rate of the electrical system 12 and the motherboard 13 and effectively improve the efficiency of the use of the computer. See also the second, second, third, fourth, and fifth maps. The display is a three-dimensional distraction of the creation, an exploded view of the heat dissipating device, a side view, and a better The three-dimensional exploded view of the embodiment, the three-dimensional exploded view of the embodiment, can be clearly seen from the respective drawings, the heat-dissipating device 3 embedded in the hollow portion 2 of the side money 2 is a cooling fan 3 1, that is, 2. Cooling fan 3 1 Straight ride Wei system 1 2. The main board i 3 blows cold air, and the hot air in the accommodating space 11 is discharged from the plurality of vent holes 14 on the rear side to reach the auxiliary electrical system i 2 , the host w 3 fast cooling effect 'and the cooling fan 3! can be the diameter of the i 6 e _ i 6 c _ on the DC fan 'listen to generate a large wind blowing to the Wei system (10) 2, the motherboard 丄 3 'fast The purpose of heat dissipation and air circulation; if the heat dissipation device 3' is installed in the hollow portion 2, the heat dissipation device 3' of the continuation 3 2 is attached to the electrical system 2, the motherboard 13 by the heat dissipation fins 3 2, and then The heat dissipating fins 3 2 absorb the hot air in the accommodating space i , and quickly dissipate them outwards, and can also reach the function of the electric secret 2 and the rapid cooling of the main board 13 . The heat dissipating device 3 can also be scattered. The fresh plate 3 3 is provided with a plurality of heat dissipation holes 3 3 于 on the heat dissipation cover plate 3 3 , and is accelerated by the plurality of heat dissipation holes 3 3 1 The speed of the convection of the internal air and the external air in the space 1i has the effect of assisting the electric system 12 and the main board 13 to quickly dissipate heat. Please refer to the fifth and sixth figures, which is a perspective exploded view of another embodiment of the creation. In a side view of the embodiment, the heat dissipating cover plate 3 of the heat dissipating device 3 is provided with a cooling fan 3 i (DC fan) that can hold the remaining 16 6 ^ ^ 6 cnmji and dissipates the heat dissipating fan 31 The cover plate 33 is fixed to the hollow portion 21 of the side cover 2. 俾 The cooling fan 3 i is in the housing space of the casing i. The main system 1 2 blows cold air, that is, utilizes The heat-dissipating cover plate 3 3 φ is used to convect the hot air in the accommodating space 11 to convect the hot air in the accommodating space 11 , so that the electrical system 12 and the main board of the accommodating space 11 can be more quickly! 3 Perform heat dissipation. The above description is only a preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. The housing heat sink of the present invention utilizes the side cover 2 of the casing 1 to be provided with a hollow portion. The heat dissipating device 3 can be disposed at the hollow portion 21, such as the political fan 3 1 , the heat dissipating fins 3 2 or the heat dissipating cover plate 3 3 , etc., so that the lion can dissipate heat and heat the inner space 11 of the casing 1 . Air and outside air catch 9 M288949 Convection 'can be used in the electrical system in the accommodating space 11 2, the main board i 3 auxiliary scatter effectively enables the housing 1 to accommodate the space 11 rapid heat dissipation function, so the above effect can be achieved Qing _ _ _ New Zealand, this _ secret decoration and equivalent structural changes, are included in the creation of the patent model _, combined with Chen Ming. The heat dissipation structure of the housing of the present invention is actually made (4), and has the following advantages, such as: () the side cover of the machine is configured to dissipate heat relative to the electrical system, the motherboard, and the heat dissipation device Auxiliary heat dissipation for the electronic recording system and the main board to dissipate the hot air generated during operation, reduce the operating temperature of the electrical system and the main board, and extend the service life. (2) 2 If the department's accommodating clock can rely on the auxiliary heat of the equipment, the hot air in the accommodating workshop will convect with the outside air, that is, the speed of the air will dissipate the heat inside the space. Therefore, the main purpose of this creation is to provide auxiliary heat dissipation for the electrical system and the motherboard inside the electronic device. The electric m-board of the extremely operating towel can quickly dissipate heat, reduce the temperature of the work, and prolong the service life. Protection focus, in order to make the electronic device reach the function of rapid heat dissipation, only the above is only the better implementation of this creation _ already, _ this is the patent of the ship creation, so the use of this creation to say that the financial simplicity is appropriate The succinct decoration and the equivalent appearance are all included in the special H of the abstract and combined with Chen Ming. As stated on the wire, the heat dissipation structure of the above-mentioned electronic device is used in the case of 10 M288949
’為確實能達到其魏及目的，故本 作，為符合新型專利之申要 提出、-貫用性優異之創 日賜、隹太安、 卞犮依去提出申請，盼審委早 稽疑/主一，^保障創作人之辛苦創作，倘若鈞局審委有任何 曰 明不吝來函指示，創作人定當竭力配合，至感德便。 11 M288949 【圖式簡單說明】 第一圖係為本創作之立體外觀圖。 第二圖係為本創作之立體分解圖。 第二A圖為本創作之散熱設備立體分解圖。 第三圖係為本創作侧視剖面圖。 第四圖係為本創作較佳實施例立體分解圖。 第五圖係為本創作再一實施例之立體分解圖。 第六圖係為本創作又一實施例之侧視剖面圖。 【主要元件符號說明】 1、 機殼 13、 主機板 14、 散熱孔 3 3、散熱罩板 3 31、散熱孔 1 1、容置空間 12、電氣系統 2、 侧蓋板 2 1、鏤空部 3、 散熱裝置 31、散熱風扇 3 2、散熱鰭片 12'In order to achieve its Wei and its purpose, this book is intended to meet the requirements of the new patent, and to create an application with excellent pertinence, such as Chuang Shi, 隹 Taian, and Yi Yi. / The main one, ^ protect the creator's hard work, if the ruling board has any instructions, the creator will try his best to cooperate, to the sense of virtue. 11 M288949 [Simple description of the diagram] The first picture is a three-dimensional appearance of the creation. The second picture is a three-dimensional exploded view of the creation. The second A picture is an exploded view of the heat dissipation device of the creation. The third figure is a side view of the creation. The fourth figure is an exploded perspective view of a preferred embodiment of the present invention. The fifth drawing is a perspective exploded view of still another embodiment of the present creation. Figure 6 is a side cross-sectional view of yet another embodiment of the present invention. [Main component symbol description] 1. The casing 13, the main board 14, the heat dissipation hole 3 3, the heat dissipation cover plate 31, the heat dissipation hole 1 1, the accommodation space 12, the electrical system 2, the side cover 2, and the hollow portion 3 , heat sink 31, cooling fan 3 2, heat sink fins 12