CN102933044A - Electronic device and machine shell thereof - Google Patents

Electronic device and machine shell thereof Download PDF

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Publication number
CN102933044A
CN102933044A CN2011102268514A CN201110226851A CN102933044A CN 102933044 A CN102933044 A CN 102933044A CN 2011102268514 A CN2011102268514 A CN 2011102268514A CN 201110226851 A CN201110226851 A CN 201110226851A CN 102933044 A CN102933044 A CN 102933044A
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CN
China
Prior art keywords
louvre
casing
millimeter
electronic installation
louvres
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Granted
Application number
CN2011102268514A
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Chinese (zh)
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CN102933044B (en
Inventor
黄意惠
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Acer Inc
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Acer Inc
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Publication date
Application filed by Acer Inc filed Critical Acer Inc
Priority to CN201110226851.4A priority Critical patent/CN102933044B/en
Publication of CN102933044A publication Critical patent/CN102933044A/en
Application granted granted Critical
Publication of CN102933044B publication Critical patent/CN102933044B/en
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Abstract

The invention relates to an electronic device, which comprises a machine shell and a main body, wherein the machine shell comprises a first part and a second part; the first part is provided with a plurality of first radiating holes, and the second part is provided with a plurality of second radiating holes; the aperture of each first radiating hole and the aperture of each second radiating hole range from 0.08 to 0.2 millimeter; the main body is arranged in the machine shell; and radiating airflow enters the machine shell from the first radiating holes to flow through the main body and is discharged from the machine shell by the second radiating holes. According to the electronic device, the radiating holes in the machine shell have small apertures, so that users cannot observe the radiating holes by naked eyes. Therefore, the radiating holes can be positioned at any positions of the machine shell and does not influence the appearance of the electronic device, so that the radiating design of the electronic device is not limited to improve the radiating efficiency and beautify the appearance of the electronic device. In addition, the radiating holes have small apertures, so that external liquid cannot enter the inside of the machine shell from the radiating holes to improve a waterproof effect.

Description

Electronic installation and casing thereof
Technical field
The present invention relates to a kind of electronic installation and casing thereof, and be particularly related to a kind of electronic installation and have the casing of louvre.
Background technology
Along with advancing by leaps and bounds of electronics technology, various electronic products day by day popularly are applied in the middle of our work and life.The electronic component of electronic product inside can produce heat energy when moving.For guaranteeing the normal operation of electronic component, generally can form louvre at the casing of electronic product, so that the heat energy that produces during the electronic component operation is suitable for being taken away by radiating airflow by louvre.Take notebook computer (Notebook Computer) and panel computer (Tablet PC) as example, its inner central processing unit (Central Processing Unit, CPU) when operation, can produce a large amount of heat energy, therefore need to form louvre at the casing of notebook computer or panel computer, so that central processing unit is dispelled the heat.
In order to keep the attractive in appearance of electronic product, the louvre on the casing need be formed on the position that does not affect outward appearance, and therefore the heat dissipation design of electronic product also is restricted, so that radiating efficiency can't obtain further lifting.
Summary of the invention
The invention provides a kind of electronic installation, the size of the louvre of its casing is less and do not affect outward appearance.
The invention provides a kind of casing, the size of its louvre is less and do not affect outward appearance.
The present invention proposes a kind of electronic installation, comprises casing and main body.Casing comprises first and second portion.First has a plurality of the first louvres.Second portion has a plurality of the second louvres.The aperture of each first louvre and each the second louvre is between 0.08 millimeter and 0.2 millimeter.Main body is disposed in the casing.Radiating airflow is suitable for entering the casing main body of flowing through by the first louvre, and is suitable for discharging from casing by the second louvre.
The present invention proposes a kind of casing, is applicable to electronic installation.Electronic installation comprises main body.Main body is disposed in the casing.Casing comprises first and second portion.First has a plurality of the first louvres.Second portion has a plurality of the second louvres.The aperture of each first louvre and each the second louvre is between 0.08 millimeter and 0.2 millimeter.Radiating airflow is suitable for entering the casing main body of flowing through by the first louvre, and is suitable for discharging from casing by the second louvre.
In one embodiment of this invention, the thickness of above-mentioned first is between 0.5 millimeter and 2 millimeters.
In one embodiment of this invention, the thickness of above-mentioned second portion is between 0.5 millimeter and 2 millimeters.
In one embodiment of this invention, the distance between above-mentioned each first louvre and adjacent another first louvre is between 0.2 millimeter and 0.24 millimeter.
In one embodiment of this invention, the distance between above-mentioned each second louvre and adjacent another second louvre is between 0.2 millimeter and 0.24 millimeter.
In one embodiment of this invention, above-mentioned main body comprises heat dissipation element.The first louvre or the second louvre are to being positioned at heat dissipation element.
In one embodiment of this invention, above-mentioned heat dissipation element is radiator fan.
In one embodiment of this invention, above-mentioned main body comprises heater element.The first louvre or the second louvre are to being positioned at heater element.
In one embodiment of this invention, above-mentioned heater element is central processing unit.
Based on above-mentioned, the louvre on the casing of the present invention has less aperture, allows the user can't be to be observed visually louvre.By this, louvre can be positioned at the optional position on the casing and can not affect the outward appearance of electronic installation, and the heat dissipation design of electronic installation more is not restricted, and then improving heat radiation efficiency and promote the attractive in appearance of electronic installation.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the rearview of the electronic installation of one embodiment of the invention.
Fig. 2 is the partial sectional view of the electronic installation of Fig. 1.
Fig. 3 is the partial sectional view of the electronic installation of another embodiment of the present invention.
The main element symbol description:
100,200: electronic installation
110,210: casing
112: first
112a, 212a: the first louvre
114: second portion
114a, 214a: the second louvre
120,220: main body
122: motherboard
124: heater element
224: heat dissipation element
D1, D2: aperture
F1, F2: radiating airflow
L1, L2: distance
W1, W2: thickness
Embodiment
Fig. 1 is the rearview of the electronic installation of one embodiment of the invention.Fig. 2 is the partial sectional view of the electronic installation of Fig. 1.Please refer to Fig. 1 and Fig. 2, the electronic installation 100 of present embodiment comprises casing 110 and main body 120.Main body 120 is disposed in the casing 110.Casing 110 comprises first 112 and second portion 124, and first 112 has a plurality of the first louvre 112a, and second portion 114 has a plurality of the second louvre 114a.The aperture D2 of the aperture D1 of each first louvre 112a and each the second louvre 114a is between 0.08 millimeter and 0.2 millimeter.Radiating airflow F1 is suitable for entering casing 110 main body 120 of flowing through by the first louvre 112a, and is suitable for discharging from casing 110 by the second louvre 114a, so that the heat energy of main body 120 is taken away by radiating airflow F1.
Under this configuration mode, the first louvre 112a and the second louvre 114a on the casing 110 have less aperture, allow the user can't be to be observed visually the first louvre 112a and the second louvre 114a.By this, the first louvre 112a and the second louvre 114a can be positioned at the optional position on the casing 110 and can not affect the outward appearance of electronic installation 100, the heat dissipation design of electronic installation 100 more is not restricted, and then improving heat radiation efficiency and promote the attractive in appearance of electronic installation 100.In addition, because the first louvre 112a and the second louvre 114a have less aperture, extraneous liquid is difficult to enter casing 110 inside by the first louvre 112a and the second louvre 114a, and can promote waterproof effect.
Furthermore, can be with casing 110 in the Thickness Design of first 112 and second portion 114 for thinner, so that radiating airflow F1 is easy to by the first louvre 112a and the second louvre 114a by casing 110.Specifically, the thickness W1 of first 112 and the thickness W2 of second portion 114 are for example between 0.5 millimeter and 2 millimeters, and the other parts of casing 110 can have thicker thickness, to keep the structural strength of casing 110.In addition, distance L 1 between each first louvre 112a and adjacent another the first louvre 112a is for example between 0.2 millimeter and 0.24 millimeter, and the distance L 2 between each second louvre 114a and adjacent another the second louvre 114a is for example between 0.2 millimeter and 0.24 millimeter, so that the distribution of the first louvre 112a is comparatively intensive, and make the distribution of the second louvre 114a comparatively intensive, but and the circulation efficiency of heat radiation air-flow F1.
In other embodiments, first 112 can be positioned at other position on the casing 110 and can have other shape and the expanded range of size, so that the first louvre 112a has different distributions.Second portion 114 can be positioned at other position on the casing 110 and can have other shape and the expanded range of size, so that the second louvre 114a has different distributions.
The electronic installation 100 of present embodiment for example is panel computer.In other embodiments, electronic installation 100 also can be notebook computer, Smartphone or other electronic installation, and the present invention is not limited this.In addition, as shown in Figure 2, the main body 120 of present embodiment comprises motherboard 122 and heater element 124, heater element 124 for example is central processing unit and is disposed on the motherboard 122, and to being positioned at the first louvre 112a, make radiating airflow F1 be flowed directly to heater element 124 after entering casing 110 by the first louvre 112a, the heat energy that produces with heater element 124 operation the time is taken away.In other embodiments, heater element 124 also can be to being positioned at the second louvre 114a, directly discharge from casing 110 by the second louvre 114a afterwards so that radiating airflow F1 receives the heat energy of heater element 124, the present invention does not limit the relative position of heater element 124, the first louvre 112a and the second louvre 114a.
Fig. 3 is the partial sectional view of the electronic installation of another embodiment of the present invention.Please refer to Fig. 3, the main body 220 of the electronic installation 200 of present embodiment comprises heat dissipation element 224, and heat dissipation element 224 is for example for radiator fan and to being positioned at the first louvre 212a on the casing 210, and in order to produce radiating airflow F2.Radiating airflow F2 enters casing 210 so that the heater element (not shown) in the casing 210 are dispelled the heat by the first louvre 212a, and discharges from casing 210 by the second louvre 214a.In other embodiments, heat dissipation element 224 also can be to being positioned at the second louvre 214a, directly discharge from casing 210 by the second louvre 214a afterwards so that radiating airflow F2 receives the heat energy of heater element, the present invention does not limit the relative position of heat dissipation element 224, the first louvre 212a and the second louvre 214a.
In sum, the louvre on the casing of the present invention has less aperture, allows the user can't be to be observed visually louvre.By this, louvre can be positioned at the optional position on the casing and can not affect the outward appearance of electronic installation, and the heat dissipation design of electronic installation more is not restricted, and then improving heat radiation efficiency and promote the attractive in appearance of electronic installation.In addition, because louvre has less aperture, extraneous liquid is difficult to enter casing inside by louvre, and can promote waterproof effect.
Although the present invention discloses as above with embodiment, so it is not to limit the present invention, any under those of ordinary skill in the technical field, when can doing a little change and retouching, and do not break away from the spirit and scope of the present invention.

Claims (18)

1. electronic installation comprises:
One casing comprises:
One first has a plurality of the first louvres; And
One second portion has a plurality of the second louvres, wherein respectively this first louvre and respectively the aperture of this second louvre between 0.08 millimeter and 0.2 millimeter; And
One main body is disposed in this casing, and wherein a radiating airflow is suitable for entering this casing this main body of flowing through by those the first louvres, and is suitable for discharging from this casing by those the second louvres.
2. electronic installation according to claim 1, wherein the thickness of this first is between 0.5 millimeter and 2 millimeters.
3. electronic installation according to claim 1, wherein the thickness of this second portion is between 0.5 millimeter and 2 millimeters.
4. electronic installation according to claim 1, wherein respectively the distance between this first louvre and adjacent another this first louvre between 0.2 millimeter and 0.24 millimeter.
5. electronic installation according to claim 1, wherein respectively the distance between this second louvre and adjacent another this second louvre between 0.2 millimeter and 0.24 millimeter.
6. electronic installation according to claim 1, wherein this main body comprises a heat dissipation element, those first louvres or those the second louvres are to being positioned at this heat dissipation element.
7. electronic installation according to claim 6, wherein this heat dissipation element is radiator fan.
8. electronic installation according to claim 1, wherein this main body comprises a heater element, those first louvres or those the second louvres are to being positioned at this heater element.
9. electronic installation according to claim 8, wherein this heater element is central processing unit.
10. a casing is applicable to an electronic installation, and this electronic installation comprises a main body, and this main body is disposed in this casing, and this casing comprises:
One first has a plurality of the first louvres; And
One second portion, have a plurality of the second louvres, wherein respectively this first louvre and respectively the aperture of this second louvre between 0.08 millimeter and 0.2 millimeter, one radiating airflow is suitable for entering this casing this main body of flowing through by those the first louvres, and is suitable for discharging from this casing by those the second louvres.
11. casing according to claim 10, wherein the thickness of this first is between 0.5 millimeter and 2 millimeters.
12. casing according to claim 10, wherein the thickness of this second portion is between 0.5 millimeter and 2 millimeters.
13. casing according to claim 10, wherein respectively the distance between this first louvre and adjacent another this first louvre between 0.2 millimeter and 0.24 millimeter.
14. casing according to claim 10, wherein respectively the distance between this second louvre and adjacent another this second louvre between 0.2 millimeter and 0.24 millimeter.
15. casing according to claim 10, wherein this main body comprises a heat dissipation element, and those first louvres or those the second louvres are to being positioned at this heat dissipation element.
16. casing according to claim 15, wherein this heat dissipation element is radiator fan.
17. casing according to claim 10, wherein this main body comprises a heater element, and those first louvres or those the second louvres are to being positioned at this heater element.
18. casing according to claim 17, wherein this heater element is central processing unit.
CN201110226851.4A 2011-08-09 2011-08-09 Electronic installation and casing thereof Active CN102933044B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110226851.4A CN102933044B (en) 2011-08-09 2011-08-09 Electronic installation and casing thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110226851.4A CN102933044B (en) 2011-08-09 2011-08-09 Electronic installation and casing thereof

Publications (2)

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CN102933044A true CN102933044A (en) 2013-02-13
CN102933044B CN102933044B (en) 2016-10-12

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2429861Y (en) * 1999-11-11 2001-05-09 李小军 Positive pressure air-cooling dustproofing device for computer
CN2435780Y (en) * 1999-11-18 2001-06-20 高向鹏 Air filtering device for electronic computer
TWM288949U (en) * 2005-11-03 2006-03-21 Ping-Chun Chu Case cooling structure of electronic device
CN2911775Y (en) * 2006-06-22 2007-06-13 伟训科技股份有限公司 Air conductive tube device of computer host
CN201194451Y (en) * 2008-02-25 2009-02-11 艾默生网络能源有限公司 Heat radiating machine case
CN201503563U (en) * 2009-04-10 2010-06-09 和硕联合科技股份有限公司 desktop minicomputer
CN201523420U (en) * 2009-09-25 2010-07-07 深圳速浪数字技术有限公司 Radiating structure for digital television modulator
CN102023688A (en) * 2010-12-20 2011-04-20 东莞市金翔电器设备有限公司 Computer chassis with good heat dispersion performance
CN102054401A (en) * 2010-11-17 2011-05-11 深圳中电数码显示有限公司 Display terminal

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2429861Y (en) * 1999-11-11 2001-05-09 李小军 Positive pressure air-cooling dustproofing device for computer
CN2435780Y (en) * 1999-11-18 2001-06-20 高向鹏 Air filtering device for electronic computer
TWM288949U (en) * 2005-11-03 2006-03-21 Ping-Chun Chu Case cooling structure of electronic device
CN2911775Y (en) * 2006-06-22 2007-06-13 伟训科技股份有限公司 Air conductive tube device of computer host
CN201194451Y (en) * 2008-02-25 2009-02-11 艾默生网络能源有限公司 Heat radiating machine case
CN201503563U (en) * 2009-04-10 2010-06-09 和硕联合科技股份有限公司 desktop minicomputer
CN201523420U (en) * 2009-09-25 2010-07-07 深圳速浪数字技术有限公司 Radiating structure for digital television modulator
CN102054401A (en) * 2010-11-17 2011-05-11 深圳中电数码显示有限公司 Display terminal
CN102023688A (en) * 2010-12-20 2011-04-20 东莞市金翔电器设备有限公司 Computer chassis with good heat dispersion performance

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