‘ M282984 3、創作說明（1) 【新型所屬之技術領域】 本創作係有關一種應用在電鍍槽的授拌技術，尤其針 對電鍍槽内部用以提高電鍍液活動性的攪拌裝置加以改良 ，旨在提供一種有效降低電鍍液當中所沉殿的雜質被攪動 的攪拌裝置。 先前技術 按，一般電鍍加工主 極間 且還 的金 持續 電鍍 拌、 極表 佈、 輸入電壓後，吸 原後鍍著於陰極 屬再溶解，提供 進行，直到被鑛 常見的電鍍條件 位置（電流分佈） 空氣攪拌、陰極 面之氫氣泡反應 消除燒焦現象、 第一圖所示，即為 ，此 有一 少設4 0 機所 習用的攪拌裝置 個空氣管2〇， 引電 所接 電解 物上 不外 等； 攪拌 ，進 改善 種習 主要 並且 有一個排渣管3 0 ， 再回到電鍍槽1 0中 在進行電鍍作業時， 產生的空氣導入電鍍 要係透過電 解液中的金 續的被鍍物 液更多的金 沉積足夠的 乎電流密度 其中，改善 、超音波攪 而提升了電 錫鉛選鍍界 用電鍍槽攪 係在電鍍槽 在電鍍槽1 其排渣管3 解過程，在陽極與陰 屬離子游至陰極，並 上，同時陽極所接續 屬離子，使電解過程 鍍層為止。 、攪拌、電流波形、 攪拌條件（如水流攪 拌）可以快速除去陰 鍍效率、改善膜厚分 面線等多項優點；如 拌裝置之結構示意圖 1 0的底部至少舖設 〇的底部設有下方至 ◦係通過一個過濾機 由空氣管2 0將泵浦或空氣壓縮 槽1 0中，透過空氣管2 0所排'M282984 3. Creation instructions (1) [Technical field to which the new type belongs] This creation relates to a mixing technology applied to electroplating tanks, especially for agitating devices in the electroplating tanks to improve the activity of electroplating baths. Provided is an agitating device which can effectively reduce the agitation of impurities in the plating bath. According to the previous technology, in the general electroplating process, the gold is continuously electroplated and mixed between the main electrodes, the electrode surface cloth, and the input voltage. After absorption, it is plated and re-dissolved in the cathode, and it is provided until the position of the common plating conditions (current Distribution) Air agitation, hydrogen bubble reaction on the cathode surface to eliminate the phenomenon of scorching, as shown in the first picture, that is, there is a small number of air tubes 20, which are used for agitating devices commonly used in 40 machines. Nothing more; Stirring, improving and improving the seed habit and having a slag discharge tube 3 0, and then returning to the plating tank 10. During the plating operation, the air introduced into the plating should be passed through the gold in the electrolyte. More gold deposit in the plating solution is more than the current density. Among them, the improvement and ultrasonic stirring have improved the electrotin-lead selective plating boundary. The electroplating tank is stirred in the electroplating tank in the electroplating tank 1 and the slag discharge tube 3 is decomposed. The anode and the anion ions swim to the cathode and up, and at the same time, the anode is connected to the ions, so that the electroplating process is completed. , Stirring, current waveform, stirring conditions (such as water flow stirring) can quickly remove the negative plating efficiency, improve the film thickness facet, and many other advantages; such as the schematic diagram of the structure of the mixing device 10 at least the bottom of the bottom 0 is set to the bottom The pump or air compression tank 10 is discharged through the air pipe 20 through a filter, and is discharged through the air pipe 20
第5頁 、M282984 _四、創作說明（2) 出的氣泡產生加速電鍍液活動性的攪拌作用，以提高電鍍 效率，並由排渣管將電鍍液導引至過濾機4 0循環過濾， 以去除電鍍槽1 0當中的雜質。 然而，電鍍槽1 0當中的雜質多係沉澱在電鍍槽1 0 的底部，非常容易被空氣管2 0所排出的氣泡帶起，並且 附著在被鍍物6 0的表面，進而影響被鍍物6 0之電鍍品 質。 【新型内容】 有鑑於此，本創作即針對上述習用攪拌裝置之結構加 以改良，整個攪拌裝置同樣係在電鍍槽的底部至少舖設有 ¥ —個空氣管，以及至少設有一個排渣管；其.中，每一個空 氣管的下方係襯設一個引流板，另外在電鍍槽底部空餘的 位置舖設有攔渣閘。 - 據以，在進行電鍍作業時，除了可透過空氣管所排出 的氣泡，產生加速電鍍液活動性的攪拌作用，以提高電鍍 '效率之外，更可以在引流板的襯設下，避免沉澱在電鍍槽 底部的雜質被氣泡攪動，以及由攔渣閘將電鍍液當中所沉 澱的雜質限制在電鍍槽底部，以確保被鍍物的電鍍品質。 【實施方式】 本創作「電鍍槽之攪拌裝置」，其整個攪拌裝置之基 本結構組成如第二圖及第三圖所示，係在電鍍槽1 〇的底 _部至少舖設有一個空氣管2 0 ，以及至少設有一個排渣管 30 ，由空氣管2 0將泵浦或空氣壓縮機所產生的空氣導 入電鍍槽1 0中，透過空氣管2 0所排出的氣泡產生加速Page 5, M282984 _IV. Creation instructions (2) The bubbles produced have a stirring effect that accelerates the electroplating solution's mobility to improve the efficiency of electroplating, and the electroplating solution is guided by the slag discharge pipe to the filter for 40 cycles of filtration to Remove impurities in the plating bath 10. However, most of the impurities in the plating tank 10 are deposited on the bottom of the plating tank 10, which is very easy to be carried by the air bubbles discharged from the air pipe 20, and adheres to the surface of the plating object 60, thereby affecting the plating object. 6 0 plating quality. [New content] In view of this, this creation is to improve the structure of the above-mentioned conventional stirring device. The entire stirring device is also laid with at least ¥-one air pipe and at least one slag discharge pipe at the bottom of the plating tank; In the lower part of each air pipe, a drainage plate is lined. In addition, a slag blocking gate is laid at the empty position at the bottom of the plating tank. -According to this, in the electroplating operation, in addition to the air bubbles discharged through the air pipe, it can stir the electroplating solution to accelerate the mobility of the electroplating solution, so as to improve the efficiency of electroplating. It can also prevent the precipitation under the lining of the drainage plate. Impurities at the bottom of the plating tank are stirred by bubbles, and impurities deposited in the plating solution are restricted to the bottom of the plating tank by a slag gate to ensure the plating quality of the plated object. [Embodiment] The "stirring device of the electroplating tank" of this creation, the basic structure of the entire stirring device is shown in the second and third figures, and at least one air pipe 2 is laid at the bottom of the electroplating tank 10 0, and at least one slag discharge pipe 30 is provided. The air pipe 20 directs the air generated by the pump or the air compressor into the plating tank 10, and the air bubbles discharged through the air pipe 20 accelerate.
第6頁 M282984 四、創作說明（3) 電鍍液活動 過濾機4 0 的雜質。 其重點 流板5 1 ， 閘5 2 ，而 引流板5 1 管2 0則與 中，引流板 以阻擋空氣 質；另外， 狀結構體， 縫隙5 2 2 在具體 四圖所示， 設在電鍍槽 第五圖所示 在在電鈹槽 底座5 3定 裝強度較佳 據以， 過空氣管2 拌作用，以 設下，避免 性的攪拌作用 再送回電鍍槽 在於：每 個 另外在電鍍槽 各空氣管2 0 為直接焊接固 電鍍槽1 0扣 5 1係為戴面 管2 0所排放 攔渣閘5 2係 並且在溝槽5 ，由排渣管3 0將電鍍液導引至 10中，以去除電鍍槽10當中 空氣管2〇的下方係襯設一個引 1 0底部空餘的位置舖設有攔渣 與引流板5 1係為分離設置’其 定於電鍍槽1 0底部，而各空氣 接定位於引流板5 1之上方；其 呈半圓狀的板片結構體，主要用 的氣泡攪動電鍍槽1 0底部的雜 為排列有若干溝槽5 2 1的浪板 2 1的低點處設有供雜質通過的 實施時，引流 分別為不同的 的底部使用， 板5 1與攔渣閘5 2係可以如第 結構體，而以併靠組裝的方式舖 容易拆卸以及方便清洗，或是如 為一體加工成型的同一個結構體，直接舖設 其攔渣閘5 2高點下方係利用一 0底部，如第六圖所示，使其組 的底部使用， 位於電鍍槽1 在進行電鍍作 0所排出的氣 提高電鍍效率 沉澱在電鍍槽 業時，如第三圖所示，除了可透 泡，產生加速電鍍液活動性的攪: 之外，更可以在引流板5 1的襯 1 0底部的雜質被氣泡攪動，以Page 6 M282984 Fourth, the creation instructions (3) Electroplating bath activities The impurities in the filter 40. The main flow plate 5 1, the gate 5 2, and the drainage plate 5 1 and the tube 2 0 are in between. The drainage plate blocks the air quality. In addition, the shape of the structure, the gap 5 2 2 is shown in the specific four figures, and is provided in the electroplating. As shown in the fifth figure of the tank, the mounting strength of the base 3 of the electric beryllium tank is better. Based on the air tube, the mixing effect is set to avoid the stirring effect and then sent back to the plating tank. Each air pipe 20 is a direct welding solid plating bath 1 0 buckle 5 1 is a slag gate 5 2 which is discharged by the wearing tube 2 0 and is in the groove 5, and the slag discharge pipe 30 guides the plating solution to 10 In order to remove the bottom of the air pipe 20 in the electroplating tank 10, a slag block and a drainage plate 5 are laid at the bottom of the vacant bottom. The slag block and the drainage plate 5 are laid separately. It is set at the bottom of the plating tank 10, and each The air is positioned above the drainage plate 51; its plate structure is semi-circular, and the air bubbles at the bottom of the plating tank 1 are mainly used to stir the low point of the wave plate 21 with a plurality of grooves 5 2 1 When the implementation is provided for the passage of impurities, the drainage is used for different bottoms, plate 51 and slag blocking. The 5 2 series can be used as the first structure, and it can be easily disassembled and cleaned by assembly, or the same structure can be formed as a whole, and the slag gate 5 can be laid directly under the 2 high point. The bottom of 0, as shown in the sixth figure, is used at the bottom of the group. It is located in the plating tank 1. When the gas exhausted during the electroplating is 0, the plating efficiency is improved. As shown in the third figure, Bubbles, which can accelerate the activity of the plating solution: In addition, impurities at the bottom of the lining 1 0 of the drainage plate 5 1 can be stirred by the bubbles to
第7頁 M282984 g、創作說明（4) 及由攔渣閘5 2將電鍍液當中所沉澱的雜質限制在電鍍槽 1 0底部，以確保被鍍物6 0的電鍍品質。 如上所述，本創作提供一較佳可行之電鍍槽攪拌裝置 ，爰依法提呈新型專利之申請；惟，以上之實施說明及圖 式所示，係本創作較佳實施例者，並非以此侷限本創作， 是以，舉凡與本創作之構造、裝置、特徵等近似、雷同者 ，均應屬本創作之創設目的及申請專利範圍之内。 ΦPage 7 M282984 g, creation instructions (4) and the slag-blocking gate 5 2 limit the impurities deposited in the plating solution to the bottom of the plating tank 10 to ensure the plating quality of the substrate 60. As mentioned above, this creation provides a better and feasible electroplating tank agitation device, and submits an application for a new patent according to law; however, the above implementation description and diagrams are for the preferred embodiment of this creation, and not based on The limitation of this creation is that all similarities and similarities in the structure, installation, and characteristics of this creation should fall within the scope of the creation purpose and patent application scope of this creation. Φ
第8頁 M282984 圖式簡單說明 【圖式簡單說明】 第一圖係為一種習用電鍍槽攪拌裝置之結構示意圖圖。 第二圖係為本創作之攪拌裝置平面結構俯視圖。 第三圖係為本創作之攪拌裝置結構剖視圖。 第四圖係為本創作第一實施例之引流板與攔渣閘之使用 置狀態圖。 第五圖係為本創作第二實施例之引流板與攔渣閘之使用 置狀態圖。 第六圖係為本創作之另一攪拌裝置結構剖視圖。 【主要元件代表符號說明】 10 2 0 3 0- 4 0 5 1 5 2 電鍍槽 —空氣管 排渣管 過渡機 —弓1流板 --攔渣閘 5 2 1 - -溝槽 5 2 2 - -縫隙 5 3----底座 6 0----被鑛物Page 8 M282984 Simple description of the drawings [Simple illustration of the drawings] The first diagram is a schematic diagram of the structure of a conventional electroplating tank stirring device. The second figure is a plan view of the planar structure of the mixing device for this creation. The third figure is a cross-sectional view of the structure of the mixing device of this creation. The fourth picture is a state diagram of the use of the drainage plate and the slag gate in the first embodiment of the creation. The fifth picture is a state diagram of the use of the drainage plate and the slag gate in the second embodiment of the creation. The sixth figure is a cross-sectional view of the structure of another stirring device of this creation. [Description of symbols of main components] 10 2 0 3 0- 4 0 5 1 5 2 Plating tank—air pipe slag discharge pipe transition machine—bow 1 flow plate—slag gate 5 2 1--groove 5 2 2- -Gap 5 3 ---- Base 6 0 ---- Mineral
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