JP2001200394A - Plating treatment device - Google Patents
Plating treatment deviceInfo
- Publication number
- JP2001200394A JP2001200394A JP2000009598A JP2000009598A JP2001200394A JP 2001200394 A JP2001200394 A JP 2001200394A JP 2000009598 A JP2000009598 A JP 2000009598A JP 2000009598 A JP2000009598 A JP 2000009598A JP 2001200394 A JP2001200394 A JP 2001200394A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- plating
- plating solution
- jig
- outlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、シリンダブロック
のような円筒状に形成された被処理物の内周面に高速度
のメッキ処理を施すことができるメッキ処理装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus capable of performing a high-speed plating process on an inner peripheral surface of a processing object formed in a cylindrical shape such as a cylinder block.
【０００２】[0002]
【従来の技術】通常、シリンダブロックのような筒状の
被処理物に電気メッキを施す場合、生産性を高めるため
に電流密度を高くしたり、電極と被処理物の内面との極
間距離を小さくすることによって高速メッキを施すこと
がある。まず、電流密度を高くする場合について説明す
る。例えば、メッキ被膜として、Ｎｉ−Ｐ−ＳｉＣ、又
はＮｉ−ＳｉＣの形でＳｉＣを析出させる場合、メッキ
液の流れが不均一であるとＳｉＣの析出も不均一とな
り、シリンダの耐摩耗性に問題が生じる。また、高電流
密度では、メッキ液の流れの遅い部位において、いわゆ
る、こげと呼ばれるメッキ被膜の異常析出が生じるおそ
れがある。2. Description of the Related Art Usually, when electroplating a cylindrical workpiece such as a cylinder block, the current density is increased in order to increase the productivity, or the distance between the electrode and the inner surface of the workpiece is increased. In some cases, high-speed plating may be performed by reducing the size of the substrate. First, the case where the current density is increased will be described. For example, when depositing SiC in the form of Ni-P-SiC or Ni-SiC as a plating film, if the flow of the plating solution is not uniform, the deposition of SiC will also be uneven, causing a problem in the wear resistance of the cylinder. Occurs. In addition, at a high current density, abnormal deposition of a plating film, which is called burn, may occur in a portion where the flow of the plating solution is slow.
【０００３】また、電極と被処理物との極間距離を小さ
くすると、被処理物と陽極との間隙におけるメッキ液の
流れが不均一になりやすく、こげなどのメッキ不良が発
生し、良好なメッキを施すことができない。さらに、従
来は、らす網状のチタンバスケット中に溶解性のニッケ
ルペレットを収納した陽極を使用している。しかし、該
陽極の外周面は波状に形成されているため、極間距離が
１〜５ｍｍと狭い場合は、陽極の外周面における波状の
形状によって被処理物の内周面に形成されるメッキ被膜
の膜厚が不均一となるため、良好なメッキ処理を施すこ
とができない。これらの不具合は、極間距離を小さくし
て、陽極と被処理物の内面との距離を小さくするほど、
メッキ液の不均一な流れによる悪影響が出やすい。よっ
て、メッキ液の流れの均一化が非常に重要となる。この
メッキ液の流れに均一化を図る従来の技術として、特公
平８−１６２７８号公報に記載されたものがある。しか
し、上述した高速メッキに用いるには、未だ不十分であ
り、更なるメッキ液の流れの均一化が要求される。な
お、多気筒シリンダブロックにメッキを施す場合、他の
気筒と干渉しないような構造である必要がある。If the distance between the electrode and the object is reduced, the flow of the plating solution in the gap between the object and the anode tends to be non-uniform, and poor plating such as burns occurs. Cannot be plated. Further, conventionally, an anode in which soluble nickel pellets are contained in a braided mesh titanium basket is used. However, since the outer peripheral surface of the anode is formed in a wavy shape, if the distance between the electrodes is as narrow as 1 to 5 mm, the plating film formed on the inner peripheral surface of the object to be processed due to the wavy shape on the outer peripheral surface of the anode Therefore, good plating cannot be performed because the film thickness becomes uneven. These problems are caused by reducing the distance between the electrodes and decreasing the distance between the anode and the inner surface of the workpiece.
An adverse effect due to uneven flow of the plating solution is likely to occur. Therefore, it is very important to make the flow of the plating solution uniform. As a conventional technique for making the flow of the plating solution uniform, there is a technique described in Japanese Patent Publication No. H8-16278. However, it is still insufficient for use in the above-mentioned high-speed plating, and further uniform flow of the plating solution is required. When plating is performed on a multi-cylinder cylinder block, it is necessary to have a structure that does not interfere with other cylinders.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記課題を
解決し、陽極と被処理物の間にメッキ液を均一に流すこ
とができ、多気筒のシリンダブロックにも適用可能なメ
ッキ処理装置を提供することを目的とする。DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems and provides a plating apparatus capable of uniformly flowing a plating solution between an anode and an object to be processed, and applicable to a multi-cylinder cylinder block. The purpose is to provide.
【０００５】[0005]
【課題を解決するための手段】本発明に係るメッキ処理
装置は、上記目的を達成するため、筒状の被処理物と中
空に形成された内部をメッキ液が送給される陽極とに電
流を流した状態で、メッキ液槽から陽極内部にメッキ液
を送り、該陽極の上端から被処理物の内部に排出し、陽
極の外面と被処理物の内面との間にメッキ液を流し、更
に陽極の外面と出口側治具の内面との間にメッキ液を流
したのちメッキ液槽に戻すことによって、被処理物の内
面にメッキを施すメッキ処理装置において、上記陽極の
うち、出口側治具の中空部に収納された下部側陽極の径
を、上記被処理物の内部に収納された上部側陽極の径よ
りも小さく形成している。上記メッキ処理装置によれ
ば、陽極の外面と出口側治具の内面との極間距離は、陽
極の外面と被処理物の内面との極間距離よりも小さく形
成されているため、出口側治具内でバッファ効果を生
じ、被処理物の内部をメッキ液が均一に流れるよにな
る。このため、高速メッキを施す場合に、こげ等のメッ
キ不良を抑制することができ、処理時間の短縮及び処理
コストの削減を図ることができる。なお、上記メッキ処
理装置としては、例えば、その上面に筒状の被処理物を
載置する、内方が中空部に形成された出口側治具と、該
出口側治具の中空部内に、その上端が出口側治具の上面
よりも突出するように配設された筒状の陽極と、該陽極
及び出口側治具に配管を介して接続されたメッキ液槽と
を備え、上記出口側治具の上面に筒状の被処理物を載置
して該被処理物の内部に陽極の上部側を配置させる構造
が好ましい。In order to achieve the above object, a plating apparatus according to the present invention provides an electric current flowing between a cylindrical object to be processed and an anode through which a plating solution is fed through a hollow interior. With the flowing, the plating solution is sent from the plating solution tank to the inside of the anode, discharged from the upper end of the anode to the inside of the object to be processed, and the plating solution is caused to flow between the outer surface of the anode and the inner surface of the object to be processed. Further, in the plating apparatus for plating the inner surface of the workpiece by flowing the plating solution between the outer surface of the anode and the inner surface of the outlet side jig and then returning to the plating solution tank, the outlet side of the anode The diameter of the lower anode housed in the hollow portion of the jig is formed smaller than the diameter of the upper anode housed inside the object. According to the plating apparatus, the pole distance between the outer surface of the anode and the inner surface of the outlet-side jig is formed smaller than the pole distance between the outer surface of the anode and the inner surface of the workpiece. A buffer effect is generated in the jig, and the plating solution flows uniformly inside the object. For this reason, when performing high-speed plating, plating defects such as burns can be suppressed, and processing time and processing cost can be reduced. In addition, as the plating apparatus, for example, a cylindrical workpiece is placed on the upper surface thereof, an outlet jig formed inside the hollow part, and a hollow part of the outlet jig, A cylindrical anode disposed so that the upper end thereof protrudes from the upper surface of the outlet-side jig; and a plating solution tank connected to the anode and the outlet-side jig via piping. It is preferable that a cylindrical workpiece is placed on the upper surface of the jig, and the upper side of the anode is arranged inside the workpiece.
【０００６】また、本発明の一態様に係るメッキ処理装
置は、上記陽極に不溶性陽極を用いている。この不溶性
陽極を合わせて用いると、極間距離を更に小さくするこ
とができるため、メッキ処理時間が更に短縮できる。例
えば、被処理物にシリンダブロックを用いた場合、従来
の極間距離は５ｍｍ以上必要であったが、本発明によれ
ば、１〜５ｍｍまで極間距離を狭めることができる。さ
らに、本発明の別の態様に係るメッキ処理装置は、上記
上部側陽極と下部側陽極とを分割可能に構成している。
このため、陽極をメンテナンスする場合に、上部側の
み、又は下部側のみを取り替えることができて非常に便
利である。なお、本発明の更に別の態様に係るメッキ処
理装置は、上記出口側治具の中空部及び陽極を複数設け
ることによって、多気筒エンジンにもメッキを施すこと
ができるように構成している。[0006] The plating apparatus according to one aspect of the present invention uses an insoluble anode as the anode. If this insoluble anode is used in combination, the distance between the electrodes can be further reduced, so that the plating time can be further reduced. For example, when a cylinder block is used as an object to be processed, a conventional gap distance of 5 mm or more is required. According to the present invention, the gap distance can be reduced to 1 to 5 mm. Furthermore, the plating apparatus according to another aspect of the present invention is configured such that the upper anode and the lower anode can be divided.
Therefore, when the anode is maintained, only the upper side or only the lower side can be replaced, which is very convenient. The plating apparatus according to still another aspect of the present invention is configured so that a multi-cylinder engine can be plated by providing a plurality of hollow portions and anodes of the outlet side jig.
【０００７】[0007]
【発明の実施の形態】以下に、本発明の実施形態に係る
メッキ処理装置について、図面を用いて詳細に説明す
る。 ［メッキ処理装置の構成］本発明の実施形態に係るメッ
キ処理装置１は、図１に示すように、内方が中空部に形
成された出口側治具３と、該出口側治具３の中空部５に
配設され、その上端６が出口側治具３の上面８よりも突
出した円筒状の陽極１０と、該陽極１０及び出口側治具
３に配管１２，１３を介して接続されたメッキ液槽１５
と、被処理物であるシリンダブロック１７及び陽極１０
に連結した電源１９，２０とを備えている。上記出口側
治具３は、筒状に形成された側面２２と底面２３によっ
て囲まれており、側面２２の上面８には薄いシール材２
５が配設されている。このシール材２５としては、弾性
を有し、被処理物１７との密閉性を保持できるものが好
ましい。また、出口側治具３の下部には、メッキ液流出
口２６が設けられており、該メッキ液流出口２６から配
管１２を介してメッキ液槽１５に連結されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a plating apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. [Configuration of Plating Apparatus] As shown in FIG. 1, a plating apparatus 1 according to an embodiment of the present invention includes an outlet jig 3 having a hollow inside, and an outlet jig 3 A cylindrical anode 10, which is disposed in the hollow portion 5 and whose upper end 6 protrudes from the upper surface 8 of the outlet side jig 3, is connected to the anode 10 and the outlet side jig 3 via pipes 12 and 13. Plating bath 15
And the cylinder block 17 and the anode 10 to be processed
And power supplies 19 and 20 connected to the power supply. The outlet side jig 3 is surrounded by a cylindrical side surface 22 and a bottom surface 23, and the upper surface 8 of the side surface 22 has a thin sealing material 2.
5 are provided. As the sealing material 25, a material having elasticity and capable of maintaining the sealing property with the object 17 is preferable. Further, a plating solution outlet 26 is provided below the outlet side jig 3, and is connected to the plating solution tank 15 via the pipe 12 from the plating solution outlet 26.
【０００８】また、陽極１０は、内部が中空になった円
筒状に形成されており、被処理物１７及び出口側治具３
の中空部２８，５をそれぞれ貫通するように上下方向に
配設されている。この陽極１０は不溶性陽極であり、上
部側と下部側に２分割され、それぞれ脱着可能に構成さ
れている。この下部側に配設された下部側陽極３０の上
端３０ａは、出口側治具３の上面８とほぼ高さが同じで
あり、上部側に配設された上部側陽極３１の上端６は、
被処理物であるシリンダブロック１７のクランクケース
部３３の端縁３３ａとほぼ同じ高さに位置している。上
記下部側陽極３０の径は、上部側陽極３１の径よりも小
さく形成されており、この径の差異は、下部側陽極３０
の方が上部側陽極３１よりも僅かでも小さければ良い
が、その寸法差は１０ｍｍ以上が好ましい。上記陽極１
０としては、例えば、チタンからなる円筒状基材の表面
に白金をメッキしたもの、チタンからなる円筒状基材の
表面に白金からなる薄板を接着させたクラッド材とした
もの、又はチタンからなる円筒状基材の表面に酸化イリ
ジウム膜をコーティングしたものなどを好適に用いるこ
とができる。The anode 10 is formed in a cylindrical shape having a hollow inside, and is provided with a workpiece 17 and an outlet jig 3.
Are vertically arranged so as to penetrate through the hollow portions 28 and 5 respectively. The anode 10 is an insoluble anode, is divided into an upper part and a lower part, and is configured to be detachable. The upper end 30a of the lower anode 30 disposed on the lower side has substantially the same height as the upper surface 8 of the outlet jig 3, and the upper end 6 of the upper anode 31 disposed on the upper side has
It is located at substantially the same height as the edge 33a of the crankcase portion 33 of the cylinder block 17, which is the workpiece. The diameter of the lower anode 30 is formed smaller than the diameter of the upper anode 31.
May be slightly smaller than the upper anode 31, but the dimensional difference is preferably 10 mm or more. The above anode 1
As 0, for example, a material obtained by plating platinum on the surface of a cylindrical substrate made of titanium, a material made of a clad material in which a thin plate made of platinum is adhered to the surface of a cylindrical substrate made of titanium, or made of titanium A material obtained by coating a surface of a cylindrical substrate with an iridium oxide film can be suitably used.
【０００９】従って、上部側陽極３１の外周面と被処理
物１７の内面との間隔（距離）である極間距離は、下部
側電極３０の外周面と出口側治具３の内面との間隔（距
離）である極間距離よりも小さく形成されている。例え
ば、上部側陽極３１は、シリンダブロック１７のシリン
ダボア内面から１〜５ｍｍの間隔を隔てた状態で、か
つ、シリンダボア内面とほぼ平行に配設されている。さ
らに、下部側陽極３０の下端部には、メッキ液流入口３
５が設けられている。なお、メッキ液槽１５には、上述
したように、上記出口側治具３のメッキ液流出口２６か
ら延設された配管１２が連結されており、また、メッキ
液槽１５からポンプ３６を介して下部側陽極３０の下端
部まで配管１３が接続されている。これによって、メッ
キ液槽１５から陽極１０にメッキ液３８が送給され、被
処理物１７の内面にメッキ処理を施したのち、メッキ液
槽１５に戻るように構成されている。Therefore, the distance between the electrodes, which is the distance (distance) between the outer peripheral surface of the upper anode 31 and the inner surface of the workpiece 17, is the distance between the outer peripheral surface of the lower electrode 30 and the inner surface of the outlet jig 3. (Distance) is formed smaller than the distance between the poles. For example, the upper anode 31 is disposed at a distance of 1 to 5 mm from the inner surface of the cylinder bore of the cylinder block 17 and substantially parallel to the inner surface of the cylinder bore. Further, the lower end of the lower anode 30 is provided with a plating solution inlet 3.
5 are provided. The pipe 12 extending from the plating solution outlet 26 of the outlet side jig 3 is connected to the plating solution tank 15 as described above. The pipe 13 is connected to the lower end of the lower anode 30. Thus, the plating solution 38 is supplied from the plating solution tank 15 to the anode 10, the plating process is performed on the inner surface of the workpiece 17, and the plating solution 38 returns to the plating solution tank 15.
【００１０】［被処理物］上記メッキ処理装置１によっ
て処理可能な被処理物は、図１に示すように、例えばシ
リンダブロック１７のような円筒形状の部品であり、そ
の円筒状の内面にメッキ処理を施すものである。このシ
リンダブロック１７は、図１に示すように、上下方向を
逆にした状態でメッキ処理装置１に取り付けられてい
る。つまり、シリンダブロック１７は、車両搭載状態に
おいては、下部が外方に広がったクランクケース部３３
であり、上部がシリンダヘッド部であり、該シリンダヘ
ッド部の内方に、図示しないピストンを摺動可能に収納
するシリンダボアが形成されている。従って、シリンダ
ブロック１７を上下逆にすると、上側がクランクケース
部３３であり、下側がシリンダヘッド部になっている。
このシリンダブロック１７のシリンダヘッド面を出口側
治具３の上面８に配設したシール材２５に当接させ、ク
ランクケース部３３の下面をシール部材４０に当接する
ことによって、シリンダブロック１７の上端と下端は共
に密閉されている。なお、上記した上部側陽極３１は、
シリンダボアの内面に対向した高さに設けられている。[Workpiece] The work piece which can be processed by the plating apparatus 1 is, as shown in FIG. 1, a cylindrical part such as a cylinder block 17, for example. Processing is performed. As shown in FIG. 1, the cylinder block 17 is attached to the plating apparatus 1 in a state where the cylinder block 17 is turned upside down. That is, when the cylinder block 17 is mounted on the vehicle, the lower portion of the crankcase portion 33 extends outward.
The upper part is a cylinder head part, and a cylinder bore for slidably storing a piston (not shown) is formed inside the cylinder head part. Therefore, when the cylinder block 17 is turned upside down, the upper side is the crankcase section 33 and the lower side is the cylinder head section.
The upper end of the cylinder block 17 is brought into contact by bringing the cylinder head surface of the cylinder block 17 into contact with the sealing material 25 disposed on the upper surface 8 of the outlet side jig 3 and the lower surface of the crankcase portion 33 with the sealing member 40. And the lower end are both sealed. In addition, the above-mentioned upper side anode 31
It is provided at a height facing the inner surface of the cylinder bore.
【００１１】上記構成を有するメッキ処理装置１による
メッキ液３８の流れ及びその作用を以下に説明する。な
お、本発明において高速メッキとは、１００（Ａ／ｄｍ
2 ）以上の高い電流密度で行う高速度のメッキ処理のこ
とである。まず、ポンプ３６の駆動力によって、メッキ
液槽１５から配管１３を介して下部側陽極３０にメッキ
液３８が流れる。この下部側陽極３０と上部側陽極３１
は、内部が中空部に形成されているため、メッキ液３８
が下部側陽極３０の内部から上部側陽極３１の内部に上
昇し、上部側陽極３１の上端６に設けられた開口部から
シリンダブロック１７のクランクケース部３３の内部に
向けて排出される。このクランクケース部３３の内部に
は、メッキ液３８が一時的に溜まり、クランクケース内
部はいわゆるバッファ効果としての役割をするため、メ
ッキ液３８の流れが均一化する。こののち、メッキ液３
８は上部側陽極３１とシリンダボアの内面との間から下
方に流れる。上述したように、下部側陽極３０の極間距
離は上部側陽極３１における極間距離よりも大きく、下
部側陽極３０と出口側治具３との間でも、バッファ効果
によって、メッキ液３８が均一にかつスムーズに流れ
る。これらの２つのバッファ効果による相乗効果でクラ
ンクケース内部から出口側治具３までのメッキ液３８の
流れを均一に確保することができる。なお、出口側治具
３と下部側陽極３０との極間距離を大きくすることで、
シリンダブロック１７の他気筒との干渉もなく、多気筒
エンジンにも適用することができる。The flow and operation of the plating solution 38 by the plating apparatus 1 having the above configuration will be described below. In the present invention, high-speed plating means 100 (A / dm.
2 ) High-speed plating at a high current density. First, the plating solution 38 flows from the plating solution tank 15 to the lower anode 30 via the pipe 13 by the driving force of the pump 36. The lower anode 30 and the upper anode 31
Since the inside is formed in a hollow portion, the plating solution 38
Rises from the inside of the lower anode 30 to the inside of the upper anode 31, and is discharged from the opening provided at the upper end 6 of the upper anode 31 toward the inside of the crankcase 33 of the cylinder block 17. The plating solution 38 temporarily accumulates inside the crankcase portion 33, and the inside of the crankcase serves as a so-called buffer effect, so that the flow of the plating solution 38 is uniform. After this, plating solution 3
8 flows downward from between the upper anode 31 and the inner surface of the cylinder bore. As described above, the distance between the poles of the lower anode 30 is greater than the distance between the poles of the upper anode 31, and the plating solution 38 is uniform between the lower anode 30 and the outlet jig 3 due to the buffer effect. It flows smoothly and smoothly. By the synergistic effect of these two buffer effects, the flow of the plating solution 38 from the inside of the crankcase to the outlet jig 3 can be secured uniformly. By increasing the distance between the exit side jig 3 and the lower side anode 30,
The cylinder block 17 can be applied to a multi-cylinder engine without interference with other cylinders.
【００１２】[0012]
【実施例】［実施例１］次いで、実施例によって本発明
を説明する。図１と図２に示すメッキ処理装置１，５１
を用いて、種々の電流密度においてシリンダブロック１
７の内面にメッキを施した。図１は、上述したように、
上部側陽極３１よりも径が小さい下部側陽極３０を有す
るメッキ処理装置１である。これに対する比較例とし
て、上部側陽極３１と略同一の径の下部側陽極５３を有
するメッキ処理装置５１を図２に示す。なお、図２のメ
ッキ処理装置５１の構造は、下部側陽極５３を除いて、
全て図１のメッキ処理装置１と同一構造である。メッキ
の処理条件において、メッキ液３８の平均流速を共に
１．７ｍ／ｓに一定に保持し、図１の装置における上部
側陽極３１、及び図２の装置における上部側陽極３１と
下部側陽極５３の極間距離を全て５ｍｍに設定した。ま
た、電流密度は、１００，１２０，１５０（Ａ／ｄ
ｍ2 ）の３つの条件で行った。これらの結果を表１に示
す。[Embodiment 1] Next, the present invention will be described with reference to embodiments. 1 and 2 shown in FIGS. 1 and 2
At various current densities using the cylinder block 1
7 was plated. FIG. 1, as described above,
The plating apparatus 1 includes a lower anode 30 having a smaller diameter than the upper anode 31. As a comparative example, a plating apparatus 51 having a lower anode 53 having substantially the same diameter as the upper anode 31 is shown in FIG. The structure of the plating apparatus 51 shown in FIG.
All have the same structure as the plating apparatus 1 of FIG. Under the plating conditions, the average flow rate of the plating solution 38 was kept constant at 1.7 m / s, and the upper anode 31 in the apparatus of FIG. 1 and the upper anode 31 and the lower anode 53 in the apparatus of FIG. Were all set to 5 mm. The current density is 100, 120, 150 (A / d
m 2 ). Table 1 shows the results.
【００１３】[0013]
【表１】 [Table 1]
【００１４】丸印は、こげ等のメッキ不良が発生せずに
良好であったもの、バツ印は、メッキ不良が発生したも
のである。ここで、「こげ」とは、Ｎｉの供給が間に合
わないと水素イオンが発生し、近傍がアルカリになっ
て、Ｎｉ（ＯＨ）x ができて黒くなってしまうメッキ不
良のことであり、メッキ液３８の流れが滞留する部位に
発生し易い。The circles indicate that the plating was good without any defective plating such as burning, and the crosses indicate that the plating was defective. Here, the term "burn" refers to a plating defect in which hydrogen ions are generated when the supply of Ni is not in time, the vicinity becomes alkali, Ni (OH) x is formed, and the plating solution becomes black. 38 is likely to be generated at the portion where the flow stays.
【００１５】この表１によれば、本発明に係るメッキ処
理装置１を用いれば、電流密度が１００〜１５０（Ａ／
ｄｍ2 ）のいずれでもこげが発生せずに良好であった。
この形状の陽極１０によって、高速度メッキが可能にな
り、こげの発生も抑制することができ、良好なシリンダ
ブロック１７のメッキ処理が可能となった。これに対し
て、比較例に係るメッキ処理装置５１を用いると、１２
０，１５０（Ａ／ｄｍ 2 ）の高電流密度においてこげが
発生した。このこげは、メッキ液３８の流れが不均一で
流速が遅い部位において発生したものであり、また、比
較例では、メッキ液３８の流れが不均一のため、ＳｉＣ
の共析も不均一であった。According to Table 1, the plating treatment according to the present invention is performed.
When the processing device 1 is used, the current density is 100 to 150 (A /
dmTwo) Was good without causing burns.
This shape of the anode 10 enables high-speed plating.
Good cylinder.
The plating process of the block 17 has become possible. In contrast
When the plating apparatus 51 according to the comparative example is used,
0,150 (A / dm TwoAt high current density)
Occurred. This burn is caused by uneven flow of the plating solution 38.
It is generated at the site where the flow velocity is low, and
In the comparative example, since the flow of the plating solution 38 was not uniform, the SiC
Was also non-uniform.
【００１６】実施例１によれば、下部側陽極５３の径を
細く形成することによって、極間距離が１〜５ｍｍにお
いてもメッキ液３８の流れが均一になる。また、陽極１
０の外周面を波状等の凹凸がない平坦な不溶性陽極を用
いることによって、陽極１０の各部位における被処理物
１７との極間距離が一定になり、膜厚も均一でこげが発
生しない良好なメッキ被膜を得ることが可能になった。According to the first embodiment, by making the diameter of the lower anode 53 small, the flow of the plating solution 38 becomes uniform even when the distance between the electrodes is 1 to 5 mm. In addition, anode 1
By using a flat insoluble anode having no irregularities such as corrugations on the outer peripheral surface of 0, the distance between the anode 10 and the workpiece 17 at each part is constant, the film thickness is uniform, and no burning occurs. It has become possible to obtain an excellent plating film.
【００１７】［実施例２］次いで、陽極の形状としては
図１を用い、陽極のみを不溶性陽極又はチタンバスケッ
トに変えたものを用いて、シリンダブロック１７にメッ
キ処理を施した。また、メッキ処理の処理条件におい
て、メッキ液３８の平均流速を共に１．７ｍ／ｓに一定
に保持した。その結果を表２に示す。Example 2 Next, as shown in FIG. 1, the cylinder block 17 was subjected to plating using only the anode as an insoluble anode or a titanium basket. Further, under the plating conditions, the average flow rate of the plating solution 38 was kept constant at 1.7 m / s. Table 2 shows the results.
【００１８】[0018]
【表２】 [Table 2]
【００１９】不溶性陽極の場合、１００〜１５０（Ａ／
ｄｍ2 ）のいずれの電流密度においても、こげ等のメッ
キ不良が発生せず、良好なメッキ処理を行うことができ
た。しかし、チタンバスケットの場合、１２０〜１５０
（Ａ／ｄｍ2 ）において、こげ等のメッキ不良が発生し
た。また、チタンバスケットの外周面の形状は、波状に
形成されており寸法精度が良好でないため、極間距離が
小さいと陽極と被処理物とが短絡するおそれがある。こ
のため、極間距離を５ｍｍよりも大きくする必要があ
る。In the case of an insoluble anode, 100 to 150 (A /
In any of the current densities of dm 2 ), plating failures such as burns did not occur, and good plating treatment could be performed. However, for titanium baskets, 120-150
At (A / dm 2 ), plating defects such as burns occurred. Further, since the shape of the outer peripheral surface of the titanium basket is formed in a wave shape and the dimensional accuracy is not good, if the distance between the electrodes is small, the anode and the object to be processed may be short-circuited. For this reason, it is necessary to make the distance between the poles larger than 5 mm.
【００２０】[0020]
【発明の効果】本発明によれば、出口側治具内でバッフ
ァ効果を生じ、被処理物の内部をメッキ液が均一に流れ
るため、高速メッキを施す場合に、こげ等のメッキ不良
を抑制することができ、処理時間の短縮及び処理コスト
の削減を図ることができる。According to the present invention, a buffer effect is generated in the outlet side jig, and the plating solution flows uniformly inside the object to be processed. Therefore, when performing high-speed plating, plating defects such as burns are suppressed. The processing time and the processing cost can be reduced.
【図１】本発明に係る、下部側陽極の径が上部側陽極よ
りも小さいメッキ処理装置を示す断面図である。FIG. 1 is a sectional view showing a plating apparatus according to the present invention, in which a diameter of a lower anode is smaller than that of an upper anode.
【図２】下部側と上部側とが同じ径を有する陽極を採用
したメッキ処理装置を示す断面図である。FIG. 2 is a cross-sectional view showing a plating apparatus employing an anode in which a lower side and an upper side have the same diameter.
１ メッキ処理装置 ３ 出口側治具 ５ 中空部 ６，２８ 上端 ８ 上面 １０ 陽極 １５ メッキ液槽 １７ シリンダブロック（被処理物） ２２ 側面 ２３ 底面 ２５ シール材 ２６ メッキ液排出口 ３０ 下部側陽極 ３１ 上部側陽極 ３５ メッキ液流入口 ４０ シール部材 DESCRIPTION OF SYMBOLS 1 Plating apparatus 3 Outlet-side jig 5 Hollow part 6, 28 Upper end 8 Top surface 10 Anode 15 Plating liquid tank 17 Cylinder block (object to be processed) 22 Side surface 23 Bottom surface 25 Seal material 26 Plating liquid discharge port 30 Lower anode 31 Upper part Side anode 35 Plating solution inlet 40 Sealing member
Claims (4)
をメッキ液が送給される陽極とに電流を流した状態で、
メッキ液槽から陽極内部にメッキ液を送り、該陽極の上
端から被処理物の内部に排出し、陽極の外面と被処理物
の内面との間にメッキ液を流し、更に陽極の外面と出口
側治具の内面との間にメッキ液を流したのちメッキ液槽
に戻すことによって、被処理物の内面にメッキを施すメ
ッキ処理装置において、 上記陽極のうち、出口側治具の中空部に収納された下部
側陽極の径を、上記被処理物の内部に収納された上部側
陽極の径よりも小さく形成したことを特徴とするメッキ
処理装置。1. A state in which a current is passed between a cylindrical object to be processed and an anode to which a plating solution is supplied through a hollow interior,
The plating solution is sent from the plating solution tank to the inside of the anode, discharged from the upper end of the anode to the inside of the object to be processed, the plating solution flows between the outer surface of the anode and the inner surface of the object to be processed, and further, the outer surface of the anode and the outlet In the plating apparatus for plating the inner surface of the object to be processed by flowing the plating solution between the inner surface of the side jig and returning the plating solution to the plating solution tank, in the hollow portion of the outlet side jig of the anode, A plating apparatus, wherein the diameter of the stored lower anode is smaller than the diameter of the upper anode stored inside the object to be processed.
徴とする請求項１に記載のメッキ処理装置。2. The plating apparatus according to claim 1, wherein an insoluble anode is used as the anode.
能に構成したことを特徴とする請求項１又は２に記載の
メッキ処理装置。3. The plating apparatus according to claim 1, wherein the upper anode and the lower anode are configured to be splittable.
設けることによって、多気筒エンジンにもメッキを施す
ことができるように構成したことを特徴とする請求項１
〜３のいずれかに記載のメッキ処理装置。4. The multi-cylinder engine can be plated by providing a plurality of hollow portions and anodes of the outlet side jig.
4. The plating apparatus according to any one of claims 1 to 3.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000009598A JP3835099B2 (en) | 2000-01-19 | 2000-01-19 | Plating equipment |
| DE10102145A DE10102145B4 (en) | 2000-01-19 | 2001-01-18 | Electroplating pretreatment device and plating treatment device |
| US09/765,742 US6383348B2 (en) | 2000-01-19 | 2001-01-19 | Plating pretreatment apparatus and plating treatment apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000009598A JP3835099B2 (en) | 2000-01-19 | 2000-01-19 | Plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001200394A true JP2001200394A (en) | 2001-07-24 |
| JP3835099B2 JP3835099B2 (en) | 2006-10-18 |
Family
ID=18537727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000009598A Expired - Lifetime JP3835099B2 (en) | 2000-01-19 | 2000-01-19 | Plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3835099B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010084186A (en) * | 2008-09-30 | 2010-04-15 | Suzuki Motor Corp | Plating pretreatment apparatus and method for cylinder block |
| JP2015132017A (en) * | 2013-12-20 | 2015-07-23 | ハウメット コーポレイションＨｏｗｍｅｔ Ｃｏｒｐｏｒａｔｉｏｎ | Internal turbine component electroplating |
| JP2016008328A (en) * | 2014-06-25 | 2016-01-18 | 日立オートモティブシステムズ株式会社 | Method and apparatus for anodic oxidation treatment of cylinder member |
| CN111321452A (en) * | 2018-12-17 | 2020-06-23 | 联合汽车电子有限公司 | Deep inner hole part rack plating structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101608388B1 (en) | 2013-12-02 | 2016-04-04 | 한국표준과학연구원 | Apparatus for electrodeposition |
-
2000
- 2000-01-19 JP JP2000009598A patent/JP3835099B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010084186A (en) * | 2008-09-30 | 2010-04-15 | Suzuki Motor Corp | Plating pretreatment apparatus and method for cylinder block |
| JP2015132017A (en) * | 2013-12-20 | 2015-07-23 | ハウメット コーポレイションＨｏｗｍｅｔ Ｃｏｒｐｏｒａｔｉｏｎ | Internal turbine component electroplating |
| JP2016008328A (en) * | 2014-06-25 | 2016-01-18 | 日立オートモティブシステムズ株式会社 | Method and apparatus for anodic oxidation treatment of cylinder member |
| CN111321452A (en) * | 2018-12-17 | 2020-06-23 | 联合汽车电子有限公司 | Deep inner hole part rack plating structure |
| CN111321452B (en) * | 2018-12-17 | 2021-06-08 | 联合汽车电子有限公司 | Deep inner hole part rack plating structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3835099B2 (en) | 2006-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101054701B (en) | Method of increasing electroplating evenness | |
| JPH1180989A (en) | Plating apparatus | |
| JP6222145B2 (en) | Metal film forming apparatus and film forming method | |
| US6663758B2 (en) | Method and apparatus for producing electrolytic copper foil | |
| US6383348B2 (en) | Plating pretreatment apparatus and plating treatment apparatus | |
| US4045304A (en) | High speed nickel plating method using insoluble anode | |
| KR101623869B1 (en) | Electric plating apparatus with horizontal cell | |
| JP2001200394A (en) | Plating treatment device | |
| CN201626987U (en) | Electroplating equipment | |
| CN103233250A (en) | Method for electroplating goldfinger with thick gold layer | |
| JP2001200391A (en) | Plating pretreatment device | |
| JP3915762B2 (en) | Partial plating equipment | |
| JPH10310896A (en) | Composite plating apparatus for inside surface of cylindrical body | |
| JP2014214375A (en) | Cylinder block, apparatus and method for plating treatment of cylinder block | |
| CN211689284U (en) | Double-layer titanium mesh anode for horizontal electroplating of PCB | |
| JP6552485B2 (en) | Plating equipment and storage tank | |
| JP4035434B2 (en) | Electrolytic copper foil manufacturing method and apparatus used therefor | |
| JP2002004095A (en) | Insoluble anode and power feeding method for the same | |
| JPH0831834A (en) | Semiconductor wafer plating method | |
| JP2006328470A (en) | Electroplating apparatus | |
| JPS6274529A (en) | Electrolytic processing method | |
| JP2001342589A (en) | Method and apparatus for manufacturing copper foil | |
| JP3351710B2 (en) | Plating method | |
| KR101068625B1 (en) | Method of Uniform Film Metal Layer Formation Using Electroplating | |
| KR100634446B1 (en) | Wafer plating apparatus for improving process uniformity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040802 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060414 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060612 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060704 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060717 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 3835099 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313532 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090804 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100804 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110804 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110804 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120804 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120804 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130804 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130804 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140804 Year of fee payment: 8 |
|
| EXPY | Cancellation because of completion of term |