TW202006194A - Agitating device of electroplating system - Google Patents

Abstract

The present invention relates to an electroplating system. The system comprises a tank body having a bottom wall and a plurality of side walls extending upwardly from the bottom wall to define an interior chamber for accommodating an electroplating solution and a workpiece to be electroplated. The system further comprises an agitating device which includes a gas conduit and two liquid outlet tubes. The gas conduit is formed with a gas ejection zone, and the liquid outlet tubes are formed with a liquid ejection zone, respectively. The gas ejection zone and the liquid ejection zones are so arranged beneath the workpiece that the gas ejection zone overlaps with the workpiece in the vertical direction, and the liquid ejection zones are arranged along both sides of the gas ejection zone. By introducing a gas through the gas ejection zone and by introducing a liquid through the liquid ejection zones, the electroplating solution is agitated and disturbed, the electroplating efficiency is enhanced and the thickness distribution of the electroplated film is improved.

Description

Stirring device of electroplating system

The invention relates to a stirring device of an electroplating system, in particular to a stirring device that uses more active and reliable means to improve electroplating efficiency and improve film thickness distribution.

The electroplating system is an electrolytic reaction, which uses the electrolytic reaction to plate one metal on the surface of another metal to form a metal shell film. We call this process electroplating. The electroplating technology is widely used in various applications and different fields. From the early aesthetic-oriented decorative applications, such as the formation of a glossy film on the surface of the container, it has gradually developed into today's high-tech industries, such as semiconductor manufacturing processes, is an indispensable technology in today's technology industry .

Common electroplating conditions are nothing more than current density, agitation, current waveform, electroplating position (current distribution), etc.; among them, improved agitation conditions (such as water flow agitation, air agitation, cathode agitation, ultrasonic agitation) can quickly remove hydrogen on the cathode surface The bubble reaction further improves the plating efficiency, improves the film thickness distribution, eliminates the scorch phenomenon, and improves the tin-lead selective plating interface line.

The current electroplating equipment, for example, "Mixing Device for Electroplating Bath" of Republic of China Patent No. M282984, as shown in FIG. 7, is mainly provided with at least one air pipe 62 at the bottom of the electroplating bath 61, under each air pipe 62 The lining is provided with a drainage plate 63. During the electroplating operation, the air generated by the pump or the air compressor is introduced into the electroplating tank 61 by the air tube 62, and the air bubbles discharged through the air tube 62 accelerate the activity of the electroplating solution. Stirring effect to improve the electroplating efficiency; however, in the above conventional electroplating equipment, two air pipes 62 are provided under the object 50 to be plated, and the two air pipes 62 are located relatively outside the object 50 to be plated. Part of the air bubbles generated by the air tube 62 will adhere to the surface of the object to be plated 50 during the floating process, which will cause the chemical reaction of the area where the air bubbles of the object to be plated 50 cannot be adhered to, and the formation of pits (commonly known as bullet holes) will affect The quality of the object to be processed, and the degree of agitation of the plating solution due to bubbles, is to make the plating solution exhibit temperature stratification, which also affects the progress of the chemical reaction, resulting in poor quality of the object 50 to be plated.

In view of this, the present invention provides a stirring device for an electroplating system, especially a stirring device that uses more active and reliable means to improve the plating efficiency and improve the film thickness distribution.

In the present invention, the electroplating system has a tank with a bottom wall and a plurality of side walls erected on the bottom wall, and a space for installing a plating solution and objects to be plated is enclosed by the bottom wall and the plurality of side walls. The stirring device includes at least: a gas duct penetrating through a side wall of the tank to inject a gas into the tank, the gas duct is provided with a gas ejection area, and the gas ejection area is disposed on the object to be plated Below and overlapping with the object to be plated, the gas ejection area has a plurality of downward gas outflow holes; and two water outlet pipes, which penetrate through one of the side walls of the tank and are close to the bottom wall, the water outlet pipe A liquid ejection area is provided to inject the plating solution into the tank. The liquid ejection areas of the two water outlet pipes are arranged under the object to be plated and are located on both sides of the gas ejection area respectively. The liquid ejection area has a plurality of A downward facing liquid outflow hole.

In the present invention, the gas ejection area is mainly arranged in the overlapping area under the object to be plated, and the liquid ejection areas of the two water outlet pipes are respectively located on both sides of the gas ejection area, and the gas ejection area is used to eject the gas and concentrate it on the object Directly below the plating, the liquids ejected from the liquid ejection areas on both sides are used to cause disturbance, and then the plating solution is stirred, which can improve the plating efficiency and improve the film thickness distribution.

In a preferred embodiment, a diffusion plate is further provided at the bottom wall of the tank, forming an accommodating space with the bottom wall, the gas ejection area and the liquid ejection area are located in the accommodating space The diffusion plate has a plurality of perforations, and the diffusion plate is also provided with at least one protruding portion, the protruding portion is directed toward the top of the groove body.

In a preferred embodiment, the protruding portion of the diffuser plate has a flat portion and a connecting portion connecting the protruding portion and the flat portion on both sides, and the protruding portion of the diffuser plate is relatively positioned under the object to be plated.

In a more preferred embodiment, the connecting portion is a slope.

In a preferred embodiment, the angle between the flat surface and the inclined surface is greater than 90 degrees and less than 180 degrees.

In a preferred embodiment, the connecting portion is a vertical plane.

In a preferred embodiment, the gas conduit is provided with two rows of gas outflow holes arranged along the longitudinal direction of the gas conduit, and the angle between the two rows of gas outflow holes is 90 degrees.

In a preferred embodiment, the stirring device is provided with two gas ejection areas, and they are respectively arranged inside the two liquid ejection areas.

In a more preferred embodiment, the outlet pipe is provided with two rows of liquid outflow holes arranged along the longitudinal direction of the outlet pipe, and the angle between the two rows of liquid outflow holes is 90 degrees.

Unless otherwise stated, the following terms used in the specification and patent scope of this application have the definitions given below. Please note that the singular term "a" used in the specification and patent scope of this application is intended to cover one or more of the items contained, such as at least one, at least two, or at least three, and does not mean to have only The single item contained. In addition, open connection terms such as "include", "have", etc. used in the scope of patent application mean that the combination of elements or components described in the request does not exclude other components or components not specified in the request. It should also be noted that the term "or" also generally includes "and/or" in the sense, unless the content clearly indicates otherwise. The term "about" used in the specification and patent scope of this application is used to modify any slight variation error, but such slight variation will not change its essence.

Please refer to FIG. 1, FIG. 2 and FIG. 3, the electroplating system of the present invention has a tank 10 for installing electroplating solution. The tank body 10 has a bottom wall 11 and a plurality of side walls 12 erected on the bottom wall 11. The bottom wall 11 and the plurality of side walls 12 form a space for mounting a plating solution and an object 50 to be plated.

The stirring device of the present invention at least includes: a gas duct 21 and two water outlet pipes 22, the gas duct 21 penetrates through a side wall 12 of the tank body 10 to inject a gas into the tank body 10, the gas duct 21 is provided with There is a gas ejection area 210 which is disposed under the object to be plated 50 and overlaps with the object to be plated 50. The gas ejection area 210 has a plurality of downward gas outflow holes 211. At least one power element (which can be a motor) is connected to the gas conduit to provide pressure to promote the flow of the gas.

The two water outlet pipes 22 are penetrated by one of the side walls 12 of the tank body 10 and are close to the bottom wall 11. The water outlet pipe 22 is provided with a liquid ejection area 220 to inject the plating solution into the tank body 10. The two water outlet pipes The liquid ejection region 220 of 22 is disposed below the object to be plated 50 and is located on both sides of the gas ejection region 210 respectively. The liquid ejection region 220 has a plurality of downward liquid outflow holes 221. At least one power element (which can be a motor) is connected to the water outlet pipe to provide pressure to promote the flow of the plating solution.

In the embodiment shown in the figure, the stirring device is provided with two gas ejection regions 210, which are respectively disposed inside the two liquid ejection regions 220, and a diffusion plate 30 is further provided in the plating tank, which is provided on the The tank 10 is close to the bottom wall 11 and forms an accommodating space 31 with the bottom wall 11. The gas ejection area 210 and the liquid ejection area 220 are located in the accommodating space 31. The diffusion plate 30 has a plurality of perforations 32.

When the electroplating system is actually used, the tank 10 is provided with a plating solution, and the anode plate extending into the tank 10 is impregnated with the plating solution, and then the object 50 to which the electroplating layer is attached is to be plated Suspended from the cathode plate and immersed in the electroplating solution, after the DC power is applied, the two anode plates will release electrons, and the positive ions of the electroplating solution will be reduced at the cathode end, and then the anode plate will The metal is electrolytically attached to the surface of the object 50 to form a plating layer. In the present invention, the gas ejection area 210 is mainly arranged in the overlapping area under the object 50 to be plated, and the liquid ejection areas 220 of the two water outlet pipes are located on both sides of the gas ejection area 210, respectively. The gas is sprayed and concentrated directly under the object to be plated 50, and the liquid sprayed by the liquid spraying regions 220 on both outer sides is used to cause disturbance, thereby forming a stirring effect on the plating solution, which can improve the plating efficiency and improve the film thickness distribution. Moreover, the plurality of bubbles are dispersed through the plurality of perforations 32 of the diffusion plate, which can slow down the power of the jet flow and achieve uniform diffusion, so as to improve the lack of uneven flow field during electroplating and improve the quality of electroplating.

As shown in FIG. 4, the gas duct 21 is provided with two rows of gas outflow holes 211 and liquid outflow holes 221 arranged in the longitudinal direction of the associated pipe body in the gas ejection area and the water outlet pipe 22 in the liquid ejection area, respectively. The angle A1 of the second row of gas outflow holes 211 is 90 degrees, and the angle A2 of the second row of liquid outflow holes 221 is 90 degrees.

In addition, as shown in FIG. 5 and FIG. 6, the diffusion plate 30 is also provided with at least one protruding portion 33 that faces toward the top of the tank 10, and the diffusion plate 30 has a protruding portion 33 and two The connecting portions 35 are respectively connected to the planar portions 34 on both sides thereof. In this embodiment, the connecting portion 35 is a slope, and the angle A3 between the planar portion 34 and the slope is greater than 90 degrees and less than 180 degrees. The angle between the plane portion 24 and the inclined surface is preferably 135 degrees. Although the description and drawings in this specification show that the inclined planes on both sides of the protrusion 33 are configured as a single inclined plane, both sides of the protrusion 33 may have various other configurations known to those skilled in the art. . For example, a plurality of slopes are connected in sequence, or the slopes on both sides of the protrusion 33 have different inclination angles.

In the above embodiment, the diffuser plate can also be as shown in the embodiment shown in FIG. 7, the diffuser plate 30 also has a protruding portion 33 and two flat portions 34 connected to both sides by a connecting portion 35, In this embodiment, the connecting portion 35 is a vertical plane, which can also achieve the effect of improving the lack of uneven flow field during electroplating and improving the quality of electroplating.

The above embodiments are only for illustrating the present invention, rather than limiting the present invention. Those skilled in the relevant arts, various changes or changes made without departing from the technical scope of the present invention should also fall within the protection scope of the present invention.

A1, A2, A3 ‧‧‧ included angle 10‧‧‧Slot body 11‧‧‧Bottom wall 12‧‧‧Side wall 21‧‧‧Gas conduit 210‧‧‧Gas ejection area 211‧‧‧Gas outflow hole 22‧‧‧ Outlet pipe 220‧‧‧Liquid ejection area 221‧‧‧ liquid outflow hole 30‧‧‧Diffusion plate 31‧‧‧accommodation space 32‧‧‧Perforation 33‧‧‧Projection 34‧‧‧ Plane Department 35‧‧‧Connect 50‧‧‧to be plated

Figure 1 is a schematic diagram of the structure of the electroplating system in the present invention; Figure 2 is a schematic diagram of the structure of another perspective of the electroplating system in the present invention; Figure 3 is a schematic diagram of the use of the electroplating system in the present invention; The figure shows an enlarged schematic view of the structure of the electroplating system in the present invention; Figure 5 shows the schematic view of the structure of the diffuser plate in the present invention; Figure 6 shows the perspective view of the structure of the diffuser plate in the present invention; and Figure 7 It is another perspective view of another structure of the diffusion plate in the present invention.

10‧‧‧Slot body

210‧‧‧Gas ejection area

211‧‧‧Gas outflow hole

220‧‧‧Liquid ejection area

30‧‧‧Diffusion plate

31‧‧‧accommodation space

32‧‧‧Perforation

50‧‧‧to be plated

Claims (9)

A stirring device for an electroplating system, the electroplating system has a tank body with a bottom wall and a plurality of side walls erected on the bottom wall, surrounded by the bottom wall and the plurality of side walls to form an electroplating solution and waiting In the space of the plating, the stirring device at least includes: a gas duct penetrated through a side wall of the tank to inject a gas into the tank, the gas duct is provided with a gas ejection area, and the gas ejection area is configured Below and overlapping with the object to be plated, the gas ejection area has a plurality of downward gas outflow holes; and two water outlet pipes, which penetrate through one of the side walls of the tank and approach the bottom wall The outlet pipe is provided with a liquid ejection area to inject the plating solution into the tank. The liquid ejection areas of the two outlet pipes are arranged under the object to be plated and are located on both sides of the gas ejection area. The liquid The ejection area has a plurality of downward liquid outflow holes. The stirring device of the electroplating system according to claim 1, wherein a diffusion plate is further provided, which is disposed near the bottom wall of the tank, and forms an accommodating space with the bottom wall, the gas ejection area and the liquid ejection area Located in the accommodating space, the diffusion plate has a plurality of perforations. The stirring device of the electroplating system according to claim 2, wherein the diffuser plate is also provided with at least one protruding portion, the protruding portion is directed toward the top of the tank, and the protruding portion of the diffuser plate has flat portions on both sides and connected to the The connecting part of the protruding part and the flat part, the protruding part of the diffusion plate is relatively located under the object to be plated. The stirring device of the electroplating system according to claim 3, wherein the connecting portion is a slope. The stirring device of the electroplating system according to claim 4, wherein the angle between the plane portion and the inclined surface is greater than 90 degrees and less than 180 degrees. The stirring device of the electroplating system according to claim 3, wherein the connecting portion is a vertical plane. The stirring device of the electroplating system according to any one of claims 1 to 6, wherein the gas ejection area is provided with two rows of gas outflow holes arranged along the longitudinal direction of the gas conduit, and the two rows of gas outflow holes The included angle is 90 degrees. The stirring device of the electroplating system according to any one of claims 1 to 6, wherein the stirring device is provided with two gas ejection regions, and is respectively arranged inside the two liquid ejection regions. The stirring device of the electroplating system according to any one of claims 1 to 6, wherein the liquid ejection area is provided with two rows of liquid outflow holes arranged along the longitudinal direction of the water outlet pipe, and the two rows of liquid outflow holes The included angle is 90 degrees.

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