TWM572375U - Gas stirrer for electroplating system - Google Patents

Abstract

In the present invention, the electroplating system has a tank for mounting a plating solution, and the gas agitating device comprises at least: a diffusion plate and a gas conduit, the diffusion plate is disposed near the bottom of the trough body, and forms a bottom portion of the trough body. a space, the diffusing plate has a plurality of perforations, and the diffusing plate is provided with at least one protruding portion facing the top of the trough; the gas conduit is penetrated by a wall surface of the trough to pass a gas Injecting the tank body, the portion of the gas conduit located below the diffuser plate is further provided with a plurality of downwardly facing gas outflow holes, in addition to the bubbles discharged through the plurality of gas outflow holes of the gas conduit, thereby generating a stirring effect for accelerating the activity of the plating solution. And through the shape design of the special diffusion plate can improve the lack of uneven flow field during plating to improve the plating quality.

Description

Gas mixing device for electroplating system

The present invention relates to a gas agitation device for an electroplating system, and more particularly to a gas agitation device which improves the electroplating quality by a more active and reliable means to improve the lack of uneven flow field during electroplating.

Electroplating is an electrolytic reaction in which a metal is plated on the surface of another metal by electrolytic reaction to form a metal casing film. We refer to such a process as electroplating. Electroplating technology is widely used in a variety of different applications and in different fields. From the early aesthetic-oriented decorative use, such as the formation of a glossy film on the surface of the container, it has gradually developed into a high-tech industry, such as semiconductor manufacturing process, is an indispensable technology in today's technology industry. .

Common plating conditions are nothing more than current density, stirring, current waveform, plating position (current distribution), etc. Among them, improving the stirring conditions (such as water flow stirring, air stirring, cathode stirring, ultrasonic stirring) can quickly remove the hydrogen on the cathode surface. The bubble reaction further improves the plating efficiency, improves the film thickness distribution, eliminates the scorch phenomenon, and improves the tin-lead selective plating interface line.

The electroplating treatment apparatus is provided with a plating liquid discharge device for discharging a plating solution at the bottom of the plating tank filled with the plating solution, and an air ejection device which is ejected by the plating liquid ejection device by air agitation discharged from the air ejection device. The plating solution, the object to be plated, such as a printed circuit board, is immersed in the plating solution. Since the plating liquid is stirred by the air ejected from the air ejecting device as it rises to the liquid surface along the printed circuit board, the plating liquid uniformly contacts the printed circuit board without deviation, so that the concentration gradient of the metal ions is reduced on the surface of the printed circuit board. A uniform thickness plating is performed thereon.

The design of the air ejection device is a jet flow method. The disadvantage is that the excessive jet flow mechanism during the electroplating process tends to cause uneven conductivity and flow field, so that the plated material cannot form a uniform thickness of plating, which affects the plating quality. .

In view of this, the present invention provides a gas stirring device for an electroplating system, in particular, a gas stirring device for improving the electroplating quality by a more active and reliable means for improving the lack of flow field unevenness during electroplating, and its main purpose is By.

In the present invention, the electroplating system has a tank for mounting a plating solution, and the gas agitating device comprises at least: a diffusion plate and a gas conduit, the diffusion plate is disposed near the bottom of the trough body, and forms a bottom portion of the trough body. a space, the diffusing plate has a plurality of perforations, and the diffusing plate is provided with at least one protruding portion facing the top of the trough; the gas conduit is penetrated by a wall surface of the trough to pass a gas The tank body is injected, and a portion of the gas conduit located below the diffuser plate is further provided with a plurality of downward gas outflow holes.

In a preferred embodiment, the tank body can accommodate a circuit board fixture to hold a material to be plated.

In a preferred embodiment, the two sides of the protruding portion of the diffusing plate respectively have a flat portion and a connecting portion connecting the protruding portion and the flat portion, and the protruding portion of the diffusing plate is located opposite to the object to be plated.

In a preferred embodiment, the connecting portion is a bevel.

In a more preferred embodiment, the angle between the planar portion and the bevel is greater than 90 degrees and less than 180 degrees.

In another preferred embodiment, the connecting portion is a vertical plane.

In another preferred embodiment, the electroplating system is further provided with a jetting device having an outlet pipe and a power member connecting the outlet pipe, the outlet pipe being penetrated by a wall surface of the trough body, The electroplating solution is injected into the tank body, and the outlet pipe is located at a portion below the diffusing plate, and a plurality of downwardly facing liquid outflow holes are further provided, and the power member provides power for electroplating liquid to flow out from the liquid outflow hole of the outlet pipe. .

In a preferred embodiment, the outlet pipe ring is provided with two rows of liquid outflow holes arranged along the longitudinal direction of the outlet pipe, and the liquid outflow holes of the adjacent two columns are at an angle of 90 degrees.

In a preferred embodiment, the gas conduit ring is provided with two rows of gas outflow holes arranged along the longitudinal direction of the gas conduit, and the gas outflow holes of the adjacent two columns are at an angle of 90 degrees.

In a more preferred embodiment, the gas outflow aperture is disposed at an angle of 45 degrees to the bottom of the tank.

Unless otherwise stated, the following terms used in the specification and claims of the present application have the definitions given below. It is to be understood that the singular <RTI ID=0.0>&quot;&quot;&quot;&quot;&quot; A single item. In addition, the open-ended conjunctions such as "including" and "having" used in the claims are intended to mean that the components or components described in the claims are not excluded. It should also be noted that the term "or" generally includes "and/or" in the sense, unless the content clearly indicates otherwise. The term "about" as used in the specification and claims of this application is intended to modify any error that may vary slightly, but such minor changes do not alter the nature.

Referring to Fig. 1, the electroplating system of the present invention has a tank 10 for mounting a plating solution. Wherein, the gas stirring device comprises at least: a diffusion plate 20 and a gas conduit 30. The diffusion plate 20 is disposed at a position close to the bottom of the groove body 10, and forms a space 21 with the bottom of the groove body 10. The diffusion plate 20 has a plurality of perforations 22, please refer to FIG. 2 at the same time, and the diffusion plate 21 is At least one protrusion 23 is provided, which is directed toward the top of the trough 10.

In the embodiment shown in the figure, the tank body 10 can accommodate a circuit board fixture (not shown) for holding a material to be plated 40, and the diffusion plate 21 is located opposite to the object to be plated 40. The diffusing plate 20 has a protruding portion 23 and two flat portions 24 respectively connected to the two sides thereof by the connecting portion 25. In the embodiment, the connecting portion 25 is a sloped surface, and the plane portion 24 is at an angle A1 with the inclined surface. The system is greater than 90 degrees and less than 180 degrees. The angle between the flat portion 24 and the inclined surface is preferably 135 degrees. Although the present specification describes and illustrates that the slopes on both sides of the protruding portion 23 are configured as a single inclined surface, the two sides of the protruding portion 23 may have various other configuration structures known to those skilled in the art. . For example, a plurality of inclined faces are sequentially connected, or the inclined faces on both sides of the protruding portion 23 have different inclination angles and the like.

The gas conduit 30 is penetrated by a wall surface of the tank body 10, and the air generated by the pump or the air compressor is introduced by the gas conduit 30 to inject a gas into the tank body 10. The gas conduit 30 is located in the diffusion. The portion below the plate 20 is further provided with a plurality of downwardly facing gas outflow holes 31. In the embodiment shown in Fig. 3, the gas conduit 30 is provided with two rows of gas flowing out along the longitudinal direction of the gas conduit 30. The hole 31, the gas outflow holes 31 of the two adjacent rows have an angle A2 of 90 degrees, and the gas outflow hole 31 is disposed at an angle A3 of 45 degrees to the bottom of the groove.

When performing the electroplating operation, as shown in FIG. 4, in addition to the bubbles discharged through the plurality of gas outflow holes 31 of the gas conduit 30, a stirring action for accelerating the activity of the plating solution is generated to improve the plating efficiency; and the plurality of gases After the outflow hole 31 is sprayed toward the bottom of the tank body 10, the air bubbles are again dispersed by the plurality of perforations 22 on the inclined surface 23 to slow down the jet flow force and achieve uniform diffusion, and the loss of the flow field unevenness during plating can be improved. Improve plating quality.

As shown in FIG. 1, the electroplating system is further provided with a jetting device having an outlet pipe 52 and a power member (not shown) connected to the outlet pipe 52. The outlet pipe 52 is formed by the trough body 10. A wall is penetrated to inject a plating solution into the tank body 10. a portion of the outlet pipe 52 located below the diffuser plate 20 is further provided with a plurality of downwardly facing liquid outflow holes 521, and the plating member is used to supply the plating solution. The water flowing out of the water pipe 521 flows toward the outside. In the embodiment shown in the figure, the outlet pipe 52 is provided with two rows of liquid outflow holes 521 arranged along the longitudinal direction of the outlet pipe. Please also refer to the liquid outflow holes of the adjacent two columns as shown in FIG. 521 has an angle A4 of 90 degrees. When the plating solution flows out from the plurality of liquid outflow holes 521 disposed downward from the outlet pipe 52, the plurality of perforations 22 of the diffusing plate 20 can flow from bottom to top, and then the bottom-up fluid direction passes through the plurality The stirring action of the gas outflow holes 31 to eject the bubbles can uniformly flow on the surface of the circuit board to be plated, thereby improving the plating effect. In the embodiment shown in the figure, an outlet pipe 52 and a gas conduit 30 respectively located outside the outlet pipe 52 are disposed under the diffuser plate 21; as shown in FIG. 5, the diffuser plate 21 is disposed under the diffuser plate 21 Two gas conduits 30 and outlet pipes 52 located on both outer sides of the gas conduit 30 are provided.

In the above embodiment, the diffusing plate can also be as shown in the embodiment shown in FIG. 6. The diffusing plate 20 also has a protruding portion 23 and two flat portions 24 respectively connected to the two sides thereof by the connecting portion 25. In this embodiment, the connecting portion 25 is a vertical plane, and the effect of improving the plating quality can be improved by improving the lack of uneven flow field during plating.

The above embodiments are intended to be illustrative of the present invention, and are not intended to limit the scope of the present invention, and various changes or modifications made by those skilled in the art without departing from the scope of the present invention should fall within the protection scope of the present invention.

10‧‧‧

20‧‧‧Diffuser

21‧‧‧ Space

22‧‧‧Perforation

23‧‧‧Protruding

24‧‧‧Flat Department

25‧‧‧Connecting Department

30‧‧‧ gas conduit

31‧‧‧ gas outflow hole

40‧‧‧The object to be plated

52‧‧‧Outlet

521‧‧‧Liquid outflow hole

Fig. 1 is a schematic view showing the structure of the electroplating system in the present creation; Fig. 2 is a perspective view showing the structure of the diffusing plate in the creation; Fig. 3 is a schematic enlarged view showing the structure of the gas stirring device in the present creation; The schematic diagram of the use of the gas stirring device in the present invention is shown; FIG. 5 is a schematic view showing another use of the gas stirring device in the present invention; and FIG. 6 is a perspective view showing another structure of the diffusing plate in the present invention.

Claims (10)

A gas agitation device for an electroplating system, the electroplating system having a tank for mounting a plating solution, the gas agitation device comprising: a diffuser plate disposed at the bottom of the trough body and forming a bottom portion with the trough body a space, the diffusing plate has a plurality of perforations, and the diffusing plate is provided with at least one protruding portion facing the top of the trough body; and a gas conduit is penetrated by a wall surface of the trough body to Gas is injected into the tank, and a portion of the gas conduit located below the diffuser plate is further provided with a plurality of downward gas outflow holes. The gas stirring device of the electroplating system of claim 1, wherein the trough body can accommodate a circuit board fixture to hold a material to be plated. The gas agitation device of the electroplating system of claim 2, wherein the two sides of the protruding portion of the diffusing plate respectively have a flat portion and a connecting portion connecting the protruding portion and the flat portion, and the protruding portion of the diffusing plate is relatively located Below the plating. The gas stirring device of the electroplating system according to claim 2, wherein the connecting portion is a slope. The gas stirring device of the electroplating system according to claim 4, wherein the angle between the plane portion and the inclined surface is greater than 90 degrees and less than 180 degrees. The gas stirring device of the electroplating system of claim 2, wherein the connecting portion is a vertical plane. The gas stirring device of the electroplating system according to any one of claims 1 to 6, wherein the electroplating system further comprises a spouting device having an outlet pipe and a power member connecting the outlet pipe, the outlet pipe being a wall surface of the tank body penetrates to inject a plating solution into the tank body, and a portion of the outlet pipe below the diffuser plate is further provided with a plurality of downwardly facing liquid outflow holes, and the power member provides a plating liquid from the outlet The water flowing out of the water pipe flows out of the hole toward the outside. The gas agitation device of the electroplating system according to claim 7, wherein the outlet pipe ring is provided with two rows of liquid outflow holes arranged along the longitudinal direction of the outlet pipe, and the liquid outflow holes of the adjacent two columns have an angle of 90. degree. The gas agitation device of the electroplating system according to any one of claims 1 to 6, wherein the gas conduit ring is provided with two rows of gas outflow holes arranged along the longitudinal direction of the gas pipe, and gas discharge holes of two adjacent columns. Its angle is 90 degrees. The gas stirring device of the electroplating system according to claim 9, wherein the gas outflow hole is disposed at an angle of 45 degrees to the bottom of the tank body.