TWM265694U - Waterproof heat sink structure of computer keyboard - Google Patents

Waterproof heat sink structure of computer keyboard Download PDF

Info

Publication number
TWM265694U
TWM265694U TW93216889U TW93216889U TWM265694U TW M265694 U TWM265694 U TW M265694U TW 93216889 U TW93216889 U TW 93216889U TW 93216889 U TW93216889 U TW 93216889U TW M265694 U TWM265694 U TW M265694U
Authority
TW
Taiwan
Prior art keywords
waterproof
heat
patent application
scope
item
Prior art date
Application number
TW93216889U
Other languages
Chinese (zh)
Inventor
Feng-Gu Wang
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW93216889U priority Critical patent/TWM265694U/en
Publication of TWM265694U publication Critical patent/TWM265694U/en

Links

Description

M265694 八、新型說明: 【新型所屬之技術領域】 曰本創作係有關於-種電腦鍵盤之防水散熱結構 =種為電腦㈣之散熱而設置於鍵盤下方兼具防水 乳功肖b之防水散熱結構。 一遗 【先前技術】 隨著科技的進步,電腦已經逐漸的走人每—個公司及 =之中’設計的方向也朝著輕薄短小的趨勢進行,所以 ^輕^和攜帶方便的筆記型電腦,逐漸為大家所喜愛, 、:’、、市場上的主流。筆記型電腦除了必須輕薄短小之外, ^的提升也是使用者所需求的重點,由於速度的提升, =上的電子元件,在運作狀態下所產生的熱能也相對 二=電腦内部一但蓄積大量的熱能無法散掉, ::吏筆记型電腦在運作上受到影響,甚至當機,如何有 效地解決散熱的問題就變得相當重要。 鐽般::白鍵盤包含··#帽、架橋、橡皮墊、電路薄膜及 中:女衣座等#份,這些部分通常會留有孔隙使熱能散發 “ ’但電腦使用者習慣將電腦鍵盤放在桌上,此時電腦 、二非或命水緊鄰放£,一不小心很容易就把咖茶水 倒進鍵盤内,由 體隨著鍵巾胃、、=笔腦鍵盤底下^機板,一但液 隙、參 ^木心、橡皮墊、電路薄膜及鍵盤安裝座之空 :入主機板,則會造成主機板相當嚴重的傷害,為了防 )之體對主機板的傷害,必須在鍵盤底部加設一層防水層 M265694 來防止液體滲入,但是加上防水層後,熱氣是無法往外散 發,熱氣一但無法向外散發,會導致主機板過熱,系統: 法正常運作而當機。 ’' 中華民國專利第433497號所揭示之具防水透氣保護層 讀盤構造,係利用具防水功能之聚合物材料所形成之^ 護層,且以聚四氟乙烯為較佳實施例,但是,聚合物材料 由於流阻太大且熱傳導效果不好,並無法提升散熱效率。 有鑑於此,若能提出-種可防止液體渗入主機板且透 氣性佳的防水鍵盤,必能有效解決前述的缺失。 【新型内容】 鑒於以上習知技術的問題,本創作之 一種電腦鍵盤之防水散埶έ士構, 茺”糸Μ、 ^ 成·、、、、。構除了可以防止使用者不怛 將液體倒進鍵盤而導致主機板 二放π + 序外遇具有可散發熱氣 而使付电腦的運轉效能更好之優點。 、 為達到上述之目的,本創作 ― 埒埶钍播^ 不劁作所揭不之電腦鍵盤之防水 政”、、、、、口構,该防水散熱結構包括:一防水厚,甘执士 口邱,兮γ 尺層’其5又有一開 h亥開口部係設於主機板之發熱源 透氣層,該防水透氣層覆罢 、 , 防水 該防水透氣層除具有防水性可 &主要疋心重 其他諸如透氣性、導% 液體渗入主機板外, l'生、導熱性良好及 將主機板主要的埶能了同低M、交化寻特性,而 之強制對流的夂散出,或靠内部風扇吸力 層進入系統内用以p夂低二&可㈣由鍵盤穿過防水透氣 牛低主機板的溫度’達到透氣及散熱之 M265694 功效。 為讓本創作之上述目的、特徵和優點能更明顯易懂, 下文特舉一較佳實施例,並配合所附圖式,作詳細說明如 下: … 【實施方式】 請參閱第1圖,第1圖所示係為本創作—種電腦鍵盤 之防水散熱結構之分解圖。一般鍵盤1〇〇包含··鍵帽、架 ,丄橡皮墊、電路薄膜及鍵盤安裝座等部份,這些部分通 苇曰4有工隙,可使得發熱源(例如,中央處理器、顯示 ^片々)所產生的熱氣藉由該空隙散發,如此熱氣就不會蓄 知,筆Z型電腦内部,使得筆記型電腦的運作效能更好, ,是為了防止液體滲入該空隙,危害主機板,必須在鍵盤 下方加防水散熱結構200,該防水散熱結構2〇〇係 =水層201及一防水透氣層2〇2所組成,該防水散熱 =構200設置於鍵盤⑽下方,其中該防水層2〇ι在發熱 =例如中央處理器、顯示晶片)上方設有一開口部 在°亥開口部203之上覆蓋該防水透氣層202,使得 夢:源(例t ’中央處理器、顯示晶片)所產生的熱氣 ^ X防水透氣層往外散發,或靠内部風扇(未緣示)吸 =制對流的方式’使冷空氣可以經由鍵盤1〇〇穿過防 =202進入系統内用以降低主機板的溫度,達到 乳及散熱之功效。 Λ防水層201係為塑膠材質(例如,聚酯(PET)、聚 M265694 乙稀(PE)及聚㈣(PP)等)所構成,具有防水特性,以防 止使用者不慎將液體傾倒進鍵盤1〇〇時,該防水層別1可 避免液體隨著鍵帽、架橋、橡皮塾、電路薄膜及^盤安^ 座之空隙滲入主機板中,造成主機板故障之功效。此外該 防水透氣層202係為-個熱對流性質良好之網狀材質, W4^4(P〇lytetraflu〇r〇e%lene,p 狀材質,其厚度相當的薄(在0.01毫米以内) 發熱源(例如,中央處理器、顯示晶片)之上方,3、 ==防水性、透氣性、熱對流性質良好及耐高低: :一:’而將主機板主要的熱能利用自然對流的方式 mi m203散出,或靠内部風扇吸力之強制對流的 ΓΪ统=Γ氣可以經由鍵盤⑽穿過防水透氣層202進 t系=以降低主機板的温度,防水透氣層之所以不透 的内聚力Μ水對防水透氣層2G2的附著 力的緣故,水滴的直徑約為 者 的網目孔隙吉/- f 笔未’防水透氣層2〇2 ^㈣直到、於G.1毫料,便可達財透水的作 藉由防水層2(Π及防水透氣層2 結構200之設計,a 士 口戚的防水放熱 無法滲漏至主機板裡=不慎傾倒在鍵盤100上之液體 得筆記型電腦1=/到保護主機板之功效;同時使 电知主祛板上的電子元件運作時,產M265694 8. Description of the new type: [Technical field to which the new type belongs] The creation of the book is about a kind of waterproof cooling structure for computer keyboards = a kind of waterproof cooling structure that is installed under the keyboard and has a waterproof rubber function b for the heat dissipation of computer keyboards . A legacy [Previous technology] With the advancement of technology, computers have gradually taken the direction of each company and company, and the design direction is also moving towards thin, light and short, so ^ light ^ and portable notebook computers Gradually loved by everyone, ':', the mainstream on the market. In addition to the thin and light notebook computer, the improvement of ^ is also the focus of user requirements. Due to the increase in speed, = the electronic components on the upper side, the heat energy generated in the operating state is relatively two = the inside of the computer, but a large amount of accumulation The thermal energy cannot be dissipated, and the :: notebook computer is affected in operation, and even when it is down, how to effectively solve the problem of heat dissipation becomes very important. Normal :: The white keyboard contains ## hats, bridges, rubber pads, circuit films, and middle: women's clothing seats, etc. These parts usually have holes to allow heat to be dissipated. "But computer users are used to putting computer keyboards On the table, at this time, the computer, the two non-keys, or the water is placed next to the pound. If you are not careful, you can easily pour the tea into the keyboard. The body follows the stomach of the keypad, the keyboard under the keyboard, and the keyboard. However, the liquid gap, the wooden core, the rubber pad, the circuit film, and the keyboard mounting seat are empty: entering the motherboard will cause serious damage to the motherboard. To prevent damage to the motherboard, it must be at the bottom of the keyboard. Add a waterproof layer M265694 to prevent liquid from penetrating, but after adding the waterproof layer, the hot air cannot be radiated to the outside. If the hot air cannot be radiated to the outside, it will cause the motherboard to overheat. The system can't work normally and crashes. '' China The disc reading structure with a waterproof and breathable protective layer disclosed in the Republic of China Patent No. 433497 is a protective layer formed by using a polymer material with waterproof function, and polytetrafluoroethylene is the preferred embodiment. However, the polymer material due to The flow resistance is too large and the heat conduction effect is not good, and it can not improve the heat dissipation efficiency. In view of this, if a water-resistant keyboard that can prevent liquid from penetrating into the motherboard and has good air permeability, it can surely solve the aforementioned shortcomings. [New content In view of the problems of the above-mentioned conventional technology, a waterproof keyboard structure for a computer keyboard of this creation is created, "茺 Μ, ^ 成 · ,,,,,. In addition to preventing the user from pouring liquid into the keyboard and causing the motherboard to play a π + sequence, it has the advantage of dissipating heat and making the operating performance of the computer better. In order to achieve the above-mentioned purpose, this work ― 埒 埶 钍 ^ ^ ^ ^ does not reveal the waterproofing of the computer keyboard ”,,,,, and the mouth structure, the waterproof heat dissipation structure includes: a waterproof thick, Gan Zhishi mouth Qiu, Xi γ, the layer '5 also has a heat-generating breathable layer on the motherboard. The waterproof breathable layer is covered, and the waterproof breathable layer is waterproof in addition to being waterproof. Others such as air permeability, permeability of liquid into the motherboard, l ', good thermal conductivity and the main board with the same low M, cross-seeking characteristics, and forced convection, or rely on the internal The fan suction layer enters the system to p 用以 lower & can pass the keyboard through the waterproof and breathable low temperature of the motherboard to achieve the effect of breathability and heat dissipation M265694. In order to make the above-mentioned purpose, characteristics and advantages of this creation more Obviously easy to understand, the following is a detailed description of a preferred embodiment, and in conjunction with the attached drawings, the detailed description is as follows: [Embodiment] Please refer to Figure 1, Figure 1 shows this creation—a kind of computer keyboard Classification of waterproof and heat dissipation structure Solution. General keyboard 100 includes keycaps, racks, rubber pads, circuit films, and keyboard mounts. These parts have gaps and can cause heat sources (for example, the central processing unit). 、 Display 々 片 々) The hot air generated is radiated through the gap, so that the hot air will not be known. The inside of the pen Z-type computer makes the notebook computer operate better. It is to prevent liquid from penetrating into the gap and harm. For the motherboard, a waterproof heat dissipation structure 200 must be added under the keyboard. The waterproof heat dissipation structure 200 is composed of a water layer 201 and a waterproof and breathable layer 202. The waterproof heat dissipation structure 200 is disposed below the keyboard ,, where the The waterproof layer 200 is provided with an opening above the heat generation = such as a central processing unit and a display chip. The waterproof breathable layer 202 is covered above the opening 203, so that the dream: the source (eg, the central processing unit and the display chip). ) The generated hot air ^ X waterproof breathable layer is radiated outwards, or it is sucked by an internal fan (not shown) = convection control method, so that cold air can enter the system through the keyboard 100 through the anti = 202 to reduce the host board Λ waterproof layer 201 is made of plastic materials (for example, polyester (PET), poly M265694 polyethene (PE) and polyfluorene (PP), etc.), has waterproof properties, and When the user accidentally pours liquid into the keyboard 100, the waterproof layer 1 can prevent liquid from seeping into the motherboard with the keycaps, bridges, rubber pads, circuit films, and ^ disc safety seat, causing the host The effect of the board failure. In addition, the waterproof and breathable layer 202 is a mesh material with good thermal convection properties, W4 ^ 4 (Polytetrafluróe% lene, p-shaped material, and its thickness is quite thin (in 0.01 Within millimeters) Above the heat source (for example, central processing unit, display chip), 3, == waterproof, breathable, good thermal convection properties and resistance to high and low: 1 :: And the main board of the motherboard uses natural convection The way mi m203 is emitted, or forced convection by internal fan suction. ΓΪ system = Γ gas can pass through the keyboard through the waterproof breathable layer 202 into the t series = to reduce the temperature of the motherboard, the reason why the waterproof breathable layer is impermeable Cohesive M water to waterproof and breathable layer Due to the adhesion of 2G2, the diameter of the water droplets is about the mesh pores of the gills / -f pen not 'waterproof and breathable layer 2 0 2 ^ ㈣ until, in the G.1 material, you can reach the role of water permeability through waterproof Design of layer 2 (Π and waterproof and breathable layer 2 structure 200), a waterproof and heat-resistant material of the driver cannot leak into the motherboard = the laptop accidentally dumped the liquid on the keyboard 100 = 1 to protect the motherboard Effect; at the same time, when the electronic components on the main board are operated,

,透過防水透氣層2G2溢出㈣1Q 吸力之強制對流的4罪内邛風扇 防水透氣層202進入工^以經由鍵盤⑽穿過 進入系統内用以降低主機板的溫度,達到 M265694 透氣及散熱之功效,如此熱氣就不會蓄積在筆記型電腦内 部,使得筆記型電腦的運作效能更好,另外,本創作只在 f熱源(例如,中央處理器、顯示晶片)之上方設置較高 單偏之防水透氣層202 ,而在發熱源之外的位置設置以低 單價的防水層201 ,不但可使鍵盤1〇〇具有防水並透出熱 氣,保護效果,也可以降低製造成本。由此可見,本創作 ,較於習知之防水鍵盤已具備防止液體滲入且透散熱氣之 -貝著功效’且製造成本也顯著的降低。 〜雖然本創作已以較佳實施例揭露如上,然其並非用以 限=本創作,任何熟習此技藝者,在不脫離本創作之精神 1範圍内,當可作些許之更動與潤飾,因此本創作之保護 範圍§視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 弟1圖所示係為本創作一種電腦鍵盤之防水散熱結構之分 解圖。 主要元件符號說明】 100鍵盤 2〇〇防水散熱結構 201防水層 202防水透氣層 203開口部 9Through the waterproof and breathable layer 2G2 overflow ㈣ 1Q suction force convection 4 sins inside the fan waterproof breathable layer 202 into the work ^ to pass through the keyboard to enter the system to reduce the temperature of the motherboard, to achieve the effect of M265694 ventilation and heat dissipation, In this way, the heat will not accumulate inside the notebook computer, which makes the notebook computer operate better. In addition, this creation only sets a higher unidirectional waterproof and breathable above the f heat source (for example, central processing unit, display chip). The layer 202 is provided with a low-price waterproof layer 201 at a location other than the heat source, which not only makes the keyboard 100 waterproof and exudes heat, a protective effect, but also reduces the manufacturing cost. It can be seen that, compared with the conventional waterproof keyboard, this creation has the function of preventing the liquid from penetrating and radiating heat, and the manufacturing cost is also significantly reduced. ~ Although this creation has been disclosed as above with a preferred embodiment, it is not intended to be limited to this creation. Anyone who is familiar with this skill can make some changes and decorations without departing from the spirit of this creation. Therefore, The scope of protection of this creation § is subject to the scope of the attached patent application. [Brief description of the drawing] The picture shown in Figure 1 is an exploded view of the waterproof and heat dissipation structure of a computer keyboard. Explanation of main component symbols] 100 keyboard 200 waterproof and heat dissipation structure 201 waterproof layer 202 waterproof and breathable layer 203 opening 9

Claims (1)

M265694 九、申請專利範圍: 1· 一種電腦鍵盤之防水散熱結構,係設置於電腦鍵盤下 方,該防水散熱結構包括: 一防水層,其設有一開口部;及 防水透氣層’该防水透氣層係覆蓋於該開口部之上。 2·依申請專利範圍第丨項所述之防水散熱結構,其中該防 水層之開口部係設置在主機板發熱源之上方。 3.依申請專利範圍第2項所述之防水散熱結構,其中該發 熱源係為中央處理器或顯示晶片。 4·依申請專利範圍第1項所述之防水散熱結構,其中該防 水層係為塑膠材質。 5·依申請專利範圍第4項所述之防水散熱結構,其中該塑 膠材質係為聚酯、聚乙烯或聚丙烯。 6·依申請專利範圍第4項所述之防水散熱結構,其中該防 水層係為防靜電材質。 7·依申請專利範圍第1項所述之防水散熱結構,其中該防 水透氣層係為具熱對流性質之網狀材質。 8·依申請專利範圍第7項所述之防水散熱結構, 狀材質其網目小於(U毫米。 9·依申請專利範圍第7項所述之防水散熱結構,其中該網 狀材質係為聚四氟乙烯網或鎳金屬網等。M265694 9. Scope of patent application: 1. A waterproof and heat-dissipating structure of a computer keyboard is arranged below the computer keyboard. The waterproof and heat-dissipating structure includes: a waterproof layer with an opening; and a waterproof and breathable layer. Covers the opening. 2. The waterproof and heat-dissipating structure according to item 丨 in the scope of the patent application, wherein the opening of the waterproof layer is disposed above the heat source of the motherboard. 3. The waterproof and heat-dissipating structure according to item 2 of the patent application scope, wherein the heat source is a central processing unit or a display chip. 4. The waterproof and heat-dissipating structure according to item 1 of the scope of patent application, wherein the waterproof layer is made of plastic. 5. The waterproof and heat dissipation structure according to item 4 of the scope of the patent application, wherein the plastic material is polyester, polyethylene or polypropylene. 6. The waterproof and heat-dissipating structure according to item 4 of the scope of the patent application, wherein the water-proof layer is an anti-static material. 7. The waterproof and heat-dissipating structure according to item 1 of the scope of the patent application, wherein the water-proof and breathable layer is a mesh material with thermal convection properties. 8. According to the waterproof heat dissipation structure described in item 7 of the scope of the patent application, the mesh material has a mesh smaller than (U mm. 9) According to the waterproof heat dissipation structure described in item 7 of the scope of the patent application, the mesh material is polysilicon Vinyl fluoride mesh or nickel metal mesh.
TW93216889U 2004-10-22 2004-10-22 Waterproof heat sink structure of computer keyboard TWM265694U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93216889U TWM265694U (en) 2004-10-22 2004-10-22 Waterproof heat sink structure of computer keyboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93216889U TWM265694U (en) 2004-10-22 2004-10-22 Waterproof heat sink structure of computer keyboard

Publications (1)

Publication Number Publication Date
TWM265694U true TWM265694U (en) 2005-05-21

Family

ID=36480479

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93216889U TWM265694U (en) 2004-10-22 2004-10-22 Waterproof heat sink structure of computer keyboard

Country Status (1)

Country Link
TW (1) TWM265694U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178803B2 (en) 2010-02-12 2012-05-15 Acer Incorporated Electronic device having key
TWI570756B (en) * 2011-03-07 2017-02-11 富士通電子零件有限公司 Push button-type switch device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178803B2 (en) 2010-02-12 2012-05-15 Acer Incorporated Electronic device having key
TWI570756B (en) * 2011-03-07 2017-02-11 富士通電子零件有限公司 Push button-type switch device

Similar Documents

Publication Publication Date Title
US10966345B2 (en) Solid-state drive heat dissipation device
US7419722B2 (en) Heat-radiating sheet and heat-radiating structure
US20060198086A1 (en) Waterproof and heat-dissipating structure of computer keyboard
US20050280987A1 (en) Phase change materials as a heat sink for computers
US20150048073A1 (en) Heating element and circuit module stack structure
US9210832B2 (en) Thermal buffering element
KR20080011392A (en) Thermal lamination module
CN107142037A (en) A kind of aerogel heat-proof device for electronic product
WO2017185960A1 (en) Terminal device and related method
CN105700649A (en) Cooling system and electronic equipment
TWM265694U (en) Waterproof heat sink structure of computer keyboard
JP2000323186A (en) Battery device of electronic apparatus
CN203633035U (en) Heat dissipation structure and electronic device
JP2003029878A (en) Notebook-sized personal computer
TWI569711B (en) Mobile phone cooling module
CN208739195U (en) Graphene liquid-cooling heat radiation mobile phone shell
CN208649201U (en) A kind of multi-functional PET protection film
JPH11177264A (en) Accommodation case for portable electronic apparatus
TWI357556B (en) Industrial computer
JP3079675U (en) Endothermic heat dissipation sheet containing gel
JP2009217773A (en) Portable information processor
CN105792616B (en) A kind of touch panel unit and mobile terminal
CN211349236U (en) Involutive sealing packaging structure for tablet personal computer
TWM608734U (en) Mobile device with heat dissipation module
CN217088436U (en) Mobile device protection shell

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees