CN107142037A - A kind of aerogel heat-proof device for electronic product - Google Patents
A kind of aerogel heat-proof device for electronic product Download PDFInfo
- Publication number
- CN107142037A CN107142037A CN201710461564.9A CN201710461564A CN107142037A CN 107142037 A CN107142037 A CN 107142037A CN 201710461564 A CN201710461564 A CN 201710461564A CN 107142037 A CN107142037 A CN 107142037A
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- CN
- China
- Prior art keywords
- proof device
- electronic product
- layer
- aerogel heat
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of aerogel heat-proof device for electronic product.A kind of aerogel heat-proof device for electronic product, it includes graphite flake layer and the airsetting film layers on graphite flake layer；The upper surface of the airsetting film layers is provided with high molecular polymer insulating protective layer or adhesive layer；The lower surface of the graphite flake layer is provided with adhesive layer or high molecular polymer insulating protective layer, and different from the layer that the upper surface of airsetting film layers is set；The gross thickness of aerogel heat-proof device is 0.2 5mm.A kind of aerogel heat-proof device for electronic product of the present invention, by the low thermal conductivity of the high-rise hot combination aerogel layer of graphite linings, reduces localized hyperthermia, heat source position and the temperature difference away from heat source position are reduced, easy shape by die-cutting can self bonding, it is bent, there is stronger pliability.
Description
Technical field
The present invention relates to the heat-insulated field of electronic product heat generating component, more particularly to a kind of airsetting for electronic product
Glue heat-proof device.
Background technology
With developing rapidly for microelectronics integrated technology and high density PCB package technique, packing density is improved rapidly,
Electronic component, thousands of times of ground of logic circuit volume reduce, and notebook computer increasingly develops towards light, thin, small direction, at present
Notebook CPU is coordinates its speed of service, and usual CPU need to run at high speed, therefore local pyrexia amount can be significantly increased, together
When display screen require high brightness, make LED light emitting diode quantity amount increase, also increase the caloric value of equipment, at the same because power consumption
Increase, battery capacity also needs increase, and the heat energy produced by internal battery impedance is substantially improved, and can not such as allow the heat energy sent
Shed and isolate in order, CPU, video card, LED light emitting diodes, these thermal source peripheries of battery heat-sensitive element because temperature it is too high
And shorten life-span or loss of function, especially with there is this larger temperature difference in heat source position away from heat source position.Especially, thermal source is attached
Near electronic product casing temperature is too high, on the one hand can cause the discomfort of user, still further aspect, the mistake born due to shell
High-temperature, causes the service life for influenceing shell and the deterioration for causing casing appearance.Heat-insulated the one of electronic product in the market
As apply glass fibre, but glass fibre thermal conductivity factor is higher, easily falls bits, needs bound edge to press it because of meeting after pressure exhaust
Its thermal-insulation function is reduced, processing technology is also complex.Common Monolithic aerogel is frangible, and no intensity is not plastic, it is impossible to directly
For the heat-insulated of electronic product.
The content of the invention
In order to solve the above technical problems, the invention provides a kind of aerogel heat-proof device for electronic product, passing through
The low thermal conductivity of the high-rise hot combination aerogel layer of graphite linings, reduces localized hyperthermia, reduces heat source position and remote
The temperature difference of heat source position, easy shape by die-cutting, can self bonding, it is bent, have stronger pliability.
The technical solution adopted for the present invention to solve the technical problems is：A kind of aerogel heat-proof for electronic product is filled
Put, it includes graphite flake layer and the airsetting film layers on graphite flake layer；The upper surface of the airsetting film layers is provided with
High molecular polymer insulating protective layer or adhesive layer；The lower surface of the graphite flake layer is provided with adhesive layer or high molecular polymer
Insulating protective layer, and it is different from the layer that the upper surface of airsetting film layers is set；The gross thickness of aerogel heat-proof device is 0.2-
5mm。
The thickness of the high molecular polymer insulating protective layer is 0.01-0.05mm.
The thickness of the graphite flake layer is 0.017-0.1mm.
The thickness of the airsetting film layers is 0.1-5mm.
The thickness of the adhesive layer is 0.005-0.1mm.
The high molecular polymer insulating protective layer is PET protective layers, PC protective layers or PE protective layers.
The airsetting film layers are that multiple aeroge little particles 301 are constituted；Multiple short grained gaps of aeroge are filled with
Adhesive.
The aeroge little particle is SiO2Aeroge, titanium dioxide TiO2Aeroge, Al2O3Aeroge, SiO2/Al2O3
Aeroge or SiC aeroges.
Described adhesive is vinyldimethicone, vinyl Polymethyl methacrylate, the poly- diformazan of hydrogen-based
Radical siloxane, phenyl dimethicones, chlorphenyl dimethyl silicone polymer, trifluoro propyl dimethyl silicone polymer and stupid base
One kind in Polymethyl methacrylate or wherein several mixtures in any proportion；Its range of viscosities is 500-
10000cps。
The adhesive layer is elastomeric-type pressure-sensitive adhesive layer, resin pressure sensitive adhesive layer, acrylic glue-line or hot melt adhesive layer.
Beneficial effects of the present invention：A kind of aerogel heat-proof device for electronic product of the present invention, passes through graphite linings
High-rise hot combination aerogel layer low thermal conductivity, reduce localized hyperthermia, reduce heat source position and away from thermal source position
The temperature difference put, easy shape by die-cutting, can self bonding, it is bent, have stronger pliability.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of the use state of aerogel heat-proof device for electronic product of embodiment one；
Fig. 2 is a kind of schematic diagram of the use state of aerogel heat-proof device for electronic product of embodiment two；
Fig. 3 be embodiment in a kind of aerogel heat-proof device for electronic product airsetting film layers structural representation
Figure.
Embodiment
In order to deepen the understanding of the present invention, the present invention is done below in conjunction with drawings and examples and further retouched in detail
State, the embodiment is only used for explaining the present invention, protection scope of the present invention is not constituted and limited.
Embodiment one
As shown in figures 1 and 3, a kind of aerogel heat-proof device for electronic product is present embodiments provided, it includes
Graphite flake layer 200 and the airsetting film layers 300 on graphite flake layer 200；The upper surface of the airsetting film layers 300 is set
There is adhesive layer 400；The lower surface of the graphite flake layer 200 is provided with high molecular polymer insulating protective layer 100；Aerogel heat-proof
The gross thickness of device is 0.2mm；The graphite flake layer 200 is artificial graphite flake layer, and its thickness is 0.025mm；The aeroge
Lamella 300 constitutes for multiple SiO2 aeroges little particles (particle diameter is 2-5 μm), and gap is filled with vinyldimethicone
Adhesive 302 (range of viscosities is 500-800cps), its thickness is 0.125mm；The adhesive layer 400 is PET double faced adhesive tapes, and it is thick
Spend for 0.03mm；The high molecular polymer insulating protective layer 100 is transparent PET protective layer, and thickness is 0.015mm；Adhesive layer
400 contact shells 600, high molecular polymer insulating protective layer 100 is close to thermal source 500.
A kind of aerogel heat-proof device for electronic product of the present embodiment is prepared into area for 100mm*60mm；With
Dummy box boxes are tested, and thermal source 500 is 25mm*25mm*1mm, and heating power is 3.3w；(1) without heat-proof device：Plus
Heat is after 20 minutes, and thermal source Tc temperature is 107.8 DEG C, and just the temperature T1 to the position of thermal source casing 600 is 77.1 DEG C；(2) this reality is used
Apply the heat-proof device of example：After heat-proof device is heated 20 minutes, thermal source Tc temperature is 100.6 DEG C, the just position of shell 600 to thermal source
Temperature T1 be 70.8 DEG C.
Embodiment two
As shown in Figures 2 and 3, a kind of aerogel heat-proof device for electronic product is present embodiments provided, it includes
Graphite flake layer 200 and the airsetting film layers 300 on graphite flake layer 200；The upper surface of the airsetting film layers 300 is set
There is high molecular polymer insulating protective layer 100；The lower surface of the graphite flake layer 200 is provided with adhesive layer 400；Aerogel heat-proof
The gross thickness of device is 0.2mm；The graphite flake layer 200 is artificial graphite flake layer, and its thickness is 0.025mm；The aeroge
Lamella 300 constitutes for multiple SiO2 aeroges little particles (particle diameter is 2-5 μm), and gap is filled with vinyldimethicone
Adhesive 302 (range of viscosities is 500-800cps), its thickness is 0.125mm；The adhesive layer 400 is PET double faced adhesive tapes, and it is thick
Spend for 0.03mm；The high molecular polymer insulating protective layer 100 is transparent PET protective layer, and thickness is 0.015mm；Adhesive layer
400 contact thermals source 500, high molecular polymer insulating protective layer 100 is close to shell 600.
A kind of aerogel heat-proof device for electronic product of the present embodiment is prepared into area for 100mm*60mm；With
Dummy box boxes are tested, and thermal source 500 is 25mm*25mm*1mm, and heating power is 3.3w；(1) without heat-proof device：Plus
Heat is after 20 minutes, and thermal source Tc temperature is 107.8 DEG C, and just the temperature T1 to the position of thermal source casing 600 is 77.1 DEG C；(2) this reality is used
Apply the heat-proof device of example：After heat-proof device is heated 20 minutes, thermal source Tc temperature is 101.5 DEG C, the just position of shell 600 to thermal source
Temperature T1 be 71.6 DEG C.
A kind of aerogel heat-proof device for electronic product of above-described embodiment utilizes the plane high-termal conductivity of graphite linings
Diffusion distally combines the extremely low thermal conductivity factor of aerogel layer to the heat energy that thermal source is sent rapidly, and thermal conductivity factor can reach 0.028
~0.20W/MK；The heat-sensitive element around thermal source, increase heat-sensitive element service life and guarantee temperature-sensitive can effectively be separated
The normal operation of sensing unit；The point heat problem of electronic product can effectively be eliminated；The casing position temperature of near heating sources can effectively be reduced
Degree, reduces the possibility scalded, and comfort level during user's contact electronic product is added because reducing localized hyperthermia；Drop
Low heat source position and the temperature difference away from heat source position；Coiled strip can be fabricated to, sheet stock can be also fabricated to.
A kind of aerogel heat-proof device for electronic product of above-described embodiment, passes through the high-rise hot combination of graphite linings
The low thermal conductivity of aerogel layer, reduces localized hyperthermia, reduces heat source position and the temperature difference away from heat source position, Yi Mo
Be cut into type, can self bonding, it is bent, have stronger pliability.
Above-described embodiment should not in any way limit the present invention, all to be obtained by the way of equivalent substitution or equivalency transform
Technical scheme all fall within protection scope of the present invention.
Claims (10)
1. a kind of aerogel heat-proof device for electronic product, it is characterised in that：It includes graphite flake layer 200 and positioned at graphite
Airsetting film layers on lamella；The upper surface of the airsetting film layers is provided with high molecular polymer insulating protective layer or gluing
Layer；The lower surface of the graphite flake layer is provided with adhesive layer or high molecular polymer insulating protective layer, and with airsetting film layers
The layer that upper surface is set is different；The gross thickness of aerogel heat-proof device is 0.2-5mm.
2. a kind of aerogel heat-proof device for electronic product according to claim 1, it is characterised in that：The high score
The thickness of sub- polymer insulation protective layer is 0.01-0.05mm.
3. a kind of aerogel heat-proof device for electronic product according to claim 1, it is characterised in that：The graphite
The thickness of lamella is 0.017-0.1mm.
4. a kind of aerogel heat-proof device for electronic product according to claim 1, it is characterised in that：The airsetting
The thickness of film layers is 0.1-5mm.
5. a kind of aerogel heat-proof device for electronic product according to claim 1, it is characterised in that：It is described gluing
The thickness of layer is 0.005-0.1mm.
6. a kind of aerogel heat-proof device for electronic product according to claim 2, it is characterised in that：The high score
Sub- polymer insulation protective layer is PET protective layers, PC protective layers or PE protective layers.
7. a kind of aerogel heat-proof device for electronic product according to claim 4, it is characterised in that：The airsetting
Film layers constitute for multiple aeroge little particles；Multiple short grained gaps of aeroge are filled with adhesive.
8. a kind of aerogel heat-proof device for electronic product according to claim 7, it is characterised in that：The airsetting
Glue little particle is SiO2Aeroge, titanium dioxide TiO2Aeroge, Al2O3Aeroge, SiO2/Al2O3Aeroge or SiC airsettings
Glue.
9. a kind of aerogel heat-proof device for electronic product according to claim 8, it is characterised in that：The bonding
Agent is vinyldimethicone, vinyl Polymethyl methacrylate, hydrogen-based dimethyl silicone polymer, phenyl poly- two
Methylsiloxane, chlorphenyl dimethyl silicone polymer, trifluoro propyl dimethyl silicone polymer and the poly- methyl ethylene silica of stupid base
One kind in alkane or wherein several mixtures in any proportion；Its range of viscosities is 500-10000cps.
10. a kind of aerogel heat-proof device for electronic product according to claim 5, it is characterised in that：The glue
Adhesion coating is elastomeric-type pressure-sensitive adhesive layer, resin pressure sensitive adhesive layer, acrylic glue-line or hot melt adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710461564.9A CN107142037A (en) | 2017-06-19 | 2017-06-19 | A kind of aerogel heat-proof device for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710461564.9A CN107142037A (en) | 2017-06-19 | 2017-06-19 | A kind of aerogel heat-proof device for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107142037A true CN107142037A (en) | 2017-09-08 |
Family
ID=59782122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710461564.9A Withdrawn CN107142037A (en) | 2017-06-19 | 2017-06-19 | A kind of aerogel heat-proof device for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107142037A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878917A (en) * | 2018-06-28 | 2018-11-23 | 贵州梅岭电源有限公司 | A kind of thermal cell sustained release heating plant |
| GB2571292A (en) * | 2018-02-22 | 2019-08-28 | Graphene Composites Ltd | Composite structure and method of manufacture |
| CN110621141A (en) * | 2019-09-23 | 2019-12-27 | Oppo广东移动通信有限公司 | Composite film and electronic device |
| GB2587889A (en) * | 2018-02-22 | 2021-04-14 | Graphene Composites Ltd | Composite structure and method of manufacture |
| CN113871749A (en) * | 2021-08-20 | 2021-12-31 | 荣耀终端有限公司 | Electronic device |
| US11635280B2 (en) | 2018-05-18 | 2023-04-25 | Graphene Composites Limited | Protective shield, shield wall and shield wall assembly |
-
2017
- 2017-06-19 CN CN201710461564.9A patent/CN107142037A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2571292A (en) * | 2018-02-22 | 2019-08-28 | Graphene Composites Ltd | Composite structure and method of manufacture |
| GB2571292B (en) * | 2018-02-22 | 2020-09-09 | Graphene Composites Ltd | Composite structure and method of manufacture |
| GB2587889A (en) * | 2018-02-22 | 2021-04-14 | Graphene Composites Ltd | Composite structure and method of manufacture |
| GB2587889B (en) * | 2018-02-22 | 2022-01-12 | Graphene Composites Ltd | Composite structure and method of manufacture |
| US11635280B2 (en) | 2018-05-18 | 2023-04-25 | Graphene Composites Limited | Protective shield, shield wall and shield wall assembly |
| CN108878917A (en) * | 2018-06-28 | 2018-11-23 | 贵州梅岭电源有限公司 | A kind of thermal cell sustained release heating plant |
| CN110621141A (en) * | 2019-09-23 | 2019-12-27 | Oppo广东移动通信有限公司 | Composite film and electronic device |
| CN113871749A (en) * | 2021-08-20 | 2021-12-31 | 荣耀终端有限公司 | Electronic device |
| CN113871749B (en) * | 2021-08-20 | 2022-09-27 | 荣耀终端有限公司 | Electronic device |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170908 |
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| WW01 | Invention patent application withdrawn after publication |