TWM261831U - Anti-static LED assembly structure - Google Patents
Anti-static LED assembly structure Download PDFInfo
- Publication number
- TWM261831U TWM261831U TW093211624U TW93211624U TWM261831U TW M261831 U TWM261831 U TW M261831U TW 093211624 U TW093211624 U TW 093211624U TW 93211624 U TW93211624 U TW 93211624U TW M261831 U TWM261831 U TW M261831U
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting diode
- bracket
- fixed
- arc
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Led Device Packages (AREA)
Description
M261831 _-件仏影響了發光二極體2〇發光強度及角度，此 貫施例將表面黏著保護元件22a及發光二極體20分別封裝 不同於第2 _會示的實施例，本實施例 ==保護元件22a代替保護元件22。表面黏著保護 =件=係—種將保護元件❿桿在基板上之㈣。表面黏 :保h件22a藉著表面黏著技術固定於 件34將支架3。及保護…封裝於其：，； 於支木的另一面形成一圓弧狀凹杯Μ。 ::r5r。發光二極體2。以黏二= 上述的模塑構件可以是:上的電極（未緣出）。 ㈣、液晶高分子上 文A上逑材料的組合。 β參照第4 W ’其綠示依照本創作又—較 -種發光二極體防靜電封裳結構、：的 件22影響了發光二極體2。發光 ：了避免保達元 保護元件22及發光二極體2 二角度，此霄施例將 支架上。以模塑構件 刀’、裝在具有深淺落差的 於支架的一面形二Γ 深淺落差的封裝於其内，並 露於圓弧狀凹杯35的^^杯35°子支架3Ga/通並暴 的子支架3 0 a上，並以導線2° 8 m二極體2 〇固定於較淺 將保護元件22固定於較深 架上的電極（未繪出）。 連至支架上的電極（未繪出）。:规上，並以導線28 弧狀凹杯35。上逑的模塑構 ^黏合材料33填滿圓 氧化鈦、氧化舞、液晶高分子 ' :是環氧樹脂、玻璃纖維、 由上述本創作較佳實施例可:二上二材料的組合。 ，應用本創作之發光二 M261831 狹、申讀專利範圍 / … 種發光二極體防靜電封裝結構，至少包含： 支木’其中—面具有一四陷； . 保澧元件，固定於該凹陷中； · ' 籌件封裝該凹陷，並在該支架的另—面形成 . 一圓弧狀凹杯；以及 一發光二極體晶片固定於該圓弧狀凹杯内。 ❿ 2. 如申請專利範圍第1項所述之發光二極體防靜電 ί裝、’σ構其中§亥保護元件包誊發光二極體、蕭基二極體 或齊那二極體。 3. 如申請專利範圍第1項所述之發光二極體防靜電 封裝結構’其中該保護元件係藉由黏合材料固定於該凹陷 内。 4. 如申請專利範圍第1項所述之發光二極體防靜電 嫌 封裝結構’其中該發光二極體晶片藉由黏合材料固定該圓 弧狀凹杯内。 5. 如申請專利範圍第丨項所述之發光二極體防靜電 封裝結構，其中該模塑構件係環氧樹脂、玻螭纖維、氧化 鈦、氧化鈣、液晶高分子、陶瓷或上述材料的組合。 6. —種發光二極體防靜電封裝結構，至少包含： 11 M261831 一支架； 表面勘著保護元件’固定於該支架的一面； 輪塑構件，封裝該表面黏著保護元件，並在該支架 的另一面形成一圓弧狀凹杯；以及 發光一極體晶片固定於該圓弧狀凹杯内。. 7.如申清專利範圍第6項所述之發光二極體防靜電 封裝結構，其中表面黏著保護元件至少包含發光二極體、 蕭基二極體或齊那二極體。 8.如申請專利範圍第 封裝結構，其中表面黏著保 定於該支架的一面。 6項所述之發光二極體防靜電 。蔓元件係藉由表面黏著技術固 β v $所返之發先二極體防 封裝結構，其中該發光二極體晶 圓弧狀凹杯内。 片藉由黏合材料固定M261831 _-piece 仏 affects the light emitting intensity and angle of the light-emitting diode 20, this embodiment encapsulates the surface adhesion protection element 22a and the light-emitting diode 20 separately from the embodiment shown in the second embodiment. This embodiment == The protection element 22a replaces the protection element 22. Surface Adhesive Protection = Piece = System-a kind of protection element on the substrate. Surface adhesion: The holder 22a is fixed to the bracket 34 by the surface adhesion technology to fix the bracket 3. And protect ... encapsulated in:,; forming an arc-shaped concave cup M on the other side of the branch. :: r5r. Luminescent diode 2. To stick two = the above-mentioned molded component can be: the upper electrode (not edged out). ㈣, liquid crystal polymer above A combination of 逑 materials. β refers to the 4th W ′, and its green color shows that according to the present invention, a kind of light-emitting diode antistatic sealing structure, the element 22 affects the light-emitting diode 2. Luminescence: In order to avoid the two angles of the protection element 22 and the light-emitting diode 2 of the Boda yuan, this embodiment will be mounted on the bracket. A molded component knife 'is installed in a one-sided two-deep depth drop package with a depth difference on the bracket, which is exposed in the arc-shaped concave cup 35 ^^ Cup 35 ° sub bracket 3Ga / 通 Parado The sub-bracket 30 a is fixed on the electrode with a wire 2 ° 8 m diode 20 and the protection element 22 is fixed to a deeper electrode (not shown). An electrode (not shown) attached to the bracket. : On the gauge, and the arc-shaped concave cup 35 with a wire 28. The upper molding structure ^ The bonding material 33 is filled with round titanium oxide, oxidized dance, liquid crystal polymer ': It is epoxy resin, glass fiber, and from the above-mentioned preferred embodiment of the present invention, it can be a combination of two and two materials. The light emitting diode M261831 that applies this creation, the scope of patent application /… a kind of antistatic package structure of light emitting diode, at least includes: branch wood 'of which-the mask has a four depressions;. Security element, fixed in the depression ; 'The chip encapsulates the recess and is formed on the other side of the bracket. An arc-shaped concave cup; and a light-emitting diode chip is fixed in the arc-shaped concave cup. ❿ 2. The anti-static light-emitting diode as described in item 1 of the scope of the patent application, and the ‘σ’ structure includes a light-emitting diode, a Schottky diode, or a zener diode. 3. The light-emitting diode anti-static package structure according to item 1 of the scope of the patent application, wherein the protection element is fixed in the recess by an adhesive material. 4. The light-emitting diode anti-static package structure described in item 1 of the scope of patent application, wherein the light-emitting diode chip is fixed in the arc-shaped concave cup by an adhesive material. 5. The light-emitting diode antistatic packaging structure according to item 丨 in the scope of the patent application, wherein the molding member is epoxy resin, glass fiber, titanium oxide, calcium oxide, liquid crystal polymer, ceramic or the above materials. combination. 6. A light-emitting diode anti-static package structure, including at least: 11 M261831 a bracket; the surface is protected by a protective element 'fixed to one side of the bracket; a wheel plastic member, which encapsulates the surface with a protective element, and is mounted on the bracket. An arc-shaped concave cup is formed on the other side; and a light-emitting polar chip is fixed in the arc-shaped concave cup. 7. The light-emitting diode antistatic package structure as described in item 6 of the patent claim, wherein the surface-adhesive protection element includes at least a light-emitting diode, a Schottky diode, or a zener diode. 8. The package structure according to the scope of patent application, wherein the surface adhesion is fixed on one side of the bracket. Anti-static light-emitting diode according to item 6. The mandrel element is fixed by the surface adhesion technology β v $ and the first diode anti-package structure is formed, wherein the light emitting diode crystal is in an arc-shaped concave cup. The piece is fixed by an adhesive material
1〇·如申請專利範圍第6項所述 封裂結構，其中該模塑構件係環 先〜極體防靜電 鈦、氧化鈣、液晶高分子、陶吝 日、破磚纖維、氧化 陶竟或上述材料的組合。 1210. The crack-sealing structure as described in item 6 of the scope of the patent application, wherein the molding member is a ring first ~ polar antistatic titanium, calcium oxide, liquid crystal polymer, pottery day, brick breaking fiber, oxide ceramic or A combination of the above materials. 12
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093211624U TWM261831U (en) | 2004-07-22 | 2004-07-22 | Anti-static LED assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093211624U TWM261831U (en) | 2004-07-22 | 2004-07-22 | Anti-static LED assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM261831U true TWM261831U (en) | 2005-04-11 |
Family
ID=36087195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093211624U TWM261831U (en) | 2004-07-22 | 2004-07-22 | Anti-static LED assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM261831U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7679090B2 (en) | 2006-10-25 | 2010-03-16 | Lighthouse Technology Co., Ltd. | SMD diode holding structure and package thereof |
| US8242531B2 (en) | 2009-02-25 | 2012-08-14 | Everlight Electronics Co., Ltd. | Light emitting diode package |
-
2004
- 2004-07-22 TW TW093211624U patent/TWM261831U/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7679090B2 (en) | 2006-10-25 | 2010-03-16 | Lighthouse Technology Co., Ltd. | SMD diode holding structure and package thereof |
| US8242531B2 (en) | 2009-02-25 | 2012-08-14 | Everlight Electronics Co., Ltd. | Light emitting diode package |
| US8497523B2 (en) | 2009-02-25 | 2013-07-30 | Everlight Electronics Co., Ltd. | Light emitting diode package |
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| Date | Code | Title | Description |
|---|---|---|---|
| MK4K | Expiration of patent term of a granted utility model |