TWM261368U - Metal plate structure for enclosure of electronic device - Google Patents

Metal plate structure for enclosure of electronic device Download PDF

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Publication number
TWM261368U
TWM261368U TW93210282U TW93210282U TWM261368U TW M261368 U TWM261368 U TW M261368U TW 93210282 U TW93210282 U TW 93210282U TW 93210282 U TW93210282 U TW 93210282U TW M261368 U TWM261368 U TW M261368U
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TW
Taiwan
Prior art keywords
layer
metal plate
metal
electronic device
plate structure
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Application number
TW93210282U
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Chinese (zh)
Inventor
Ying-Hui Chuang
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Lien Chy Laminated Metal Co Lt
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Application filed by Lien Chy Laminated Metal Co Lt filed Critical Lien Chy Laminated Metal Co Lt
Priority to TW93210282U priority Critical patent/TWM261368U/en
Publication of TWM261368U publication Critical patent/TWM261368U/en

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Description

M261368 四、創作說明(1) 【新型所屬之技術領域^ :巧:是有關於電子裝置殼體金屬 屬;:r:密著性,表面光滑、術兼具美觀 【先前技術】 y目則攜帶型電子裝置如筆記型電腦,豆軏 -金屬基材經過多道處理步驟(如:2 ::大多 的電鑛或塗裝處理),才可使其表面具多道 ?憂良密著性、防钕性,然而,在各種上述性 的,程中’會產生大量廢水及作業環以二=處理 建材等之高級化,致具… 料表面之式樣,尤其是以高鮮:重材 之形狀表現。 乂及其拉伸加工 因此’乃有中華民國專利止 專利案,其係…種塗覆樹脂:屬片43 = 片的金屬# ’其粗糙度的算術平】 .層 包括未硬化的混合型態樹= ί明軟樹脂層,其 或聚烯烴樹脂;包括顏料心著層曰=曰的塗料塗覆層, 理之透明樹脂薄膜,1中、一 ^ 有兩面經過光澤處 樹脂層,接著層和透明層覆d】;面被著色層,軟 樹脂薄膜依序覆蓋。」.鈇曰糸仗金屬片側到透明 樹脂的結構,其製造方法:於金屬片上覆蓋多層 於金屬板上塗覆著色塗料層, 第5頁 M261368 、創作說明(2) 再塗覆軟樹脂層,加熱乾燥 用積層輥輾壓,再經光澤處 製得,其雖可製得表面光澤 樹脂金屬片,但其整體之滾 本高昂,且其品質不易控制 另有中華民國專利公告 ,其係:「一種樹脂被覆金 之基板上,依序層合塗料層 月曰層D、化樣或/及全面印 # m厚之透明聚酯系樹脂薄 層合之樹脂的中間所設之變 料層、聚酯系樹脂薄膜等之 等之嚴苛加工下、構成層界 優異之加工密接性。又,金 樹脂層)之凹凸,係由變性 樹脂被覆金屬板,可獲得優 加工方式基本上亦有上述滾 缺失。 有鐘於習見塗覆樹脂之 人乃針對該些缺點研究改進 【新型内容】 本創作旨在提供一種電 於一金屬基板上塗覆一層接 鏡面滾輪直接將一由聚氯乙 後再與樹脂塗覆薄膜接觸,使 理,在高溫下輾壓,再予冷卻 ^生佳且工作黏著性優良㉔塗覆 壓過程極為繁鎖,不但製造成 〇 第4 0 4 8 8 8號發明專利案 屬板,其主要係以一金屬材質 、5〜1 0 0 // m厚之變性烯烴樹 刷層C、接著劑層b、5〜1 〇 〇 膜A而成之樹脂被覆金屬板。 性烯烴樹脂層,與印制層、塗 接著性優異,故而即使在深沖 面處之剝離也不會發生,具有 屬板之表面粗糙或各構成層( 烯烴樹脂層吸收,因此,作為 異之鮮映性。」;此種結構之 壓過程繁鎖、加工成本高昂之 金屬板片有上述之缺點,創作 之道,終於有本創作產生。 子裝置殼體金屬板結構,其係 著劑並烘烤後,經由一加熱之 稀層、接著層、印刷層、聚酯M261368 IV. Creation instructions (1) [Technical field to which the new type belongs ^: Clever: It is about the metal genus of the electronic device housing;: r: Adhesiveness, smooth surface, and aesthetically pleasing technique [Previous technology] Carrying y head -Type electronic devices such as notebook computers, tempeh-metal substrates undergo multiple processing steps (such as: 2: most of the electrical ore or coating treatment), can their surfaces have multiple channels? Worry good adhesion, Neodymium resistance, however, among the above-mentioned properties, during the process, a large amount of waste water will be generated and the operation ring will be treated as a high-level treatment of building materials, resulting in a pattern of ... which performed.乂 and its stretching processing are therefore a patent pending patent of the Republic of China, which is a kind of coating resin: a piece of metal 43 = sheet metal # 'the arithmetic level of its roughness]. The layer includes an unhardened mixed type Tree = bright soft resin layer, or polyolefin resin; including pigment coating layer, coating layer, transparent resin film, 1 medium, 1 ^ resin layer with two sides passing through the gloss area, then the layer and The transparent layer is covered by d]; the surface is sequentially covered by the colored layer and the soft resin film.鈇. The structure of the transparent resin from the side of the metal sheet is manufactured by covering the metal sheet with multiple layers and applying a colored paint layer on the metal plate. Page 5 M261368, Creative Instructions (2) Applying a soft resin layer and heating It is made by laminating rolls for drying, and then made by gloss. Although it can produce surface gloss resin metal sheets, its overall roll cost is high, and its quality is not easy to control. There is also a patent publication of the Republic of China, which is: On the resin-coated gold substrate, a coating layer is sequentially laminated, such as a layer D, a sample, and / or a full-printed #m thick transparent polyester resin thin laminated resin layer, a polyester layer, and a polyester layer. Under the severe processing of resin films, etc., it has excellent processing adhesion for forming the layer boundary. Moreover, the unevenness of the gold resin layer) is covered with a denatured resin for a metal plate, and an excellent processing method can basically be obtained. . Some people who are familiar with resin coating have researched and improved for these shortcomings. 【New content】 The purpose of this creation is to provide a metal substrate with a mirror-coated roller directly coated with a polyvinyl chloride. Then contact with the resin-coated film. Let it be rolled at high temperature, and then cooled. It is good and has good work adhesion. The coating and pressing process is extremely complicated. It is not only manufactured into No. 4 0 4 8 8 8 The invention patent case belongs to a plate, which is mainly a resin-coated metal plate made of a metal material, a modified olefin tree brush layer C having a thickness of 5 to 100 0 // m, an adhesive layer b, and a film 5 to 100. The olefinic resin layer has excellent adhesion to printed layers and coatings, so peeling does not occur even at the deep-drawn surface, and it has a rough surface of the metal plate or various constituent layers (the olefinic resin layer absorbs, so it is different from The freshness of this structure. "; The metal plate of this structure has a complicated process of pressing and high processing cost. The above-mentioned shortcomings are caused by the creation method. The metal plate structure of the casing of the sub-device has a binding agent. After baking, through a heated thin layer, adhesive layer, printing layer, polyester

第6頁 M261368 、創作說明(3) 層構f的皮獏層滾壓合於、^ 著劑結合,使J?基板付以进著,藉由該聚氯乙烯層與接 耐磨之保護,卩:::屬基板表面形成高度的光滑及 W合印刷層顯現之美_效要暂 金屬板之整體暂成f ^ ^又夹规效果貝,可有效提昇 至於本貪感,此為本創作之主要目的。 參照下列依附圈::田構以、應用原理、作用與功效,則 【實施方式】所作之說明即可得到完全的瞭解·· 第1圖係本創作之構造剖面圖, 之主要結構包括· +屬A ,囬α由4圖所不,本創作 份,苴中該金屬其f 1 、接著劑2及皮膜層3等部 切八T 4金屬基板丄係一 :士寺^ ,一般以質輕強度佳之今麗k =电卞表置八又體之基本材料 劑2係以-適當厚声(=板广:銘板)較適當,接著 板丄之至少一側=,(:力4口:Vm)塗覆於前述金屬基 著劑2適當軟化,❿皮膜声’3、: 00〜210 C之間,使該接 -接著層32、-印以係二:聚氯乙婦層31、 合而成,使該皮膜層3 i於兮技—^自曰層3 4依序層疊結 層3 1與接著劑2相接觸,‘ f 2 2 = ’以該聚氣乙稀 持議〜霞之間)將滾;::=面=(溫度保 與金屬基板1密著結合。 、、、 P 使该皮膜層3 上述皮膜層3中,由於取 較光滑,可有效保護該皮心3曰二心較::耐刮,且 3 2内,則可添加金屬粉末( ^ ;该接著層 層3帶有金属光澤,以增加視覺 M261368 創作說明(4) 與皮膜層3中聚氯乙烯3 1之接著劑2 ,其係一含有高耐 熱性亞克力樹脂成份之接著劑,以使其具有較穩定之、=人 效果。 以下輔以實例,說明本發明之成型方法及其結構所能 達成之功效: % 實例一 ·· 在厚度為0 · 8 m m的銘板上,塗布9 # m亞克力樹脂接著 劑,並予以烘烤之,烘烤後之板溫為2〇4它,將皮膜層3 以加熱至1 9 1 °C之鏡面滾輪滾壓,滾壓為5 · 〇,再以水冷卻 ,結果發現,本創作之密著性為3· 5A,有優良的光滑^ 環境測試後密著為3. 5 Α。 實例二: 在厚度為0.8mm的鋁板上,塗布9 #㈤亞克力樹脂接著 ^ ^ ί予以供烤之’供烤後之板溫為2 0 7 °c ’將皮膜層3 以:要' 91 C一之鏡面滾輪滾壓,滾壓為5· 5,再以水冷卻 別;德〗垃岔著性為3 · 5 A,皮膜表面光滑性良好,環境 測忒後,密接性為3· 5A。 兄 功 並 具有加ΐ = Ϊ可知,本創作電子裝置殼體金屬板結 ;產;Ϊ環保要求且表面光滑、密著性 惟以上所述I,=性、新穎性及進步性。 僅為本創作之一較佳實施例而Page 6 M261368, Creation Note (3) The skin layer of the layer f is rolled and bonded with a bonding agent, so that the J? Substrate is advanced, and the polyvinyl chloride layer is protected by abrasion resistance.卩 ::: It belongs to the beauty of high smoothness on the surface of the substrate and the appearance of the W-printing layer. The effect of the temporary temporary metal plate is f ^ ^ and the clip effect can be effectively improved. the main purpose. Refer to the following attachment circles: Tian Tianyi, applied principles, functions and effects, then the description of [Embodiment] can be fully understood. · Figure 1 is the structural cross-section of this creation. The main structure includes: + It belongs to A. The alpha is not shown in Figure 4. In this creative work, the metal is cut into eight T 4 metal substrates, such as f 1, adhesive 2 and film layer 3. The first one is Shi Temple ^, generally light in weight. The best strength of this time k = the basic material agent of the electric meter with octave body 2 is-appropriate thick sound (= board wide: name plate) is more appropriate, then at least one side of the board =, (: force 4 port: Vm ) Coated on the aforementioned metal base agent 2 to soften it properly, and press the film sound between '3: 00 ~ 210 C, so that the bonding-adhesive layer 32,-is printed with the second: polyvinyl chloride layer 31, and So that the film layer 3 i can be used in the technology— ^ Since the layer 3 4 is sequentially stacked, the junction layer 31 is in contact with the adhesive 2, 'f 2 2 =' ) Rolling :: = surface = (Temperature protection is tightly combined with the metal substrate 1. 、,, P makes the film layer 3 of the above film layer 3, because it is smoother, it can effectively protect the skin center. Comparison :: Scratch resistant, and within 3 2 metal powder can be added (^; the adhesive layer 3 has a metallic luster to increase the visual M261368 creative instructions (4) and the polyvinyl chloride 3 in the film layer 3 1 Adhesive 2 is an adhesive containing a high heat-resistant acrylic resin component, so that it has a relatively stable, human effect. The following is supplemented by examples to illustrate the effect that the molding method and structure of the present invention can achieve: % Example 1 · On a nameplate with a thickness of 0 · 8 mm, apply 9 # m acrylic resin adhesive and bake it. The temperature of the plate after baking is 204. The film layer 3 is heated to Mirror roller with a temperature of 19 ° C was rolled at 5 · 〇, and then cooled with water. As a result, it was found that the adhesion of this work was 3.5A, and it had excellent smoothness. ^ The adhesion after environmental testing was 3. 5 Α. Example 2: On an aluminum plate with a thickness of 0.8mm, apply 9 # acrylic resin and then ^ ^ to give it for baking 'The plate temperature after baking is 2 0 7 ° c' '91 C Yizhi's mirror roller is rolled, the rolling is 5 · 5, and then cooled with water; Germany〗 3 5 A, the surface of the film is very smooth, and the adhesion is 3.5A after the environmental test. Brothers have added ΐ = Ϊ It can be seen that the electronic device casing metal plate is produced in this creative production; Adhesion is only the above-mentioned I, = sex, novelty, and progressiveness. It is only a preferred embodiment of this creation.

M261368M261368

第9頁 M261368 圖式簡單說明 第1圖係本創作之構造剖面圖 < 圖 示 元 件 號 1..... 金 屬 基 板 2..... 接 著 劑 3..... 皮 膜 層 31____ 聚 氣 乙 稀 層 32____ 接 著 層 33____ 印 刷 層 34____ 聚 酯 層Page 9 M261368 Schematic description of the first diagram is the cross-section of the structure of this creation < element number of the picture 1 ..... metal substrate 2 ..... adhesive 3 ..... film layer 31____ 聚Gas vinyl layer 32____ followed by 33____ printed layer 34____ polyester layer

第10頁Page 10

Claims (1)

^61^68 五、申請專利範圍 1. 一種電子裝置殼體金屬板結構,其至少包括: 一金屬基板; 一接著劑層,塗覆於前述金屬基板之至少一側表面 並經加熱使之適當軟化; 接著層、一聚 皮膜層,係由至少一聚氯乙稀層 酯層依序層疊結合而成,且可以一加熱之滾輪滾壓層合 於前述接著劑層上,然後冷卻,可使該皮膜層與金屬基 板密著結合。 2. 如申請專利範圍第1項所述之電子裝置殼體金屬板結構 ,其中該皮膜層内之接著層與聚酯層之間設有一印刷層 〇 3. 如申請專利範圍第1或2項所述之電子裝置殼體金屬板 結構,其中該皮膜層之接著層内可加入金屬粉末。^ 61 ^ 68 V. Application for patent scope 1. A metal plate structure of an electronic device housing, which at least comprises: a metal substrate; an adhesive layer, which is coated on at least one surface of the aforementioned metal substrate and heated to make it suitable Softening; the next layer and a polymer film layer are formed by stacking and combining at least one polyvinyl chloride ester layer in sequence, and can be laminated on the aforementioned adhesive layer by a heated roller, and then cooled, so that This coating layer is tightly bonded to the metal substrate. 2. The metal plate structure of the casing of the electronic device as described in item 1 of the scope of patent application, wherein a printing layer is provided between the adhesive layer in the film layer and the polyester layer. 0. Item 1 or 2 of the scope of patent application In the metal plate structure of the electronic device casing, metal powder can be added into the adhesive layer of the film layer. 第11頁Page 11
TW93210282U 2004-06-30 2004-06-30 Metal plate structure for enclosure of electronic device TWM261368U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8409678B2 (en) 2010-04-06 2013-04-02 Pao Yi Technology Co., Ltd. Thin metal casing with plastic part and manufacturing method thereof
TWI663904B (en) * 2014-09-29 2019-06-21 群邁通訊股份有限公司 Housing and electronic device using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8409678B2 (en) 2010-04-06 2013-04-02 Pao Yi Technology Co., Ltd. Thin metal casing with plastic part and manufacturing method thereof
TWI663904B (en) * 2014-09-29 2019-06-21 群邁通訊股份有限公司 Housing and electronic device using the same

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