TWI280190B - Forming method of the metallic slab for electronic device shell and its structure thereof - Google Patents

Forming method of the metallic slab for electronic device shell and its structure thereof Download PDF

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TWI280190B
TWI280190B TW93119015A TW93119015A TWI280190B TW I280190 B TWI280190 B TW I280190B TW 93119015 A TW93119015 A TW 93119015A TW 93119015 A TW93119015 A TW 93119015A TW I280190 B TWI280190 B TW I280190B
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layer
adhesive
electronic device
film layer
metal
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TW93119015A
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Chinese (zh)
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TW200600333A (en
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Ying-Hui Chuang
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Lien Chy Laminated Metal Co Lt
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Abstract

A forming method of the metallic slab for electronic device shell and its structure, which primarily coats a layer of adhesive onto a metallic substrate which is then subject to baking, followed by directly utilizing a heated mirror roller to laminate a film layer composed of the PVC layer, the adhesive layer, the printing layer, and polyester layer onto the adhesive for binding, and forms by subsequent cooling, such that the film layer and the metallic layer possesses excellent air-tightness in between. By means of direct rolling-press forming process method, waste water and environment pollutions generated from the surface treatment of substrate can be effectively avoided, and the materials of PVC layer and polyester layer of the film layer can maintain high smoothness and erosion resistance for the surface of metallic substrate in order that both artistic and protection efficacies can be possessed.

Description

1280190 五、發明說明 【發明所屬之技術領域』 構,特別』:ί f電子裝置殼體金屬板成型方法及复处 且符人^ T 種加工簡易、具高度光滑表面及资$ ^、、、° 環保要求之金屬板成型方法及其= 俜由目:ΐ▼型電子裴置如筆記型電腦,其殼體社構*夕 2鑛或塗裝處理w可使其表…多道 =密著性、防钱性,然而,在各種上述各性 而二、=中,會產生大量廢水及作業環境污染等環‘問二理1280190 V. INSTRUCTIONS INSTRUCTIONS [Technical field to which the invention belongs], special 』: f f electronic device shell metal sheet forming method and re-integration and is easy to handle, highly smooth surface and capital ^ ^,,, ° Environmentally-friendly metal sheet forming method and its = 俜 目: ΐ ▼ type electronic device such as notebook computer, its shell structure * 夕 2 mine or coating treatment w can make its table ... multi-channel = dense Sexuality and anti-money, however, in all the above-mentioned variousities, and in the second, there will be a lot of waste water and environmental pollution.

建Ξ2丄伴隨著家電機器、音響機器、*房器具:内F f荨之兩級化,致使各種電子裝置之殼體亦隨之、、主二 枓表面之式樣,尤其是以高鮮映他材 之形狀表,見。 矛〇見w及其拉伸加工 專利【此華民2利公告第4 3 4 1 “號發明 J案,其係· 「一種塗覆樹脂金屈y ^ 片的金屬[其粗糙度的算術平均匕=:、:乍為;層 〇微米及1〇微米之間;著色塗差巾:度數值介於 包括未硬化的混合型態樹脂層,聚;:^軚知"曰層’其 或聚烯烴樹脂;包括顏料之接著:=的塗料塗覆層’ ™ ^ 9 ,其有兩面經過光澤處 樹ίΓ月:?f膜,其2少一金屬片表面被著色層,軟 樹脂的結構,《製造方法係於金屬心::择片+上覆盍多層 1屬板上塗覆著色塗料層,Jianye 2丄 is accompanied by home appliances, audio equipment, and *room appliances: the internalization of F f荨, resulting in the shell of various electronic devices, and the appearance of the main surface, especially The shape of the material table, see. Spear 〇 see w and its stretch processing patent [This Huamin 2 Lee Announcement No. 4 3 4 1 "No. J case, its system · "A metal coated with resin y y ^ sheet [the arithmetic mean of its roughness匕 =:,: 乍 is; layer 〇 micron and 1 〇 micron; coloring coated towel: degree value between the layer comprising uncured mixed type resin, poly;: ^ knowing " 曰 layer' Polyolefin resin; including pigment coating: = coating coating layer ' TM ^ 9 , which has two sides through the gloss of the tree Γ : : ? : : : : , , , , , , , , , , , : : : : : : : : : : : : : : "The manufacturing method is based on the metal core:: the sizing + super-layer 盍 multi-layer 1 slab coated with a pigmented coating layer,

第5頁 1280190 --------- 五、發明說明(2) ^覆軟樹脂層,加熱乾燥後再與樹脂塗覆薄膜接觸,使 制,層輥輾麼,再經光澤處理,在高溫下輾麼,再予冷卻 二Ϊ雖可製得表面光澤性佳且工作黏著性優良的塗覆 f ,屬片,但其整體之滾壓過程極為繁鎖,不但製造 本南叩’且其品質不易控制。 二有^華民國專利公告第4 ◦ 4 8 8 8號發明專利案 ,; 一種樹脂被覆金屬板,其主要係以一金屬材質 r二D二依序層合塗料|、5〜1 〇〇"m厚之變性烯烴樹 二及全面印刷層C、接著劑層6、5〜10: 二iiirr旨系樹脂薄膜a而成之樹脂被覆金屬板。 料;、間所設之變性烯烴樹脂層,與印制層、塗 等^嚴^ 薄膜等之接著性優異,故而即使在深沖 優異之Γ二下、構成層界面處之剝離也不會發生,具有 樹ί尽/工岔接性。又,金屬板之表面粗糙或各構成層( 樹月。舜ί:凸’係由變性稀烴樹脂層吸收,因此,作為 加工方;:太板’可獲侍優異之鮮映性。」;此種結構之 缺失。本上亦有上述滾壓過程繁鎖、加工成本高昂之 人乃塗覆!"旨之金屬板片有上述之缺點,發明 【發明内容『、點研究改進之道,終於有本發明產生。 其結:發;種電子裝置殼體金屬板成型方康及 經由一力^ 一至萄基板上塗覆一層接著劑並烘烤後, …之鏡面滾輪直接將一由聚氣乙烯層、接著層、 第6頁 1280190 五、發明說明(3) 印刷層、聚酯層構成的皮祺 後冷卻成型,其整體加工方 屬基板表面處理(如··化成 生之廢水處理及環境污染問 依本發明之此種電子裝 構,其藉由加熱後之鏡面滚 該皮膜層内之聚氯乙烯層: 滑性及優良密著性,達到最 為本發明之另一目的。 至於本發明之詳細構造 參照下列依附圖所作之說明 【實施方式】 第1圖係本發明之成型 顯地看出,本發明之加工流 1Q、 「烘烤加熱」ii、 1 3等步驟,其中「塗佈接 基板1之至少一側表面塗覆 」步驟1 1 ,則係加熱該接 之適當軟化,該「滾壓」步 7衰輪(溫度保持於1 9 G〜2 0 0 合於該接著劑2上,又「冷 1亥接=劑2,使該皮膜層3 第2圖係本發明之構造 之主要結構包括:金屬基板 層滾壓 法極為 處理及 題,此 置殼體 輪直接 聚酯層 佳之美 、應用 即可得 方法流 裎主要 「滾壓 著劑」 層合於該接著劑上,然 簡易,且可有效避免金 電鍍或塗裝處理)所產 為本發明之主要目的。 金屬板成型方法及其結 滾壓於皮膜層上,可使 於成型後形成高度的光 觀及保護、耐蝕性,此 原理、作用與功效,則 到完全的瞭解: 程圖,由該 包括:「塗 」12及「冷卻成型 _丨 圖可以很明 佈接著劑」 步驟1 0,係於一金屬 —層接著劑2 ,而 至200〜210 著劑2 驟1 2 °C之間 卻成型 與金屬 剖面圖 1 、接 ,係藉由一 )將一皮膜 」步驟1 3 基板1得以 ,由該圖所 著劑2及皮 「烘烤加熱 °C之間,使 加熱之鏡面 層3滾壓層 ,則係冷卻 密著結合。 示,本發明 膜層3等部Page 5 1280190 --------- V. Description of the invention (2) ^ Cover the soft resin layer, heat and dry, then contact with the resin coated film, make the layer, roll, and then gloss treatment, At high temperatures, it can be used to cool the coating. Although it can produce a coating with good surface gloss and excellent work adhesion, it is extremely sturdy, and the whole rolling process is extremely complicated. Its quality is not easy to control. 2. There is a patent case of the Republic of China Patent No. 4 ◦ 4 8 8 8 , a resin-coated metal plate, which is mainly composed of a metal material r 2 D two sequential coatings |, 5~1 〇〇&quot m thick denatured olefin tree 2 and full printed layer C, adhesive layer 6, 5 to 10: Two iiirr resin-coated metal sheets obtained by resin film a. The olefin resin layer provided between the materials and the olefin resin layer is excellent in adhesion to the printed layer, the coating, and the like. Therefore, even if it is excellent in deep drawing, peeling at the interface of the layer does not occur. , with tree / / work connection. Further, the surface of the metal plate is rough or the constituent layers (the tree is 由 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : The lack of such a structure. The above-mentioned people who are complicated in the rolling process and have high processing cost are coated! The metal sheet has the above-mentioned shortcomings, and the invention [invention content], the point of research and improvement, Finally, the invention is produced. The knot: the hair; the electronic device shell metal plate forming Fang Kang and after applying a layer of adhesive on the substrate to the substrate, and baking, the mirror roller directly receives a gas from the gas Layer, Adhesive Layer, Page 6 1280190 V. INSTRUCTIONS (3) After the skin layer of the printed layer and the polyester layer is cooled and formed, the overall processing is the surface treatment of the substrate (such as the wastewater treatment and environmental pollution of the chemical industry) According to the electronic device of the present invention, it is achieved by the mirror-rolling of the polyvinyl chloride layer in the film layer after heating: slipperiness and excellent adhesion to achieve the other object of the present invention. Detailed construction reference DESCRIPTION OF THE PREFERRED EMBODIMENTS [Embodiment] FIG. 1 is a view showing the process of the present invention, which is a process flow 1Q, "baking heating" ii, 1 3, etc. of the present invention, wherein "the substrate 1 is coated. "At least one surface is coated" step 1 1 , the appropriate softening is performed by heating the joint, and the "rolling" step 7 is a decaying wheel (the temperature is maintained at 19 G to 200 in combination with the adhesive 2, and Cold 1H = Agent 2, the film layer 3 The second figure is the main structure of the structure of the present invention: the metal substrate layer rolling method is extremely processed and the problem, the shell wheel direct polyester layer is good, the application The method of flowing the main "rolling agent" laminated on the adhesive, which is simple and can effectively avoid gold plating or coating treatment, is the main purpose of the invention. The knot is rolled onto the film layer, which can form a high degree of light and protection and corrosion resistance after molding. The principle, function and effect are fully understood: The process includes: "Coating" 12 and " Cooling molding _ 丨 可以 can be very clear adhesive agent step 1 0 Attached to a metal-layer adhesive 2, and to 200~210 of the agent 2 between 12 ° C but molded and metal profile 1 , connected by a) a film "step 1 3 substrate 1 According to the drawing 2 and the skin "bake heating °C, the heated mirror layer 3 is rolled and laminated, and the film is cooled and bonded.

1280190 五、發明說明(4) 份’其中該金屬基板1係一組成電子裝置殼體之基本材料 ’一般以質輕強度佳之金屬板(如:鋁板)較適當,接著 劑2係以一適當厚度(約4〜6 # m )塗覆於前述金屬基 板1之至少一側表面,而皮膜層3則係由:一聚氯乙烯層 3 1 、一接著層3 2、一印刷層3 3、一聚酯層3 4依序 層疊結合而成,且以該皮膜層3受壓時係以該聚氯乙稀層 3 1與接著劑2相黏合,以使該皮膜層3與金屬基板丄二 著結合。 山 本發明上述皮膜層3中,由於聚酯層3 4具較佳的耐 刮性且較光滑,可有效保護該皮膜層3内部各層,而於該 接著層3 2内’則可添加金屬粉末(如··鋁粉等),以使 該皮膜層3帶有金屬光澤,以增加視覺美感;而接著金 基f 1與皮膜層3中聚氯乙烯3 ]_之接著劑2 ,其係〜含 有高耐熱性亞克力樹脂成份之接著劑,以使其具有較穩= 之結合效果。 〜疋 以下輔以實例,說明本發明之成型方法及其結構 達成之功效: ^ 實例一: 添 在厚度為〇 · 8mm的鋁板上,塗布9 # m亞克力樹脂接著· ^ ’並予以供烤之,烘烤後之板溫為2 0 4 °C,將皮祺層3 乂 2熱至1 9 1它之鏡面滾輪滾壓,滾壓為5 · 〇,再以水冷卻 I結果發現,本發明之密著性為3 · 5 a,有優良的光滑性, ^境測試後密著為3. 5 A。1280190 V. INSTRUCTIONS (4) The 'the basic material of the metal substrate 1 which constitutes the electronic device housing' is generally suitable for a metal plate (such as an aluminum plate) of good quality and light strength, and the adhesive 2 is a suitable thickness. (about 4 to 6 #m) is applied to at least one side surface of the metal substrate 1, and the film layer 3 is composed of: a polyvinyl chloride layer 3 1 , an adhesive layer 3 2, a printed layer 3 3, a The polyester layer 34 is sequentially laminated and bonded, and when the film layer 3 is pressed, the polyvinyl chloride layer 31 is bonded to the adhesive 2 so that the film layer 3 and the metal substrate are bonded together. Combine. In the above-mentioned film layer 3 of the present invention, since the polyester layer 34 has better scratch resistance and smoothness, the inner layers of the film layer 3 can be effectively protected, and in the adhesive layer 32, metal powder can be added ( Such as aluminum powder, etc., so that the film layer 3 has a metallic luster to increase the visual aesthetic; and then the gold base f 1 and the film layer 3 in the polyvinyl chloride 3]_ the adhesive 2, which contains ~ A high heat-resistant acrylic resin component adhesive to give it a more stable combination. ~ 疋 hereinafter, with the following examples, illustrate the effect of the molding method and structure of the present invention: ^ Example 1: Adding to an aluminum plate having a thickness of 〇·8 mm, coating 9 #m acrylic resin followed by ^ ^ and serving it for baking The plate temperature after baking is 2 0 4 ° C, and the skin layer 3 乂 2 is heated to 1 9 1 and its mirror roller is rolled, rolled to 5 · 〇, and then cooled by water I. The invention is found. 5 A。 The adhesion is 3 · 5 a, has a good smoothness, the adhesion after the test is 3. 5 A.

第8頁 1280190Page 8 1280190

在厚度為0. 8mm的鋁板上涂 蜊,ϋ予以烘烤之,烘 二布广5克力樹脂接著 以加熱至191 tI 板/皿為207 C,將皮膜層 ,結果發現,密%鏡:二,壓,編^ 測試後,密接性為3 f3.5A,皮膜表面光滑性良好,環境 由上所述可知, 及其結構確實具有加工t明電=裝置殼體金屬板成型方法 密著性佳之功效,確=2付合環保要求且表面光滑、一 步性。 /、有產業上之利用性、新穎性及進 惟以上所述者, 非用來限定本發明實 圍所作之均等變化與 僅為本發明之一較佳實施例而已,並 ^之範圍、。即凡依本發明申請專利範 >飾’皆為本發明專利範圍所涵蓋。Apply a crucible on an aluminum plate having a thickness of 0.8 mm, and bake it. Bake a 2 gram of resin and then heat to 191 tI plate/dish to 207 C. The film layer is found to be dense. Second, pressure, editing ^ After testing, the adhesion is 3 f3.5A, the surface of the film is smooth, the environment is known from the above, and its structure does have processing t = electricity = device shell metal sheet forming method adhesion Good effect, indeed = 2 pay for environmental protection requirements and the surface is smooth, one step. / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / That is, the patents of the inventions are all covered by the scope of the invention.

第9頁 1280190 圖式簡單說明 第 1 圖 係 本 發 明 之 成 型 方 第 2 圖 係 本發 明 之 構 造 剖 < 圖 示 元 件 號 數 參 昭 > 1· 金 屬 基 板 2. • 接 著 劑 3· 皮 膜 層 31 聚 氣 乙 稀 層 32 接 著 層 33 印 刷 層 34 聚 酯 層 10 厂 塗 佈 接 著 劑 j 步 驟 11 厂 烘 烤 加 熱 j 步 驟 12 厂 滾 壓 j 步 驟 13 厂 冷卻 成 型 j 步 驟 Φ ΦPage 9 1280190 Brief Description of the Drawings Fig. 1 is a molding of the present invention. Fig. 2 is a structural section of the present invention. < Illustration of the number of components is shown.> 1. Metal substrate 2. • Adhesive 3· Film layer 31 Polyethylene Ethylene Layer 32 Next Layer 33 Printing Layer 34 Polyester Layer 10 Factory Coating Adhesive j Step 11 Factory Baking Heating j Step 12 Factory Rolling j Step 13 Plant Cooling Forming j Step Φ Φ

第ίο頁Page ίο

Claims (1)

_ 六、申請專利範ΐ 1. 一種電子裝置殼體金屬板成型方法,其至少包括: 一「塗佈接著劑」步驟,係於一金屬基板之至少一側 表面塗覆一層接著劑,該金屬基板係由ί呂合金所製成, 且該接著劑具有金屬粉末; 一「烘烤加熱」步驟,加熱該塗覆接著劑之金屬基板 ,使該接著劑適當軟化; Υ 一「滾壓」步驟,藉由一加熱之滾輪將一皮膜層滾壓 層合於該接著劑上; 一「冷卻成型」步驟,使該皮膜層與金屬基板得以密 著結合。 2. 如申請專利範圍第1項所述之電子裝置殼體金屬板成型 方法,其中該「滾壓」步驟之滾輪係一鏡面滾輪。 3. 如申請專利範圍第2項所述之電子裝置殼體金屬板成型 方法,其中該鏡面滾輪之溫度係於1 9 0〜2 0 0°C之間。 4. 如申請專利範圍第1或2或3項所述之電子裝置殼體金 屬板成型方法,其中該「烘烤加熱」步驟之烘烤溫度係 於2 0 0〜2 1 0QC之間。 5. —種電子裝置殼體金屬板結構,其至少包括: 一金屬基板,其係為銘合金所製成; 一接著劑層,塗覆於前述金屬基板之至少一側表面, 並經加熱使之適當軟化; 一皮膜層,係由至少一聚氯乙烯層、一接著層、一聚 酯層依序層疊結合而成,且接著層具有金屬粉末; 使該皮膜層藉由一加熱之滚輪滾壓層合於該接著劑_ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The substrate is made of ίLu alloy, and the adhesive has a metal powder; a "baking heating" step of heating the metal substrate coated with the adhesive to appropriately soften the adhesive; Υ a "rolling" step A film layer is rolled and laminated on the adhesive by a heated roller; a "cooling molding" step allows the film layer to be intimately bonded to the metal substrate. 2. The method of forming a metal plate of an electronic device housing according to claim 1, wherein the roller of the "rolling" step is a mirror roller. 3. The method of forming a metal plate of an electronic device housing according to claim 2, wherein the temperature of the mirror roller is between 19 and 200 °C. 4. The method of forming a metal plate of an electronic device housing according to claim 1 or 2 or 3, wherein the baking temperature of the "bake heating" step is between 2 0 0 and 2 10 QC. 5. An electronic device housing metal plate structure comprising at least: a metal substrate made of an alloy; an adhesive layer applied to at least one side surface of the metal substrate and heated Appropriate softening; a film layer formed by laminating at least one polyvinyl chloride layer, one adhesive layer and one polyester layer in sequence, and the subsequent layer has a metal powder; the film layer is rolled by a heating roller Laminated to the adhesive 第11頁 1280190 六、申請專利範圍 層上,然後冷卻,可使該皮膜層與金屬基板密著結合。 6. 如申請專利範圍第5項所述之電子裝置殼體金屬板結構 ,其中該皮膜層内之接著層與聚酯層之間設有一印刷層 〇 7. 如申請專利範圍第5項所述之電子裝置殼體金屬板結構 ,其中該金屬粉末係為鋁粉。Page 11 1280190 VI. Application for the patent area The layer is then cooled to allow the film layer to be tightly bonded to the metal substrate. 6. The electronic device housing metal plate structure of claim 5, wherein a printing layer 〇7 is disposed between the adhesive layer and the polyester layer in the film layer. The electronic device housing metal plate structure, wherein the metal powder is aluminum powder. 第12頁Page 12
TW93119015A 2004-06-29 2004-06-29 Forming method of the metallic slab for electronic device shell and its structure thereof TWI280190B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8409678B2 (en) 2010-04-06 2013-04-02 Pao Yi Technology Co., Ltd. Thin metal casing with plastic part and manufacturing method thereof
TWI419748B (en) * 2010-04-27 2013-12-21 Ichia Tech Inc Method of forming a fine line on a molding die

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201400289A (en) * 2012-06-22 2014-01-01 Ritedia Corp Liquid metal composite material and method for fabricating the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8409678B2 (en) 2010-04-06 2013-04-02 Pao Yi Technology Co., Ltd. Thin metal casing with plastic part and manufacturing method thereof
TWI419748B (en) * 2010-04-27 2013-12-21 Ichia Tech Inc Method of forming a fine line on a molding die

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