M259911 四、創作說明（1) 【新型所屬之技術領域】 本創作係提供一種可使丨c於高溫模擬環 ，以獲致更加精準測試品質之應用於〗c檢測 $測 裝置。 …、列至 【先前技術】 在現今，科技不斷地研擎與創新，以往必需由許多 型電子電路結合才能完成之工作，已完全由積體電路 (integrated circuit，簡稱 I c )所取代，由於 j c 生產過程中需經過多道加工程序，因此為確保產品品質 於I C製作完成後，均會進行電路檢測作業，以檢測是否 損壞，進而淘汰出不良品，且若I C係應用於高溫場所日卞 (例如1 5 0 °C )，在載送至測試台之過程中，即視應用 場所之溫度，令各載具可產生高溫，使I C處於模擬應用 場所之高溫環境中進行載送，以期提高測試品質，請參_ 第1圖所示，係為申請人先前申請之台灣專利申請第 882 1 762 6號「I C檢測裝置」專利案，其係於機台上設有 一測試台1 ，而測試台1之上方設有一檢測裝置2 ，以控 制數個可產生高溫之吸頭3作X — Z方向位移，一設於檢 測裝置2前方之入料機構4 ，係設有可產生高溫之吸頭5 及載台6 ，以分別取放及載送I C，一設於檢測裝置2後 方之出料機構7 ，亦設有吸頭8及載台9 ，以分別取放及 載送I C ，請配合第2圖所示，當丨c製作完成後，入料 機構4之吸頭5即將IC吸取並置放 6載送至檢測裝置2之前方，再由檢測以之吸 M259911 四、創作說明（2) I C吸取至測試台1進行測試作業；惟，I C於載送之過 程中均由各吸頭及載台產生之高溫，使其處於模擬高溫之 應用環境中，但測試台卻位於開放式之常溫空間中，當 I C置入時，即會迅速降溫，而於常溫狀態下進行測試， 非處於模擬應用之高溫環境中作檢測，使模擬檢測高溫環 境之一貫化載送流程，在最後重要之測試動作，卻具有溫 度上之落差，進而影響I C之測試品質，並無法獲致最佳 之測試效益，因此，如何使I C於載送、測試之作業流程 中均處於最佳之模擬應用高.溫環境，即為業者思考及改良 之標的。 【新型内容】 本創作之主要目的係提供一種應用於I C檢測機之熱 測室裝置，其主要係在於檢測裝置及測試台之外部固設一 外罩，使外罩之内部形成一半密閉式空間之熱測室，並於 側方設有一升溫器，該升溫器之出風口則相通至熱測室； 藉此，可視I C應用場所之溫度，而控制升溫器之出風溫 度，使熱測室之溫度升溫至預設溫度，令測試台於模擬之 高溫環境中對I C進行測試，以避免I C置入時迅速降 溫，使I C在載送及檢測之一貫化過程中均處於模擬高溫 之環境下，而達到獲致更加精準檢測品質之實用效益。 本創作之次一目的係在於該升溫器之出風口處設有一感溫 件，俾以將溫度回授至一控制器，以控制熱測室之溫度 ，以確保I C在最佳模擬高溫之環境下進行測試，而提升 測試品質。 M259911 四、創作說明（3) 【實施方式】 步之瞭解，茲舉 為使貴審查委員對本創作 一較佳實施例並配合圖式，詳述 請參閱第3〜R岡私- ° ^ 七 、， 、， ΰ圖所不，該機台上設有一測試台 上述設計非本創作之 外罩5 〇 ，該外 出料機構3 0 、4 〇 之載台3 2 、4 2出入，並於雨側面及前面外部均設有滑 槽5 1供插置面板5 2 ，且將面板5 2鎖固於外罩5 〇 上，以供開啟維修外罩5 〇内之物件，-挪μ μ浓^ -方之升溫器6 〇 ，其内部設有一 有二風扇63 、64 ，其 並方、測忒台1 〇之上方設有檢測裝置2 〇 ，以控制 數？可產生2溫之吸頭2 1 # X — Ζ方向位移，-設於檢 測裝置2 〇前方之入料機構3 〇 ，係設有町產生高溫之吸 1 3 1及載台3 2 ，以分別取放及載送I C，一設於檢測 裝置2 0後方之出料機構4 〇 ，亦設有吸頭4 1及載台 4 2 ，以分別取放及載送丨c，由於上' ·’ 丄· · 標的，故在此不予贅述，本創作係設有 罩5 0之兩側板底面具有通道供入 風管6 穹二Μ ，另該風管61之出風 有一 以控 設於外罩5 0側 ，並於風管6 1 中設有發熱件6 2 ，且於上方設 一風扇6 4可消除I c上之靜電 6 1 1係相通至外罩5 〇内，旅於出風口 6 1 1處設有 感溫件6 5 ，俾以將出風溫度旧授至一控制器6 6 ，以灯 制外罩5 〇内部之溫度，進而該外罩5 0係罩置於檢測裝 置2 0及測試台1 〇之外部，而鎖固於機台上，並可供λ 料機構3 〇及出料機構4 〇之載台3 2、4 2由兩側通 進出作動，使外罩5 〇之内部形成一半岔閉式空間之熱須1 M259911 四、創作說明（4) 室5 3 ; 藉此，請參閱第4 、6 、7圖所示，可視I C應用之 場所溫度（如1 5 0 °C高溫），以控制器6 6控制升溫器 6 0之風扇6 3 、6 4 ，將發熱件6 2所產生高溫，經出 風口 6 1 1吹入於外罩5 0之熱測室5 3中，使熱測室 5 3由常溫升溫至預設溫度1 5 0 °C，而成為一模擬應用 場所之高溫環境，使測試台1 0處於較佳之測試環境中， 又出風口 6 11處之感溫件6 5並可將出風溫度回授至控 制器6 6 ，以控制熱測室5 3之溫度保持在預設溫度，因 此，當I C製作完成後，即由入料機構3 0之吸頭3 1吸春 取，並放置於載台3 2上，由載台3 2載送進入於熱測室 5 3 ，而送至檢測裝置2 0之側方，該檢測裝置2 0之吸 頭2 1即作X — Z方向位移以吸取I C ’在此時，由於入 料機構3 0及檢測裝置2 0之吸頭3 1 、2 1及載台3 2 均設有發熱件，而可使I C於載送之過程中處於高溫狀態 下，而後檢測裝置2 0之吸頭2 1即載送I C至測試台 1 0處進行測試，由於熱測室5 3内之溫度已升溫至高溫 環境，當I C置入於測試台1 0時，可使其於預設之高溫 環境中作精確測試，並不會迅速降溫而影響測試品質，使 φ I C於載送、測試之一貫化作業流程中均保持在高溫環境 狀態下，而獲致更佳精確之測試品質。 綜上所述，本創作深具實用性及進步性，然未見有相 同之產品及刊物公開，從而允符新型專利申請要件，爰依 法提出申請。M259911 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is to provide a high-temperature simulation ring that can be used for more accurate test quality. ..., listed to [previous technology] In today's technology, continuous research and innovation, the work that could only be completed by combining many types of electronic circuits in the past has been completely replaced by integrated circuits (referred to as I c). jc During the production process, multiple processing procedures are required. Therefore, to ensure product quality, after the completion of the IC production, a circuit inspection operation will be performed to detect damage, and then eliminate defective products, and if the IC is used in high temperature places (Such as 150 ° C), during the process of loading to the test bench, depending on the temperature of the application site, so that each carrier can generate high temperature, so that the IC is carried in the high temperature environment of the simulated application site, in order to improve For the test quality, please see _ Figure 1. It is the patent application of Taiwan Patent Application No. 882 1 762 6 “IC Testing Device” previously applied by the applicant. It is equipped with a test bench 1 on the machine, and the test Above the table 1, there is a detection device 2 to control the X-Z displacement of several suction heads 3 that can generate high temperature. A feeding mechanism 4 located in front of the detection device 2 is provided with a production capacity. The high-temperature tip 5 and the stage 6 are used to pick up and carry the IC, respectively. A discharge mechanism 7 located behind the detection device 2 is also provided with the tip 8 and the stage 9 to pick and place and load respectively. Send the IC, please cooperate with the picture shown in Figure 2. After the production of 丨 c is completed, the suction head 5 of the feeding mechanism 4 will pick up the IC and place it 6 before the detection device 2, and then suck the M259911 from the test. Creation instructions (2) The IC is sucked to the test bench 1 for the test operation; however, the IC produces high temperatures during the loading process from each of the tips and the carrier, making it in an application environment that simulates high temperatures, but the test bench It is located in an open room at normal temperature. When the IC is placed, it will quickly cool down, and the test will be performed at normal temperature. The test will be performed in a high temperature environment other than the simulated application. In the last important test operation, there is a temperature drop, which affects the test quality of the IC and cannot achieve the best test efficiency. Therefore, how to make the IC in the best simulation in the process of carrying and testing Application of high temperature environment, For the industry and improvement of the thinking subject. [New content] The main purpose of this creation is to provide a thermal chamber device for IC testing machines. The main purpose is to fix a cover on the outside of the detection device and the test bench, so that the inside of the cover forms half the heat of a closed space. There is a heating device on the side of the measurement room, and the air outlet of the heating device is connected to the thermal measurement room; by this, the temperature of the air temperature of the IC application area can be controlled to control the temperature of the thermal measurement room according to the temperature of the IC application place. The temperature rises to a preset temperature, so that the test bench tests the IC in a simulated high-temperature environment to avoid rapid temperature drop when the IC is inserted, so that the IC is in a simulated high-temperature environment during the process of carrying and testing. To achieve the practical benefits of more accurate detection quality. The second purpose of this creation is to set a temperature sensing element at the air outlet of the heater, so as to feedback the temperature to a controller to control the temperature of the thermal measurement chamber to ensure that the IC is in the best simulated high temperature environment. Test, and improve test quality. M259911 IV. Creation Instructions (3) [Implementation] Step by step, in order to make your reviewing committee a better embodiment of this creation and cooperate with the drawings, please refer to Section 3 ~ R Gangsui-° ^ for details. As shown in the figure, the machine is provided with a test bench with the above design not covered by the original creation 50, and the loading platforms 3 2 and 4 2 of the out-feeding mechanism 30 and 4 are in and out, and are located on the side of the rain and The front and the outside are provided with sliding grooves 51 for inserting the panel 5 2, and the panel 5 2 is locked on the outer cover 5 〇 for opening and repairing the objects in the outer cover 5 〇 The device 60 is equipped with two fans 63 and 64 inside it, and a detection device 2 is provided above the measuring table 1 10 to control the number. Can produce 2 temperature suction head 2 1 # X — Z direction displacement,-set in front of the detection device 2 〇 feeding mechanism 3 〇, is equipped with high temperature suction 1 3 1 and the stage 3 2 to separate Picking, placing and carrying IC, a discharge mechanism 4 0 located behind the detection device 20, and also equipped with a suction head 41 and a carrier 4 2 to pick and place and carry 丨 c, respectively.标 ··, so I won't go into details here. This creation is provided with a cover 50 on both sides of the bottom plate with a channel for the air duct 6 dome 2M, and the outlet of the air duct 61 has one to control the outer cover 5 On the 0 side, a heating element 6 2 is provided in the air duct 6 1, and a fan 6 4 is provided on the upper side to eliminate the static electricity 6 1 1 on the I c, which communicates with the outer cover 5 0 and travels through the air outlet 6 1 1 There is a temperature sensing element 6 5, so that the temperature of the air outlet is given to a controller 6 6, and the temperature inside the lamp cover 5 〇, and the cover 5 0 series cover is placed in the detection device 20 and the test bench. It is locked on the machine table and can be used for the loading platform 3 2 and 4 2 of the λ material mechanism 3 〇 and the material discharge mechanism 4 〇. It can be moved in and out from both sides, so that the inside of the cover 5 is formed in half. The heat of the closed space must be 1 M259911 IV. Creative Instructions (4) Room 5 3; By this, please refer to Figures 4, 6, and 7 to see the temperature of the place where the IC is applied (such as high temperature of 150 ° C). The controller 6 6 controls the fans 6 3 and 6 4 of the temperature increaser 60, and blows the high temperature generated by the heating element 6 2 into the thermal measurement chamber 5 3 of the cover 5 0 through the air outlet 6 1 1 to make the thermal measurement chamber 5 3 The temperature rises from normal temperature to the preset temperature of 150 ° C, and becomes a high temperature environment that simulates the application place, so that the test bench 10 is in a better test environment, and the temperature sensing parts 6 5 at the air outlet 6 and 11 The output air temperature can be fed back to the controller 6 6 to control the temperature of the thermal measurement chamber 5 3 to be maintained at a preset temperature. Therefore, after the IC is completed, the suction head 3 1 of the feeding mechanism 3 1 will suck the spring. Take it and place it on the stage 32. The stage 32 carries it into the thermal measurement chamber 53 and sends it to the side of the detection device 20. The tip 21 of the detection device 20 is X. — Displacement in the Z direction to suck the IC 'At this time, since the suction heads 3 1 and 21 of the feeding mechanism 30 and the detection device 20 are provided with heating elements, the IC can be carried on the carrier. Over In the high temperature state, the nozzle 21 of the detection device 20 then carries the IC to the test bench 10 for testing. Since the temperature in the thermal measurement chamber 53 has risen to a high temperature environment, when the IC is placed in the test When the station is 10, it can be accurately tested in the preset high temperature environment, and it will not quickly decrease the temperature and affect the test quality, so that the φ IC is maintained in the high temperature environment during the continuous operation process of carrying and testing. , And get better and more accurate test quality. In summary, this creation is highly practical and progressive, but no similar products and publications have been disclosed, which allows the new patent application requirements to be met, and applications are submitted in accordance with the law.
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第8頁 M259911 係習式第88 2 1 76 2 6號專利案之示意圖 係第1圖進行測試之示意圖。 本創作與測試裝置之分解圖。 本創作之側視圖。 本創作裝設於機台上之示意圖。 本創作之使用示意圖（一）。 本創作之使用示意圖（二）。 圖式簡單說明 第1圖： 第2圖： 第3圖： 第4圖： 第5圖： 第6圖： 第7圖： 件號索引 〔習式〕 測試台：1 吸頭：3 吸頭：5 出料機構：7 載台：9 〔本創作〕 測試台：1 0 吸頭：2 1 吸頭：3 1 出料機構：4 0 載台：4 2 滑槽：5 1 熱測室：5 3 風管：6 1 發熱件：6 2 檢測裝置：2 入料機構· 4 載台：6 吸頭：8 檢測裝置：2 0 入料機構：3 0 載台：3 2 吸頭：4 1 外罩：5 0 面板：5 2 升溫器：6 0 出風口 ： 6 1 1 風扇：6 3 、6 4 M259911 圖式簡單說明 感溫件：6 5 控制器：6 6 圓_1 第10頁Page 8 M259911 is a schematic diagram of the conventional patent No. 88 2 1 76 2 6 is a schematic diagram of the test in Figure 1. An exploded view of this authoring and testing device. Side view of this creation. This creation is installed on the machine. Schematic diagram of the use of this creation (1). Schematic diagram of the use of this creation (2). Brief description of the drawings Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Part Number Index [Habit] Test Bench: 1 Tip: 3 Tip: 5 Discharging mechanism: 7 stage: 9 [This creation] Test platform: 1 0 Tip: 2 1 Tip: 3 1 Discharging mechanism: 4 0 Stage: 4 2 Chute: 5 1 Thermal chamber: 5 3 Duct: 6 1 Heating element: 6 2 Detection device: 2 Feeding mechanism · 4 Stage: 6 Tip: 8 Detection device: 2 0 Feeding mechanism: 3 0 Stage: 3 2 Tip: 4 1 Housing : 5 0 Panel: 5 2 Heater: 6 0 Air outlet: 6 1 1 Fan: 6 3 、 6 4 M259911 Schematic description of temperature sensing element: 6 5 Controller: 6 6 round_1 page 10