TWM259221U - Water-cooling heat dissipation apparatus having heat dissipation sheet with high density and height ratio - Google Patents

Description

M259221

I. [Technical Field to which the New Type belongs] This new type relates to a kind of water-cooled heat dissipation device with radiating fins and height ratios, especially a kind of cooling> storage M ^ ^ .B ^ μ Ba τ 卩 Liquid circulation The height ratio of each cooling fin and the distance between the two i ΐ ΐ… fins is greater than or equal to 5 in the thermal connection seat. The high and dense cooling fins are connected to the cooling seat to increase the space between the cooling fluid and the circulating coolant. Those who change the thermal efficiency to improve the overall cooling performance. First, [not the first technology]

The heat dissipation device applied to circuit board wafers is generally made of heat dissipation fins made of metal materials and is placed against the heat source (ie, the chip) of the circuit board. After the chip is started, the heat generated can be transmitted through the heat. The effect is transmitted to the fin bodies of the heat dissipation fins and dissipates heat to the outside world. However, the heat dissipation efficiency of the heat dissipation fins cannot meet the heat dissipation requirements of today's high-performance chips. Therefore, there is a kind of The heat sink of the circulating cooling system is disclosed and applied.

The structure of the heat dissipation device of the circulating cooling system, as shown in the first and second figures, includes: a base (80), and a plurality of grooves (8 1) are milled on the base (80) to make two phases Between adjacent grooves (81), a person forming a protrusion (82) is defined; and a cover (90) crosses over the base (80) and is on the top surface of the cover (90). A water inlet (91) and a water outlet (92) are connected, so that most of the grooves (81) covering the base (80) of the cover (90) are arranged to form a self-water inlet. The water channel between the head (91) and the water outlet (92), and the inlet and outlet heads (91, 92) are respectively locked with a buckle (94), and the corresponding buckle is connected to a heat source socket (9 5) on the buckle ears (9 5 1) on both sides, press the base (80) relatively close to the heat source (9 5 3); if you want to make the coolant from the water inlet (9 1) Inject

Page M259221 IV. After the description of creation (2), the groove (8 1) on the base (80) circulates out of the water head (9 2) to remove the heat energy of the base (80). The conventional cooling device described above still has the following disadvantages: 1. The base (80) is formed by a conventional milling method to form a large number of grooves (81). The grooves (81) are limited by the milling cutter. Diameter and milling depth, so the ratio h / d of the height (h) of the projection (82) between the two grooves (81) to the width (d) of the grooves (81) is usually less than 7/3, Because the time for the coolant to pass through the grooves (81) is extremely short, it is difficult to complete the heat exchange between the thermal energy on the base (80) and the coolant passing through it in a very short time, so that it reaches thermal equilibrium. Reduce the heat exchange efficiency of the conventional heat sink 2. The conventional heat sink is installed at the center of the cover (90), and the inlet and outlet heads (9 1, 9 2) are arranged in a straight line on the cover (9 〇) At the center of the top, when the cooling fluid is inside the Note (9 2) and so on, it only has a local piece (94) which is fixed to the cover (90) and snaps in After the device of known density and height ratio of this case is put upright into the cover body (90), the outward flow method and the heat exchange function of the base (80) are fixedly locked in and rotated together by 90 degrees. In view of this, when the receiver (95) is used in the water-cooled state of the heat sink, that is, as shown in the second figure, 'When the liquid level (L) reaches the water head', the entire cover cannot be filled ( 9 〇) The heat exchange is carried out in various places in the upper half, because 'the buckle (91, 92) used to fasten the heat sink is not installed, if it is to be installed, the buckle (94) cannot be used at this time. The ears (951) on both sides make it impossible to use. Research and innovation have revealed a device with high heat dissipation.

M259221 IV. Creation instructions (3) II. [New content The water-cooled heat sink for the purpose of this new model includes: ·· 一 ⑼⑼ / 一 — v 〈于 'The top surface is juxtaposed with a plurality of heat sinks, so that the base It is close to a heat source and a cover. In the first example, a valley is set in four to correspond to the edge of *-, u-hole, and it is bridged over the air to provide a high density and height ratio. The heat sink pedestal contains a substrate on top of it; it is flat, the union month is hot again, and the trough is tumbled: £ eight < / v, 々, ~ w ~ clever task; ^ potential connection On the base plate, and on the opposite side of the first side of the cover, that is, the second side, a water inlet head and a water outlet head are passed through, respectively, to the accommodation six, and connected to the water inlet end of a coolant delivery pump. And the water outlet to drive the coolant to circulate through the heat sinks of the heat sink; 苴 7 / the height of the heat sinks juxtaposed on the vertical, and: the heat sink seat value is greater than or equal to 5, With multiple :, Λ mesh / heat sink distance ratio plus contact area with circulating coolant, and dense heat sink, increase cost Disclosed having a high density, the overall thermal efficiency = persons. The water-cooling heat-dissipating device of the piece disposed on the second side of the cover body is arranged in such a way that the water head entering the cover body is connected at an angle and fills the entire military body. The head-entering cooling liquid can be sent out with each of the ^^ water outlet heads in the cover to make the overall heat dissipation efficiency. …, Carry out heat exchange at the film site to enhance the desirable entity of the new model, which can be made clear. The description below u and the attached drawings, IV. [Embodiment] Please refer to the second to seventh drawings for the water-cooled heat dissipation type with a height ratio higher than that of the fins. It is about _ species with high density __ — including: Thermal connection base M259221 4. Creation instructions (4) (10), containing a base plate (11), on its top surface (111), a plurality of heat sinks (12) are juxtaposed in parallel to make the base plate (1 1) A cover (20) is closely attached to a heat source (40), and a receiving cavity (2 1) is recessed on the first side thereof to cover each heat sink (12) correspondingly, and The edge of the containing cavity (21) is hermetically strung over the base plate (1 1) of the thermal connection seat (10), and is on the opposite side of the first side of the cover body (20), that is, the first A water inlet (2 2) and a water outlet (23) are provided on the two sides, respectively, to conduct the accommodation cavity (21), and connect the water outlet (241) and the water inlet (241) of a coolant delivery pump (24). 242), in order to drive the coolant to circulate into the accommodating cavity (21) of the cover body (20) and flow between the heat sinks (12) of the heat receiving base (10); it is characterized in that the heat Juxtaposed on the base (10) The height (H) of each heat sink (12) and the distance (D) between two adjacent heat sinks (12) are greater than or equal to 5 [the height of the heat sink / the distance between the two heat sinks], that is, H / D-5, By connecting a plurality of towering and dense heat sinks (1 2) on the heat base (10), the contact area with the circulating cooling liquid is increased to improve the overall heat exchange efficiency. As shown in the third, fourth, and fifth figures, the cover (20) disclosed in the present invention is provided with a plurality of fixing holes (2 5 2) on its flange portion (2 5) for fastening. A fastener or a lock piece (1 3) is locked; as shown in the fourth and fifth figures, the new type of dreamable bolt (28) is sleeved and a spring (281) is passed through the fastener or the lock piece ( 13) and tightly locked on a circuit board (p) to force the base plate (11) of the thermal connection base (10) to be closely attached to a heat source (40); the new model does not limit the buckle by itself; The water-cooled heat-dissipating device with high-density and height-specific heat-dissipating fins disclosed in the new model, among which the substrate (11) and the heat-radiating fins (1, ^ 'Ί shown in 4 thermal connection bases (10)

Page 8 ~ '' '----- M259221 IV. Creative Instructions (5) It can be formed by cutting or extrusion or casting, or the heat sinks (1 2) can be welded and glued one by one. The method is fastened on the substrate (丨 丨), and the new model is not self-limiting. As shown in the third, fourth, and fifth figures, the water-cooled heat dissipation device with high density and height ratio heat sink disclosed in the new model, wherein the first side of the cover body (20) is recessed with a receiving cavity (21 ), And a protruding edge portion (25) is protruded on the periphery of the accommodation hole (21), and a plurality of perforations (251) are penetrated on the protruding edge portion (25) to borrow a plurality of screws (26) It is locked on the base plate (11) of the thermal connection base (10), and each heat sink (12) is framed in the containing cavity (21) of the cover body (20). 20) A leak-proof gasket (27) is tightly clamped between the base plate (η) of the thermal connection base (10) to prevent the cooling liquid penetrating into the cover body (20) from leaking outward. / The above-mentioned cover body (20), so that the water inlet head (22) and the water inlet head (23) thereof are in a diagonal relationship, and is arranged on the second side of the cover body (20), as shown in the fifth and sixth figures. It is shown that, when the base plate (11) of the new type heat receiving base (10) is in close contact with a heat source (40) perpendicular to the ground circuit board (P), it is placed under the cover (20). The person approaching the ground is defined as the water inlet head (22), and the one located above the diagonal of the water inlet head (23) is closer to the top of the cover (20) as the water outlet head (23), so that the cooling liquid flows from The water inlet head (22) enters the cover body (20) and fills the cavity (21) with the cover body (20), and then comes out from the water outlet head (23) located above the diagonal line. Then, the cooling liquid injected into the cover body (20) can be completely submerged and flowed between the radiating fins (12), so that the thermal energy entrained at each position of each radiating fin (j2) is It can perform heat exchange with the cooling liquid to quickly remove the energy from the thermal socket (10) and improve the heat dissipation efficiency of the heat source. ,

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" ~ ^ 9 page --- ~. M259221 IV. Creative Instructions (6) The water-cooled heat-dissipating liquid delivery pump (24) shown in the seventh picture is composed of (3 0) the heat-dissipating row (3 3). In order to improve the overall object, it is not suitable for the new model to be exposed with other new models. It has the following: 1. Each of the thermal sockets is formed outside the two-phase thermal area, that is, the heat dissipation device is improved. 2 The cover Up and in the water state, so the cold body is placed in the cover, so the heat exchange is located in the cover, so that the new model is disclosed. Therefore, regardless of the whole position, the system is made up and down. : The high-density and height-specific discrete track disclosed by the new model is in which a heat sink (30) is connected in series between the water inlet (22) of the cover (20) and the water outlet (241) of the cover (20). Γ / The majority of fins (31), condensing tubes (32), and air shoulders perform heat exchange and reduce the heat dissipation efficiency of the cooling liquid sent into the cover (20); since the heat sink (30) is a habit Known the new type of request for the subject, so it will not be repeated, the use of heat sink components in this practice, the new model is not self-limiting. Features and advantages of water-cooled heat sink than heat sink: ^ The height of the heat sink is much larger than the bumps that are currently known on the substrate between adjacent trenches. Therefore, it greatly increases the area for heat exchange with the cooling liquid, which can be effective The overall heat dissipation efficiency. The arrangement of the head and the water outlet head is in a diagonal arrangement, but the liquid can be injected from the lower water inlet head into the injection cover full cavity body, and then the water outlet head from the upper water outlet head. Each of the fins can be connected with the cooling liquid to effectively improve its heat dissipation efficiency. The water inlet head and the water outlet head are arranged in a diagonal line, and the heat sinks are rotated at 0 °, 90 °, 180 °. 270 are in line with the fastening position of the circuit board. The inlet and outlet heads are arranged diagonally, so there is no direction restriction on the installation to increase the scope of application of the product. ❿

Page 10 M259221 IV. Creative Instructions (7) The structure and shape disclosed in this model can be modified and applied without departing from the spirit and scope of this model, and this model is not self-limiting. M259221 Simple illustration of the diagram 5. [Simplified illustration of the diagram] The first picture is a three-dimensional exploded view of a conventional heat dissipation device. The second figure is a schematic diagram of the application state of a conventional heat sink. The third picture: It is an exploded view of the new model. Figure 4: Schematic diagram of the new model assembled on a heat source. Fifth figure: It is a schematic diagram of the cross-section structure of the new model. Figure 6: Schematic plan view of the application state of the new model. The seventh diagram: a diagram of a preferred application embodiment of the new model. [Simple description of component symbols]

(1 0) Hot joint base (11) Base plate (111) Top surface (1 3) Buckle or lock piece (2 2) Water inlet (241) Water outlet (2 5 1) Perforated (2 7) Leakproof washer (30) Radiator (3 3) Fan (D) Radiator spacing (20) Housing (2 3) Water outlet (2 4 2) Water inlet (2 5 2) Fixing hole (28) Bolt (3 1) Heat dissipation Sheet (40) heat source (P) circuit board (1 2) heat sink (21) accommodating cavity (24) cooling liquid delivery pump (2 5) flange portion (2 6) screw (281) spring (3 2) condensation Tube (H) heat sink height

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Claims (1)

M259221 5. Scope of patent application _-1 · A water-cooled heat sink with high density and height ratio heat sink, including: a thermal connector, containing a base plate, with a plurality of heat sinks protruding side by side. To make the substrate close to a heat source, and a cover, the first side of which is recessed with a cavity to cover each heat sink, and to make the edge of the cavity The ground is connected to the base plate of the thermal connection base, and a water inlet head and a water outlet head are penetrated on the opposite side of the first side of the cover body, that is, the second side, respectively, to conduct the accommodation hole and connect a cooling The inlet end and outlet end of the liquid conveying pump drive the coolant to circulate into the accommodating cavity of the cover and flow between the heat sinks of the heat sink; its characteristics are as follows: The ratio of the height (H) of each of the fins juxtaposed to the distance (D) between two adjacent fins (ie, the height of the fins / the distance between the two fins) is in accordance with the following relationship H / D ^ 5. 2. The water-cooled heat-dissipating device with high-density and height-specific heat sinks as described in item 1 of the scope of the patent application, wherein the cover body 'makes its water inlet head and water inlet head in a diagonal relationship and is arranged on the cover body. The second side. 3. A water-cooled heat-radiating device with high-density and height-specific heat-radiating fins, which includes a heat-connecting base, containing a substrate, and a plurality of spring heat-radiating fins are juxtaposed in parallel on the top surface thereof, so that the substrate is closely attached to a heat source And a cover, the first side of which is recessed with a receiving cavity to correspondingly cover each heat sink, and the six edges of the receiving cavity are air-tightly connected to the base plate of the thermal connection seat. And placed on the opposite side of the first side of the cover, that is, the second side Page 13 M259221 5. The scope of the patent application has a water inlet and a water outlet, which respectively open the receiving cavity and connect the inlet and outlet ends of a coolant pump to drive the coolant to flow into the receiving cavity of the casing. The water inlet head and the water inlet head of the cover body are arranged in a diagonal relationship and are arranged on the second side of the cover body. Page 14