TWM252978U - Liquid cooling apparatus - Google Patents

Liquid cooling apparatus Download PDF

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Publication number
TWM252978U
TWM252978U TW93202458U TW93202458U TWM252978U TW M252978 U TWM252978 U TW M252978U TW 93202458 U TW93202458 U TW 93202458U TW 93202458 U TW93202458 U TW 93202458U TW M252978 U TWM252978 U TW M252978U
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Taiwan
Prior art keywords
liquid
evaporation unit
cooling
duct
unit
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TW93202458U
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Chinese (zh)
Inventor
Shih-Che Chien
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Hon Hai Prec Ind Co Ltd
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Priority to TW93202458U priority Critical patent/TWM252978U/en
Publication of TWM252978U publication Critical patent/TWM252978U/en

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Description

M252978 五、創作說明(l) 【新型所屬之技術領域 本創作係關於一種散熱裝薏,士 卻電子元件之液冷式散熱裝置。彳寸別係關於一種用來冷 【先前技術】 隨著電子技術不斷發展,電子_ 在不斷提昇。惟,高頻高速將使電元件運行頻率及速度亦 越多。溫度亦越來越高,嚴重减脅件產生之熱量越來 能及穩定性,為確保電子元件能正^= 70件運行時之性 進行有效之散熱。‘准,現有風冷式=:要需對電子元件 足高頻高輿電子元件之散熱需要,來f難以滿 逐漸被業界採用,相關技術請參考;2二式散熱糸統 號、第㈣21 0734.2號。 大陸專利第98248834. 3 參照上述專利不難看出,現有液人 < ^… ~式散熱系統均由一 糸列/刀政設置之元件連接而成’大體包括吸埶單元、散埶 皁兀及一驅動冷卻液之泵體。在該等元件中,泵體需要利 用電能來驅動。對於以移動性能為訴求之攜 記本電腦、膝上型電腦等而言’其主要是靠電池來提供電 能,如果將電池一部分電能分配給泵體,電池之使用時間 將急劇降低,·此與攜帶型電腦之移動性能相抵 【内容】 _ ° 本創作之目的在於提供一種無需使用泵體來驅動冷卻 液,從而降低電能消耗之液冷式散熱裝置。 π本創作液冷式散熱裝置’包括—與發熱元件緊貼之蒸 發早70、一彳立於該蒸發單元正上方之冷卻單元及連通該蒸 M252978 五、創作說明(2) 發單元與該冷卻單元之第一及第二導管,該蒸發單元内設 一儲存工作液體之空腔,該冷卻單元包括一冷卻室,該第 二導管安裝一控制工作液體在第二導管中只能從該冷卻室 流向該空腔之單向閥,當蒸發單元中之工作液體吸熱蒸發 後,蒸氣擠壓高溫之工作液體沿第一導管流回冷卻室,當 工作液體在冷卻室冷卻後自第二導管流回蒸發單元。 由於本創作液冷式散熱裝置之工作液體循環是靠工作 液體自身蒸發後形成之蒸氣擠壓推動,因此無需使用需要 電源驅動之泵體,從而節省電能,並降低材料及安裝成本 〇 【實施方式】 下面參照附圖結合實施例對本創作作i 一步之說明。 請參閱第一圖,本創作液冷式散熱裝置第一實施例包 括一蒸發單元1、一冷卻單元2及連接該蒸發單元1與冷卻 單元2之第一導管3及第二導管4。 該蒸發單元1緊貼於發熱元件1 〇 〇上,用於吸收發熱元 件1 0 0之熱量。該蒸發單元1内設一封閉之腔室,腔室内儲 存有工作液體。工作液體利用受熱蒸發之特點帶走發熱元 件1 0 0之熱量t根據發熱元件之發熱情況,一般要求工作 液體之沸點約為4 0 r至6 0 °C,例如丙酮,其沸點約為5 6 °C。 該冷卻單元2位於蒸發單元1正上方,其底部緊貼於蒸 發單元1之頂部。該冷卻單元2包括一冷卻室2 0及置於該冷 卻室2 0上對該冷卻室2 0進行冷卻之設備,本實施例中使用M252978 V. Creation Instructions (l) [Technical Field to which the New Type belongs This creation relates to a liquid-cooled heat-dissipating device for heat-dissipating equipment, but electronic components.彳 Inch is related to a kind of cold [previous technology] With the continuous development of electronic technology, electronics_ is constantly improving. However, high frequency and high speed will increase the operating frequency and speed of electrical components. The temperature is also getting higher and higher. The heat generated by the threatening parts is becoming more and more stable and stable. In order to ensure that the electronic components can operate properly when 70 pieces are running, heat is effectively dissipated. 'Standard, existing air-cooled type =: It is necessary to dissipate the electronic components to meet the high-frequency and high-frequency heat dissipation requirements of electronic components, which is difficult to be gradually adopted by the industry. For related technologies, please refer to; number. Continental Patent No. 98284834. 3 With reference to the above patents, it is not difficult to see that the existing liquid human < ^ ... ~ type heat dissipation systems are all connected by a queue / knife installation element, which generally includes a suction unit, a loose soap and a Pump body for cooling liquid. Among these components, the pump body needs to be driven by electricity. For portable computers, laptops, etc. that demand mobile performance, 'It mainly relies on batteries to provide power. If a part of the battery's power is distributed to the pump body, the battery life will be drastically reduced. The portable computer's mobile performance is inferior [Content] _ ° The purpose of this creation is to provide a liquid-cooled heat sink that does not require the use of a pump to drive the cooling fluid, thereby reducing power consumption. π This creative liquid-cooled heat dissipation device 'includes—Evaporation early 70 close to the heating element, a cooling unit standing directly above the evaporation unit, and communication with the steam M252978 5. Creation instructions (2) The hair unit and the cooling The first and second ducts of the unit, the evaporation unit is provided with a cavity for storing working fluid, the cooling unit includes a cooling chamber, and the second duct is installed with a control fluid that can only be removed from the cooling chamber in the second duct. The one-way valve flowing to the cavity, when the working liquid in the evaporation unit absorbs heat and evaporates, the vapor squeezes the high-temperature working liquid back to the cooling chamber along the first duct, and after the working liquid is cooled in the cooling chamber, it flows back to the second duct. Evaporation unit. Since the working liquid circulation of the liquid-cooled heat sink of this creation is driven by the vapor squeeze formed after the working liquid evaporates, there is no need to use a pump body that requires power to drive, thereby saving electricity and reducing material and installation costs. The following describes the creation of step i with reference to the drawings and embodiments. Referring to the first figure, the first embodiment of the liquid-cooled heat dissipation device of the present invention includes an evaporation unit 1, a cooling unit 2, and a first pipe 3 and a second pipe 4 connecting the evaporation unit 1 and the cooling unit 2. The evaporation unit 1 is closely attached to the heating element 100, and is used to absorb the heat of the heating element 100. The evaporation unit 1 has a closed chamber therein, and a working liquid is stored in the chamber. The working liquid uses the characteristics of heating and evaporation to take away the heat of the heating element 100. According to the heating of the heating element, the boiling point of the working liquid is generally about 40 r to 60 ° C, such as acetone, and its boiling point is about 5 6 ° C. The cooling unit 2 is located directly above the evaporation unit 1, and its bottom is closely attached to the top of the evaporation unit 1. The cooling unit 2 includes a cooling chamber 20 and equipment for cooling the cooling chamber 20 placed on the cooling chamber 20, which is used in this embodiment.

M252978 五、創作說明(3) 一散熱器2 6及一散熱風扇2 8。該冷卻室2 0内設有一中空 部,用於容設工作液體。當高溫之工作液體進入該冷卻室 2 0時,散熱器2 6及散熱風扇2 8可對其進行冷卻降溫。 第一導管3連接蒸發單元1之一端插入工作液體中。第 二導管4在與該蒸發單元1鄰近之位置安裝一單向閥5,使 在第二導管4中之工作液體只能由冷卻室2 0向蒸發單元1流 動,而不能由蒸發單元1向冷卻室2 0流動。 本創作液冷式散熱裝置工作過程如下: 當發熱元件1 0 0發熱時,蒸發單元1中之工作液體吸收 發熱元件0之熱量,當被加熱到其沸點時,工作液體蒸 發形成蒸氣填充於該蒸發單元1之頂部,隨著蒸氣之不斷 形成,蒸氣之氣壓會將高溫之工作液體壓又第一導管3中 ,並沿著該第一導管3進入該冷卻室2 0。由於單向閥5可防 · 止蒸發單元1中之工作液體流入第二導管4,因此,被擠壓 , 之工作液體只能進入第一導管3。 高溫之工作液體進入冷卻室2 0後,在散熱器2 6及散熱 風扇2 8之幫助下降溫冷卻,然後自第二導管4流回至蒸發 單元1進入下一冷卻循環,如此不斷循環,可源源不斷地 帶走發熱元件.1 0 0之熱量。在工作液體沿第二導管4流回蒸 發單元1之過程中,可以是受到單一重力之作用(因為冷 ψ 卻室20高於蒸發單元1),另一方面可在該第二導管4内壁 設置毛細結構,如此可通過毛細結構之吸附作用加速工作 液體之回流過程。 請參閱第二圖,本創作液冷式散熱裝置第二實施例與M252978 V. Creative Instructions (3) A radiator 26 and a cooling fan 28. A hollow portion is provided in the cooling chamber 20 for containing a working fluid. When the high-temperature working liquid enters the cooling chamber 20, the radiator 26 and the cooling fan 28 can cool and cool it. The first pipe 3 is connected to one end of the evaporation unit 1 and inserted into the working liquid. The second duct 4 is provided with a check valve 5 at a position adjacent to the evaporation unit 1, so that the working liquid in the second duct 4 can only flow from the cooling chamber 20 to the evaporation unit 1, but not from the evaporation unit 1. Cooling chamber 20 flows. The working process of the liquid-cooled heat sink of this creation is as follows: When the heating element 100 generates heat, the working liquid in the evaporation unit 1 absorbs the heat of the heating element 0. When it is heated to its boiling point, the working liquid evaporates to form a vapor to fill the At the top of the evaporation unit 1, as the steam is continuously formed, the pressure of the steam will press the high-temperature working liquid back into the first duct 3 and enter the cooling chamber 20 along the first duct 3. Since the check valve 5 can prevent the working fluid in the evaporation unit 1 from flowing into the second conduit 4, the working fluid that is squeezed can only enter the first conduit 3. After the high-temperature working liquid enters the cooling chamber 20, it is cooled down with the help of the radiator 26 and the cooling fan 28, and then flows back from the second duct 4 to the evaporation unit 1 to enter the next cooling cycle. Continuously take away the heat from the heating element. 1 0 0. In the process of the working fluid flowing back to the evaporation unit 1 along the second duct 4, it may be subjected to a single gravity (because the cold ψ cooling chamber 20 is higher than the evaporation unit 1). On the other hand, it can be provided on the inner wall of the second duct 4. Capillary structure, which can speed up the backflow process of working fluid through the adsorption of capillary structure. Please refer to the second figure, the second embodiment of the liquid-cooled heat sink of this creation and

第7頁 M252978 五、創作說明(4) 第一實施例之不同之處在於:第二實施例在冷卻單元2之底 部和蒸發單元1之頂部之間設置一具有一定高度之支撐體 6,以增加冷卻單元2和蒸發單元1之高度差,使冷卻單元中 冷卻後之液體在重力之作用下能更加迅速地流回蒸發單 元。 综上所述,本創作符合新型專利要件,爰依法提出專 利申請。惟,以上所述者僅為本創作之較佳實施例,舉凡 熟悉本案技藝之人士,在爰依本創作精神所作之等效修飾 或變化,皆應涵蓋於以下之申請專利範圍内。 〇Page 7 M252978 V. Creation instructions (4) The difference between the first embodiment is that the second embodiment sets a support 6 with a certain height between the bottom of the cooling unit 2 and the top of the evaporation unit 1. Increase the height difference between the cooling unit 2 and the evaporation unit 1, so that the cooled liquid in the cooling unit can flow back to the evaporation unit more quickly under the effect of gravity. To sum up, this creation complies with the requirements for new patents, and a patent application was filed in accordance with the law. However, the above embodiments are merely preferred embodiments of the present writing, the case that whenever person familiar with the art, modifications or variations made equivalent Yuan Yi creative spirit of the present, are intended to be included within the scope of the patent. 〇

第8頁 M252978 圖式簡單說明 【圖式簡單說明】 第一圖係本創作液冷式散熱裝置第一實施例之側面示 意圖。 第二圖係本創作液冷式散熱裝置第二實施例之侧面示 意圖。 【元件代表符號簡單說明】 蒸 發 單 元 1 發 孰 元 件 100 冷 卻 單 元 2 冷 卻 室 20 散 敎 0 器 26 散 熱 風 扇 28 第 一 tv 管 3 第 二 導 管 4 單 向 閥 5 支 撐 體 6Page 8 M252978 Brief description of the drawings [Simplified description of the drawings] The first diagram is a side view of the first embodiment of the liquid-cooled heat sink of this creation. The second figure is a schematic side view of the second embodiment of the liquid-cooled heat sink of the present invention. [Simplified description of the component representative symbols] Evaporation unit 1 hair unit 100 cooling unit 2 cooling room 20 diffuser 0 device 26 heat radiating fan 28 first tv tube 3 second guide tube 4 one-way valve 5 support body 6

第9頁Page 9

Claims (1)

M252978 六、申請專利範圍 1. 一液冷式散熱裝置,其包括: 一蒸發單元,其内設一儲存工作液體之空腔; 一冷卻單元,係位於該蒸發單元之正上方,包括一冷 卻室;及 冷卻單 體在第 閥; 其中,當 壓高辱之 體在冷卻 2. 如申/請專 第二導管 3. 如申請專 冷卻室之 4. 如申請專 冷卻室與 體。 5. 如申請專 冷卻單元 卻風扇。 6. 如申請專 单向閥設 7. 如申請專 第一導管及第二導管,係連通該蒸發單元之空腔與該 元之冷卻室,該第二導管安裝一控制工作液 二導管中只能從該冷卻室流向該空腔之單向 蒸發單元中之工作液體吸熱蒸發後,蒸氣擠 工作液體沿第一導管流入冷卻室,當工作液 室冷卻後自第二導管回流至蒸發單元。 利範圍第1項所述之液冷式散ά裝置,其中該 内壁設有毛細結構。 利範圍第1項所述之液冷式散熱裝置,其中該 底部緊貼於蒸發單元之頂部。 利範圍第1項所述之液冷式散熱裝置,其中該 該蒸發單元之間設置一具有一定高度之支撐 利範圍第1項所述之液冷式散熱裝置,其中該 進一步包括用於冷卻該冷卻室之散熱器及冷 利範圍第1項所述之液冷式散熱裝置,其中該 置於靠近該蒸發單元之位置。 利範圍第1項所述之液冷式散熱裝置,其中該M252978 6. Scope of patent application 1. A liquid-cooled heat-dissipating device, comprising: an evaporation unit, which contains a cavity for storing working liquid; a cooling unit, located directly above the evaporation unit, including a cooling chamber ; And the cooling unit is in the first valve; among them, when the pressured body is being cooled 2. If you apply for / please apply for a second duct 3. If you apply for a dedicated cooling room 4. If you apply for a dedicated cooling room and body. 5. If you apply for a special cooling unit, but the fan. 6. If applying for a special one-way valve 7. If applying for a special first duct and a second duct, connect the cavity of the evaporation unit and the cooling chamber of the element, the second duct is installed with one control fluid and two ducts only After the working liquid in the one-way evaporation unit capable of flowing from the cooling chamber to the cavity absorbs heat and evaporates, the vapor squeezes the working liquid into the cooling chamber along the first duct, and after the working fluid chamber cools, it returns to the evaporation unit from the second duct. The liquid-cooled dispersing device according to item 1 of the utility model, wherein the inner wall is provided with a capillary structure. The liquid-cooled heat dissipating device according to item 1 of the utility model, wherein the bottom is closely attached to the top of the evaporation unit. The liquid-cooled heat-dissipating device according to item 1 of the utility model, wherein a support having a certain height is provided between the evaporation units, and the liquid-cooled-type heat-dissipation device according to item 1 of the utility model, further comprising: The radiator of the cooling chamber and the liquid-cooled heat dissipation device described in item 1 of the cold profit range, wherein the radiator is placed near the evaporation unit. The liquid-cooled heat dissipating device described in Item 1 第10頁 M252978 六、申請專利範圍 第一導管連接蒸發單元之一端插入工作液體中 〇 iiiiPage 10 M252978 VI. Scope of patent application One end of the first pipe connected to the evaporation unit is inserted into the working fluid 〇 iiii
TW93202458U 2004-02-20 2004-02-20 Liquid cooling apparatus TWM252978U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108201658A (en) * 2018-02-28 2018-06-26 谭本 A kind of cooling-type ultrasonic therapeutic head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108201658A (en) * 2018-02-28 2018-06-26 谭本 A kind of cooling-type ultrasonic therapeutic head
CN108201658B (en) * 2018-02-28 2024-02-13 谭本 Cooling type ultrasonic treatment head

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