M251441 捌、新型說明： 【新型所屬之技術領域】 本創作係有關於一種散熱裝置，尤指-種高密度之空氣接觸截面 積工法所製成之波浪式散熱鰭片，用以提升有限體積内之散熱鰭片之 散熱效率。 【先前技術】 在一般工業電腦的機殼中存在許多的積體電路、電晶體、電力電 子元件或是中央處理裔，隨著科技的進步，這些電子元件的工作速度 越來越快，同時’這些電子元件在*速工作下伴隨而來的問題是本身 所產生的高溫，由於這些電子元件内部都是由矽晶片及一些極 的金屬線所組成，所以高溫下很容易就會造成這些電子元件的損壞，p 因此我們必須提供-種媒介物質能將這些熱源帶離電子元件，而散熱 片便為此媒介並扮演著重要的角色。 ㈣专弟人A圖興第八B圖’係為顯示―種習知之散熱裝置2〇〇, 主要包含：-基板7與-散熱片6,其中前述基板7係為—銘材質之平 板體’且具有上平板面7G與下平板面7卜而前述散熱片6係為一薄狀 片體且經沖壓形成連續彎曲之-體成型之散熱片6。前述基板7之上平 η 藉由一锡片或锡膏等焊料以焊接技術與相對之經沖壓形成連續 弓曲之讀散熱片6之表面連接成—體以構成散熱裝置，而於前述基 ^:前述散刻6組合後，將前雜板7之下平板面Μ置於一中央 1 =(圖未不）上’使前述t央處職於運作時所產生的熱，藉由 別迹基板7傳導至前述散熱片6上進行散熱。 ㈣^知之散熱肢將—薄狀㈣經沖壓形成賴彎曲之一體 之…^ I片，其與空氣的接觸面積有限，且目前市面上的散熱裝置 概略可分為_、薄片摺疊、切削式、壓鑄式或以上任何複合 熱與空氣缺換之雜，而散熱”因電子元件之耗電量上 趨變大’因而在某些特定之高密度運用時，常有空間不足 之困擾，貫有待改善。 【新型内容】 t創,目的在於提供—種散織置，Μ密度之空氣接觸截面 積法，以提升有限體積内之摺疊式鰭片之散埶效率。 n述目的之散熱裝置’包含：_散糾組，具有複數讎熱 1 有—波浪板片及由前述波浪板片兩端各延伸一 人十糾’及―基板，具有上平板面與下平板面，其中藉由接 =述也、』組細述紐，财魏熱則係為縱向 前 述基板之上方。 2述散熱則之水平部係為與前述波浪板片垂交。 岫述基板係為一鋁材質之平板狀體。 自塗佈—層錫片或錫料焊料，_焊接技術而與前 述散熱片組接合。 達到上述目的之另-實補之散紐置 細:一 壁上 ^穿孔，其中猎由—熱導管與—基板鑲接，且再藉由前 二、、、％^牙過Μ述散熱鰭^{之穿孔而橫向排_著於前述熱導管之管 刚述基板設有至少1槽，該凹槽係為供前述熱導管鎮接。 鑲接 前述基板it-步設有至少—穿孔，該穿聽為供前賴導管穿伸 月!I述基板係為一 I呂材質之平板狀體 實施方式】 清參考第-®，係為顯示賴作散練置之外觀立體圖。本創作 M251441 散熱裝置100，包含·一斗為 各延伸-對相對之水平部12 ^板片11及由碱波_11兩端 垂交卜基板2 ,該美板2#A水平部12係為與前述波浪板片11 上平板面Μ與下恤21_之輸體，且該基板2具有 發熱係為顯示本創作散熱裝置與— 乂m無U z 4放熱片組1底端之水平部12連接， =面1〇上係為縱向排列固著於前述基板2之上平 板面20上’而前述基板2之下 構成本創作之散熱裝置觸。㈣21係為與一發熱源4連接，以 當前述散熱片組1與前述基板人 面2!置於前述發_ 4上後將别迷基板2之下平板 由前述其板2值Γ 發熱源4於運作時所產生的熱，藉 片前述散熱片組1上進行散熱，並再藉由一風扇置 成之空隙面的前側（如圖式箭頭所示），使加 本創二，並再利用 有限體積内Hi 與空氣接觸之表面積，以提升 翻«之外觀立 文…衣置100匕3 · 一散熱片組1，該嵛埶片έ】1古 板2呈右，基板2 ’祕板2係為-|8機之平板紐，且該基 發熱 2之_内，欄卿係藉 7 M251441 前述散熱鰭片ίο之穿孔13而固著於前述熱導管5之管壁52上，而與 前述基板2結合，並使前述散熱鰭片1〇橫向排列固著於前述基板2之 上方，此時將4述基板2之底面與一發熱源4連接，以構成本創作之 散熱裝置ί⑽= 當前述散熱片組1透過熱導管5與前述基板2結合後，將前述基 板2之底面置於刚述發熱源4上，使前述發熱源4於運作時所產生的 熱，藉由4述基板2傳送至前述熱導管5，再經由前述熱導管5傳導至 前述散熱組1上進行散熱，频述發麟4職生之歸由前述敎 導管5鱗引，達到更佳·熱效果，而進—步再藉由—風扇置於前 述散熱片組1所形成之空隙面的任一側（如圖式箭頭所示），使加壓 空氣至前述散熱片組1，以增加空氣相互對流來進行散熱，並再利用本 創作散熱則10之波浪板片增加與空氣接觸面積，以提升有限體積内 …τ卜丞板興熱等管結合之另一 之散熱裝置之剖關，其中前述基板2具有—倒τ型之穿孔23，、該穿 孔23係為配合供前述鱗f 5穿_，錢前述鱗管5之本體如 可藉由前絲減敎穿孔23 _紅料㈣ 導管5之基座51藉由倒丁型之幻,”工上π 錢月成熟 π fi 而相贿述基板2之穿孔23 二= :由前wt 5之本115G穿過前述臟 片牙孔13而固者於前述熱導管5之管壁52上，而盘前述基板2 結合^使前述散熱鰭片1G橫向排觸著於前述基板2之上方Γ此時 ^熱導管5之基座51與-伽4連接，爾本創作之散熱裝 3考第六®，顯林_散糾_解管齡之另―實施能 樣之政熱裝置之外觀立體圖，1巾 貫心心 片1〇，該散鑛片H)具有—平板中片片'組1具有複數個散_ .^ ώ +板片14及由前述平板片14兩端水平夂 延伸一波編15，辅物m穿㈣，物 8 M251441 1㈣述熱導管5結合，而本實施例之組合結構及實施方式均盘第 二圖^貫施例相同，且具有相同之功效，在此不再資述。 狀23七圖’顯示本創作散熱片組與熱導管結合之再—實施態 ϊΐΐΓ觀立義”其讀述散㈣組1射複數俩散_ 皮t板Hr G具有—平板片14及由前述平板# 14四端延伸之 15 ’而該平板片14設有—穿孔13，該f孔13係為配合 述^官5結合，俾使前述熱導管5之顯僅為前述平板片14所包覆， 而本貫施例之組合結構及實施方式均亦與第三圖之實施例相同，且呈 有相同之功效，在此亦不再贅述。 一 旦本創作散練置之鱗管5可依所t之實财辆加鱗管 2之述熱導管5之數量的增加，其相對亦增加與熱導管5 之月文熱鯖片10之穿孔13及基板2之凹槽22與穿孔3，俾使使用 者可依需求何選擇㈣組合之賴結構，使本 於有限體_可提升散熱效率且柯作紐化之組合。—。構不僅 依據前述本創作構成，本創作之散熱裝置於高密度環境下運 時，可有效增加熱源與散熱則傳熱接觸之截面積，以解決因 足而需增加散熱則與熱源接觸面積之缺點，且本創作躺= 可有效增加空氣熱交換率。 .一 1亦 在詳細說明本創作的較佳實施例之後，熟悉該項技術人 的瞭解，在不脫離下射請專·圍與精神下可進行各種變化2 ^而本創作亦不魏於說明書之實施例的實施方式，例如：本 之可述發熱源可為一 CPU、電晶體或其它發熱元件。 【圖式簡單說明】 h 第一圖係為本創作散熱裝置之外觀立體圖。 第二圖係為本鋪散織置與-發__之剖面圖。 第三圖係為本創作另—實施例之散難置之外觀立體圖 第四圖係為本創作散熱裝置與_發熱源接觸之剖面圖: 9 M251441 第五圖係為本創作基板與熱導管結合之另一實施例之散熱· 之剖面圖。 、夏 第六圖係為本創作散熱片組與熱導管結合之另一實施態樣之散 熱裝置之外觀立體圖。 第七圖係為本創作散熱片組與熱導管結合之再一實施態樣之散 熱裝置之外觀立體圖。 第八A圖係為習知散熱裝置未組合之示意圖。 第八B圖係為習知散熱裝置組合後之示意圖。 [主要元件符號對照說明] φ 1()()〜散熱裝置 I —散熱片組 2—基板 4…發熱源 5〜熱導管 …散熱鰭片 II -〜波浪板片 12…水平部 13…穿孔 . 14…平板片 15…波浪板片 20 -〜上平板面 21 ^下平板面 22…凹槽 23 —倒τ型之穿孔 50…本體 51 基座 52…管壁 10M251441 新型 Description of the new type: [Technical field to which the new type belongs] This creation is about a heat sink, especially a wave-shaped heat sink fin made by a high-density air-contact cross-sectional area method, which is used to enhance the volume within a limited volume. The cooling efficiency of the cooling fins. [Previous technology] There are many integrated circuits, transistors, power electronic components, or central processing units in the casing of general industrial computers. With the advancement of technology, these electronic components work faster and faster, and at the same time, ' The problem accompanying these electronic components under high-speed operation is the high temperature generated by them. Since these electronic components are internally composed of silicon wafers and some polar metal wires, it is easy to cause these electronic components at high temperatures. Therefore, we must provide a medium that can remove these heat sources from electronic components, and the heat sink plays an important role in this medium. ㈣Specialist A Tu Xing Eighth B '' is a display-a conventional heat sink 200, which mainly includes:-substrate 7 and-heat sink 6, where the aforementioned substrate 7 is-a flat plate of Ming material ' The heat sink 6 has an upper flat plate surface 7G and a lower flat plate surface 7 and the aforementioned heat sink 6 is a thin sheet body and is pressed to form a continuously curved body-shaped heat sink 6. The flat surface of the aforementioned substrate 7 is connected to the opposite surface of the reading fin 6 which is continuously bowed by stamping by a soldering technique such as a solder or a solder paste to form a body to form a heat dissipation device. : After combining the above-mentioned scattered 6, the flat surface M below the front miscellaneous plate 7 is placed on a center 1 = (not shown in the figure), so that the above-mentioned central office is responsible for the heat generated during operation, by using a separate substrate 7 is conducted to the heat sink 6 for heat dissipation.知 ^ Known heat-dissipating limbs—thin-shaped cymbals are punched to form a curved body ... ^ I, its contact area with air is limited, and the current heat sinks on the market can be roughly divided into _, sheet folding, cutting, Die-casting or any combination of the above-mentioned heat and air deficiency, and the heat dissipation "because of the increase in power consumption of electronic components", so in some specific high-density applications, there is often a problem of insufficient space, which needs to be improved. [New content] The purpose is to provide a kind of interspersed weaving and M density air contact cross-sectional area method to improve the dispersing efficiency of the folded fins in a limited volume. N The purpose of the heat sink device includes: _Scatter correction group, has a plurality of 雠 heat 1 There is-a wave plate and a person extending from both ends of the aforementioned wave plate, and a base plate, which has an upper flat plate surface and a lower flat plate surface. The group describes the button in detail, and the Caiwei heat is vertically above the substrate. The horizontal part of the 2 heat dissipation rule is perpendicular to the wave plate. The substrate is a flat body made of aluminum. Self-coating Cloth—layer tin sheet or tin Material, _ soldering technology to join the aforementioned heat sink group. Another to achieve the above-mentioned supplementary-the thinning of the loose: a wall ^ perforation, where hunting-heat pipe and-substrate inlay, and then through the front 2. The% ^ teeth pass through the perforations of the heat dissipation fins and are arranged in a horizontal row. The tube just above the heat pipe is provided with at least 1 slot, and the groove is used for the aforementioned heat pipe ballasting. The aforementioned substrate is provided with at least a perforation. The perforation is for the front catheter to penetrate and extend the moon! The substrate described above is a plate-shaped body of the Lu material. [Refer to Section -®, which is to show Lai Zuo A three-dimensional view of the appearance of the scouring. This creative M251441 heat sink 100 includes a bucket of each extension-a pair of opposite horizontal sections 12 ^ plate 11 and a base plate 2 perpendicularly intersecting by the ends of the alkali wave _11, the beautiful plate 2 #A 平面 部 12 is the same as the upper plate surface M and the lower shirt 21_ of the wave plate 11 above, and the substrate 2 has a heating system to show the heat dissipation device of this creation and — 乂 m without U z 4 heat radiation film group 1 The horizontal portion 12 at the bottom end is connected, and the surface 10 is vertically aligned and fixed on the flat plate surface 20 above the substrate 2. The base 2 underneath constitutes the heat sink of this creation. ㈣21 is connected to a heat source 4 so that when the aforementioned heat sink group 1 and the aforementioned substrate face 2! Are placed on the aforementioned hair_4, do not fan the substrate 2 below The heat generated by the heat generated by the heat source 4 during the operation of the plate 2 is obtained by the plate. The heat is radiated from the heat sink group 1 described above, and then the front side of the air gap surface formed by a fan (as shown by the arrow in the figure). ), Make Gabon Chuang II, and then use the surface area of Hi in contact with air in a limited volume to improve the appearance of the «Lianwen ... clothes 100 dagger 3 · a heat sink group 1, the shovel】 1 old-fashioned 2 is on the right, the base plate 2 is a flat plate button of the-| 8 machine, and within the base heat 2, lan Qing is fixed to the heat pipe by the perforation 13 of the heat dissipation fin 7 of M251441. The tube wall 52 of 5 is combined with the substrate 2 and the heat dissipation fins 10 are horizontally arranged and fixed on the substrate 2 at this time. At this time, the bottom surface of the substrate 2 is connected to a heat source 4 to The heat-dissipating device that constitutes this creation ⑽ = When the aforementioned heat sink group 1 is combined with the aforementioned substrate 2 through the heat pipe 5, the front The bottom surface of the substrate 2 is placed on the heat source 4 just described, so that the heat generated by the heat source 4 during operation is transmitted to the heat pipe 5 through the substrate 2 and then conducted to the heat dissipation group through the heat pipe 5 The heat dissipation is performed on 1 and the return of the 4 vocational students is reported by the above-mentioned sacral duct 5 to achieve better and better thermal effects. Further, the fan is further placed on the void surface formed by the aforementioned heat sink group 1. On either side (as shown by the arrow in the figure), pressurize the air to the aforementioned heat sink group 1 to increase the convection of the air to dissipate heat, and then use the wave plate of this creative heat sink to increase the contact area with air In order to enhance the heat dissipation in a limited volume ... τ 丞 丞 plate Xing heat and other pipes combined with another heat sink, where the aforementioned substrate 2 has an inverted τ-shaped perforation 23, the perforation 23 is for the aforementioned scale f 5 wear _, the body of the aforementioned scale tube 5 can be perforated by the front wire 23 _ red material 基座 the base 51 of the catheter 5 by the inverted fantasy, "work π money month mature π fi phase The perforation 23 of the substrate 2 is described as follows: 115G of the former wt 5 passes through the above-mentioned dirty tooth hole 13 and is fixed. On the wall 52 of the heat pipe 5, and the substrate 2 is combined with the plate ^ so that the heat sink fins 1G laterally touch the plate 2 at this time ^ the base 51 of the heat pipe 5 is connected to the -4 , Erben's 6th heat-dissipating 3rd test ®, Xianlin _ Sanjie _ Annotation of the tube age-the perspective view of the appearance of the implementation of the government-like thermal device, 1 towel heart card 10, the loose ore sheet H) Have-flat plate piece 'group 1 has a plurality of scattered _. ^ PLUS + plate piece 14 and a wave knitting 15 extending horizontally from the two ends of the aforementioned plate piece 14, the auxiliary material m penetrates the material 8 M251441 1 the heat pipe 5 combination, and the combined structure and implementation of the embodiment are the same as the second embodiment. The embodiments are the same and have the same effects, and will not be described again here. Shape 23 and seven diagrams 'show the combination of the heat sink group and the heat pipe in this creation-the implementation state ϊΐΐ 立 立 立 立 义' its reading San group 1 shot complex two scattered _ leather t plate Hr G has-flat plate 14 and by the aforementioned The flat plate 14 is extended 15 ′ at the four ends, and the flat plate 14 is provided with a perforation 13. The f-hole 13 is combined with the above-mentioned official 5 so that the display of the aforementioned heat pipe 5 is only covered by the aforementioned flat plate 14. The combined structure and implementation of this embodiment are also the same as the embodiment of the third figure, and have the same effect, so it will not be repeated here. Once the scale tube 5 scattered in this creation can be according to the The increase in the number of heat pipes 5 in the real vehicle plus the scale pipe 2 also increases with the perforation 13 of the hot-wen mackerel 10 of the heat pipe 5 and the grooves 22 and perforations 3 of the base plate 2. Users can choose the structure of the combination according to their needs, so that the combination is limited. It can improve the heat dissipation efficiency and the combination of new technology ... The structure is not only based on the composition of the above-mentioned creation, but the heat dissipation device of this creation is in a high-density environment. When shipped, it can effectively increase the cross-sectional area of heat transfer contact between heat source and heat sink to solve the need due to the foot. The disadvantage of increasing the heat dissipation is the contact area with the heat source, and this creation = can effectively increase the heat exchange rate of the air.. .1 After also explaining the preferred embodiment of this creation in detail, the person familiar with the technology will not leave it alone. You can make all kinds of changes under the guidance of “Surrounding” and “Spiritual” 2 ^ And this creation is not the implementation of the embodiment of the description, for example: the heat source can be a CPU, transistor or other heating elements. [Schematic description] h The first picture is a perspective view of the appearance of the cooling device of the creation. The second picture is a cross-sectional view of the layout and the -__ of the shop. The third picture is another embodiment of the creation The perspective view of the scattered and difficult to place appearance. The fourth figure is a cross-sectional view of the creative heat sink in contact with the heating source: 9 M251441 The fifth figure is a cross-sectional view of the heat sink of another embodiment in which the creative substrate and the heat pipe are combined. The sixth picture is a perspective view of the external appearance of a heat sink with another embodiment of the combination of the heat sink and the heat pipe. The seventh picture is another embodiment of the combination of the heat sink and the heat pipe. Heat sink A perspective view of the appearance. The eighth diagram A is a schematic diagram of a conventional heat sink without combination. The eighth diagram B is a schematic diagram of a conventional heat sink after being assembled. [Comparison of the main component symbols] φ 1 () () ~ heat sink I — heat sink group 2 — base plate 4… heat source 5 ~ heat pipe… heat radiating fins II— ~ wave plate 12… horizontal portion 13… perforation. 14… flat plate 15… wave plate 20-~ upper plate surface 21 ^ Lower flat surface 22 ... Groove 23—Inverted τ-shaped perforation 50 ... Body 51 Base 52 ... Pipe wall 10