M243883 案號 92206179 年 月 曰 修正 马、創作說明（1) 【新型所屬之技術領域】 本案係提供一種『具有防止損傷電路板及保護晶片之 防護罩結構』，特別是晶片上方之散熱裝置於裝、拆之時 容易刮傷或毁損晶片，因此設計一種金屬罩體係覆蓋於晶 片上方，並且與晶片相觸將熱量傳導出來，再供散熱片及 風扇架設其上，能得到保護晶片不被刮傷、毀損的優點。 【先前技術】 按，一般運算能力較快速的高級電路板，多半需要配 置較高級（運算能力快速）的晶片，尤其是專用於立體3D動 畫分彩能力較高的顯示卡及高階電腦用途機板，更是需要 極優良的晶片組設其中，然而此種解析、運算能力較佳的< 晶片價格昂貴，而且在處理的過程中極易發熱，因此在該 晶片之上方必需組設有散熱片、風扇，以及夾持散熱片的 夾具’可是該散熱片的夾具、風扇等皆是一種消耗品，況 且對於較為昂貴的電路板在一定時間的保養，都會預先將 舊的消耗零件換新，但是在拆卸或組裝散熱片之時，該金 屬製的夾具或散熱片的邊緣、尖角等，受限於組裝時的空 間位置有不易操作之情形，或是在組裝、拆卸的不留意之 間，極容易刮傷晶片的表面，甚至造成毁損晶片之情形， 常使得該昂貴的電路板也就因此失效或嚴重受損，往往得 不償失，因此有鑑於昂貴的電路板中仍有許多損耗性零件彳 在裝、卸之間，受限於空間的位置操作不易，而時有不小 心以尖銳的金屬物件刮傷、毁損晶片的情形，是使用者所M243883 Case No. 92206179 Revised Horse and Creation Instructions (1) [Technical Field to which the New Type belongs] This case provides a "protective cover structure with damage prevention circuit board and chip protection", especially the heat dissipation device above the chip. 2.It is easy to scratch or damage the chip when disassembling. Therefore, a metal cover system is designed to cover the chip, and it contacts the chip to conduct heat, and then the heat sink and fan are mounted on it to protect the chip from being scratched. Destroyed advantages. [Previous technology] Press. Generally, advanced circuit boards with faster computing power usually need to be equipped with higher-level (fast computing power) chips, especially graphics cards and high-end computer boards dedicated to stereo 3D animation. It also requires a very good chip set. However, such a chip with better analysis and computing power is expensive and easily heats up during processing. Therefore, a heat sink must be set above the chip. , Fan, and the fixture holding the heat sink ', but the heat sink's fixture, fan, etc. are all consumables. Moreover, for the more expensive circuit board maintenance at a certain time, the old consumable parts will be replaced with new ones in advance, but When disassembling or assembling the heat sink, the edges and sharp corners of the metal fixture or the heat sink may be difficult to operate due to the space position during assembly, or if you do not pay attention to the assembly and disassembly, It is very easy to scratch the surface of the wafer and even cause damage to the wafer, which often causes the expensive circuit board to fail or be seriously damaged. Worry-out, so there are still many lossy parts in the expensive circuit board. It is not easy to operate in a space-constrained location between loading and unloading, and sometimes the chip is scratched and damaged by sharp metal objects. The situation is the user
第5頁 M243883 _案號92206179_年月日__ 四、創作說明（2) 常遭遇的事件，應予妥善解決。 【新型内容】 因此，為解決上述習用的問題，本創作之主要目的， 在設一金屬罩體，為五面封合且開口朝下的結構體，該金 屬罩體罩於整個晶片，而頂部則與晶片相觸，以便將熱量 向外傳出，再配合散熱片及風扇等裝置架設其上而成，則 在換裝散熱片時，該晶片受到金屬罩體之防護，不會被金 屬物件以銳利的尖角刮傷或毀損，即能減少人為的破壞， 而延長使用壽命，是本創作之特色。 己 酉 請 容 内 之 案 本 瞭 明 步 1 進 更 能 員 委 查 1貴 式 方使 施為 實 [ 后案 如本 明， 說示 細所 詳圖 ，A 明三 說、 單一 簡第 式看 圖參 看請 參 合P.5 M243883 _Case No. 92206179_Year Month and Date__ 4. Description of Creation (2) The incidents often encountered should be properly resolved. [New content] Therefore, in order to solve the above-mentioned conventional problems, the main purpose of this creation is to set up a metal cover, which is a structure sealed on five sides and opening downwards. The metal cover covers the entire wafer, and the top It is in contact with the chip so as to transfer the heat outward, and is mounted on it with a heat sink and a fan. When the heat sink is replaced, the chip is protected by a metal cover and is not protected by metal objects. Scraping or damaging with sharp sharp corners can reduce man-made damage and prolong the service life, which is the characteristic of this creation. I have asked the contents of the case to make clear steps 1 to enter into a more capable committee to check 1 expensive way to implement Shi [the later case is as clear as this, detailed illustrations, A Ming San said, a single simple look Please refer to the picture
o U 2CP C器 片理 晶處 算央 運中 級的 高板 定機 特主 的或 上片 X)/ 曰BQ 主例 板 路 在 要 如 周 至 顯 的 卡 示 i言 顯少 兩 有 ο示 相 孔金金 插一該 的 ’ 對 體 向體 該罩 且屬 ，金 狀該 1體體 1罩罩外 屬屬 構張 結擴 的呈 下外 朝向 口為 開略 且係 合壁 封側 面緣 。五周 >為的 2 1 ο ο 佳部 為底 度邊 30對 3 ^»»'才 外兩 向的 線壁 直側 垂緣 以周 係於 ，少 度至 角又 之 張ο 擴3 孔、 扣一 具第 有看 伸參 延請 外 向 ο 3 體 。罩 1金 3該 Γν ， 翼示 凸所 的圖 )A 2三 ^^1o The U 2CP C chip is calculated by the central transport mid-level high-board set-up special owner or on the film X) / said BQ main example board circuit should be as obvious as the card display. Kong Jinjin inserted a pair of body-to-body cover and genus, and the gold-like body 1 and body cover genus expanded and expanded with a lower outward facing opening and bound the side edges of the wall seal. Five weeks> 2 for 1 1 ο ο The best part is the bottom edge 30 to 3 ^ »» 'The outer two-way line wall straight side vertical edge is tied in a circle, less to the angle again ο Expand 3 holes , Buckle one of the first to see the extension, please extend outward ο 3 body. Hood 1 gold 3 the Γν, the wing shows the convex figure) A 2 three ^^ 1
第6頁 M243883 案號92206179 _年 月 日 修正 部 頂 的 \iy ο 3 Γν 體 罩 屬 金 而 體 本 ο 2 /IV 片 3)晶 個 月 S整 辦設 四罩 下}晶上00}0 3 ， () 體ο 罩6 屬C 金膏 在熱 時導 同層 - 觸有 相設 面係 頂面 }觸 ο接 2 ) (ο 片2 晶C 與片 則晶 方與 ο使 4 )( ο片 3熱 散 體設 罩加 屬再 金可 至則 傳方 勻上 均} 量ο 熱3 的C 生體 產罩 所屬 金 ο該 2在 C而 片， 4 0 (3 片'^ 熱體 散罩 由 藉金 並將 ，時 熱同 散， 利定 以固 置的 裝間 等 \1/ ο ο 1 7 ( C板 扇路 風電 及與 4 /IV 片 熱 散 與 ο 3 0 () 體1 罩6 屬C 金膏 該熱 在導 ， 層 中一 其有 •，設 定亦 固間 壓之 爽/^ 扣片定 具定固 一 、固} 的出該2 板 路 與 ο 4 /IV 片， 熱例 散施 述實 上種 ο 4 /|\ 片 熱 散 在 係 式 方凸 定有 固設 的側 間對 }相 ο兩 1—I的 穿 1 ·, 貫C定 }孔固 ο插壓 5的夾 {上時 扣同 釘 ο 兩1 ο 以C 3 並板{ ，路體 }電罩 1於屬 4釘金 {扣將 片而時 定/-N同 固1可 之4即 孔 (， \»/ ο 7 Γν 扇 風 設 組 可 亦 方 上 之 X]/ ο 4 (ο 片果 熱效 散熱 而散 加 增 以 本 }孔 ο扣 3具 C其 體將 罩係 屬， 金上 ，N)y 示ο 所1 圖C B板 三路 、電 二於 、固 一扣 第行 看自 參以 請得 亦 身 板穿 路貫 電} 於1 合5 對C 扣 1釘 3兩 C以 翼再 凸， )1 2 1 3 ( C孔 當板 •，路 二 1^ml IJ }在 ο定 1 固 C均 板別 路各 在ο 固4 釘C 接片 直熱 散 ο與 3 ) (ο 一體 另罩 的屬 }金 ο將金 1而 體} 罩ο I—Η 3 時 3 的 翼對 凸相 的呈 \)/ ο 1 3 4 /|\ /1\ 體片 罩定 屬固 金的 該} 其ο ，4 示C 所片 圖熱 四散 、與 二， 第} 如1Page 6 M243883 Case No. 92206179 _Year Month Day Correction Department \ iy ο 3 Γν The body cover is gold and the body is ο 2 / IV 3) The crystal month S is set up under four covers} 晶 上 00} 0 3 ， () body ο cover 6 metal C paste in the same layer when hot-contact the surface of the top system} contact ο 2) (ο 2 pieces of crystal C and piece of crystal and ο make 4) (ο The heat dispersion of sheet 3 can be covered with metal, and then it can be transferred evenly. The amount is ο. The heat of the 3 C body production mask belongs to the gold. The 2 is in C, and 4 0 (3 pieces of heat shield. By borrowing money, and dispersing the heat at the same time, and deciding to install the fixed room, etc. 1 / (ο ο ο 1 7 (C plate fan road wind power and 4 / IV heat dissipation and ο 3 0 () body 1 cover 6 The gold paste of C belongs to the heat guide, there is one in each layer, and the setting of the solid pressure is also cool / ^ The clips have a fixed and a solid shape. The 2 circuit and ο 4 / IV are heated. Exemplified by the description of the actual situation ο 4 / | \ A piece of heat is scattered on the side of the system square convex fixed fixed pair} phase ο two 1-I through 1 ·, through C fixed} hole solid ο insert a pressure of 5 clip {upper Buckle the same ο two 1 ο and C 3 and board {, road body} electricity 1 于 belongs to 4 nails (the buckle will be fixed at the time / -N is the same as the solid 1 can be 4 that is the hole (, \ »/ ο 7 Γν fan wind set can also be X on the square) / ο 4 (ο piece fruit The heat dissipation is increased and the heat dissipation is increased. The holes are buckled. The body is attached to the cover. It is shown on the gold, N) y. So the picture 1 of the CB board has three circuits, two electric cables, and one solid button. Please refer to it and get through the body through the electricity} 1 in 5 pairs of C buckle 1 nail 3 two C with wings again,) 1 2 1 3 (C hole when the plate •, Road 2 1ml IJ} 1 solid C equal plate each way separately ο solid 4 nail C splicing heat dissipation ο and 3) (ο the other integrated cover} gold ο will gold 1 and body} cover ο I—Η 3 o'clock 3 wings pair Presentation of convex phase \) / ο 1 3 4 / | \ / 1 \ The body cover must be solid gold, which ο, ο, 4 shows C, the picture is scattered, and two, the first} such as 1
第7頁 M243883 _案號92206179_年月日 修正 _ 四、創作說明（4) 錯開狀，使扣固更為容易。 由於本案之設計具有巧思，在實施上具有如下之諸項 優點： 1 .本案在晶片上方蓋設有一金屬罩體，並使金屬罩體與晶 片頂部相觸，一方面可以保護晶片不受到外界的刮傷或 損傷，減少使用上的折壞，並能延長晶片的使用壽命， 是本案之主要優點。 2 .金屬罩體之金屬罩體的周緣側壁係略為向外呈擴張狀， 使其罩於晶片時更具有穩定性，且頂部更易貼合於晶 片，是本案之另一優點。 3.金屬罩體在與晶片、散熱片的接觸面係設有導熱膏，使 晶片上的熱量得以平均且迅速散出，並容易被上方組設 的散熱片所吸收，為本案之又一優點。 由於本創作人一本不斷求進步的積極態度，首先創獲 本產品，具有上述之保護晶片不被刮傷、毁損的優點，減 少使用上的人為損壞，延長晶片的使用壽命，具有產業之 利用價值，應符合申請新型專利之要件，特提出申請，並 請 貴審查委員能早曰賜予新型專利為感。Page 7 M243883 _Case No. 92206179_Year Month Day Amendment _ Fourth, the creation instructions (4) staggered shape, making fastening easier. Because the design of this case is ingenious, it has the following advantages in implementation: 1. This case is provided with a metal cover on the wafer and the metal cover is in contact with the top of the wafer, on the one hand, it can protect the wafer from the outside world. The main advantages of this case are to reduce scratches or damages, reduce breakage during use, and extend the life of the chip. 2. The metal cover's peripheral wall is slightly expanded outward, making it more stable when covering the wafer, and the top is easier to fit on the wafer, which is another advantage of this case. 3. The metal cover is provided with a thermal conductive paste on the contact surface with the chip and the heat sink, so that the heat on the chip can be evenly and quickly dissipated, and easily absorbed by the heat sink arranged above, which is another advantage of this case. . Due to the positive attitude of the creator to continuously strive for progress, this product was first created, which has the advantages of protecting the chip from being scratched and damaged as described above, reducing artificial damage during use, extending the life of the chip, and having industrial use value It should meet the requirements for applying for a new patent, and make an application, and ask your reviewing committee to give the new patent as soon as possible.
第8頁 M243883 _案號 92206179 年月日 修正 圖式簡單說明 【圖式說明】 第一圖 係本創作之結構分解圖。 第二圖 係本創作之組裝實施例圖。 第三A圖係本創作之縱剖側視圖。 第三B圖係本創作之另一縱剖側視圖。 第四圖 係本創作組裝後之俯視圖。 片 膏 孔片翼熱扣熱扇 插晶凸散釘導風 1 ο 1 ο ο ο ο 1 2 3 4 5 6 7Page 8 M243883 _Case No. 92206179 Date Modified Brief Description [Schematic Description] The first figure is an exploded view of the structure of this creation. The second figure is a diagram of the assembly example of this creation. The third A picture is a vertical side view of this creation. The third B-picture is another longitudinal sectional side view of this creation. The fourth picture is the top view after the creation and assembly. Sheet paste Hole sheet wing hot buckle hot fan Insert crystal convex scattered nail guide 1 ο 1 ο ο ο ο 1 2 3 4 5 6 7
【元件代表符號】 1 0電路板 1 2插孔 3 0罩體 3 2扣孔 4 1固定片 5 1釘扣 6 1導熱膏[Representative symbols of components] 1 0 circuit board 1 2 jack 3 0 cover 3 2 buttonhole 4 1 fixing piece 5 1 nail button 6 1 thermal paste
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