CN2624589Y - Protecting cover structure capable of protecting circuit board and wafer - Google Patents
Protecting cover structure capable of protecting circuit board and wafer Download PDFInfo
- Publication number
- CN2624589Y CN2624589Y CN 03251569 CN03251569U CN2624589Y CN 2624589 Y CN2624589 Y CN 2624589Y CN 03251569 CN03251569 CN 03251569 CN 03251569 U CN03251569 U CN 03251569U CN 2624589 Y CN2624589 Y CN 2624589Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- wafer
- cover body
- metal cover
- prevents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a protective cup structure which is used to guard against the damage of the circuit board and the wafer. A metal protective cup is arranged above the wafer of the circuit board and the metal protective cup adopts the structure of which five sides are sealed and the opening is downward; also, the nether top hereof is touched with the top surface of the wafer; in addition, the cooling fin is added above the metal protective cup and the metal circuit board is clamped via the fixing between the cooling fin and the circuit board, so as to decrease the man-made damage and increase the service life.
Description
Technical field
The utility model relates to a kind of the have protective roof structure that prevents to damage circuit board and protection wafer, the particularly heat abstractor of wafer top scratch or damage wafer easily, the therefore protective roof structure of design in the mounting or dismounting.
Background technology
Press, general operational capability level circuit plate faster needs to dispose the wafer of more senior (operational capability is quick) mostly, especially is exclusively used in three-dimensional 3D animation and divides higher display card of color ability and high-order computer purposes machine plate.Need extremely good wafer set to establish wherein especially, yet this kind parsing, the wafer price costliness that operational capability is preferable, and very easily heating in the process of handling, therefore above this wafer, must organize and be provided with fin, fan, and the anchor clamps of clamping fin, but the anchor clamps of this fin, fans etc. all are a kind of running stores, moreover for of the maintenance of comparatively expensive circuit board at certain hour, the capital renews old consumable product in advance, but in dismounting or assembling fin, the edge or the wedge angle of these metallic anchor clamps or fin, space bit when being subject to assembling is equipped with the situation that is difficult for operation, or in assembling, the surface of as easy as rolling off a log scratch wafer between dismounting careless, even cause the situation of damaging wafer, often make this expensive circuit board also just therefore lose efficacy or be badly damaged, often lose more than gain, therefore because still have many loss parts in the expensive circuit board, at dress, between unloading, the position operation that is subject to the space is difficult for, and the time have careless with sharp-pointed metal objects scratch, damage the situation of wafer, the person of being to use the normal incident that meets with, should properly settle.
Summary of the invention
The purpose of this utility model provides a kind of protective roof structure that prevents to damage circuit board and protection wafer that has; a kind of metal cover body is to be covered in the wafer top; and touch mutually with wafer heat is conducted out; set up on it for fin and fan, the wafer that can be protected is not by the advantage of scratch, damage again.
The utility model provides a kind of protective roof structure that prevents to damage circuit board and protection wafer that has, the main metal cover body that above the wafer of circuit board, is provided with, this metal cover body is five involutions and downward opening structure, and touches mutually with wafer top surface with its below, top; Above this metal cover body, then add fin again, and, simultaneously metal cover body cramping is fixed by fixing between fin and circuit board.
The utility model provides a kind of protective roof structure that prevents to damage circuit board and protection wafer that has, and the wafer week side of this circuit board is provided with several jacks; And the metal cover body is extended with the protruding wing of tool button hole at least in the two relative edges bottom of perimeter side walls; Two nail catchers of mat run through the protruding wing, and the metal cover body are directly followed closely solid on circuit board.
The utility model provides a kind of protective roof structure that prevents to damage circuit board and protection wafer that has, and the perimeter side walls of this metal cover body is slightly outwards to be the expansion shape.
The utility model provides a kind of protective roof structure that prevents to damage circuit board and protection wafer that has, and the angle that the perimeter side walls of this metal cover body expands outwardly is for good with outward-dipping 30 degree of vertical line.
The utility model provides a kind of protective roof structure that prevents to damage circuit board and protection wafer that has, and is provided with heat-conducting cream between this metal cover body and wafer contact-making surface.
The utility model provides a kind of protective roof structure that prevents to damage circuit board and protection wafer that has, and is provided with heat-conducting cream between the contact-making surface of this metal cover body and top fin.
The utility model can reduce artificial destruction, and increases the service life.
Description of drawings
Fig. 1 is STRUCTURE DECOMPOSITION figure of the present utility model.
Fig. 2 is assembled embodiment figure of the present utility model.
Fig. 3 is a vertical profile end view of the present utility model.
Fig. 4 is another vertical profile end view of the present utility model.
Fig. 5 is the vertical view after the utility model assembling.
Embodiment
For making the duty juror can further understand content of the present utility model, please cooperate referring to brief description of drawingsfig, describe in detail as the back:
Please referring to shown in Fig. 1,3, the utility model is all sides of the specific senior computing wafer 20 on circuit board 10 (for example: the shows wafer of display card or the central processor CPU of motherboard) mainly, are provided with two groups of relative jacks 11,12 at least.
One metal cover body 30 is five involutions and downward opening structure, and the perimeter side walls of this metal cover body 30 is slightly outwards to be the expansion shape, and this angle that expands outwardly, and is for good with outwards about 30 degree of vertical line; This metal cover body 30 is outward extended with the protruding wing 31 of button hole 32 again to the two relative edges bottom that is less than perimeter side walls.
Please referring to shown in Fig. 1~3, this metal cover body 30 is covered with entire wafer 20 bodies, then touch mutually with wafer 20 end faces the below, top of metal cover body 30, be to be provided with one deck heat-conducting cream 60 at metal cover body 30 with wafer 20 contact-making surfaces simultaneously, the heat that wafer 20 is produced evenly reaches on the metal cover body 30, above this metal cover body 30, then can add devices such as fin 40 and fan 70 again in order to heat radiation, and fixing by 10 of fin 40 and circuit boards, simultaneously metal cover body 30 crampings are fixed; Wherein, between this metal cover body 30 and fin 40, also be provided with one deck heat-conducting cream 61.
A kind of embodiment of the fixed form that above-mentioned fin 40 and circuit board are 10, it is the stator 41 that is provided with protrusion in the two opposite sides of fin 40, has button hole, and run through this stator 41 and the jack 12 of clasp nail on circuit board 10 is fixing with two nail catchers 50, can be simultaneously with metal cover body 30 simultaneously cramping fix; And the top of fin 40 also can be organized and establishes fan 70, to increase radiating effect.
Please referring to shown in Fig. 1,2,4, metal cover body 30 itself is also detained voluntarily to be fixed on the circuit board 10, be it to be had the protruding wing 31 of button hole 32 is involutory to be run through with two nail catchers 51 in another jack 11 of circuit board 10 again, and metal cover body 30 directly followed closely solid on circuit board 10; When metal cover body 30 and fin 40 distinctly all were fixed on the circuit board 10, shown in Fig. 2,5, the protruding wing 31 of its this metal cover body 30 was the relative shape that staggers with the stator 41 of fin 40, made button solid more easy.
Because design of the present utility model has clever thought, has all following advantage on the implementation:
1, the utility model is covered with a metal cover body above wafer; and the metal cover body is touched mutually with the wafer top, and can protect wafer not to be subjected to extraneous scratch or damage on the one hand, reduce the damage on using; and can prolong useful life of wafer, be major advantage of the present utility model.
2, the perimeter side walls of the metal cover body of metal cover body is slightly outwards to be the expansion shape, has more stability when making it cover in wafer, and the easier wafer that fits in top, is another advantage of the present utility model.
3, the metal cover body is to be provided with heat-conducting cream at the contact-making surface with wafer, fin, makes the heat on the wafer be able on average and rapidly shed, and the fin of being established by upper set easily absorbs, and is another advantage of the present utility model.
Because one of this creator constantly asks progressive positive attitude; this product of new discovery at first; have as above-mentioned protection wafer not by the advantage of scratch, damage; reduce the artificial damage on using; prolong the useful life of wafer; value with industry should meet the important document of applying for utility model patent, and the spy files an application.
Claims (6)
1, a kind of have a protective roof structure that prevents to damage circuit board and protection wafer, it is characterized in that: mainly above the wafer of circuit board, be provided with a metal cover body, this metal cover body is five involutions and downward opening structure, and touches mutually with wafer top surface with its below, top; Above this metal cover body, then add fin again, and, simultaneously metal cover body cramping is fixed by fixing between fin and circuit board.
2, according to claim 1 have a protective roof structure that prevents to damage circuit board and protection wafer, and it is characterized in that: the wafer week side of this circuit board is provided with several jacks; And the metal cover body is extended with the protruding wing of tool button hole at least in the two relative edges bottom of perimeter side walls; Two nail catchers of mat run through the protruding wing, and the metal cover body are directly followed closely solid on circuit board.
3, according to claim 1 have a protective roof structure that prevents to damage circuit board and protection wafer, and it is characterized in that: the perimeter side walls of this metal cover body is slightly outwards to be the expansion shape.
4, according to claim 3 have a protective roof structure that prevents to damage circuit board and protection wafer, and it is characterized in that: the angle that the perimeter side walls of this metal cover body expands outwardly is for good with outward-dipping 30 degree of vertical line.
5, according to claim 1 have a protective roof structure that prevents to damage circuit board and protection wafer, it is characterized in that: be provided with heat-conducting cream between this metal cover body and wafer contact-making surface.
6, according to claim 1 have a protective roof structure that prevents to damage circuit board and protection wafer, it is characterized in that: be provided with heat-conducting cream between the contact-making surface of this metal cover body and top fin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03251569 CN2624589Y (en) | 2003-04-30 | 2003-04-30 | Protecting cover structure capable of protecting circuit board and wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03251569 CN2624589Y (en) | 2003-04-30 | 2003-04-30 | Protecting cover structure capable of protecting circuit board and wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2624589Y true CN2624589Y (en) | 2004-07-07 |
Family
ID=34253218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 03251569 Expired - Fee Related CN2624589Y (en) | 2003-04-30 | 2003-04-30 | Protecting cover structure capable of protecting circuit board and wafer |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2624589Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106169977A (en) * | 2016-08-24 | 2016-11-30 | 成都智齐科技有限公司 | A kind of multifunctional intellectual router |
CN112802807A (en) * | 2021-02-25 | 2021-05-14 | 福州创实讯联信息技术有限公司 | Chip heat dissipation device and manufacturing method |
TWI764386B (en) * | 2020-11-20 | 2022-05-11 | 英業達股份有限公司 | Electronic assembly and server |
-
2003
- 2003-04-30 CN CN 03251569 patent/CN2624589Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106169977A (en) * | 2016-08-24 | 2016-11-30 | 成都智齐科技有限公司 | A kind of multifunctional intellectual router |
TWI764386B (en) * | 2020-11-20 | 2022-05-11 | 英業達股份有限公司 | Electronic assembly and server |
CN112802807A (en) * | 2021-02-25 | 2021-05-14 | 福州创实讯联信息技术有限公司 | Chip heat dissipation device and manufacturing method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |