TWI764386B - Electronic assembly and server - Google Patents
Electronic assembly and serverInfo
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- TWI764386B TWI764386B TW109140754A TW109140754A TWI764386B TW I764386 B TWI764386 B TW I764386B TW 109140754 A TW109140754 A TW 109140754A TW 109140754 A TW109140754 A TW 109140754A TW I764386 B TWI764386 B TW I764386B
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- circuit board
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- cover body
- electronic component
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Description
本發明係關於一種電子組件及伺服器,特別係關於一種包含保護蓋的電子組件及伺服器。The present invention relates to an electronic component and a server, in particular to an electronic component and a server including a protective cover.
一般來說,伺服器中的主機板上會設有可信平台模組(Trusted Platform Module,TPM)元件來對硬碟進行加密。此外,為了防止可信平台模組元件被有心人士輕易地從主機板拆除,通常會透過鉚釘將保護蓋固定於主機板而罩住可信平台模組元件。Generally, a Trusted Platform Module (TPM) component is provided on the motherboard in the server to encrypt the hard disk. In addition, in order to prevent the trusted platform module element from being easily removed from the motherboard by a deliberate person, a protective cover is usually fixed on the motherboard through rivets to cover the trusted platform module element.
然,暴露於外的鉚釘容易使用工具來破壞或撬開而無法有效地將保護蓋維持在罩住可信平台模組元件的狀態。此外,不同厚度的電路板需要使用不同規格的鉚釘,這會使得將保護蓋安裝在電路板的成本增加。再者,由於鉚釘需要穿過主機板才能達到所需的緊固力,因此鉚釘會凸出於主機板靠近伺服器的機殼的一側而佔據主機板及機殼之間的空間。However, the exposed rivets are easily broken or pried open with tools and cannot effectively maintain the protective cover in a state covering the trusted platform module components. In addition, different thicknesses of circuit boards require the use of rivets of different specifications, which increases the cost of mounting the protective cover on the circuit board. Furthermore, since the rivet needs to pass through the motherboard to achieve the required tightening force, the rivet will protrude from the side of the motherboard close to the casing of the server to occupy the space between the motherboard and the casing.
本發明在於提供一種電子組件及伺服器以使保護蓋能安裝於不同厚度的電路板,並同時有效地保護電子元件及減少電路板及機殼之間被佔據的空間。The present invention is to provide an electronic component and a server so that the protective cover can be installed on circuit boards of different thicknesses, and at the same time effectively protect the electronic components and reduce the space occupied between the circuit board and the casing.
本發明一實施例所揭露之電子組件包含一電路板、一電子元件、一止擋件以及一保護蓋。電路板包含一底面及一頂面。底面及頂面彼此相背對。電子元件固定於電路板的頂面。止擋件的一側固定於電路板的頂面。保護蓋包含一罩體以及一卡扣結構。卡扣結構凸出於罩體。止擋件的另一側止擋卡扣結構而防止罩體朝遠離電路板的頂面之方向移動。罩體蓋合於電路板的頂面且罩體與電路板共同形成一容置空間。電子元件位於容置空間中。An electronic assembly disclosed in an embodiment of the present invention includes a circuit board, an electronic component, a stopper, and a protective cover. The circuit board includes a bottom surface and a top surface. The bottom surface and the top surface face away from each other. Electronic components are fixed to the top surface of the circuit board. One side of the stopper is fixed on the top surface of the circuit board. The protective cover includes a cover body and a buckle structure. The buckle structure protrudes from the cover body. The other side of the stopper blocks the buckle structure to prevent the cover body from moving away from the top surface of the circuit board. The cover body covers the top surface of the circuit board, and the cover body and the circuit board together form an accommodating space. Electronic components are located in the accommodating space.
本發明另一實施例所揭露之一種電子組件包含一電路板、一電子元件、一止擋件以及一保護蓋。電路板包含一底面及一頂面。底面及頂面彼此相背對。電子元件固定於電路板的頂面。止擋件包含一本體及一第一卡扣結構。止擋件固定於電路板。第一卡扣結構位於本體。保護蓋包含一罩體以及一第二卡扣結構。第二卡扣結構凸出於罩體。第一卡扣結構卡合於第二卡扣結構而防止罩體朝遠離電路板的頂面之方向移動。罩體蓋合於電路板的頂面且罩體與電路板共同形成一容置空間。電子元件位於容置空間中。Another embodiment of the present invention discloses an electronic assembly comprising a circuit board, an electronic component, a stopper and a protective cover. The circuit board includes a bottom surface and a top surface. The bottom surface and the top surface face away from each other. Electronic components are fixed to the top surface of the circuit board. The stopper includes a body and a first buckle structure. The stopper is fixed on the circuit board. The first buckle structure is located on the body. The protective cover includes a cover body and a second buckle structure. The second buckle structure protrudes from the cover body. The first buckle structure is engaged with the second buckle structure to prevent the cover body from moving away from the top surface of the circuit board. The cover body covers the top surface of the circuit board, and the cover body and the circuit board together form an accommodating space. Electronic components are located in the accommodating space.
本發明再另一實施例所揭露之伺服器包含一機殼以及一電子組件。電子組件包含一電路板、一電子元件、一止擋件以及一保護蓋。電路板固定於機殼。電路板包含一底面及一頂面。底面及頂面彼此相背對。電子元件固定於電路板的頂面。止擋件的一側固定於電路板的頂面。保護蓋包含一罩體以及一卡扣結構。卡扣結構凸出於罩體。止擋件的另一側止擋卡扣結構而防止罩體朝遠離電路板的頂面之方向移動。罩體蓋合於電路板的頂面且罩體與電路板共同形成一容置空間。電子元件位於容置空間中。A server disclosed in yet another embodiment of the present invention includes a casing and an electronic component. The electronic assembly includes a circuit board, an electronic component, a stopper and a protective cover. The circuit board is fixed on the casing. The circuit board includes a bottom surface and a top surface. The bottom surface and the top surface face away from each other. Electronic components are fixed to the top surface of the circuit board. One side of the stopper is fixed on the top surface of the circuit board. The protective cover includes a cover body and a buckle structure. The buckle structure protrudes from the cover body. The other side of the stopper blocks the buckle structure to prevent the cover body from moving away from the top surface of the circuit board. The cover body covers the top surface of the circuit board, and the cover body and the circuit board together form an accommodating space. Electronic components are located in the accommodating space.
根據上述實施例所揭露之伺服器及電子組件,由於保護蓋的卡扣結構是受到固定於電路板的止擋件止擋而不是受電路板止擋,因此電路板的厚度並不會影響保護蓋的卡扣結構及止擋件之間的止擋關係。如此一來,便得以使保護蓋能透過卡扣結構安裝於不同厚度的電路板。According to the server and electronic components disclosed in the above-mentioned embodiments, since the buckle structure of the protective cover is stopped by the stopper fixed to the circuit board instead of the circuit board, the thickness of the circuit board does not affect the protection The latching structure of the cover and the blocking relationship between the blocking pieces. In this way, the protective cover can be installed on circuit boards with different thicknesses through the snap-fit structure.
以下在實施方式中詳細敘述本發明之實施例之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本發明之實施例之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the embodiments of the present invention are described in detail below in the embodiments, and the contents are sufficient to enable any person with ordinary knowledge in the art to understand the technical contents of the embodiments of the present invention and implement them accordingly, and according to the disclosure in this specification Any person with ordinary knowledge in the art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.
請參閱圖1至圖4。圖1為根據本發明第一實施例之伺服器的側視圖之局部放大圖。圖2為圖1中的伺服器之電子組件的立體圖之局部放大圖。圖3為圖2中的電子組件之分解圖之局部放大圖。圖4為圖2中的電子組件之側剖示意圖之局部放大圖。See Figures 1 through 4. FIG. 1 is a partial enlarged view of a side view of a server according to a first embodiment of the present invention. FIG. 2 is a partial enlarged view of a perspective view of electronic components of the server in FIG. 1 . FIG. 3 is a partial enlarged view of the exploded view of the electronic assembly of FIG. 2 . FIG. 4 is a partial enlarged view of a schematic side sectional view of the electronic component in FIG. 2 .
於本實施例中,伺服器10包含一機殼100以及一電子組件200。電子組件200包含一電路板210、一電子元件220、二止擋件230、一保護蓋240及多個螺絲250。In this embodiment, the
如圖1所示,於本實施例中,電路板210例如透過這些螺絲250固定於機殼100。須注意的是,於其他實施例中,電路板亦可僅透過單個螺絲固定於機殼,或者,於其他實施例中,電路板亦可透過鉚釘或其他合適的緊固件固定於機殼。於本實施例中,電路板210包含一底面211、一頂面212及二穿孔213。底面211及頂面212彼此相背對。二穿孔213彼此分離並貫穿底面211及頂面212。此外,於本實施例中,電路板210的厚度T1例如為0.118英寸。As shown in FIG. 1 , in this embodiment, the
於本實施例中,電子元件220固定於電路板210的頂面212並例如為可信平台模組(Trusted Platform Module,TPM)元件。In this embodiment, the
於本實施例中,二止擋件230各包含彼此相連的一第一部分231及一第二部分232。於本實施例中,第一部分231的延伸方向E1例如垂直於第二部分232的延伸方向E2。第一部分231例如以表面黏著技術(Surface-mount technology,SMT)焊接於電路板210的頂面212。二第二部分232分別位於二穿孔213中。並且,於本實施例中,第二部分232遠離第一部分231的一側介於電路板210的底面211及頂面212之間而沒有凸出於電路板210的底面211。In this embodiment, each of the two
於其他實施例中,第一部分的延伸方向亦可與第二部分的延伸方向夾一銳角。於其他實施例中,止擋件的第一部分亦可透過黏合或任何其他合適的方式固定於電路板的頂面。In other embodiments, the extending direction of the first portion may also form an acute angle with the extending direction of the second portion. In other embodiments, the first part of the stopper can also be fixed on the top surface of the circuit board by gluing or any other suitable means.
於本實施例中,保護蓋240包含一罩體241、二卡扣結構242及一凸緣243。二卡扣結構242分別凸出於罩體241的相對兩側並例如為卡勾。二卡扣結構242分別位於二穿孔213中,且止擋件230的二第二部分232分別止擋於二卡扣結構242的一側而防止罩體241朝遠離電路板210的頂面212之拆卸方向D1移動。並且,於本實施例中,二卡扣結構242分別接觸於二第二部分232,但並不以此為限。於其他實施例中,只要二卡扣結構能分別受到二第二部分的止擋,二卡扣結構亦可分別間隔於二第二部分。In this embodiment, the
罩體241蓋合於電路板210的頂面212且罩體241與電路板210共同形成一容置空間260。電子元件220位於容置空間260中,也就是說,保護蓋240將電路板210的頂面212上的電子元件220罩住。The
於本實施例中,凸緣243鄰近於二卡扣結構242,且凸緣243沿遠離容置空間260的方向凸出於罩體241並承靠於電路板210的頂面212。此外,於本實施例中,凸緣243環繞罩體241。如此一來,凸緣243會增加將罩體241從電路板210的頂面212撬開的難度。In this embodiment, the
此外,於本實施例中,至少部分的卡扣結構242凸出於電路板210的底面211。再者,於本實施例中,罩體241、二卡扣結構242及凸緣243例如為一體成型,但並不以此為限。於其他實施例中,罩體、二卡扣結構及凸緣亦可為組合式結構。In addition, in this embodiment, at least a part of the
請參閱圖5及圖6。圖5為圖1中的電子組件從機殼拆離的側視圖之局部放大圖。圖6為圖1中的電子組件之卡扣結構未受止擋件止擋時的側剖示意圖之局部放大圖。在將螺絲250從機殼100拆離進而將電路板210拆離機殼100之後,由於至少部分的卡扣結構242凸出於電路板210的底面211,因此操作人員得以方便地扳動卡扣結構242中凸出於底面211的部分而使二卡扣結構242分別脫離二止擋件230的二第二部分232之止擋,進而沿拆卸方向D1將保護蓋240從電路板210移除。Please refer to Figure 5 and Figure 6. FIG. 5 is a partial enlarged view of the side view of the electronic assembly of FIG. 1 detached from the casing. FIG. 6 is a partial enlarged view of a schematic side cross-sectional view of the electronic component of FIG. 1 when the buckle structure is not blocked by a stopper. After the
請參閱圖4及圖6。於本實施例中,二卡扣結構242各包含一導引斜面2420。當保護蓋240沿相反於拆卸方向D1的一安裝方向D2裝設於電路板210時,二導引斜面2420分別會導引二卡扣結構242而令二止擋件230的二第二部分232分別止擋於二卡扣結構242的一側。於其他實施例中,二卡扣結構亦可無需包含導引斜面。Please refer to Figure 4 and Figure 6. In this embodiment, each of the two
於其他實施例中,卡扣結構亦可無需凸出於底面,且操作人員亦可將手指伸入電路板的穿孔或是藉由工具來扳動卡扣結構。In other embodiments, the buckle structure does not need to protrude from the bottom surface, and the operator can also insert his finger into the through hole of the circuit board or use a tool to move the buckle structure.
須注意的是,於其他實施例中,電路板亦可僅包含一個穿孔,電子組件亦可僅包含一個止擋件且保護蓋亦可僅包含一個卡扣結構。此外,在保護蓋僅包含一個卡扣結構的實施例中,凸緣亦可無需環繞罩體而僅位於罩體中鄰近於卡扣結構的一側。或者,於其他實施例中,保護蓋亦可無需包含凸緣。於再其他實施例中,電子組件亦可包含多個電子元件及多個保護蓋。It should be noted that, in other embodiments, the circuit board may only include one through hole, the electronic component may only include one stopper, and the protective cover may include only one snap structure. In addition, in the embodiment in which the protective cover includes only one snap structure, the flange may not need to surround the cover but only on one side of the cover adjacent to the snap structure. Alternatively, in other embodiments, the protective cover does not need to include a flange. In still other embodiments, the electronic component may also include a plurality of electronic components and a plurality of protective covers.
此外,於其他實施例中,電路板亦可無需包含穿孔並令止擋件的第二部分朝遠離電路板的方向延伸而止擋保護蓋的卡構結構。In addition, in other embodiments, the circuit board does not need to include a through hole and the second portion of the stopper extends in a direction away from the circuit board to stop the protective cover.
再者,於其他實施例中,保護蓋的罩體及止擋件上可分別設有第一卡扣結構及第二卡扣結構,且第一卡扣結構及第二卡扣結構為相匹配的凹凸結構。如此一來,便得以透過第一卡扣結構及第二卡扣結構之間的卡合防止罩體朝遠離電路板的頂面之方向移動。Furthermore, in other embodiments, the cover body and the stopper of the protective cover may be respectively provided with a first buckle structure and a second buckle structure, and the first buckle structure and the second buckle structure are matched. the concave-convex structure. In this way, the cover body can be prevented from moving away from the top surface of the circuit board through the engagement between the first buckle structure and the second buckle structure.
本發明的保護蓋並不限於設置在單一厚度的電路板。請參閱圖7。圖7為根據本發明另一實施例之電子組件的側剖示意圖之局部放大圖。於本實施例中,電路板210a的厚度T2例如為0.062英寸。由於保護蓋240a的卡扣結構242a係受止擋件230a止擋而非受電路板210a止擋,因此保護蓋240a能參照第一實施例中描述的方式設置於電路板210a。須注意的是,於其他實施例中,保護蓋亦可設置於厚度介於0.062英寸至0.118英寸之間的電路板或是設置於具有其他厚度尺寸的電路板。The protective cover of the present invention is not limited to a circuit board provided in a single thickness. See Figure 7. 7 is a partial enlarged view of a schematic side sectional view of an electronic component according to another embodiment of the present invention. In this embodiment, the thickness T2 of the
根據上述實施例所揭露之伺服器及電子組件,由於保護蓋的卡扣結構是受到固定於電路板的止擋件止擋而不是受電路板止擋,因此電路板的厚度並不會影響保護蓋的卡扣結構及止擋件之間的止擋關係。如此一來,便得以使保護蓋能透過卡扣結構安裝於不同厚度的電路板。According to the server and electronic components disclosed in the above-mentioned embodiments, since the buckle structure of the protective cover is stopped by the stopper fixed to the circuit board instead of the circuit board, the thickness of the circuit board does not affect the protection The latching structure of the cover and the blocking relationship between the blocking pieces. In this way, the protective cover can be installed on circuit boards with different thicknesses through the snap-fit structure.
此外,由於卡扣結構及止擋件的第二部分係位於電路板的穿孔中,因此難以從外部破壞卡扣結構及止擋件的第二部分。如此一來,保護蓋便能有效地保護電子元件。In addition, since the snap structure and the second part of the stopper are located in the through hole of the circuit board, it is difficult to damage the snap structure and the second part of the stopper from the outside. In this way, the protective cover can effectively protect the electronic components.
再者,由於止擋件的第二部份遠離第一部分的一側介於電路板的底面及頂面之間而沒有凸出於電路板的底面,因此得以減少受止擋件止擋的卡扣結構在電路板及機殼之間所佔據的空間。Furthermore, since the side of the second part of the stopper which is far away from the first part is between the bottom surface and the top surface of the circuit board and does not protrude from the bottom surface of the circuit board, the jamming caused by the stopper can be reduced. The space occupied by the buckle structure between the circuit board and the casing.
在本發明的一實施例中,本發明之電子組件係可應用於伺服器,該伺服器係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(edge computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In an embodiment of the present invention, the electronic component of the present invention can be applied to a server, and the server can be used for artificial intelligence (AI) computing, edge computing (edge computing), and can also be used as 5G Server, cloud server or car network server use.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed above by the aforementioned embodiments, it is not intended to limit the present invention. Anyone who is familiar with the similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection of the invention shall be determined by the scope of the patent application attached to this specification.
10:伺服器
100:機殼
200:電子組件
210:電路板
211:底面
212:頂面
213:穿孔
220:電子元件
230:止擋件
231:第一部分
232:第二部分
240:保護蓋
241:罩體
242:卡扣結構
2420:導引斜面
243:凸緣
250:螺絲
260:容置空間
E1、E2延伸方向
T1:厚度
D1:拆卸方向
D2:安裝方向
210a:電路板
230a:止擋件
240a:保護蓋
242a:卡扣結構
T2:厚度10: Server
100: Chassis
200: Electronic Components
210: Circuit Board
211: Underside
212: top surface
213: Perforation
220: Electronic Components
230: Stopper
231: Part One
232: Part II
240: Protective cover
241: cover body
242: Snap structure
2420: Guide Bevel
243: Flange
250: Screw
260: accommodating space
E1, E2 extension direction
T1: Thickness
D1: Disassembly direction
D2:
圖1為根據本發明第一實施例之伺服器的側視圖之局部放大圖。 圖2為圖1中的伺服器之電子組件的立體圖之局部放大圖。 圖3為圖2中的電子組件之分解圖之局部放大圖。 圖4為圖2中的電子組件之側剖示意圖之局部放大圖。 圖5為圖1中的電子組件從機殼拆離的側視圖之局部放大圖。 圖6為圖1中的電子組件之卡扣結構未受止擋件止擋時的側剖示意圖之局部放大圖。 圖7為根據本發明另一實施例之電子組件的側剖示意圖之局部放大圖。 FIG. 1 is a partial enlarged view of a side view of a server according to a first embodiment of the present invention. FIG. 2 is a partial enlarged view of a perspective view of electronic components of the server in FIG. 1 . FIG. 3 is a partial enlarged view of the exploded view of the electronic assembly of FIG. 2 . FIG. 4 is a partial enlarged view of a schematic side sectional view of the electronic component in FIG. 2 . FIG. 5 is a partial enlarged view of the side view of the electronic assembly of FIG. 1 detached from the casing. FIG. 6 is a partial enlarged view of a schematic side cross-sectional view of the electronic component of FIG. 1 when the buckle structure is not blocked by a stopper. 7 is a partial enlarged view of a schematic side sectional view of an electronic component according to another embodiment of the present invention.
200:電子組件 200: Electronic Components
210:電路板 210: Circuit Board
211:底面 211: Underside
212:頂面 212: top surface
213:穿孔 213: Perforation
220:電子元件 220: Electronic Components
230:止擋件 230: Stopper
231:第一部分 231: Part One
232:第二部分 232: Part II
240:保護蓋 240: Protective cover
241:罩體 241: cover body
242:卡扣結構 242: Snap structure
243:凸緣 243: Flange
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW109140754A TWI764386B (en) | 2020-11-20 | 2020-11-20 | Electronic assembly and server |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109140754A TWI764386B (en) | 2020-11-20 | 2020-11-20 | Electronic assembly and server |
Publications (2)
Publication Number | Publication Date |
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TWI764386B true TWI764386B (en) | 2022-05-11 |
TW202222123A TW202222123A (en) | 2022-06-01 |
Family
ID=82594052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW109140754A TWI764386B (en) | 2020-11-20 | 2020-11-20 | Electronic assembly and server |
Country Status (1)
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TW (1) | TWI764386B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2624589Y (en) * | 2003-04-30 | 2004-07-07 | 耕宇股份有限公司 | Protecting cover structure capable of protecting circuit board and wafer |
CN203217607U (en) * | 2013-04-01 | 2013-09-25 | 赵婧涵 | Buckling-type electronic label |
US20160066444A1 (en) * | 2014-08-26 | 2016-03-03 | Hon Hai Precision Industry Co., Ltd. | Anti-data theft structures and electronic devices with the same |
US9648765B1 (en) * | 2015-11-27 | 2017-05-09 | Nanning Fugui Precision Industrial Co., Ltd. | Anti-disassembly protection structure |
TW201946517A (en) * | 2018-04-27 | 2019-12-01 | 新加坡商雲網科技新加坡有限公司 | Electronic device with anti-disassembly structure |
CN110674536A (en) * | 2019-08-16 | 2020-01-10 | 华为技术有限公司 | Anti-dismounting device of security chip and electronic equipment |
-
2020
- 2020-11-20 TW TW109140754A patent/TWI764386B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2624589Y (en) * | 2003-04-30 | 2004-07-07 | 耕宇股份有限公司 | Protecting cover structure capable of protecting circuit board and wafer |
CN203217607U (en) * | 2013-04-01 | 2013-09-25 | 赵婧涵 | Buckling-type electronic label |
US20160066444A1 (en) * | 2014-08-26 | 2016-03-03 | Hon Hai Precision Industry Co., Ltd. | Anti-data theft structures and electronic devices with the same |
US9648765B1 (en) * | 2015-11-27 | 2017-05-09 | Nanning Fugui Precision Industrial Co., Ltd. | Anti-disassembly protection structure |
TW201946517A (en) * | 2018-04-27 | 2019-12-01 | 新加坡商雲網科技新加坡有限公司 | Electronic device with anti-disassembly structure |
CN110674536A (en) * | 2019-08-16 | 2020-01-10 | 华为技术有限公司 | Anti-dismounting device of security chip and electronic equipment |
Also Published As
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TW202222123A (en) | 2022-06-01 |
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