TWI749887B - Electronic assembly and server - Google Patents

Abstract

An electronic assembly and a server. Electronic assembly includes circuit board, electronic component, protecting cover, flexible component and mounting base. Circuit board includes bottom surface, top surface and through hole. Electronic component is fixed to top surface of circuit board. Protecting cover includes cover body and first engagement structure that is located on cover body. Flexible component is clamped by cover body and top surface of circuit board. Circuit board, cover body and flexible component together form accommodation space where electronic component and first engagement structure located. Mounting base includes bottom plate, elastic arm and second engagement structure. Elastic arm is connected to a side of circuit board and disposed through the through hole of circuit board so that second engagement structure is engaged with first engagement structure.

Description

Electronic components and servers

The present invention relates to an electronic component and a server, and particularly relates to an electronic component and a server including a protective cover.

Generally speaking, a Trusted Platform Module (TPM) component is provided on the motherboard in the server to encrypt the hard disk. In addition, in order to prevent the trusted platform module components from being easily removed from the motherboard by those interested, a protective cover is usually fixed to the motherboard through rivets to cover the trusted platform module components.

However, the exposed rivets are easily broken or pried with tools, and the protective cover cannot be effectively maintained in the state of covering the components of the trusted platform module. In addition, circuit boards of different thicknesses need to use rivets of different specifications, which will increase the cost of installing the protective cover on the circuit board. Furthermore, since the rivets need to pass through the motherboard to achieve the required fastening force, the rivets protrude from the side of the motherboard close to the chassis of the server and occupy the space between the motherboard and the chassis.

The present invention is to provide an electronic component and a server so that the protective cover can be installed on circuit boards of different thicknesses, while effectively protecting the electronic components and reducing the space occupied between the circuit board and the casing.

The electronic component disclosed in an embodiment of the present invention includes a circuit board, an electronic component, a protective cover, a flexible member, and an assembly base. The circuit board includes a bottom surface, a top surface and a through hole. The bottom surface and the top surface face away from each other. The perforation runs through the bottom surface and the top surface. The electronic components are fixed on the top surface of the circuit board. The protective cover includes a cover and a first buckle structure. The first buckle structure is located on the cover. The flexible piece is sandwiched between the cover body and the top surface of the circuit board. The circuit board, the cover and the flexible part jointly surround an accommodating space. The electronic component and the first buckle structure are located in the accommodating space. The assembly base includes a bottom plate, an elastic arm and a second buckle structure. The elastic arm is connected to one side of the bottom plate. The second buckle structure is connected to the side of the elastic arm away from the bottom plate. The bottom plate abuts against the bottom surface of the circuit board. The elastic arm penetrates the through hole of the circuit board so that the second buckle structure is engaged with the first buckle structure.

The server disclosed in another embodiment of the present invention includes a casing and an electronic component. The electronic component includes a circuit board, an electronic component, a protective cover, a flexible part and an assembly base. The circuit board is fixed to the casing. The circuit board includes a bottom surface, a top surface and a through hole. The bottom surface and the top surface face away from each other. The perforation runs through the bottom surface and the top surface. The electronic components are fixed on the top surface of the circuit board. The protective cover includes a cover and a first buckle structure. The first buckle structure protrudes from the cover body. The flexible piece is sandwiched between the cover body and the top surface of the circuit board. The circuit board, the cover and the flexible part jointly surround an accommodating space. The electronic component and the first buckle structure are located in the accommodating space. The assembly base includes a bottom plate, an elastic arm and a second buckle structure. The elastic arm is connected to one side of the bottom plate. The second buckle structure is connected to the side of the elastic arm away from the bottom plate. The bottom plate abuts against the bottom surface of the circuit board. The elastic arm penetrates the through hole of the circuit board so that the second buckle structure is engaged with the first buckle structure.

According to the server and electronic components disclosed in the above embodiments, since the flexible element is sandwiched between the cover of the protective cover and the top surface of the circuit board, the flexible element is compressed to a certain degree according to the thickness of the circuit board. In turn, the protective cover can be assembled on circuit boards of different thicknesses through the assembly base.

In addition, since the first buckle structure is located in the accommodating space, it is difficult to use tools to break the engagement relationship between the first buckle structure and the second buckle structure. In this way, it is possible to prevent a person from removing the protective cover from the circuit board and effectively use the protective cover to protect the electronic components.

Furthermore, since the assembly seat not only abuts against the bottom surface of the circuit board through the bottom plate, but also engages with the first engaging structure of the protective cover through the second buckle structure, the bottom plate of the assembly seat does not need to protrude from the bottom surface of the circuit board. Too much can achieve the required tightening force. In this way, the space occupied between the circuit board and the casing can be reduced.

The detailed features and advantages of the embodiments of the present invention are described in the following embodiments, and the content is sufficient to enable anyone with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement them accordingly, and is disclosed in accordance with this specification. With the content, scope of patent application and drawings, anyone with ordinary knowledge in the field can easily understand the related purposes and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

Please refer to Figure 1 to Figure 4. Fig. 1 is a partial enlarged view of a side view of a server according to a first embodiment of the present invention. FIG. 2 is a partial enlarged view of a three-dimensional view of the electronic components of the server in FIG. 1. Fig. 3 is a partial enlarged view of an exploded view of the electronic component in Fig. 2. FIG. 4 is a partial enlarged view of the side cross-sectional schematic diagram of the electronic component in FIG. 2. In this embodiment, the server 10 includes a casing 100 and an electronic component 200. In this embodiment, the electronic component 200 includes a circuit board 210, an electronic component 220, a protective cover 230, a flexible member 240, an assembly base 250, and a plurality of screws 260.

As shown in FIG. 1, in this embodiment, the circuit board 210 is fixed to the casing 100 by, for example, these screws 260. It should be noted that, in other embodiments, the circuit board can also be fixed to the casing by a single screw only, or, in other embodiments, the circuit board can also be fixed to the casing by rivets or other suitable fasteners. In this embodiment, the circuit board 210 includes a bottom surface 211, a top surface 212 and two through holes 213. The bottom surface 211 and the top surface 212 are opposite to each other. The two through holes 213 are separated from each other and penetrate the bottom surface 211 and the top surface 212. In addition, in this embodiment, the thickness T1 of the circuit board 210 is, for example, 0.062 inches.

In this embodiment, the electronic component 220 is fixed on the top surface 212 of the circuit board 210 and is, for example, a Trusted Platform Module (TPM) component.

In this embodiment, the protective cover 230 includes a cover 231 and two first buckle structures 232. The two first buckle structures 232 respectively protrude from opposite sides of the cover body 231 and are, for example, hooks. In addition, in this embodiment, the two first buckle structures 232 each include a first guiding inclined surface 2320.

In this embodiment, the flexible element 240 is sandwiched between the cover 231 and the top surface 212 of the circuit board 210 and is, for example, foam. In addition, the circuit board 210, the cover 231, and the flexible member 240 collectively surround an accommodating space 270. The electronic component 220 and the two first buckle structures 232 are located in the accommodating space 270.

In this embodiment, the protective cover 230 further includes a flange 233. The flange 233 protrudes from the cover body 231 in a direction away from the accommodating space 270 and bears against the top surface 212 of the circuit board 210 through the flexible member 240. In addition, in this embodiment, the flange 233 surrounds the cover 231. As a result, the flange 233 will increase the difficulty of prying the cover 231 from the top surface 212 of the circuit board 210.

In this embodiment, the cover 231, the first buckle structure 232, and the flange 233 are integrally formed, but it is not limited thereto. In other embodiments, the cover, the first buckle structure and the flange may also be a combined structure.

In this embodiment, the assembly base 250 includes a bottom plate 251, two elastic arms 252, two second buckle structures 253, and two operating convex plates 254. The bottom plate 251 abuts against the bottom surface 211 of the circuit board 210. The two elastic arms 252 are respectively connected to two opposite sides of the bottom plate 251 and pass through the two through holes 213 respectively. The two second buckle structures 253 are, for example, hooks and are respectively connected to a side of the two elastic arms 252 away from the bottom plate 251, and are respectively engaged with the two first buckle structures 232. In this way, the bottom plate 251 abuts against the bottom surface 211 of the circuit board 210 and the first buckle structure 232 and the second buckle structure 253 are engaged with each other, so as to prevent the cover 231 from moving away from one of the top surfaces 212 of the circuit board 210. Move in the disassembly direction D1. In this embodiment, each of the two second locking structures 253 includes a second guiding inclined surface 2530. The two operating convex plates 254 respectively protrude from the side of the two elastic arms 252 away from the two second buckle structures 253. In addition, the second operating convex plate 254 is farther away from the bottom surface 211 of the circuit board 210 than the bottom plate 251.

In this embodiment, the bottom plate 251, the elastic arm 252, the second buckle structure 253, and the operating convex plate 254 are integrally formed, but it is not limited thereto. In other embodiments, the cover, the first buckle structure and the flange may also be a combined structure.

In this embodiment, the assembly base 250 further includes two openings 255. One of the openings 255 is located at the junction of one of the elastic arms 252 and the bottom plate 251. The other opening 255 is located at the junction of the other elastic arm 252 and the bottom plate 251. In this way, the elastic arm 252 can be more easily flexed relative to the bottom plate 251. In other embodiments, the assembly base may only include one opening or not include any openings.

Please refer to Figure 5 and Figure 6. Fig. 5 is a partial enlarged view of the side view of the electronic component in Fig. 2 detached from the casing. 6 is a partial enlarged view of the side sectional view of the operating convex plate of the assembly base of the electronic component in FIG. 2 when it is pulled. After the screw 260 is detached from the casing 100 and the circuit board 210 is detached from the casing 100, since the operating convex plate 254 is farther from the bottom surface 211 of the circuit board 210 than the bottom plate 251, the operator can easily pull the operating convex plate 254 The two first buckle structures 232 and the two second buckle structures 253 are separated from each other, and then the protective cover 230 is removed from the circuit board 210 along the disassembly direction D1.

Please refer to Figure 4 and Figure 6. After the assembly base 250 is mounted on the circuit board 210 so that the two elastic arms 252 respectively pass through the two through holes 213, the protective cover 230 can be mounted on the circuit board 210 in a mounting direction D2 opposite to the disassembly direction D1, so that the second The one buckle structure 232 and the two second buckle structures 253 are engaged with each other through the guidance of the two first guiding inclined surfaces 2320 and the two second guiding inclined surfaces 2530.

It should be noted that in other embodiments, the circuit board may also include only one perforation, the protective cover may also only include a first buckle structure, and the assembly base may also only include a spring arm and a second buckle structure . In addition, in the embodiment where the protective cover only includes a first snap structure, the flange may also be located on the side of the cover adjacent to the snap structure without surrounding the cover to prevent the cover from being pried off the circuit board. . Alternatively, in other embodiments, the protective cover may not need to include a flange. In still other embodiments, the electronic component may also include a plurality of electronic components and a plurality of protective covers. In addition, in other embodiments, the electronic assembly may also include a plurality of electronic components, a plurality of protective covers, and a plurality of assembly seats.

Furthermore, in other embodiments, the assembly base does not need to include the operating convex plate and the operator can also directly pull the elastic arm. Furthermore, in other embodiments, the first buckle structure may not need to include the first guide slope and the second buckle structure may not need to include the second guide slope.

The protective cover of the present invention is not limited to a circuit board with a single thickness. Refer to Figure 7. FIG. 7 is a partial enlarged view of a schematic side sectional view of an electronic component according to a second embodiment of the present invention. In this embodiment, the thickness T2 of the circuit board 210a is, for example, 0.118 inches. The flexible member 240a is sandwiched between the cover body 231a of the protective cover 230a and the top surface 212a of the circuit board 210a. Compared with the first embodiment, the circuit board 210a in this embodiment has a thicker thickness. T2. Therefore, when the protective cover 230a is assembled to the circuit board 210a through the assembly base 250a, compared to the first embodiment, the flexible member 240a in this embodiment will be compressed to a greater extent. In other words, by sandwiching the flexible member 240a between the cover body 231a of the protective cover 230a and the top surface 212a of the circuit board 210a, the flexible member 240a will be compressed to a certain degree according to the thickness T2 of the circuit board 210a, and then The protective cover 230a can be assembled on the circuit board 210a of different thickness through the assembly base 250a. It should be noted that in other embodiments, the protective cover can also be provided on a circuit board with a thickness between 0.062 inches and 0.118 inches or a circuit board with other thickness dimensions.

The present invention is not limited to the form of the flexible member. Refer to Figure 8. Fig. 8 is a partial enlarged view of a three-dimensional view of an electronic component according to a third embodiment of the present invention. In this embodiment, the number of flexible elements 240b is multiple. The flexible member 240b protrudes from the side of the cover body 231b of the protective cover 230b close to the circuit board 210b and is integrally formed with the cover body 231b.

According to the server and electronic components disclosed in the above embodiments, since the flexible element is sandwiched between the cover of the protective cover and the top surface of the circuit board, the flexible element is compressed to a certain degree according to the thickness of the circuit board. In turn, the protective cover can be assembled on circuit boards of different thicknesses through the assembly base.

In addition, since the first buckle structure is located in the accommodating space, it is difficult to use tools to break the engagement relationship between the first buckle structure and the second buckle structure. In this way, it is possible to prevent a person from removing the protective cover from the circuit board and effectively use the protective cover to protect the electronic components.

Furthermore, since the assembly seat not only abuts against the bottom surface of the circuit board through the bottom plate, but also engages with the first engaging structure of the protective cover through the second buckle structure, the bottom plate of the assembly seat does not need to protrude from the bottom surface of the circuit board. Too much can achieve the required tightening force. In this way, the space occupied between the circuit board and the casing can be reduced.

In an embodiment of the present invention, the electronic component of the present invention can be applied to a server, and the server can be used for artificial intelligence (AI) computing, edge computing, and can also be used as 5G Used by server, cloud server or car networking server.

Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

10: Server 100: Chassis 200: Electronic components 210: circuit board 211: Bottom 212: top surface 213: Piercing 220: electronic components 230: Protective cover 231: Hood 232: The first buckle structure 2320: The first guide slope 233: Flange 240: Flexible parts 250: Assembly seat 251: Floor 252: Spring Arm 253: Second buckle structure 2530: The second guide slope 254: Operation convex plate 255: hole 260: Screw 270: accommodating space T1: thickness D1: Disassembly direction D2: Installation direction 210a: circuit board 212a: Top surface 230a: Protective cover 231a: Cover 240a: Flexible parts 250a: Assembly seat T2: thickness 210b: circuit board 230b: Protective cover 231b: cover 240b: Flexible parts

Fig. 1 is a partial enlarged view of a side view of a server according to a first embodiment of the present invention. FIG. 2 is a partial enlarged view of a three-dimensional view of the electronic components of the server in FIG. 1. Fig. 3 is a partial enlarged view of an exploded view of the electronic component in Fig. 2. FIG. 4 is a partial enlarged view of the side cross-sectional schematic diagram of the electronic component in FIG. 2. Fig. 5 is a partial enlarged view of the side view of the electronic component in Fig. 2 detached from the casing. 6 is a partial enlarged view of the side sectional view of the operating convex plate of the assembly base of the electronic component in FIG. 2 when it is pulled. FIG. 7 is a partial enlarged view of a schematic side sectional view of an electronic component according to a second embodiment of the present invention. Fig. 8 is a partial enlarged view of a three-dimensional view of an electronic component according to a third embodiment of the present invention.

200: Electronic components

210: circuit board

211: Bottom

212: top surface

213: Piercing

220: electronic components

230: Protective cover

231: Hood

232: The first buckle structure

233: Flange

240: Flexible parts

250: Assembly seat

251: Floor

252: Spring Arm

253: Second buckle structure

254: Operation convex plate

255: hole

Claims (10)

An electronic component includes: a circuit board, the circuit board includes a bottom surface, a top surface and a through hole, the bottom surface and the top surface are opposite to each other, the through hole penetrates the bottom surface and the top surface; an electronic component, the electronic The component is fixed on the top surface of the circuit board; a protective cover, the protective cover includes a cover and a first buckle structure, the first buckle structure is located in the cover; a flexible piece, the flexible piece Sandwiched between the cover and the top surface of the circuit board, the circuit board, the cover, and the flexible member collectively surround an accommodating space, and the electronic component and the first buckle structure are located in the accommodating space. And an assembly seat, the assembly seat includes a bottom plate, an elastic arm and a second buckle structure, the elastic arm is connected to one side of the bottom plate, the second buckle structure is connected to the elastic arm away from On one side of the bottom plate, the bottom plate abuts against the bottom surface of the circuit board, and the elastic arm penetrates the through hole of the circuit board so that the second buckle structure is buckled with the first buckle structure. The electronic component according to claim 1, wherein the assembling base further includes an opening, and the opening is located at the connection between the elastic arm and the bottom plate. The electronic component according to claim 1, wherein the assembly base further includes an operating convex plate, the operating convex plate protruding from the side of the elastic arm away from the second buckle structure, and the operating convex plate is smaller than the bottom plate Keep away from the bottom surface of the circuit board. The electronic component according to claim 1, wherein the flexible member is foam. The electronic component according to claim 1, wherein the number of the flexible elements is multiple, and the flexible elements protrude from a side of the cover body of the protective cover close to the circuit board and are connected to the cover body. One piece. The electronic component according to claim 1, wherein the protective cover further comprises a flange, the flange is adjacent to the first buckle structure, and the flange protrudes from the cover in a direction away from the accommodating space And bear against the top surface of the circuit board. The electronic component according to claim 1, wherein the flange surrounds the cover. The electronic component according to claim 1, wherein the first buckle structure includes a first guide slope and the second buckle structure includes a second guide slope, the first buckle structure and the second card The buckle structure is engaged with each other through the guidance of the first guiding inclined surface and the second guiding inclined surface. The electronic component according to claim 1, wherein the number of the perforation, the number of the first buckle structure, the number of the elastic arm, and the number of the second buckle structure are two, the two perforations are separated from each other, and the two The first buckle structure respectively protrudes from opposite sides of the cover body and is located in the accommodating space, the two elastic arms are respectively connected to the opposite sides of the bottom plate and respectively pass through the two through holes, and the two second clips The buckle structure is respectively connected to the side of the two elastic arms away from the bottom plate and is respectively engaged with the two first buckle structures. A server includes: a casing; and an electronic component, the electronic component includes: a circuit board, the circuit board is fixed to the casing, the circuit board includes a bottom surface, a top surface and a perforation, the bottom surface and The top surface is opposite to each other, the through hole penetrates the bottom surface and the top surface; an electronic component, the electronic component is fixed to the top surface of the circuit board; a protective cover, the protective cover includes a cover and a first card Buckle structure, the first buckle structure protrudes from the cover; a flexible piece, the flexible piece is sandwiched between the cover and the top surface of the circuit board, the circuit board, the cover and The flexible member collectively surrounds an accommodating space, the electronic component and the first buckle structure are located in the accommodating space; and an assembly seat, the assembly seat includes a bottom plate, an elastic arm and a second buckle Structure, the elastic arm is connected to one side of the bottom plate, the second snap structure is connected to the side of the elastic arm away from the bottom plate, the bottom plate abuts against the bottom surface of the circuit board, and the elastic arm passes through the circuit The perforation of the plate makes the second buckle structure engage with the first buckle structure.

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