TWI905608B - 樹脂粒子、導電性粒子、導電材料及連接構造體 - Google Patents

樹脂粒子、導電性粒子、導電材料及連接構造體

Info

Publication number
TWI905608B
TWI905608B TW112151050A TW112151050A TWI905608B TW I905608 B TWI905608 B TW I905608B TW 112151050 A TW112151050 A TW 112151050A TW 112151050 A TW112151050 A TW 112151050A TW I905608 B TWI905608 B TW I905608B
Authority
TW
Taiwan
Prior art keywords
conductive
particles
resin
aforementioned
resin particles
Prior art date
Application number
TW112151050A
Other languages
English (en)
Chinese (zh)
Other versions
TW202419583A (zh
Inventor
森田弘幸
脇屋武司
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202419583A publication Critical patent/TW202419583A/zh
Application granted granted Critical
Publication of TWI905608B publication Critical patent/TWI905608B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
TW112151050A 2019-03-19 2020-03-19 樹脂粒子、導電性粒子、導電材料及連接構造體 TWI905608B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019050770 2019-03-19
JP2019-050770 2019-03-19
JP2019-224683 2019-12-12
JP2019224683 2019-12-12

Publications (2)

Publication Number Publication Date
TW202419583A TW202419583A (zh) 2024-05-16
TWI905608B true TWI905608B (zh) 2025-11-21

Family

ID=72520160

Family Applications (3)

Application Number Title Priority Date Filing Date
TW112151050A TWI905608B (zh) 2019-03-19 2020-03-19 樹脂粒子、導電性粒子、導電材料及連接構造體
TW109109137A TW202045626A (zh) 2019-03-19 2020-03-19 樹脂粒子、導電性粒子、導電材料及連接構造體
TW112151049A TW202419582A (zh) 2019-03-19 2020-03-19 樹脂粒子、導電性粒子、導電材料及連接構造體

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW109109137A TW202045626A (zh) 2019-03-19 2020-03-19 樹脂粒子、導電性粒子、導電材料及連接構造體
TW112151049A TW202419582A (zh) 2019-03-19 2020-03-19 樹脂粒子、導電性粒子、導電材料及連接構造體

Country Status (6)

Country Link
US (1) US11884782B2 (https=)
JP (2) JP7411553B2 (https=)
KR (1) KR102871736B1 (https=)
CN (1) CN113614142A (https=)
TW (3) TWI905608B (https=)
WO (1) WO2020189697A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7411553B2 (ja) * 2019-03-19 2024-01-11 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体
KR102915932B1 (ko) * 2019-08-08 2026-01-22 세키스이가가쿠 고교가부시키가이샤 수지 입자, 도전성 입자, 도전 재료 및 접속 구조체
KR102535911B1 (ko) 2022-08-12 2023-05-30 오컴퍼니 주식회사 활성도막이 형성된 솔더 입자, 이를 포함한 접속용 필름을 제조하기 위한 혼합물 및 접속용 필름

Citations (3)

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CN104822773A (zh) * 2013-05-23 2015-08-05 积水化学工业株式会社 导电材料及连接结构体
JP2016183300A (ja) * 2015-03-26 2016-10-20 富士ゼロックス株式会社 熱硬化性粉体塗料、熱硬化性粉体塗料の製造方法、塗装品、及び塗装品の製造方法
TW201809084A (zh) * 2016-07-19 2018-03-16 大賽璐 贏創股份有限公司 聚醯胺粒子及其製造方法、樹脂組成物以及成形品

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JPH0347877A (ja) * 1990-05-31 1991-02-28 Toray Ind Inc エポキシ系球状粒子状接着剤及びその製造方法
WO2006080247A1 (ja) 2005-01-25 2006-08-03 Fujikura Kasei Co., Ltd. 導電性ペースト
JP5731110B2 (ja) * 2009-09-18 2015-06-10 積水化学工業株式会社 発泡粒子、発泡性組成物、及び、発泡成形体の製造方法
JP6040773B2 (ja) 2010-11-15 2016-12-07 日産化学工業株式会社 熱硬化樹脂軟質化粒子
JP5653737B2 (ja) 2010-12-08 2015-01-14 株式会社日本触媒 樹脂粒子およびこれを用いた絶縁化導電性粒子並びに異方性導電材料
BR112014003754A2 (pt) 2011-08-18 2017-03-07 Dow Global Technologies Llc composição de resina epóxil curável e processo
KR101380454B1 (ko) 2012-03-26 2014-04-01 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP6739988B2 (ja) * 2015-04-30 2020-08-12 積水化学工業株式会社 基材粒子、基材粒子の製造方法、導電性粒子、導電材料及び接続構造体
JP5854248B1 (ja) * 2015-05-27 2016-02-09 東洋インキＳｃホールディングス株式会社 導電性接着剤、ならびにそれを用いた導電性接着シートおよび電磁波シールドシート
CA2996410A1 (en) * 2015-08-24 2017-03-02 Cytec Industries Inc. Composite material and resin composition containing metastable particles
WO2017061502A1 (ja) * 2015-10-07 2017-04-13 ダイセル・エボニック株式会社 繊維強化樹脂及びその製造方法並びに成形品
JP2019019248A (ja) * 2017-07-19 2019-02-07 住友ベークライト株式会社 熱硬化性樹脂組成物
JP6532575B2 (ja) * 2018-06-07 2019-06-19 デクセリアルズ株式会社 異方性導電フィルム、接続方法、接合体、及び接合体の製造方法
JP7411553B2 (ja) * 2019-03-19 2024-01-11 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体
KR102915932B1 (ko) 2019-08-08 2026-01-22 세키스이가가쿠 고교가부시키가이샤 수지 입자, 도전성 입자, 도전 재료 및 접속 구조체

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104822773A (zh) * 2013-05-23 2015-08-05 积水化学工业株式会社 导电材料及连接结构体
JP2016183300A (ja) * 2015-03-26 2016-10-20 富士ゼロックス株式会社 熱硬化性粉体塗料、熱硬化性粉体塗料の製造方法、塗装品、及び塗装品の製造方法
TW201809084A (zh) * 2016-07-19 2018-03-16 大賽璐 贏創股份有限公司 聚醯胺粒子及其製造方法、樹脂組成物以及成形品

Also Published As

Publication number Publication date
JP7411553B2 (ja) 2024-01-11
US20220213279A1 (en) 2022-07-07
KR20210144695A (ko) 2021-11-30
JPWO2020189697A1 (https=) 2020-09-24
JP2024038074A (ja) 2024-03-19
TW202419583A (zh) 2024-05-16
TW202419582A (zh) 2024-05-16
KR102871736B1 (ko) 2025-10-17
CN113614142A (zh) 2021-11-05
TW202045626A (zh) 2020-12-16
WO2020189697A1 (ja) 2020-09-24
US11884782B2 (en) 2024-01-30

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