TWI904338B - 曝光裝置及配線圖案形成方法 - Google Patents

曝光裝置及配線圖案形成方法

Info

Publication number
TWI904338B
TWI904338B TW111107297A TW111107297A TWI904338B TW I904338 B TWI904338 B TW I904338B TW 111107297 A TW111107297 A TW 111107297A TW 111107297 A TW111107297 A TW 111107297A TW I904338 B TWI904338 B TW I904338B
Authority
TW
Taiwan
Prior art keywords
substrate
wiring pattern
substrates
chip
wafer
Prior art date
Application number
TW111107297A
Other languages
English (en)
Chinese (zh)
Other versions
TW202240314A (zh
Inventor
加藤正紀
水野恭志
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW202240314A publication Critical patent/TW202240314A/zh
Application granted granted Critical
Publication of TWI904338B publication Critical patent/TWI904338B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing & Machinery (AREA)
TW111107297A 2021-04-09 2022-03-01 曝光裝置及配線圖案形成方法 TWI904338B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021066770 2021-04-09
JP2021-066770 2021-04-09

Publications (2)

Publication Number Publication Date
TW202240314A TW202240314A (zh) 2022-10-16
TWI904338B true TWI904338B (zh) 2025-11-11

Family

ID=83545839

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111107297A TWI904338B (zh) 2021-04-09 2022-03-01 曝光裝置及配線圖案形成方法

Country Status (5)

Country Link
US (1) US20230400773A1 (https=)
JP (2) JP7593482B2 (https=)
CN (1) CN117120934A (https=)
TW (1) TWI904338B (https=)
WO (1) WO2022215385A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022215385A1 (ja) * 2021-04-09 2022-10-13 株式会社ニコン 露光装置及び配線パターン形成方法
JP7625950B2 (ja) * 2021-04-12 2025-02-04 株式会社ニコン 露光装置、露光方法、デバイス製造方法、及びデバイス
WO2026028795A1 (ja) * 2024-07-30 2026-02-05 株式会社ニコン 露光システム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200821765A (en) * 2006-08-31 2008-05-16 Nikon Corp Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
TW200830055A (en) * 2006-08-31 2008-07-16 Nikon Corp Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
TW200832084A (en) * 2006-08-31 2008-08-01 Nikon Corp Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
JP2012527766A (ja) * 2009-05-20 2012-11-08 マッパー・リソグラフィー・アイピー・ビー．ブイ． デュアルパス走査
JP3200372U (ja) * 2014-08-01 2015-10-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ マスクレスリソグラフィのためのデュアルステージ／デュアルチャック
JP2016071022A (ja) * 2014-09-29 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス 配線データの生成装置、生成方法、および描画システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3870182B2 (ja) * 2003-09-09 2007-01-17 キヤノン株式会社 露光装置及びデバイス製造方法
JP5226557B2 (ja) * 2008-04-22 2013-07-03 富士フイルム株式会社 レーザ露光方法、フォトレジスト層の加工方法およびパターン成形品の製造方法
JP2013058520A (ja) * 2011-09-07 2013-03-28 Dainippon Screen Mfg Co Ltd 描画装置、データ補正装置、再配線層の形成方法、および、データ補正方法
JP6063270B2 (ja) * 2013-01-25 2017-01-18 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
JP6236858B2 (ja) * 2013-05-08 2017-11-29 富士通株式会社 集積装置及びその製造方法並びに配線データ生成装置、配線データ生成方法及び配線データ生成プログラム
KR102549429B1 (ko) * 2018-05-31 2023-06-28 어플라이드 머티어리얼스, 인코포레이티드 디지털 리소그래피 시스템들 상에서의 다중-기판 프로세싱
US10678150B1 (en) * 2018-11-15 2020-06-09 Applied Materials, Inc. Dynamic generation of layout adaptive packaging
WO2022215385A1 (ja) * 2021-04-09 2022-10-13 株式会社ニコン 露光装置及び配線パターン形成方法
JP7625950B2 (ja) * 2021-04-12 2025-02-04 株式会社ニコン 露光装置、露光方法、デバイス製造方法、及びデバイス

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200821765A (en) * 2006-08-31 2008-05-16 Nikon Corp Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
TW200830055A (en) * 2006-08-31 2008-07-16 Nikon Corp Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
TW200832084A (en) * 2006-08-31 2008-08-01 Nikon Corp Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
JP2012527766A (ja) * 2009-05-20 2012-11-08 マッパー・リソグラフィー・アイピー・ビー．ブイ． デュアルパス走査
JP3200372U (ja) * 2014-08-01 2015-10-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ マスクレスリソグラフィのためのデュアルステージ／デュアルチャック
JP2016071022A (ja) * 2014-09-29 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス 配線データの生成装置、生成方法、および描画システム

Also Published As

Publication number Publication date
JP2025013628A (ja) 2025-01-24
WO2022215385A1 (ja) 2022-10-13
CN117120934A (zh) 2023-11-24
JP7593482B2 (ja) 2024-12-03
KR20230148231A (ko) 2023-10-24
US20230400773A1 (en) 2023-12-14
JPWO2022215385A1 (https=) 2022-10-13
TW202240314A (zh) 2022-10-16

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