JP7593482B2 - 露光装置及び配線パターン形成方法 - Google Patents

露光装置及び配線パターン形成方法 Download PDF

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Publication number
JP7593482B2
JP7593482B2 JP2023512859A JP2023512859A JP7593482B2 JP 7593482 B2 JP7593482 B2 JP 7593482B2 JP 2023512859 A JP2023512859 A JP 2023512859A JP 2023512859 A JP2023512859 A JP 2023512859A JP 7593482 B2 JP7593482 B2 JP 7593482B2
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Japan
Prior art keywords
chip
wiring pattern
substrate
substrates
wafer
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JP2023512859A
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English (en)
Japanese (ja)
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JPWO2022215385A1 (https=
JPWO2022215385A5 (https=
Inventor
正紀 加藤
恭志 水野
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Nikon Corp
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Nikon Corp
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Publication of JPWO2022215385A5 publication Critical patent/JPWO2022215385A5/ja
Priority to JP2024196109A priority Critical patent/JP2025013628A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing & Machinery (AREA)
JP2023512859A 2021-04-09 2022-02-28 露光装置及び配線パターン形成方法 Active JP7593482B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024196109A JP2025013628A (ja) 2021-04-09 2024-11-08 配線パターン形成方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021066770 2021-04-09
JP2021066770 2021-04-09
PCT/JP2022/008212 WO2022215385A1 (ja) 2021-04-09 2022-02-28 露光装置及び配線パターン形成方法

Related Child Applications (1)

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JP2024196109A Division JP2025013628A (ja) 2021-04-09 2024-11-08 配線パターン形成方法

Publications (3)

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JPWO2022215385A1 JPWO2022215385A1 (https=) 2022-10-13
JPWO2022215385A5 JPWO2022215385A5 (https=) 2024-01-19
JP7593482B2 true JP7593482B2 (ja) 2024-12-03

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JP2023512859A Active JP7593482B2 (ja) 2021-04-09 2022-02-28 露光装置及び配線パターン形成方法
JP2024196109A Pending JP2025013628A (ja) 2021-04-09 2024-11-08 配線パターン形成方法

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US (1) US20230400773A1 (https=)
JP (2) JP7593482B2 (https=)
CN (1) CN117120934A (https=)
TW (1) TWI904338B (https=)
WO (1) WO2022215385A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022215385A1 (ja) * 2021-04-09 2022-10-13 株式会社ニコン 露光装置及び配線パターン形成方法
JP7625950B2 (ja) * 2021-04-12 2025-02-04 株式会社ニコン 露光装置、露光方法、デバイス製造方法、及びデバイス
WO2026028795A1 (ja) * 2024-07-30 2026-02-05 株式会社ニコン 露光システム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012527766A (ja) 2009-05-20 2012-11-08 マッパー・リソグラフィー・アイピー・ビー．ブイ． デュアルパス走査
JP3200372U (ja) 2014-08-01 2015-10-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ マスクレスリソグラフィのためのデュアルステージ／デュアルチャック
JP2016071022A (ja) 2014-09-29 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス 配線データの生成装置、生成方法、および描画システム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3870182B2 (ja) * 2003-09-09 2007-01-17 キヤノン株式会社 露光装置及びデバイス製造方法
EP3291010A1 (en) * 2006-08-31 2018-03-07 Nikon Corporation Exposure apparatus and method, and device manufacturing method
TWI416269B (zh) * 2006-08-31 2013-11-21 尼康股份有限公司 Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, and component manufacturing method
KR101669785B1 (ko) * 2006-08-31 2016-10-27 가부시키가이샤 니콘 이동체 구동 시스템 및 이동체 구동 방법, 패턴 형성 장치 및 방법, 노광 장치 및 방법, 디바이스 제조 방법, 그리고 결정 방법
JP5226557B2 (ja) * 2008-04-22 2013-07-03 富士フイルム株式会社 レーザ露光方法、フォトレジスト層の加工方法およびパターン成形品の製造方法
JP2013058520A (ja) * 2011-09-07 2013-03-28 Dainippon Screen Mfg Co Ltd 描画装置、データ補正装置、再配線層の形成方法、および、データ補正方法
JP6063270B2 (ja) * 2013-01-25 2017-01-18 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
JP6236858B2 (ja) * 2013-05-08 2017-11-29 富士通株式会社 集積装置及びその製造方法並びに配線データ生成装置、配線データ生成方法及び配線データ生成プログラム
KR102549429B1 (ko) * 2018-05-31 2023-06-28 어플라이드 머티어리얼스, 인코포레이티드 디지털 리소그래피 시스템들 상에서의 다중-기판 프로세싱
US10678150B1 (en) * 2018-11-15 2020-06-09 Applied Materials, Inc. Dynamic generation of layout adaptive packaging
WO2022215385A1 (ja) * 2021-04-09 2022-10-13 株式会社ニコン 露光装置及び配線パターン形成方法
JP7625950B2 (ja) * 2021-04-12 2025-02-04 株式会社ニコン 露光装置、露光方法、デバイス製造方法、及びデバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012527766A (ja) 2009-05-20 2012-11-08 マッパー・リソグラフィー・アイピー・ビー．ブイ． デュアルパス走査
JP3200372U (ja) 2014-08-01 2015-10-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ マスクレスリソグラフィのためのデュアルステージ／デュアルチャック
JP2016071022A (ja) 2014-09-29 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス 配線データの生成装置、生成方法、および描画システム

Also Published As

Publication number Publication date
TWI904338B (zh) 2025-11-11
JP2025013628A (ja) 2025-01-24
WO2022215385A1 (ja) 2022-10-13
CN117120934A (zh) 2023-11-24
KR20230148231A (ko) 2023-10-24
US20230400773A1 (en) 2023-12-14
JPWO2022215385A1 (https=) 2022-10-13
TW202240314A (zh) 2022-10-16

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