TWI901847B - 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置、以及環化樹脂的前驅物 - Google Patents

樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置、以及環化樹脂的前驅物

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Publication number
TWI901847B
TWI901847B TW111104838A TW111104838A TWI901847B TW I901847 B TWI901847 B TW I901847B TW 111104838 A TW111104838 A TW 111104838A TW 111104838 A TW111104838 A TW 111104838A TW I901847 B TWI901847 B TW I901847B
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Taiwan
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compounds
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TW111104838A
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Chinese (zh)
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TW202244129A (zh
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浅川大輔
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日商富士軟片股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
TW111104838A 2021-02-12 2022-02-10 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置、以及環化樹脂的前驅物 TWI901847B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021021058 2021-02-12
JP2021-021058 2021-02-12

Publications (2)

Publication Number Publication Date
TW202244129A TW202244129A (zh) 2022-11-16
TWI901847B true TWI901847B (zh) 2025-10-21

Family

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Family Applications (1)

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TW111104838A TWI901847B (zh) 2021-02-12 2022-02-10 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置、以及環化樹脂的前驅物

Country Status (5)

Country Link
JP (1) JP7828903B2 (https=)
KR (1) KR102938791B1 (https=)
CN (1) CN116888187B (https=)
TW (1) TWI901847B (https=)
WO (1) WO2022172962A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121925443A (zh) 2023-09-26 2026-04-24 迈克沃有限公司 薄膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201714934A (zh) * 2015-08-28 2017-05-01 富士軟片股份有限公司 硬化膜的製造方法、再配線層用層間絕緣膜的製造方法及半導體元件的製造方法
JP2019206689A (ja) * 2018-05-29 2019-12-05 旭化成株式会社 樹脂組成物、及び硬化膜の製造方法
TW202028304A (zh) * 2018-10-19 2020-08-01 日商富士軟片股份有限公司 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04291235A (ja) * 1991-03-19 1992-10-15 Fuji Photo Film Co Ltd 液晶表示素子
JP4154954B2 (ja) * 2002-08-09 2008-09-24 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物並びにそれを用いたレリーフパターンおよび耐熱性塗膜の製造方法およびそれらを有する電子部品
JP4595417B2 (ja) * 2004-07-16 2010-12-08 チッソ株式会社 フェニレンジアミン、それを用いて形成される配向膜、および該配向膜を含む液晶表示素子
JP2007056196A (ja) 2005-08-26 2007-03-08 Tokyo Institute Of Technology ポリイミド前駆体組成物、ポリイミド膜の製造方法及び半導体装置
JP5747431B2 (ja) 2008-03-31 2015-07-15 大日本印刷株式会社 感光性樹脂組成物、当該感光性樹脂組成物からなるパターン形成用材料、パターン形成方法、及び当該感光性樹脂組成物を用いた物品、並びに塩基発生剤
JP6136486B2 (ja) 2013-04-08 2017-05-31 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物及びそれを用いたパターン形成方法
JP7252020B2 (ja) 2018-04-16 2023-04-04 旭化成株式会社 ネガ型感光性樹脂組成物及び硬化レリーフパターンの製造方法
EP3859447B1 (en) * 2018-09-28 2025-11-19 FUJIFILM Corporation Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201714934A (zh) * 2015-08-28 2017-05-01 富士軟片股份有限公司 硬化膜的製造方法、再配線層用層間絕緣膜的製造方法及半導體元件的製造方法
JP2019206689A (ja) * 2018-05-29 2019-12-05 旭化成株式会社 樹脂組成物、及び硬化膜の製造方法
TW202028304A (zh) * 2018-10-19 2020-08-01 日商富士軟片股份有限公司 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件

Also Published As

Publication number Publication date
TW202244129A (zh) 2022-11-16
CN116888187A (zh) 2023-10-13
CN116888187B (zh) 2025-12-02
JPWO2022172962A1 (https=) 2022-08-18
KR102938791B1 (ko) 2026-03-16
WO2022172962A1 (ja) 2022-08-18
KR20230129043A (ko) 2023-09-05
JP7828903B2 (ja) 2026-03-12

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