CN116888187B - 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及环化树脂的前驱体 - Google Patents

树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及环化树脂的前驱体

Info

Publication number
CN116888187B
CN116888187B CN202280014418.0A CN202280014418A CN116888187B CN 116888187 B CN116888187 B CN 116888187B CN 202280014418 A CN202280014418 A CN 202280014418A CN 116888187 B CN116888187 B CN 116888187B
Authority
CN
China
Prior art keywords
group
formula
carbon atoms
organic group
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202280014418.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN116888187A (zh
Inventor
浅川大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN116888187A publication Critical patent/CN116888187A/zh
Application granted granted Critical
Publication of CN116888187B publication Critical patent/CN116888187B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
CN202280014418.0A 2021-02-12 2022-02-09 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及环化树脂的前驱体 Active CN116888187B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021021058 2021-02-12
JP2021-021058 2021-02-12
PCT/JP2022/005156 WO2022172962A1 (ja) 2021-02-12 2022-02-09 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、環化樹脂の前駆体

Publications (2)

Publication Number Publication Date
CN116888187A CN116888187A (zh) 2023-10-13
CN116888187B true CN116888187B (zh) 2025-12-02

Family

ID=82837621

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280014418.0A Active CN116888187B (zh) 2021-02-12 2022-02-09 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及环化树脂的前驱体

Country Status (5)

Country Link
JP (1) JP7828903B2 (https=)
KR (1) KR102938791B1 (https=)
CN (1) CN116888187B (https=)
TW (1) TWI901847B (https=)
WO (1) WO2022172962A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121925443A (zh) 2023-09-26 2026-04-24 迈克沃有限公司 薄膜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004077552A (ja) * 2002-08-09 2004-03-11 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物並びにそれを用いたレリーフパターンおよび耐熱性塗膜の製造方法およびそれらを有する電子部品
TW202028304A (zh) * 2018-10-19 2020-08-01 日商富士軟片股份有限公司 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04291235A (ja) * 1991-03-19 1992-10-15 Fuji Photo Film Co Ltd 液晶表示素子
JP4595417B2 (ja) * 2004-07-16 2010-12-08 チッソ株式会社 フェニレンジアミン、それを用いて形成される配向膜、および該配向膜を含む液晶表示素子
JP2007056196A (ja) 2005-08-26 2007-03-08 Tokyo Institute Of Technology ポリイミド前駆体組成物、ポリイミド膜の製造方法及び半導体装置
JP5747431B2 (ja) 2008-03-31 2015-07-15 大日本印刷株式会社 感光性樹脂組成物、当該感光性樹脂組成物からなるパターン形成用材料、パターン形成方法、及び当該感光性樹脂組成物を用いた物品、並びに塩基発生剤
JP6136486B2 (ja) 2013-04-08 2017-05-31 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物及びそれを用いたパターン形成方法
WO2017038598A1 (ja) 2015-08-28 2017-03-09 富士フイルム株式会社 硬化膜の製造方法、再配線層用層間絶縁膜の製造方法、および、半導体デバイスの製造方法
JP7252020B2 (ja) 2018-04-16 2023-04-04 旭化成株式会社 ネガ型感光性樹脂組成物及び硬化レリーフパターンの製造方法
JP7351637B2 (ja) 2018-05-29 2023-09-27 旭化成株式会社 樹脂組成物、及び硬化膜の製造方法
EP3859447B1 (en) * 2018-09-28 2025-11-19 FUJIFILM Corporation Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004077552A (ja) * 2002-08-09 2004-03-11 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物並びにそれを用いたレリーフパターンおよび耐熱性塗膜の製造方法およびそれらを有する電子部品
TW202028304A (zh) * 2018-10-19 2020-08-01 日商富士軟片股份有限公司 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件

Also Published As

Publication number Publication date
TW202244129A (zh) 2022-11-16
CN116888187A (zh) 2023-10-13
JPWO2022172962A1 (https=) 2022-08-18
KR102938791B1 (ko) 2026-03-16
WO2022172962A1 (ja) 2022-08-18
KR20230129043A (ko) 2023-09-05
JP7828903B2 (ja) 2026-03-12
TWI901847B (zh) 2025-10-21

Similar Documents

Publication Publication Date Title
CN116648313B (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件
JP7780274B2 (ja) 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス、並びに、化合物
CN116685622A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件
KR102627683B1 (ko) 경화물의 제조 방법, 적층체의 제조 방법, 및, 반도체 디바이스의 제조 방법, 및, 처리액
CN117157344A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及聚酰亚胺前驱体及其制造方法
CN117881745A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件、以及化合物
WO2022224838A1 (ja) 樹脂組成物、硬化物、積層体、硬化物の製造方法、半導体デバイス、及び、樹脂
WO2022070730A1 (ja) 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法
CN117120512A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及聚酰亚胺前驱体
CN117120550A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件
CN117083346A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件
CN116724071A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件
KR102877409B1 (ko) 경화물의 제조 방법, 적층체의 제조 방법, 및, 반도체 디바이스의 제조 방법, 및, 처리액, 및, 수지 조성물
CN117836715A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件、以及碱产生剂
CN117940516A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件
TW202305040A (zh) 硬化物的製造方法、積層體的製造方法、半導體裝置的製造方法、樹脂組成物、硬化物、積層體及半導體裝置
CN116888187B (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及环化树脂的前驱体
KR20230113584A (ko) 수지 조성물, 경화물, 적층체, 경화물의 제조 방법,및, 반도체 디바이스, 및, 화합물
TW202212424A (zh) 複合圖案的製造方法、樹脂組成物、積層體的製造方法及半導體裝置的製造方法
CN116888217B (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件以及碱产生剂
CN117120513A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及碱产生剂
CN117642442A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件
CN117295794A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及化合物
CN117730280A (zh) 固化物的制造方法、层叠体的制造方法、半导体器件的制造方法、树脂组合物、固化物、层叠体及半导体器件
CN116113884A (zh) 固化物的制造方法、层叠体的制造方法及电子器件的制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant