TWI901693B - 積層陶瓷電容器中之擴散區域形成方法、Ｎｉ糊膏及積層陶瓷電容器 - Google Patents

積層陶瓷電容器中之擴散區域形成方法、Ｎｉ糊膏及積層陶瓷電容器

Info

Publication number
TWI901693B
TWI901693B TW110120522A TW110120522A TWI901693B TW I901693 B TWI901693 B TW I901693B TW 110120522 A TW110120522 A TW 110120522A TW 110120522 A TW110120522 A TW 110120522A TW I901693 B TWI901693 B TW I901693B
Authority
TW
Taiwan
Prior art keywords
ceramic
parts
paste
additive
weight
Prior art date
Application number
TW110120522A
Other languages
English (en)
Chinese (zh)
Other versions
TW202204528A (zh
Inventor
岡村寛志
Original Assignee
日商昭榮化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭榮化學工業股份有限公司 filed Critical 日商昭榮化學工業股份有限公司
Publication of TW202204528A publication Critical patent/TW202204528A/zh
Application granted granted Critical
Publication of TWI901693B publication Critical patent/TWI901693B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
TW110120522A 2020-06-18 2021-06-07 積層陶瓷電容器中之擴散區域形成方法、Ｎｉ糊膏及積層陶瓷電容器 TWI901693B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-105589 2020-06-18
JP2020105589 2020-06-18

Publications (2)

Publication Number Publication Date
TW202204528A TW202204528A (zh) 2022-02-01
TWI901693B true TWI901693B (zh) 2025-10-21

Family

ID=79267847

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110120522A TWI901693B (zh) 2020-06-18 2021-06-07 積層陶瓷電容器中之擴散區域形成方法、Ｎｉ糊膏及積層陶瓷電容器

Country Status (3)

Country Link
JP (1) JPWO2021256253A1 (https=)
TW (1) TWI901693B (https=)
WO (1) WO2021256253A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023150117A (ja) * 2022-03-31 2023-10-16 太陽誘電株式会社 セラミック電子部品およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186339A (ja) * 2002-12-02 2004-07-02 Shoei Chem Ind Co 積層電子部品の内部電極用導体ペーストおよびそれを用いた積層電子部品
JP2006196421A (ja) * 2005-01-17 2006-07-27 Noritake Co Ltd 被覆導体粉末および導体ペースト
CN1993785A (zh) * 2004-05-31 2007-07-04 Tdk株式会社 电子部件、叠层陶瓷电容器及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4432604B2 (ja) * 2004-04-30 2010-03-17 昭栄化学工業株式会社 導電性ペースト
EP3326178B1 (en) * 2015-07-17 2019-05-22 TDK Electronics AG Dielectric composition, dielectric element, electronic component and laminated electronic component
JP7338634B2 (ja) * 2018-10-31 2023-09-05 昭栄化学工業株式会社 Ｎｉペーストおよび積層セラミックコンデンサ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186339A (ja) * 2002-12-02 2004-07-02 Shoei Chem Ind Co 積層電子部品の内部電極用導体ペーストおよびそれを用いた積層電子部品
CN1993785A (zh) * 2004-05-31 2007-07-04 Tdk株式会社 电子部件、叠层陶瓷电容器及其制备方法
JP2006196421A (ja) * 2005-01-17 2006-07-27 Noritake Co Ltd 被覆導体粉末および導体ペースト

Also Published As

Publication number Publication date
TW202204528A (zh) 2022-02-01
JPWO2021256253A1 (https=) 2021-12-23
WO2021256253A1 (ja) 2021-12-23

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