TWI896742B - 感光性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件 - Google Patents

感光性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件

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Publication number
TWI896742B
TWI896742B TW110131510A TW110131510A TWI896742B TW I896742 B TWI896742 B TW I896742B TW 110131510 A TW110131510 A TW 110131510A TW 110131510 A TW110131510 A TW 110131510A TW I896742 B TWI896742 B TW I896742B
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TW
Taiwan
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group
formula
carbon atoms
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groups
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TW110131510A
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English (en)
Chinese (zh)
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TW202219637A (zh
Inventor
野崎敦靖
Original Assignee
日商富士軟片股份有限公司
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Publication of TW202219637A publication Critical patent/TW202219637A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laminated Bodies (AREA)
TW110131510A 2020-08-28 2021-08-25 感光性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件 TWI896742B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020143993 2020-08-28
JP2020-143993 2020-08-28

Publications (2)

Publication Number Publication Date
TW202219637A TW202219637A (zh) 2022-05-16
TWI896742B true TWI896742B (zh) 2025-09-11

Family

ID=80353283

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110131510A TWI896742B (zh) 2020-08-28 2021-08-25 感光性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件

Country Status (4)

Country Link
JP (3) JP7629930B2 (https=)
KR (1) KR102796438B1 (https=)
TW (1) TWI896742B (https=)
WO (1) WO2022045120A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023233895A1 (ja) * 2022-06-02 2023-12-07 東京応化工業株式会社 ポリイミド樹脂前駆体
CN116731063A (zh) * 2022-06-14 2023-09-12 北京鼎材科技有限公司 一种硅烷偶联剂及其应用、包含其的光敏树脂组合物
CN116375591B (zh) * 2023-06-05 2023-10-03 中节能万润股份有限公司 一种含双键的聚酰亚胺二胺单体的制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001092133A (ja) * 1999-09-24 2001-04-06 Hitachi Chemical Dupont Microsystems Ltd 感光性組成物、感光材料、レリーフパターンの製造法及びポリイミドパターンの製造法
CN1211418C (zh) * 1997-09-25 2005-07-20 罗列克股份公司 可光交联的聚酰亚胺
TW201430058A (zh) * 2012-12-21 2014-08-01 Hitachi Chem Dupont Microsys 聚醯亞胺前驅體組成物、硬化膜及其製造方法、以及圖案硬化膜及其製造方法
TW202016654A (zh) * 2016-04-14 2020-05-01 日商旭化成股份有限公司 感光性樹脂組合物及硬化浮凸圖案之製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5041134B2 (ja) 2006-01-30 2012-10-03 Ｊｓｒ株式会社 液晶の配向剤、配向膜および液晶表示素子
JP6712607B2 (ja) * 2016-01-29 2020-06-24 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法、および半導体デバイス
TWI767436B (zh) * 2016-02-26 2022-06-11 日商富士軟片股份有限公司 積層體的製造方法、半導體元件的製造方法及再配線層的製造方法
JP2018180227A (ja) 2017-04-11 2018-11-15 Jnc株式会社 光配向法に用いる光配向用液晶配向剤、およびそれを用いた光配向膜、液晶表示素子
KR102279447B1 (ko) * 2017-06-06 2021-07-20 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 및 반도체 디바이스
JP7062899B2 (ja) * 2017-09-15 2022-05-09 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1211418C (zh) * 1997-09-25 2005-07-20 罗列克股份公司 可光交联的聚酰亚胺
JP2001092133A (ja) * 1999-09-24 2001-04-06 Hitachi Chemical Dupont Microsystems Ltd 感光性組成物、感光材料、レリーフパターンの製造法及びポリイミドパターンの製造法
TW201430058A (zh) * 2012-12-21 2014-08-01 Hitachi Chem Dupont Microsys 聚醯亞胺前驅體組成物、硬化膜及其製造方法、以及圖案硬化膜及其製造方法
TW202016654A (zh) * 2016-04-14 2020-05-01 日商旭化成股份有限公司 感光性樹脂組合物及硬化浮凸圖案之製造方法

Also Published As

Publication number Publication date
WO2022045120A1 (ja) 2022-03-03
JP2025020376A (ja) 2025-02-12
JP7629930B2 (ja) 2025-02-14
TW202219637A (zh) 2022-05-16
KR102796438B1 (ko) 2025-04-16
JP2026065026A (ja) 2026-04-14
JPWO2022045120A1 (https=) 2022-03-03
JP7799007B2 (ja) 2026-01-14
KR20230044484A (ko) 2023-04-04

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