TWI889669B - 接著劑組成物、膜狀接著劑、接著片及半導體裝置的製造方法 - Google Patents

接著劑組成物、膜狀接著劑、接著片及半導體裝置的製造方法

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Publication number
TWI889669B
TWI889669B TW109107632A TW109107632A TWI889669B TW I889669 B TWI889669 B TW I889669B TW 109107632 A TW109107632 A TW 109107632A TW 109107632 A TW109107632 A TW 109107632A TW I889669 B TWI889669 B TW I889669B
Authority
TW
Taiwan
Prior art keywords
adhesive
film
mass
adhesive composition
semiconductor element
Prior art date
Application number
TW109107632A
Other languages
English (en)
Chinese (zh)
Other versions
TW202045676A (zh
Inventor
橋本慎太郎
矢羽田達也
谷口紘平
Original Assignee
日商力森諾科股份有限公司
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Publication of TW202045676A publication Critical patent/TW202045676A/zh
Application granted granted Critical
Publication of TWI889669B publication Critical patent/TWI889669B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
TW109107632A 2019-03-11 2020-03-09 接著劑組成物、膜狀接著劑、接著片及半導體裝置的製造方法 TWI889669B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/009762 WO2020183581A1 (ja) 2019-03-11 2019-03-11 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
WOPCT/JP2019/009762 2019-03-11

Publications (2)

Publication Number Publication Date
TW202045676A TW202045676A (zh) 2020-12-16
TWI889669B true TWI889669B (zh) 2025-07-11

Family

ID=72427342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109107632A TWI889669B (zh) 2019-03-11 2020-03-09 接著劑組成物、膜狀接著劑、接著片及半導體裝置的製造方法

Country Status (6)

Country Link
JP (3) JP7513015B2 (https=)
KR (1) KR102857784B1 (https=)
CN (1) CN113544229A (https=)
SG (1) SG11202109506YA (https=)
TW (1) TWI889669B (https=)
WO (2) WO2020183581A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022186285A1 (ja) * 2021-03-05 2022-09-09 昭和電工マテリアルズ株式会社 フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
WO2023047594A1 (ja) * 2021-09-27 2023-03-30 昭和電工マテリアルズ株式会社 フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
JP7356534B1 (ja) * 2022-03-30 2023-10-04 株式会社レゾナック 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び半導体装置を製造する方法

Citations (2)

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JP2010265359A (ja) * 2009-05-13 2010-11-25 Hitachi Chem Co Ltd 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
TW201906956A (zh) * 2017-06-21 2019-02-16 日商日立化成股份有限公司 半導體用接著劑、半導體裝置的製造方法及半導體裝置

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JP2002037864A (ja) * 2000-07-31 2002-02-06 Sumitomo Bakelite Co Ltd 半導体素子用樹脂ペースト及び半導体装置
JP2004018718A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤組成物
JP2004059859A (ja) * 2002-07-31 2004-02-26 Mitsui Chemicals Inc フィルム状接着剤及びその接着工法並びに該フィルム状接着剤を用いた半導体装置
EP1693395A4 (en) * 2003-12-08 2007-04-25 Sekisui Chemical Co Ltd HOT-RESISTANT RESIN COMPOSITION, RESIN SURFACES AND RESIN SURFACES FOR ISOLATED SUBSTRATE
KR20060000360A (ko) * 2004-06-28 2006-01-06 삼성전자주식회사 화상 형성 장치의 데이터 처리 방법 및 장치
JP4668001B2 (ja) 2005-08-18 2011-04-13 リンテック株式会社 ダイシング・ダイボンド兼用シートおよびこれを用いた半導体装置の製造方法
KR101082448B1 (ko) * 2007-04-30 2011-11-11 주식회사 엘지화학 접착 수지 조성물 및 이를 이용한 다이싱 다이 본딩 필름
JP2010118554A (ja) * 2008-11-13 2010-05-27 Nec Electronics Corp 半導体装置およびその製造方法
JP5754072B2 (ja) * 2010-02-25 2015-07-22 日立化成株式会社 粘接着剤組成物、回路部材接続用粘接着剤シート及び半導体装置の製造方法
TWI602873B (zh) * 2012-06-11 2017-10-21 味之素股份有限公司 Resin composition
JP5894035B2 (ja) * 2012-08-15 2016-03-23 日立化成株式会社 半導体装置の製造方法
JP6135202B2 (ja) * 2013-03-08 2017-05-31 日立化成株式会社 半導体装置及び半導体装置の製造方法
TWI653312B (zh) * 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
KR20160000360A (ko) * 2014-06-24 2016-01-04 도레이첨단소재 주식회사 내마이그레이션성 접착제 조성물 및 이를 이용한 커버레이 필름과 양면 접착테이프
JP6768188B2 (ja) * 2016-01-06 2020-10-14 日立化成株式会社 接着フィルム用接着剤組成物及びその製造方法
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Publication number Priority date Publication date Assignee Title
JP2010265359A (ja) * 2009-05-13 2010-11-25 Hitachi Chem Co Ltd 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
TW201906956A (zh) * 2017-06-21 2019-02-16 日商日立化成股份有限公司 半導體用接著劑、半導體裝置的製造方法及半導體裝置

Also Published As

Publication number Publication date
WO2020183581A1 (ja) 2020-09-17
KR102857784B1 (ko) 2025-09-10
JP2024091963A (ja) 2024-07-05
SG11202109506YA (en) 2021-09-29
JP7513015B2 (ja) 2024-07-09
JP2026034733A (ja) 2026-02-27
JPWO2020184490A1 (https=) 2020-09-17
CN113544229A (zh) 2021-10-22
KR20210137041A (ko) 2021-11-17
TW202045676A (zh) 2020-12-16
WO2020184490A1 (ja) 2020-09-17

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