TWI888812B - 感光性樹脂組成物、及感光性元件 - Google Patents

感光性樹脂組成物、及感光性元件 Download PDF

Info

Publication number
TWI888812B
TWI888812B TW112111954A TW112111954A TWI888812B TW I888812 B TWI888812 B TW I888812B TW 112111954 A TW112111954 A TW 112111954A TW 112111954 A TW112111954 A TW 112111954A TW I888812 B TWI888812 B TW I888812B
Authority
TW
Taiwan
Prior art keywords
component
photosensitive resin
compound
long
resin composition
Prior art date
Application number
TW112111954A
Other languages
English (en)
Chinese (zh)
Other versions
TW202343139A (zh
Inventor
古谷創
Original Assignee
日商旭化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW202343139A publication Critical patent/TW202343139A/zh
Application granted granted Critical
Publication of TWI888812B publication Critical patent/TWI888812B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C08K5/3447—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Graft Or Block Polymers (AREA)
  • Laminated Bodies (AREA)
TW112111954A 2022-03-31 2023-03-29 感光性樹脂組成物、及感光性元件 TWI888812B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-061300 2022-03-31
JP2022061300 2022-03-31

Publications (2)

Publication Number Publication Date
TW202343139A TW202343139A (zh) 2023-11-01
TWI888812B true TWI888812B (zh) 2025-07-01

Family

ID=88292668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111954A TWI888812B (zh) 2022-03-31 2023-03-29 感光性樹脂組成物、及感光性元件

Country Status (3)

Country Link
JP (2) JP7620043B2 (https=)
KR (1) KR102882784B1 (https=)
TW (1) TWI888812B (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201843527A (zh) * 2015-09-11 2018-12-16 日商旭化成股份有限公司 感光性樹脂組合物、感光性元件、抗蝕圖案之形成方法、及配線板之製造方法
TW202020563A (zh) * 2018-09-21 2020-06-01 日商旭化成股份有限公司 感光性樹脂組合物
TW202134289A (zh) * 2020-03-02 2021-09-16 日商富士軟片股份有限公司 感光性轉印材料及電路配線的製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009180795A (ja) 2008-01-29 2009-08-13 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法及びプリント配線板の製造方法
JP5948543B2 (ja) 2012-05-29 2016-07-06 旭化成株式会社 感光性樹脂組成物
KR20150118582A (ko) 2013-02-12 2015-10-22 도레이 카부시키가이샤 감광성 수지 조성물, 그것을 열경화시켜서 이루어지는 보호막 또는 절연막, 그것을 사용한 터치 패널 및 그 제조 방법
JP6207654B2 (ja) 2016-04-07 2017-10-04 旭化成株式会社 感光性樹脂組成物
WO2019173967A1 (en) * 2018-03-13 2019-09-19 Hitachi Chemical Company, Ltd. Photosensitizer, photosensitive resin composition, photosensitive element, and method of producing wiring board
WO2020045587A1 (ja) * 2018-08-31 2020-03-05 富士フイルム株式会社 平版印刷版原版、平版印刷版の作製方法、平版印刷方法、及び、硬化性組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201843527A (zh) * 2015-09-11 2018-12-16 日商旭化成股份有限公司 感光性樹脂組合物、感光性元件、抗蝕圖案之形成方法、及配線板之製造方法
TW202020563A (zh) * 2018-09-21 2020-06-01 日商旭化成股份有限公司 感光性樹脂組合物
TW202134289A (zh) * 2020-03-02 2021-09-16 日商富士軟片股份有限公司 感光性轉印材料及電路配線的製造方法

Also Published As

Publication number Publication date
KR102882784B1 (ko) 2025-11-06
JP2025039766A (ja) 2025-03-21
JP2023153082A (ja) 2023-10-17
TW202540777A (zh) 2025-10-16
TW202343139A (zh) 2023-11-01
JP7620043B2 (ja) 2025-01-22
KR20230141587A (ko) 2023-10-10

Similar Documents

Publication Publication Date Title
TWI883599B (zh) 感光性樹脂組成物、感光性樹脂積層體、及光阻圖案之形成方法
TWI888812B (zh) 感光性樹脂組成物、及感光性元件
TWI919194B (zh) 感光性元件、及光阻圖案之形成方法
JP7695484B2 (ja) 感光性エレメント、及びレジストパターンの形成方法
TWI895025B (zh) 感光性樹脂組成物及其製造方法、感光性樹脂積層體及其捲、及光阻圖案之形成方法
TWI903461B (zh) 感光性樹脂積層體、及光阻圖案之形成方法
TWI921991B (zh) 感光性樹脂積層體、及光阻圖案之形成方法以及具有導體圖案之配線板之製造方法
TWI915271B (zh) 感光性樹脂積層體、及光阻圖案之形成方法
TW202513615A (zh) 感光性元件、光阻圖案之形成方法、以及配線板之製造方法
TW202528363A (zh) 感光性樹脂積層體、光阻圖案之形成方法、及配線板之形成方法
TW202526509A (zh) 感光性樹脂積層體、及光阻圖案之形成方法以及具有導體圖案之配線板之製造方法
JP2025155987A (ja) 感光性樹脂積層体、及びその製造方法
JP2025156258A (ja) 感光性樹脂積層体、及びその製造方法
JP2026060536A (ja) 感光性樹脂組成物及びその製造方法
JP2025164502A (ja) 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法
WO2026063436A1 (ja) 感光性樹脂積層体、レジストパターンの形成方法及び配線板の製造方法
CN120722664A (zh) 感光性树脂层叠体及其制造方法