TWI885682B - 雷射加工裝置、半導體晶片及半導體晶片之製造方法 - Google Patents

雷射加工裝置、半導體晶片及半導體晶片之製造方法 Download PDF

Info

Publication number
TWI885682B
TWI885682B TW113100377A TW113100377A TWI885682B TW I885682 B TWI885682 B TW I885682B TW 113100377 A TW113100377 A TW 113100377A TW 113100377 A TW113100377 A TW 113100377A TW I885682 B TWI885682 B TW I885682B
Authority
TW
Taiwan
Prior art keywords
wafer
door
unit
inner door
outer door
Prior art date
Application number
TW113100377A
Other languages
English (en)
Chinese (zh)
Other versions
TW202436004A (zh
Inventor
鈴木芳邦
Original Assignee
日商山葉發動機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山葉發動機股份有限公司 filed Critical 日商山葉發動機股份有限公司
Publication of TW202436004A publication Critical patent/TW202436004A/zh
Application granted granted Critical
Publication of TWI885682B publication Critical patent/TWI885682B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
TW113100377A 2023-02-03 2024-01-04 雷射加工裝置、半導體晶片及半導體晶片之製造方法 TWI885682B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2023/003638 2023-02-03
PCT/JP2023/003638 WO2024161644A1 (ja) 2023-02-03 2023-02-03 レーザ加工装置、半導体チップおよび半導体チップの製造方法

Publications (2)

Publication Number Publication Date
TW202436004A TW202436004A (zh) 2024-09-16
TWI885682B true TWI885682B (zh) 2025-06-01

Family

ID=92146264

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113100377A TWI885682B (zh) 2023-02-03 2024-01-04 雷射加工裝置、半導體晶片及半導體晶片之製造方法

Country Status (5)

Country Link
JP (1) JPWO2024161644A1 (https=)
KR (1) KR20250078502A (https=)
CN (1) CN120693226A (https=)
TW (1) TWI885682B (https=)
WO (1) WO2024161644A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1630942A (zh) * 2002-02-22 2005-06-22 东京毅力科创株式会社 半导体处理系统中的端口机构
CN101733696A (zh) * 2005-04-19 2010-06-16 株式会社荏原制作所 基板抛光方法及处理方法
US20150287625A1 (en) * 2012-10-29 2015-10-08 Keiji Fujimoto Device and method for detecting position of semiconductor substrate
TW202018853A (zh) * 2018-11-07 2020-05-16 日商迪思科股份有限公司 片匣載置機構

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09306970A (ja) * 1996-05-10 1997-11-28 Komatsu Ltd ウエハカセット設置装置及びウエハ検査装置
JP2011124364A (ja) * 2009-12-10 2011-06-23 Disco Abrasive Syst Ltd 加工装置
JP2017064743A (ja) 2015-09-29 2017-04-06 株式会社ディスコ レーザー加工装置
TWI805823B (zh) * 2018-10-31 2023-06-21 日商三星鑽石工業股份有限公司 基板供給系統及基板加工裝置
CN210010599U (zh) * 2019-04-28 2020-02-04 帝闻电子（龙川）有限公司 一种紫外激光打标机外壳
US11676829B2 (en) * 2020-12-31 2023-06-13 Texas Instruments Incorporated Hyperbaric saw for sawing packaged devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1630942A (zh) * 2002-02-22 2005-06-22 东京毅力科创株式会社 半导体处理系统中的端口机构
CN101733696A (zh) * 2005-04-19 2010-06-16 株式会社荏原制作所 基板抛光方法及处理方法
US20150287625A1 (en) * 2012-10-29 2015-10-08 Keiji Fujimoto Device and method for detecting position of semiconductor substrate
TW202018853A (zh) * 2018-11-07 2020-05-16 日商迪思科股份有限公司 片匣載置機構

Also Published As

Publication number Publication date
KR20250078502A (ko) 2025-06-02
CN120693226A (zh) 2025-09-23
JPWO2024161644A1 (https=) 2024-08-08
TW202436004A (zh) 2024-09-16
WO2024161644A1 (ja) 2024-08-08

Similar Documents

Publication Publication Date Title
JP4466811B2 (ja) 露光装置及びデバイス製造方法
US8425172B2 (en) Reticle manipulation device
US6471037B1 (en) Semiconductor manufacturing apparatus and method
KR20010034647A (ko) 클러스터 장비
JP2003536247A (ja) 材料搬送システム
CN111009485B (zh) 基板仓库、基板处理系统和基板检查方法
KR100757216B1 (ko) 검사 장치
JP7519822B2 (ja) 収納モジュール、基板処理システムおよび消耗部材の搬送方法
WO2013148607A1 (en) Apparatus and methods for reticle handling in an euv reticle inspection tool
TWI885682B (zh) 雷射加工裝置、半導體晶片及半導體晶片之製造方法
JP5575691B2 (ja) 基板処理装置、基板処理方法及びその基板処理方法を実行させるためのプログラムを記録した記録媒体
JP2009200063A (ja) 基板の変形検出機構，処理システム，基板の変形検出方法及び記録媒体
JP3730810B2 (ja) 容器の移動装置および方法
US6811369B2 (en) Semiconductor fabrication apparatus, pod carry apparatus, pod carry method, and semiconductor device production method
JP2000188316A (ja) 搬送方法および装置ならびにそれを用いた半導体装置の製造方法
JP3894513B2 (ja) 半導体製造装置
KR20230045765A (ko) EFEM(Equipment Front End Module) 및 이를 포함하는 파괴 분석 자동화 설비
JP2006041027A (ja) 半導体製造装置およびデバイス製造方法
KR100568770B1 (ko) 웨이퍼의 자동 시각 검사시스템
TWI889125B (zh) 開槽裝置、半導體晶片及半導體晶片之製造方法
CN120603674A (zh) 激光加工装置、激光加工方法、半导体芯片及半导体芯片的制造方法
TWI913635B (zh) 雷射加工裝置、雷射加工方法、半導體晶片及半導體晶片之製造方法
TWI881652B (zh) 雷射加工裝置、半導體晶片及半導體晶片之製造方法
JP2023111109A (ja) 基板処理装置
JPH0611067B2 (ja) マスク保管装置