TWI883782B - 電子零件用黏著膠帶 - Google Patents

電子零件用黏著膠帶 Download PDF

Info

Publication number
TWI883782B
TWI883782B TW113101345A TW113101345A TWI883782B TW I883782 B TWI883782 B TW I883782B TW 113101345 A TW113101345 A TW 113101345A TW 113101345 A TW113101345 A TW 113101345A TW I883782 B TWI883782 B TW I883782B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
adhesive
electronic components
wafer
adhesive tape
Prior art date
Application number
TW113101345A
Other languages
English (en)
Chinese (zh)
Other versions
TW202435295A (zh
Inventor
岡本将尚
松原侑弘
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW202435295A publication Critical patent/TW202435295A/zh
Application granted granted Critical
Publication of TWI883782B publication Critical patent/TWI883782B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
TW113101345A 2023-01-12 2024-01-12 電子零件用黏著膠帶 TWI883782B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023002907 2023-01-12
JP2023-002907 2023-01-12

Publications (2)

Publication Number Publication Date
TW202435295A TW202435295A (zh) 2024-09-01
TWI883782B true TWI883782B (zh) 2025-05-11

Family

ID=91896947

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113101345A TWI883782B (zh) 2023-01-12 2024-01-12 電子零件用黏著膠帶

Country Status (5)

Country Link
JP (1) JPWO2024150789A1 (https=)
KR (1) KR20250134639A (https=)
CN (1) CN120584398A (https=)
TW (1) TWI883782B (https=)
WO (1) WO2024150789A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106133879A (zh) * 2014-03-28 2016-11-16 琳得科株式会社 切割片用基材膜、具备该基材膜的切割片及该基材膜的制造方法
TW202133247A (zh) * 2019-12-13 2021-09-01 日商日東電工股份有限公司 半導體加工用黏著片材及其利用
TW202142647A (zh) * 2020-03-30 2021-11-16 日商琳得科股份有限公司 膜狀接著劑以及膜狀接著劑複合片

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP4927393B2 (ja) 2005-11-30 2012-05-09 古河電気工業株式会社 ダイシングテープ
JP5128575B2 (ja) 2009-12-04 2013-01-23 リンテック株式会社 ステルスダイシング用粘着シート及び半導体装置の製造方法
JP4945014B1 (ja) * 2010-09-30 2012-06-06 三井化学株式会社 拡張性フィルム、ダイシングフィルム、および半導体装置の製造方法
WO2020230468A1 (ja) * 2019-05-15 2020-11-19 タキロンシーアイ株式会社 ダイシングテープ用基材フィルム
JP7377723B2 (ja) * 2020-01-21 2023-11-10 タキロンシーアイ株式会社 ダイシングテープ用基材フィルム
JP7682765B2 (ja) * 2021-10-29 2025-05-26 タキロンシーアイ株式会社 半導体製造テープ用基材フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106133879A (zh) * 2014-03-28 2016-11-16 琳得科株式会社 切割片用基材膜、具备该基材膜的切割片及该基材膜的制造方法
TW202133247A (zh) * 2019-12-13 2021-09-01 日商日東電工股份有限公司 半導體加工用黏著片材及其利用
TW202142647A (zh) * 2020-03-30 2021-11-16 日商琳得科股份有限公司 膜狀接著劑以及膜狀接著劑複合片

Also Published As

Publication number Publication date
CN120584398A (zh) 2025-09-02
WO2024150789A1 (ja) 2024-07-18
TW202435295A (zh) 2024-09-01
KR20250134639A (ko) 2025-09-11
JPWO2024150789A1 (https=) 2024-07-18

Similar Documents

Publication Publication Date Title
CN112400216B (zh) 半导体加工用粘着胶带及半导体装置的制造方法
JP7326270B2 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
CN101070454B (zh) 用于加工半导体晶片或半导体基材的压敏粘着片
JP2011018669A (ja) 半導体ウェハダイシング用粘着シート及び該粘着シートを用いる半導体ウェハのダイシング方法
JP2008060151A (ja) 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JPWO2019181732A1 (ja) 粘着テープおよび半導体装置の製造方法
KR102929215B1 (ko) 반도체 가공용 보호 시트 및 반도체 장치의 제조 방법
KR102929214B1 (ko) 반도체 가공용 보호 시트 및 반도체 장치의 제조 방법
WO2022097420A1 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
JP7832174B2 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
JP7069116B2 (ja) バックグラインドテープ用基材
JP2023013023A (ja) 電子部品用粘着テープ
TWI883782B (zh) 電子零件用黏著膠帶
KR20230161424A (ko) 반도체 가공용 점착 테이프 및 반도체 장치의 제조방법
JP2023013022A (ja) 電子部品用粘着テープ
KR20230163358A (ko) 반도체 가공용 점착 테이프 및 반도체 장치의 제조방법
JP7832173B2 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
JP7850802B2 (ja) 半導体加工用粘着テープ
TW202441605A (zh) 電子元件用黏著膠帶
KR20230160228A (ko) 반도체 가공용 점착 테이프 및 반도체 장치의 제조방법
KR20230122979A (ko) 워크 가공용 보호 시트 및 워크 개편화물의 제조 방법
CN116918039A (zh) 半导体加工用粘合片及半导体装置的制造方法
KR20240032655A (ko) 반도체 가공용 점착 시트 및 반도체 장치의 제조 방법
CN116918038A (zh) 半导体加工用粘合片及半导体装置的制造方法